18052 ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- A llows placing an PLCC package on a board laid out for a shrink DIP . GENERAL SPECIFICATIONS
- B OARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides
- P ADS: HASL
- P INS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- P IN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290
- O PERATING TEMPERATURE: 221°F [105°C]
- F EMALE SOCKET: AMP or equivalent standard single beam PLCC socket MOUNTING CONSIDERATIONS
- Solder process like any other surface mount device 18052 Rev. AA 5-Pin PLCC Motorola MC68HC11E9-to-56-Pin SDIP Adapter PLCC SDIP PLCC SDIP 1 1 -- 29 2 2 27 30 3 3 28 31 4 4 29 32 5 5 30 33 6 6 31 34 7 7 32 35 8 8 33 36 9 9 34 37 10 10 35 38 11 11 36 39 12 12 37 40 13 13 38 41 14 14 39 42 15 15 40 43 16 16 41 44 17 17 42 45 18 18 43 46 19 19 44 47 20 20 45 48 -- 21 46 49 21 22 47 50 22 23 48 51 23 24 49 52 24 25 50 53 25 26 51 54 26 27 52 55 -- 28 56 CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS