18043 ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- A llows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards.
- S older masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging.
- L onger male bottom Pins available at special request for easy use of probe clips.
- L arge topside pads allow for soldering test pins, jumpers, etc. to top of adapter. GENERAL SPECIFICATIONS
- B OARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides
- P ADS: HASL
- P INS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- P IN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE-AMS-QQ-N-290
- O PERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS 18043 Rev. AA P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter
ORDERING INFORMATION
P/N 1110748-P for Panelized Version CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC -610B CLASS 2 GUIDELINES CONSULT FACTORY FOR MOUNTING CONSIDERATIONS OF CONSIGNED CHIPS. CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS