18010RC ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16] or 0.600 [15.24] centers GENERAL SPECIFICATIONS
- BOARD MATERIAL : 0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26 with 1-oz. Cu traces, both sides
- PADS: Finished with ENIG (Immersion Au over Electroless Ni)
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: 10µ [2.54µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290
- OPERATING TEMPERATURE: 105°C max. MOUNTING CONSIDERATIONS 18010RC Rev. 1.5 Series 350000-11-RC RoHS/WEEE-Compliant SOIC-to-DIP Adapter
ORDERING INFORMATION
(see Table below) CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED “A” = NO. OF PINS PER ROW X 0.100 [2.54] “D” = (NO. OF PINS PER ROW - 1) X 0.100 [2.54] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS