17510 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 14
Technical content
Features
- 2 . 0 V to 15 V Continuous Operation
- Output Current 1.2 A (DC), 3.8 A (Peak)
- 450 mΩ RDS(ON) H-Bridge MOSFETs
- 5 . 0 V TTL- / CMOS-Compatible Inputs
- PWM Frequencies up to 200 kHz
- Undervoltage Shutdown
- Cross-Conduction Suppression
- Pb-Free Packaging Designated by Suffix Code EJ
Figure 1. 17510 Simplified Application Diagram
ORDERING INFORMATION
Range (TA) Package MPC17510EJ/R2 -30°C to 65°C 24 TSSOPWMPC17510MTB MPC17510MTBEL VDD CRES C1L C1H C2L C2H IN2 IN1 EN OUT2 OUT1 GOUT VM GND MCU GIN MOTOR
5.0 V 15 V
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Figure 2. 17510 Simplified Internal Block Diagram
Figure 3. 17510 Pin Connections Table 1. 17510 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 8. 1, 5 OUT1 Output 1 Driver output 1 pins. 2 LGND Logic Ground Logic ground.
3 CRES Charge Pump Output
Charge pump reservoir capacitor pin. NC No Connect No connection to these pins. 17, 18 OUT2 Output 2 Driver output 2 pins. 6, 19 PGND Power Ground Power ground. Motor power supply voltage input pins. 9 IN1 Input Control 1 Control signal input 1 pin. 10 IN2 Input Control 2 Control signal input 2 pin. 11 C1H Charge Pump 1H Charge pump bucket capacitor 1 (positive pole). 12 C1L Charge Pump 1L Charge pump bucket capacitor 1 (negative pole). 13 C2L Charge Pump 2L Charge pump bucket capacitor 2 (negative pole). 14 C2H Charge Pump 2H Charge pump bucket capacitor 2 (positive pole). 15 GOUT Gate Driver Output Output gate driver signal to external MOSFET switch. 16 EN Enable Control Enable control signal input pin. 23 VDD Logic Supply Control circuit power supply pin. 24 GIN Gate Driver Input LOW = True control signal for GOUT pin.
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ELECTRICAL CHARACTERISTICS
Table 2. Maximum Ratings permanent damage to the device.
- When supplied externally, connect via 3.0 kΩ resistor.
- T A = 25°C, 10 ms pulse at 200 ms interval.
- ESD1 testing is performed in accor dance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
- Soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data Freescale Semiconductor 5 17510 STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
- Excluding pull-up resistor current, including current of gate-drive circuit.
- Detection voltage is defined as when t he output becomes high-impedance after VDD drops below the detection threshold. When the gate
voltage VCRES is applied from an external source, VCRES = 7.5 V.
- Input logic signal not present.
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DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
- Time is defined between 10% and 90%.
- That is, the input waveform slope must be steeper than this.
- Time is defined between 90% and 10%.
- Time to charge C RES to 11 V after application of VDD.
Analog Integrated Circuit Device Data Freescale Semiconductor 7 17510 Figure 4. tPLH, tPHL, and tPZH Timing Figure 5. Low-Voltage Detection Timing Table 5. Truth Table The GIN pin and EN pin are pulled up to VDD with internal resistance.
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The 17510 is a monolithic H-Bridge power IC applicable to small DC motors used in portable electronics. The 17510 can operate efficiently with supply voltages as low as 2.0 V to as high as 15 V, and it can provide continuos motor drive currents of 1.2 A while handling peak currents up to 3.8 A. It is easily interfaced to low-cost MCUs via parallel 5.0 V- compatible logic. The device can be pulse width modulated (PWM-ed) at up to 200 kHz. The 17510 has four operating modes: Forward, Reverse, Brake, and Tri-Stated (High Impedance). Basic protection and operational features (direction, dynamic braking, PWM control of speed and torque, main power supply undervoltage detection and shutdown, logic power supply undervoltage detection and shutdown), in addition to the 1.0 A rms output current capability, make the 17510 a very attractive, cost-effective solution for controlling a broad range of small DC motors. In addition, a pair of 17510 devices can be used to control bipolar stepper motors. The 17510 can also be used to excite transformer primary windings with a switched square wave to produce secondary winding AC currents. As shown in Figure 2, 17510 Simplified Internal Block Diagram, page 2, the 17510 is a monolithic H-Bridge with built-in charge pump circuitry. For a DC motor to run, the input conditions need to be set as follows: ENable input logic HIGH, one INput logic LOW, and the other INput logic HIGH (to define output polarity). The 17510 can execute dynamic braking by setting both IN1 and IN2 logic HIGH, causing both low-side MOSFETs in the output H-Bridge to turn ON. Dynamic braking can also implemented by taking the ENable logic LOW. The output of the H-Bridge can be set to an open- circuit high-impedance (Z) condition by taking both IN1 and IN2 logic LOW. (refer to Table 5, Truth Table, page 7). The 17510 outputs are capable of providing a continuous DC load current of up to 1.2 A. An internal charge pump supports PWM frequencies to 200 kHz. The EN pin also controls the charge pump, turning it off when EN = LOW, thus allowing the 17510 to be placed in a power-conserving sleep mode. FUNCTIONAL PIN DESCRIPTION OUTPUT 1 AND OUTPUT2 (OUT1, OUT2) The OUT1 and OUT2 pins provide the connection to the internal power MOSFET H-Bridge of the IC. A typical load connected between these pins would be a small DC motor. These outputs will connect to either VM or PGND, depending on the states of the control inputs (refer to Table 5, Truth Table, page 7). POWER GROUND AND LOGIC GROUND (PGND, LGND) The power and logic ground pins (PGND and LGND) should be connected together with a very low-impedance connection. CHARGE PUMP RESERVOIR CAPACITOR (CRES) The CRES pin provides the connection for the external reservoir capacitor (output of the charge pump). Alternatively this pin can also be used as an input to supply gate-drive voltage from an external source via a series current-limiting resistor. The voltage at the CRES pin will be approximately three times the VDD voltage, as the internal charge pump utilizes a voltage tripler circuit. The VCRES voltage is used by the IC to supply gate drive for the internal power MOSFET H-Bridge. MOTOR SUPPLY VOLTAGE INPUT (VM) The VM pins carry the main supply voltage and current into the power sections of the IC. This supply then becomes controlled and/or modulated by the IC as it delivers the power to the load attached between OUT1 and OUT2. All VM pins must be connected together on the printed circuit board with as short as possible traces offering as low impedance as possible between pins. VM has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins. CONTROL SIGNAL INPUT AND ENABLE CONTROL SIGNAL INPUT (IN1, IN2, EN) The IN1, IN2, and EN pins are input control pins used to control the outputs. These pins are 5.0 V CMOS-compatible inputs with hysteresis. The IN1, IN2, and EN work together to control OUT1 and OUT2 (refer to Table 5, Truth Table). GATE DRIVER INPUT (GIN) The GIN input controls the GOUT pin. When GIN is set logic LOW, GOUT supplies a level-shifted high-side gate drive signal to an external MOSFET. When GIN is set logic HIGH, GOUT is set to GND potential.
Analog Integrated Circuit Device Data Freescale Semiconductor 9 17510 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION CHARGE PUMP BUCKET CAPACITOR (C1L, C1H, C2L, C2H) These two pairs of pins, the C1L and C1H and the C2L and C2H, connect to the external bucket capacitors required by the internal charge pump. The typical value for the bucket capacitors is 0.1 µF. GATE DRIVER OUTPUT (GOUT) The GOUT output pin provides a level-shifted, high-side gate drive signal to an external MOSFET with CISS up to 500 pF. CONTROL CIRCUIT POWER SUPPLY (VDD) The VDD pin carries the 5.0 V supply voltage and current into the logic sections of the IC. VDD has an undervoltage threshold. If the supply voltage drops below the undervoltage threshold, the output power stage switches to a tri-state condition. When the supply voltage returns to a level that is above the threshold, the power stage automatically resumes normal operation according to the established condition of the input pins.
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Figure 6 shows a typical application for the 17510. Figure 6. 17510 Typical Application Diagram Figure 7. CEMF Snubbing Techniques
Analog Integrated Circuit Device Data Freescale Semiconductor 11 17510 PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. MTB SUFFIX EJ SUFFIX (PB-FREE) 24-PIN PLASTIC PACKAGE 98ASH70455A ISSUE B
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PACKAGE DIMENSIONS (CONTINUED) PACKAGE DIMENSIONS (continued) MTB SUFFIX EJ SUFFIX (PB-FREE) 24-PIN PLASTIC PACKAGE 98ASH70455A ISSUE B
Analog Integrated Circuit Device Data Freescale Semiconductor 13 17510
REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES 2.0 7/2006 • Implemented a Revision History page.
- Converted to Freescale format, and updated to the prevaiing form and style
- Added EJ Pb-FREE package 3.0 1/2007 • Corrected symbol in Table 3, Driver Output ON Resistance from “W” to "Ω"
Rev. 3.0 RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2007. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
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