PS-172323-0001 MOLEX | Alldatasheet
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REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 1 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. ULTRA-FIT WIRE-TO-BOARD CONNECTOR SYSTEM Receptacle Terminal TPA Series: 172253 Series: 172264 , 172268 Tangless Receptacle Terminal Tangless TPA Series: 172253 Series: 172264
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 2 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Tangless Receptacle Housing Dual Row Tangless Receptacle Housing Single Row Series: 172258 Series: 172256 Receptacle Housing Single Row Receptacle Housing Dual Row Series: 172256 Series: 172258 Vertical Header, Kinked Pins Series: 172298 Series: 172286
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 3 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Vertical Header, Solder Clip Series: 172299 Series: 172287 Right Angle Header Series: 172316 Series: 172310 Right Angle Header, Solder Clip Series: 172316 Series: 172310
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 4 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
1.0 SCOPE 5
2.0 PRODUCT DESCRIPTION 5
2.1 Product Name and Series Numbers 5
2.2 Dimensions, Materials, Plating and Markings 5
2.3 Safety Agency Approvals 5
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 6
3.1 Molex Documents 6
3.2 Industry Documents 6
4.0 ELECTRICAL PERFORMANCE RATINGS 7
4.1 Voltage 7
4.2 Applicable Wires 7
4.3 Maximum Current Rating 7
4.4 Temperature 8
4.5 Durability 8
4.6 Glow Wire 9
5.0 QUALIFICATION 9
6.0 PERFORMANCE 9
6.1 Electrical Performance 9
6.2 Mechanical Performance 10
6.3 Environmental Performance 12
7.0 TEST SEQUENCE GROUPS 14
8.0 SOLDER INFORMATION 16
8.1 Solder Process Temperature 16
8.2 Reflow Solder Profile 16
9.0 PACKAGING 18
10.0 CABLE TIE AND/OR WIRE TWIST LOCATION 18
11.0 POLARIZATION AND KEYING OPTIONS 19
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 5 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
1.0 SCOPE
This Product Specification covers Ultra-Fit 3.50 mm pitch wire to board connector systems with gold and tin plating. Receptacles are terminated with 22 to 16 AWG wire using crimp technology.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER (S)
Table 1 – WIRE-TO-BOARD Description Series Number Receptacle Crimp Terminal 172253 Receptacle Housing, Single Row 172256 Receptacle Housing, Dual Row 172258 TPA 172264, 172268 Vertical Header Single Row, Kinked Pins 172286 Vertical Header Single Row, Solder Clips 172287 Vertical Header Dual Row, Kinked Pins 172298 Vertical Header Dual Row, Solder Clips 172299 Right Angle Header Single Row, Solder Clips 172310 Right Angle Header Dual Row, Solder Clips 172316
2.2 DIMENSIONS, MATERIALS, PLATING AND MARKINGS
Dimensions & Plating: See individual sales drawings. Material: RoHS compliant materials.
2.3 SAFETY AGENCY APPROVALS
2.3.1 UL File Number: E29179
UL (fully loaded) NON-current interruption Current interruption per UL1977
14 Amps @ 600V (16 AWG wire) 14 Amps @ 48V AC/DC (16 AWG wire)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 6 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
2.3.2 IEC License Number per IEC / EN 61984: TBD
IEC (fully loaded) NON-current interruption
2.3.3 File Number*: 70022376 (LR19980)
CSA approval meets following standards/test procedures: * “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the applicable CSA and ANSI/UL standards, for use in Canada and US respectively. CSA (single circuit) NON-current interruption
14 Amps @ 400V (16 AWG wire)
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1 MOLEX DOCUMENTS
See series specific sales drawings and the other sections of this specifications for the necessary referenced documents and specifications. Ultra-Fit Test Summary TS-172323-0001 Ultra-Fit Application Specification AS-172323-0001 Ultra-Fit Application Tooling Specification (Hand Crimp Tool) ATS-6382753HM Ultra-Fit Application Tooling Specification (Insertion and Extractor Tool) ATS-011030016 Ultra-Fit Application Tooling Specification (Fine Adjust Applicator) ATS-639041600 Molex Quality Crimping Handbook Order No. 63800-0029 Molex Solderability Specification SMES-152 Molex Heat Resistance Specification AS-40000-5013 Molex Moisture Technical Advisory AS-45499-001 Molex Package Handling Specification 454990100-PK
3.2 INDUSTRY DOCUMENTS
EIA-364-1000.01 UL-60950-1 UL-1977 CSA STD. C22.2 NO. 182.3-M1987 IEC / EN 61984 USCAR-2 REV.6
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 7 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
4.0 ELECTRICAL PERFORMANCE RATINGS
4.1 VOLTAGE*
600 Volts AC (RMS) or 600 Volts DC max. * This connector voltage meets the connector level provided by the safety agency. For application voltage requirements per UL-60950 or other standards, the creepage & clearance also needs to be determined based upon pads/traces on the PCB.
4.2 APPLICABLE WIRES
Stranded copper 16 AWG: 2.00mm MAXIMUM Stranded copper 18 AWG: 1.70mm MAXIMUM Stranded copper 20 AWG: 1.50mm MAXIMUM Stranded copper 22 AWG: 1.30mm MAXIMUM
4.3 MAXIMUM CURRENT RATING
Current rating is application dependent and may be affected by the wire rating such as listed in UL-60950- 1. Each application should be evaluated by the end user for compliance to specif ic safety agency requirements. The ratings listed in the chart below are per Molex test method base d on a 30°C maximum temperature rise over ambient temperature and are provided as a guideline. Appropriate de -rating is required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from adjacent modules/components and other factors that influence connector performance. Wire size, insulation thickness, stranding, tin coated or bare copper, wire length & crimp quality are other factors that influence current rating. Wire to Board Current Rating (Amp Max.) (Tested with TIN plated terminals) Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Single Row) Circuit Size (Dual Row) 2 3 4 5 6 7 8 4 6 8 10 12 14 16 Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length. *Extrapolated from test data.
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 8 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Wire to Board Current Rating (Amp Max.) (Tested with GOLD plated terminals) Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Single Row) Circuit Size (Dual Row) 2 3 4 5 6 7 8 4 6 8 10 12 14 16 Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length. *Extrapolated from test data.
4.4 TEMPERATURE
Max. operating temperature range (including T-rise from applied current) is -40°C to 105°C. Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 65°C for 10 years life per table-8. GOLD plated Max. operating temperature range (including T-rise from applied current) is -40°C to 120°C, thermal aging at 120°C for 1000 hours. Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 85°C for 10 years or 95°C for 7 years life per table-8.
4.5 DURABILITY
Tin plated: 25 mating cycles Gold plated: 200 mating cycles As tested in accordance with EIA-364-1000.01 test method (see Sec. 7.0 of this specification). Durability per EIA-364-09
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 9 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
4.6 GLOW WIRE
The following series are glow capacity: 172256, 172260, 172258 and 172262, some with TPA and 172286, 172287, 172298, 172299, 172310 and 172316. Representative samples were tested and found compliant with EN 60695-2-11-2001 / IEC 60695-2-11- 2000 Glow Wire Test Methods for End-Products. VDE Test report available upon request.
5.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364-1000.01
6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
DESCRIPTION TEST CONDITION REQUIREMENT Initial Contact Resistance (Low Level) Mate connectors, apply a maximum voltage of 20 mV and a current of 100 mA (measurement locations shown) Per EIA-364-23 Wire resistance and traces shall be removed from the measured value. Maximum (Initial): Tin: 2 m Contact Resistance @Rated Current (Voltage Drop) Mate connectors; apply the rated current. Per EIA-364-70 Maximum: Tin: 5 m Insulation Resistance Apply 500 VDC between adjacent terminals or ground. Per EIA-364-21 1,000 M minimum Dielectric Withstanding Voltage Apply 1800 VAC for 1 minute between adjacent terminals. Per EIA-364-20 No breakdown Current leakage <5mA Temperature Rise Mate connectors, measure T- Rise @ Rated Current Per EIA-364-70 Temperature rise: 30°C maximum (see chart) PASS
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 10 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
6.2 MECHANICAL PERFORMANCE
ITEM TEST CONDITION REQUIREMENT Connector Mating Force Without Latches Mate connectors at a rate of 25.4 +/- 6 mm per minute. Per EIA-364- Tin plated: 4.5 N MAX. initial mate force per circuit 15µ” & 30µ” Gold plated: 2.8 N MAX. per circuit Connector Un-mating Force Without Latches Un-mate connectors with latch disabled at a rate of 25.4 +/- 6 mm per minute. Per EIA-364-37 Tin plated: 4.0 N MAX. initial un-mate force per circuit 15µ” & 30µ” Gold plated: 2.3 N MAX. per circuit Connector Mating Force Without Terminals Mate connectors at a rate of 25.4 +/- 6 mm per minute. Per EIA-364- 8 N MAX. Thumb Latch Yield Strength Mate loaded connectors fully. Pull connectors apart at a rate of 25.4 +/- 6 mm per minute. Locking tang option: 89 N MIN. Tangless option: 60 N MIN. Durability Mate connectors 25 cycles for tin plated and 200 cycles for gold plated connectors at a maximum rate of 10 cycles per minute. Per EIA-364-09 Maximum change from initial: Tin: 7 m Header Pin Retention Force in Housing Axial pull force on the vertical header housing away from the PCB at a rate of 25.4 +/- 6 mm per minute. Push from mating side: 50N MIN. Push from PCB side: 10N MIN.
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 11 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. 6.2 MECHANICAL PERFORMANCE (CONT.) ITEM TEST CONDITION REQUIREMENT PCB Peg Insertion Force into the PCB (Right Angle Header) Insert a header at a rate of 25.4±6 mm/minute. (Applies to parts with PCB retention pegs only) Header with 2 pegs:
35 N MAX insertion force
Headers with 1 peg:
23 N MAX insertion force
(Right Angle Header) Insert a header at a rate of 25.4±6 mm/minute. (Applies to parts with PCB retention pegs only) Header with 2 pegs:
0.2 N MIN retention force
Headers with 1 peg:
0.1 N MIN retention force
(Vertical Header) Insert a header at a rate of 25.4±6 mm/minute. With Kinked Pins: 35 N MAX. With Solder Clip: 25 N MAX. Header Retention Force to the PCB (Vertical Header) Remove a header at a rate of 25.4±6 mm/minute. With Kinked Pins: 1 N MIN. With Solder Fork: 1 N MIN. Crimp Terminal Retention Force (in housing) Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm per minute. Per EIA-364-29 27 N MINIMUM retention force Wire Pull Out Force From Terminal (Axial) Apply an axial pullout force on the wire at a rate of 25 ± 6 mm per minute. 16AWG – 68.4N MIN 18AWG – 68.4N MIN 20AWG – 57.9N MIN 22AWG – 35.6N MIN Reference Molex Application Tooling Specification for Molex crimp tooling being used. Vibration (Random) Mate connectors and vibrate per EIA-364-28 test condition VII-D Tin: 15 minutes each axis. Gold: 1.5 hours each axis. Maximum Change from Initial: Tin: 7 m Discontinuity < 1 microsecond
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 12 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. 6.2 MECHANICAL PERFORMANCE (CONT.) ITEM ITEM ITEM Vibration per USCAR-2 Class V1, S1, T2 Mate connectors, mounted and vibrate as per USCAR-2 Rev6: 5.4.6 Class V1, S1, T2. Random Duration: 8hrs/axis Maximum Change from Initial: Tin: 7 m 15µ” & 30µ” Gold: 3 m Reseating Unmate/Mate connectors by hand three cycles Maximum Change from Initial: Tin: 7 m
6.3 ENVIRONMENTAL PERFORMANCE*
ITEM TEST CONDITION REQUIREMENT Thermal Shock Mate connectors, expose to 10 cycles from -55°C to 85°C Per EIA-364-32 method A, condition 1 Maximum Change from Initial: Tin: 7 m Thermal Aging Tin Mate Connectors, expose to 240 hours at 105°C Per EIA-364-17 Method A Au 1,100 hours at 120°C Maximum Change from Initial: Tin: 7 m Thermal Aging Precondition Tin & Au 120hrs at 105°C Per EIA-364-17 method A Maximum Change from Initial: Tin: 7 m
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 13 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. 6.3 ENVIRONMENTAL PERFORMANCE* (CONT.) ITEM TEST CONDITION REQUIREMENT Cyclic Temperature And Humidity Mate connectors: expose to 24 cycles from 25 °C / 80% RH to 65 °C / 50% RH ramp time: 0.5hr dwell time: 1hr Per EIA-364-31 Maximum Change from Initial: Tin: 7 m Solderability Dip Test Per Molex test method: SMES-152 Solder area shall have MIN. of 95% solder coverage (PASS) Reflow Solder Resistance Convection reflow solder process 260°C Max per AS-40000-5013 Visual: No damage Wave Solder Resistance Dip header terminal tails in solder: Duration: 5±0.5 seconds Solder temperature: 260±5° C Per AS-40000-5013 Visual: No damage Thermal Cycling Tin Plated Only Per EIA-364-1000.01 Test Group 5: Cycle mated connector between 15°C±3°C and 85°C±3°C as measured on the part. Ramps should be a minimum of 2°C per minute, and dwell times should insure contacts reach the temperature extremes (minimum of 5 minutes). Humidity is not controlled. Perform 500 cycles. Maximum Change from Initial: Tin: 7 m *Environmental tests have been performed per EIA-364-100.01 except where noted.
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 14 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
7.0 TEST SEQUENCE GROUPS
Reliability Test Sequences Per 364-1000.01 Group I Temperature Life 144 contacts tin 144 contacts gold Group II Thermal Shock 144 contacts tin 144 contacts gold Group III Vibration 144 contacts tin 144 contacts gold Group V Thermal Cycling 144 contacts tin (tin plated only) Group VII Durability 144 contacts tin 144 contacts gold Initial Contact Resistance EIA-364-23 Initial Contact Resistance EIA-364-23 Initial Contact Resistance EIA-364-23 Initial Contact Resistance EIA-364-23 DWV EIA-364-20 Durability Tin plated: 5 cycles Gold plated: 20 cycles EIA-364-09 Durability Tin plated: 5 cycles Gold plated: 20 cycles EIA-364-09 Durability Tin plated: 5 cycles Gold plated: 20 cycles EIA-364-09 Durability 5 cycles EIA-364-09 Initial Contact Resistance EIA-364-23 Contact Resistance Contact Resistance Contact Resistance Contact Resistance Durability Tin plated: 25 cycles Gold plated: 200 cycles EIA-364-09 | | | | Thermal Aging TIN 105C, 240 hrs (10 Yrs @ 65C) EIA-364-17 GOLD 120C, 1000 hrs Thermal Shock 10 cycles -55C and +85C EIA-364-32 Thermal Aging Pre-condition 105C, 120 hours
10 Yrs @ 65C
105C, 120 hours Contact Resistance Contact Resistance Contact Resistance Contact Resistance Contact Resistance Reseating 3 cycles Cyclic Temperature and Humidity EIA-364-31 Random Vibration EIA-364-28 Condition VIID Thermal Cycling EIA-364-1000.01 DWV EIA-364-20 | | | | Contact Resistance Contact Resistance Contact Resistance Contact Resistance | | Reseating 3 cycles Reseating 3 cycles Latch Retention | | Contact Resistance Contact Resistance
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 15 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Individual Tests Connector Mating / Unmating Force Connector Mating / Unmating with latch without terminals Header Pin Retention Force in the Housing Header Insertion/Retention into the PCB (Vertical Header with solder clip) Header Insertion/Retention into the PCB (Vertical Header with kinked pins 16 circuit, PTH) R/A Header Insertion/Retention into the PCB (crush pegs) Receptacle Terminal retention force into the housing 20 Terminals / 4 Connectors Crimped terminal retention force into the housing with TPA Solderability Dip Test Solder Clip retention force into the housing Receptacle latch retention force Receptacle latch retention force after durability x200 cycles USCAR Vibration Initial Contact Resistance USCAR 5.9.6 Class V1, S1, T2 Connector and/or Terminal Cycling USCAR-2 Rev6: 5.1.7 Vibration USCAR-2 Rev6: 5.4.6 Voltage Drop USCAR-2 Rev6: 5.3.2 Mechanical Shock USCAR-2 Rev6: 5.4.6 Dry Circuit Resistance
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 16 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
8.0 SOLDER INFORMATION
8.1 SOLDER PROCESS TEMPERATURES
Wave Solder: 265°C Max Reflow Solder: 260°C Max
8.2 REFLOW SOLDERING PROFILE
(This profile is per AS-40000-5013 and is provided as a guideline only. Please see notes for additional information) Molex Solderability Specification SMES-152 (Click Here) Molex Connector Heat Resistance Specification AS-40000-5013 (Click Here)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 17 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Notes: 1. Temperature indicated refers to the PCB surface temperature at solder tail area. 2. Connector can withstand 1 reflow cycle. 3. Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other components on the board. Please consult your solder paste & reflow equipment manufacturer for their recommendations to adopt a suitable process. Description Requirement Average Ramp Rate 3°C/sec Max Preheat Temperature 150°C Min to 200°C Max Preheat Time 60 to 180 sec Ramp to Peak 3°C/sec Max Time over Liquidus (217°C) 60 to 150 sec Peak Temperature 260 +0/-5°C Time within 5°C of Peak 20 to 40 sec Ramp - Cool Down 6°C/sec Max Time 25°C to Peak 8 min Max
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 18 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Dimension T
9.0 PACKAGING
Parts shall be packaged to protect against damage during normal handling, transit and storage. Refer Molex.com specific part number webpage to get the exact packaging document for that item.
10.0 CABLE TIE AND/OR WIRE TWIST LOCATION
The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to significant bias by external factors such as a wire tie, wire twisting, or other means of bending or deforming of the wires that repositions them from their natural relaxed state or location where they enter the housing. Wires are to be dressed in such a manner to allow the terminals to float freely in the pocket. This dimension is general recommendation and may need to be adjusted for different wire gauges and wire type and insulation thickness and insulation material. Circuit Sizes Dimension T Minimum 2 4 6 0.50” (12.7mm) 8 0.75” (19.1mm) 10 12 1.00” (25.40mm) 14 16 1.25” (31.75mm) 18 20 1.50” (38.09mm) 22 24 1.75” (44.45mm)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 19 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
11.0 POLARIZATION AND KEYING OPTIONS
11.1 Single Row Receptacle (Series: 172256)
11.2 Dual Row Receptacle (Series: 172258)
11.3 Vertical Header Single Row Kinked Pins (Series: 172286)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 20 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
11.4 Vertical Header Single Row Solder Clip (Series: 172287)
11.5 Vertical Header Dual Row Kinked Pins (Series: 172298)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 21 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
11.6 Vertical Header Dual Row Solder Clip (Series: 172299)
11.7 Right Angle Header Dual Row (Series: 172316)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 22 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
11.8 Right Angle Header Single Row (Series: 172310)
11.9 Right Angle Header Dual Row Solder Nail (Series: 172316)
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT CONNECTOR SYSTEM SHEET No. C EC No: 668512 23 of 23 DATE: 06/29/2021 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS-172323-0001 Dixon.Li JONNY.ZHENG ANSON.YIN Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.