170 BITECH | Alldatasheet
Document overview
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Technical content
DESCRIPTION
BI’s Custom Power Modules are designed to assemble all of your circuit’s power components into one, easy to manage, package. Power modules offer a low cost method to improve the circuit density. These modules will also reduce the assembly labor by eliminating insulating pads and reducing the individual bolting of discreet power semiconductors. BI offers power module designs that allow the module to be soldered to the circuit board at the same time as the other components, eliminating hand soldering operations. Power modules allow the use of a simpler and less expensive heat sink. All the power components normally bolted to the heat sink should be included in the custom module.
- Power supply subassemblies
- Motor driver
- Power amplifier
- H-Bridge
- Bridge rectifier
- Ganged power FETs MODEL 170 Custom Power Modules CUSTOM POWER MODULES Package Size Custom packaging from 0.3” to 4.0” on a side. Package, Typical Heat sink attachment and heat transfer. Package Configurations Ceramic substrate, typically copper clad to promote heat transfer. Base with mounted components is assembled into a custom frame and encapsulated. PACKAGING FEATURES AND BENEFITS
- Low cost custom modules
- Reduced circuit size
- Allows simplified heat sink
- Soldering technique minimizes voids
- Flexible package dimensions TYPICAL APPLICATIONS Specifications subject to change without notice.
Substrate Alumina, beryllia, aluminum nitride, aluminum, copper Interconnect Layers 1 (crossover layers possible) Interconnect Material Copper Die Attach Solder attached, aluminum & gold wire bonding Package Construction Substrate base with plastic frame ELECTRICAL Semiconductor Components BJTs, FETs, Diodes, SCRs, IGBTs Capacitors Ceramic and tantalum Other Components Resistors, thermisters and various surface mount/solder mount components MECHANICAL ENVIRONMENTAL Custom power modules are typically designed to operate over a temperature range of -40°C to +125°C.