16808 VICOR | Alldatasheet
Document overview
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Technical content
3,30 ± 0,08 4 x ø 0.130 ± 0.003 17,78 0.700 25,4 1.000 35,56 1.400 10,16 0.400 48,26 ± 0,05 1.900 ± 0.002 1,59 0.063 48,26 1.900 3,18 ± 0,05 2 x 0.125 ± 0.002 40,64 1.600 7,62 0.300 1,59 0.063 6,35 0.250 6,36 0.250 13,61 0.536 53,24 2.096 2,47 0.097 13,61 0.536 6,36 0.251 DETAIL A (MIRROR IMAGE TO OTHER SIDE) ALL DIMENSIONS IN INCHES SEE DETAIL B SEE DETAIL A PCB 243 1 98765 PCB MOUNTING SPECIFICATIONS (ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS) PRODUCT APPLICATION SPECIFICATIONS 1,63 ±0,08 (#52 DRILL) 6 x ø0.064 ± 0.003 DETAIL B (MIRROR IMAGE TO OTHER SIDE) ALL DIMENSIONS IN INCHES 15° 11,18 0.440 50,8 2.000 61,72 2.430 6,73 0.265 7,62 0.300 20,3 ± 0,8 0.80 ± 0.03 3,8 0.15 50,3 1.98 1,6 0.06 9,5 0.38 31,6 1.25 12,47 0.491 MAX 0.56 0,15 0.006 20,3 0.80 SURFMATE INPUT CONNECTOR PCB MODULE 134 56 7 89 MODULE EXCHANGE TOOL MODULE EXCHANGE TOOL- BOTH ENDS (PARTIAL) MODULE BASEPLATE PCB SURFMATE OUTPUT CONNECTOR DETAIL C REF BOTTOM OF CAP TO TOP OF PCB EXCHANGE TOOL HOOK AREA, 4 PLCS (BOTH ENDS-SEE VIEWS) 38° 55° 0.131 0.467 0.027 0.230 0.115 0.159 0.318 0.034 0.604 0.027 0.277 TYP 0.230 0.065 0.115 0.340 0.202 TYP 0.050 0.027 TYP 0.050 0.027 0.027 0.340 0.226 0.328 0.265 0.254 0.065 0.138 TYP 0.050 TYP 0.050 0.034 0.065 0.027 0.027 0.027 FREE OF SOLDER MASK SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS SOLDER MASK KEEP-OUT AREA EXCEPT ON PADS FREE OF SOLDER MASK
3 VIA HOLES
Ø 0.032 ± 0.003
29 VIA HOLES
Ø 0.032 ± 0.003 2 x Ø 0.316 7 x Ø 0.233
16 VIA HOLES
Ø 0.032 ± 0.003 3 VIA HOLES Ø 0.032 ± 0.003 7 PL Ø 0.016 NON PLATED THRU 7 x Ø 0.016 0.266 0.069 0.313 0.102 0.266 0.069 0.350 0.152 All dimensions are Inch or Inch / Metric ANSI / IPC-D-300 specifications apply for Class “B” boards. Recommended PCB construction: Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number of via holes for connection to power and ground planes shown in Details “A” & “B” for high current applications. Pads to be covered with solder mask except in circular area shown in Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad). Pin Symbol Function Symbol Function Pin Dia. Number (Inches / mm) 1 + +IN N Neutral 0.080 / 2,03 2 PC Prim. Control EMI GRD EMI 0.080 / 2,03 3 PR Parallel NC 0.080 / 2,03 4 –– IN L Line 0.080 / 2,03 5 –– OUT –– Out 0.150 / 3,81 6 –S – Sense EN Enable 0.080 / 2,03 7 SC Sec. Control ST Strap 0.080 / 2,03 8 +S +Sense BOK BUS OK 0.080 / 2,03 9 + +Out + + OUT 0.150 / 3,81 PIN LEGEND Mini FARM 4 www.vicr.com PCB Layout Drawing for Mini Size Module