157T LITTELFUSE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 3

Technical content

Features

Electrical Characteristics for Series

  • Surface Mountable, Time-Lag Fuse.
  • Fully compatible with RoHS/Pb-Free solder alloys and higher temperature profiles associated with leadfree assembly.
  • Easily replaceable on PC Board (Field Replaceable)
  • RoHS Compliant and Halogen-free
  • Available in ratings of 0.375 ~ 5 Amperes. % of Ampere Rating % of Ampere Rating Opening Time at 25ºC 100% 0.375A ~ 5A 4 hours, Minimum 200% 0.375A ~ 5A 1 sec. Minimum, 60 secs. Maximum 300% 0.375A ~ 5A 0.20 secs. Minimum, 3.00 secs. Maximum 800% 0.375A ~ 5A 0.02 secs. Minimum, 0.10 secs. Maximum

Applications

Rating (A) Amp Code Max Voltage Rating (V) Interrupting Rating (A) Fuse Furnished Nominal Cold Resistance (Ohms) Nominal Melting I2t (A2sec) Agency Approvals PS E 0.375 .375 125 50A @ 125VAC/VDC 0454.375 1 .2214 0.101 X 1 .00 001 125 0454001 . 0.2245 1 .98 X X 2.00 002 125 0454002. 0.0629 8.20 X X 3.00 003 125 0454003. 0.0342 20.16 X X 4.00 004 125 0454004. 0.0188 34.40 X X 5.00 005 125 0454005. 0.0138 53.72 X X Electrical Specifications by Item 1 . Cold resistance measured at less than 10% of rated current at 23ºC. 2. I2t values stated for 8ms opening time. 3. Agency Approval Table Key: X=Approved or Certified, P=Pending and Blank=Not Approved 4. Have special electrical characteristic needs? Contact Littelfuse to learn more about application specific options RoHS

  • Instrumentations
  • Base Stations
  • Telecommunications PS E Application testing is strongly recommended. Additional Information Datasheet SamplesResources

© 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15 Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Average Time Current Curves Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (Min to Max) (ts) 60 – 120 secs Average ramp up rate (Liquidus Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 90 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters T emperature Re-rating Curve 0.001 0.01 0.1 100 0.1 1 10 100 CURRENT IN AMPS TIME IN SECONDS .375A .50A .75A 1.0A 3.0A 2.5A 2.0A 1.5A 3.5A Note: 1 . Rerating depicted in this curve is in addition to the standard derating of 25% for continuous operation. Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature (t 25ºC to peak) Ramp-down Ramp-up Preheat Critical Zone TL to TP

© 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15 Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Materials Body: Ceramic Cap: For 0.375A ~ 5A – Silver plated Brass Clip Plating: Matte Tin Product Marking Body: Brand Logo, Current Rating, “T” for Time-Lag Clip Retention Force applied at fuse center, perpendicular to the long axis (@0.75 lbs. MIN) Solderability MIL -STD-202, Method 208 / IPC/ EIA / JEDEC J-STD-002, Test Condition A Humidity T est MIL –STD-202, Method 103 @ 85ºC / 85%RH, 1000 hours Resistance to Solvents MIL -STD-202, Method 215 (3 solvent types) Product Characteristics Operating T emperature -55ºC to 125ºC with proper derating Thermal Shock MIL -STD-202, Method 107 , Test Condition B (5 cycles -65ºC to +125ºC) Vibration MIL -STD-202, Method 201 (10-55 Hz) Moisture Resistance MIL -STD-202, Method 106, 10 cycles Salt Spray/ Atmosphere MIL -STD-202, Method 101, Test Condition B (48 hrs.), 5% NaCl in De-ionized Water Shock MIL -STD-202, Method 213, Test Condition I (100 G’s peak for 6 milliseconds) Dimensions 6.10 [0.240] 1.45 [0.057] 2.69 [0.106] 2.69 [0.106] 3.7 ± 0.13 [0.146] L 1 A F 6.50 ± 0.20 [0.256] T 3.90 ± 0.13 [0.154] 2.50 ± 0.2 [0.098] 3.70 [0.146] 3.40 [0.134] "A" "B" 0.10 7.26 [0.29] 3.00 [0.12] 2.46 [0.10] 2.40 [0.09] Packaging Packaging Option Packaging Specification Quantity Quantity & Packaging Code Tape and Reel Surface Mount 1500 DRT Part Numbering System 0157 005. D R T SERIES AMP CODE QUANTITY CODE PACKING OPTION D = 1500 pcs R = Tape and Reel PCB Recommendation for Thermal Management 1 . Minimum Copper Layer Thickness = 100um 2. Minimum Copper Trace Width = 10mm Note: Alternate methods of thermal management may be used. In such cases, under normal operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC ambient environment. TIME-LAG FUSE