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Low Profile Mini Spring™ Inductors Document 404-1 Document 404-1 Revised 10/13/15 Part Inductance2 Percent Q2 SRF min4 DCR max5 Irms6 Wt number1 Turns (nH) tol3 min (GHz) (mOhm) (A) (mg) 1508-5N5_L_ 3 5.5 5,2 115 5.0 2.6 4.0 52 1508-9N0_L_ 4 9.0 5,2 120 4.0 3.4 4.0 65 1508-13N_L_ 5 13.0 5,2 100 3.0 3.9 4.0 78 2508-16N_L_ 7 16.0 5,2 110 3.0 5.2 4.0 110 2508-18N_L_ 8 18.0 5,2 110 2.9 6.0 4.0 118 2508-23N_L_ 9 23.0 5,2 110 2.6 6.8 4.0 133 2508-27N_L_ 10 27.0 5,2 110 2.3 7.9 4.0 147 1. Specify tolerance, termination and packaging codes: 2508-27NJLC Tolerance: G = 2% J = 5% Termination: L = RoHS compliant tin-silver (96.5/3.5) over copper. Special order: T = RoHS tin-silver-copper (95.5/4/0.5) or S = non-RoHS tin-lead (63/37). Packaging: C = 7″ machine-ready reel. EIA-481 embossed plastic tape (1000 parts per full reel). B = Less than full reel. In tape, but not machine ready. To have a leader and trailer added ($25 charge), use code letter C instead. D = 13″ machine-ready reel. EIA-481 embossed plastic tape. Factory order only, not stocked (3500 parts per full reel). Designer’s Kit C394 contains 10 samples each 5% part Designer’s Kit C394-2 contains 10 samples each 2% part Terminations RoHS compliant tin-silver over copper. Other termina- tions available at additional cost. Weight 48 – 130 g Ambient temperature –40°C to +125°C with Irms current Maximum part temperature +140°C (ambient + temp rise). Storage temperature Component: –40°C to +140°C. Tape and reel packaging: –40°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +5 to +70 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Failures in Time (FIT) / Mean Time Between Failures (MTBF) One per billion hours / one billion hours, calculated per Telcordia SR-332 Packaging 1000/7″ reel; 3500/13″ reel Plastic tape: 2 mm wide, 0.23 mm thick, 8 mm pocket spacing, 2.2 mm pocket depth PCB washing Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.
- Only 2 mm tall
- High Q over a wide range of frequencies
- Low DCR and excellent current handling capability 2. L and Q measured at 250 MHz, 0.1 Vrms, 0 A using an Agilent/HP 4291A impedance analyzer with an Agilent/HP 16193A test fixture. 3. Tolerances in bold are stocked for immediate shipment. 4. SRF measured using an Agilent/HP 8753 network analyzer and a Coil- craft SMD-D test fixture. 5. DCR measured using a micro-ohmmeter. 6. Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. 7. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Low Profile Mini Spring™ Inductors Typical L vs Frequency Typical Q vs Frequency 11 0 100 100001000 Frequency (MHz) 250 275 300 225 200 175 150 125 100 Q factor 13.0 nH 16.0 nH 18.0 nH 23.0 nH 27.0 nH 11 0 100 1000 10000 Frequency (MHz) Inductance (nH 13.0 nH 16.0 nH 18.0 nH 23.0 nH 27.0 nH Dimensions are in inches mm Document 404-2 Revised 10/13/15