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PCN LEADFREE PLATING FOR SO8 PACKAGE IN MUAR first lines 2003/02/7 PRODUCT/PROCESS CHANGE NOTIFICATION
Product Family /Commercial Product STANDARD LINEAR products in SO8 package Type Of Change Package assembly process change Reason For Change Environmental directive Description of the change To remove lead from plating by using preplating nickel palladium gold leadframe NiPdAu. This change will not affect ELECTRICAL & MECHANICAL parameters. Samples available: LM393DT/LM358DT. Other samples: on request. PLEASE BOOK YOUR SAMPLE ORDER IN NON-STANDARD WITH THE FOLLOWING COMMENT "AS PER LEADFREE PCN DSG-COM/03/145". Forecasted date of change 07-May-2003 Forecasted date of samples for customer 07-Feb-2003 Forecasted date for STMicroelectronics change 07-Feb-2003 qualification report availability Marking to identify changed product "E" letter on the package close to ST LOGO Description of qualification program See Attached Qualification Plan Product Line(s) and/or Part Number(s) See Attached List Manufacturing Location(s) Estimated Date of first shipment 07-May-2003 Division Product Manager Jean Claude KAIRE Date: Jan.29 ,03 Division Q.A. Manager Francoise PACCARD Date: Jan.29 ,03 Qualification Plan Denied Name: Qualification Plan Approved Title: Customer Acknowledgement of Receipt PCN DSG-COM/03/145 Please sign and return to STMicroelectronics Sales Office Company: Change Denied Date: Change Approved Signature: Remark 2003/02/7
Prepared by JM Bugnard Page 1/9 Process Change/ Transfer Qualification report n° QASO8N91 Reference documents: SOP 2.5.9 Process critical and key parameters
0076604 Process Qualification and release to production
0078588 Reliability requirements for product qualification
0046008 Process control plan for Fro nt End
0060531 FMEA procedure
0061050 Back end qualification procedure
0091984 Construction analysis
7006451 Management of manufacturing source change
0033689 Process flow chart
PCN reference: DSG-COM/03/145 Qualification Report n°: QASO8N91 Qualification Type: Material change Process: Leadfree plating New glue Hitachi 4900 Date of issue: 22th January 2003
Prepared by JM Bugnard Page 2/9 Process Change/ Transfer Qualification report n° QASO8N91 Content
1 PROCESS MAIN SPECIFICATI ON CHANGE
1.1 Process change description
1.2 Process main specification change
1.3 Possible effects of change on Parametric, Electrical, Quality or Reliability
2 QUALIFICATION PLAN
2.1 Test vehicle description
2.2 Process qualification requirements
2.3 EWS qualification requirements
2.4 Final Test qualification requirements
2.5 Bench Test requirements
2.6 Reliability qualification requirements
3 QUALIFICATION RESULTS
3.1 Process qualification results
3.2 EWS qualification results
3.3 Final Test qualifi cation results
3.4 Bench Test qualification results
3.5 Reliability qualification results
4 PROCESS CHANGE QUALIFICATION CERTIFICATE
Prepared by JM Bugnard Page 3/9 Process Change/ Transfer Qualification report n° QASO8N91 1. PROCESS MAIN SPECIFI CATION CHANGE 1.1 Process change description.
1.1.1 Nature of Change: Leadfree plating NiPdAu preplated le adframe and glue change (Hitachi
4900) 1.1.2 Reason for Change: To be compliant with Environmental directives.
1.1.3 Affected process: SO8 assembled in ST Muar
1.1.4 Affected products: All standard linear devices assembled in SO8
1.1.5 Implementation date: April 2003
1.2 DETAILLED D ESCRIPTION OF CHANGE
New Process Current Process Assembly site ST Muar (Malaysia) ST Muar (Malaysia) Assembly flow + Control Plan 7124337 7071671 Frame (material) Copper + NiPdAu preplating Copper Die attach material Hitachi 4900ST Ablebond 839 0 Wire material Wire diameter Gold
1 MIL
Mold compound MP8000 CH4 MP8000 CH4 Wire bond method Thermosonic Thermosonic Lead finishing NiPdAu (preplated) Tin plating (SnPb85/15) LEAD-FREE components are defined by STMicroelectronics as EC OPACK® comp onents. The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used the lead finishing of components. The identification of ECOPACK products will be achieved through specific labelling on co mponent boxes. Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package body.
1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR
No effect on solderability: ECOPACK components a re solderable with both current SnPb and AgSnCu lead - free PCB assembly pro cesses. Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs in SO Narrow in order to meet the higher soldering te m perature constraints required for lead -free soldering using, in particular, the IPC/JEDEC JSTD020B standard as re ference.
Prepared by JM Bugnard Page 4/9 Process Change/ Transfer Qualification report n° QASO8N91 2. QUALIFICATION PLAN
2.1 PROCESS QUALIFICATION REQUIREMENTS
2.1.1 Flow Chart comparison (1) yes [ X ] no [ ] N/A [ ]
2.1.2 Control Plan comparison (1) yes [ X ] no [ ] N/A [ ]
2.1.3 FMEA study (1) yes [ X ] no [ ] N/A [ ]
2.1.4 Process construction analysis (1) yes [ X ] no [ ] N/A [ ]
2.1.5 Quantity of qualification lots [ ] 1 [ ] 2 [ X ] 3 [ ] 4
2.1.6 Critical parametric parameters analysis (Cpk) yes [X ] no [ ] N/A [ ]
Bond pull test, Bond shear test.
2.1.7 Non critical parameters analysis (Mean) yes [X ] no [ ] N/A [ ]
Note 1: as described in related ADCS procedure 2.2 Test Vehicles (TV) description. Line Sales Type P&L Dice size Package Assy Reliab plant Lot # 0431* TL431CD 71 1.38x1.12mm SO8 ST Muar Grenoble +Muar 1 0158* LM358D 71 1.07x1.01 SO8 ST Muar Grenoble 1 0082* TL082CD 71 1.74x1.48 SO8 ST Muar Muar 1 * shrinked die version
2.3 FINAL TEST QUALIFICATION REQUIREMENTS [ x ] yes [ ] no
2.3.1 Quantity of qualification lots [ ] 1 [X ] 2 [ ] 3
2.3.2 Lot average yield data: [ ] 1 [ X ] 2 [ ] 3
2.3.3 Package type SO8
2.3.4 Parameter distributions [X ] N/A [ ] LotA [ ] LotB [ ] Lot C
2.3.4.1List of parameters:
2.3.4.2 Qualification criteria: N/A
2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS
[ X] yes [ ] no [ ]N/A Construction analysis conforms to ST specification.
2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes [ ] no [x] N/A
2.5.1 ESD [] yes [ x ] no
2.5.1 Latch-up [] yes [ x ] no
Prepared by JM Bugnard Page 5/9 Process Change/ Transfer Qualification report n° QASO8N91
2.6 RELIABILITY QUALIFICATION REQUIREMENTS [x] yes [] no
2.6.1 Reliability tests performed on [x] LotA [x] LotB [x] LotC
2.6.2 Reliability tests:
Tests Conditions Test LotA LotB LotC Comments HTB Ta=125°C Vs=absolute max rating 1000h X X X Purpose: to point out problems connected to electrical stress related with the field application condition Environment Sequence PPT 3 atm. + TMC 48h 100 cy. X X X THB Ta=85C RH=85pct Vs=nominal 1000h X X X Purpose: To point out failure mechanism mainly due to electrochemical effects developped inside the device for contamination ions and electrical field applied TMC Ta=-65/+150C 1000c X X X Purpose: to point out the thermomechanical mismatch among the different materials employed PPT Ta=121°C P=2atm 480h X X X Purpose: to point out critical water entry path with consequential electrolytic and galvanic corrosion. Jedel level determination Jedel level 1 168h 85°C / 85%RH + 3IR reflow soldering X* X X Purpose: To point out problem connected to the reflow soldering. TMSK Ta=-65/+150C 500shk X X Purpose: to point out the thermomechanical mismatch among the different materials employed * With 260°C reflow peak (see Appendix 1) ** With 245°C reflow peak (see Appendix 1)
2.6.3 Drift analysis on Vio parameter (HTB & THB) [x yes [ ] no
2.6.4 Qualification criteria: no reject after reliability.
Prepared by JM Bugnard Page 6/9 Process Change/ Transfer Qualification report n° QASO8N91 3. QUALIFICATION RESULT S 3.1 Process qualification results. Bond Pull Test Device Wire size Min Max Average Stdev Cpk comments TL431CD LM358CD 1.0mil 1.0 mil 8.3g 8.5g 14.4g 12.7g 10.9 10.5 1.34 1.26 1.72
1.71 Minimum specification: 4g
Device Wire size Min Max Average Stdev Cpk comments TL431CD LM358CD 1.0mil 1.0 mil 45.0g 43.2g 65.4g 60.8g 57.2 53.1 5.72 5.04 1.94
1.92 Minimum specification: 32g
3.2 Bench Test qualification results
3.2.1 X-ray analysis
3.2.2 External visual
NiPdAu plating: No exposed copper Surface finish: Uniform stains free & uniform print Cracks: Not visible at x10 Resin holes: not visible at x10 Other: No other visual defect
3.2.3 Scanning acoustic mi croscopy
No delamination.
3.2.4 Microsection
Resin holes: no void Glue thickness: conform (min: 11.3µm, max 11.8µm) Glue voids: no void Die tilt: conform (0.5µm) Die scribing: conform NiPdAu plating thickness: conform Package alignment : conform
3.2.5 Decapped devices
Loop height: conform Ball size variation: conform Bond shape: conform: Bond centering: conform Weld shape: conform Weld centering: conform Die scribing: conform Die chipping: conform
Prepared by JM Bugnard Page 7/9 Process Change/ Transfer Qualification report n° QASO8N91
3.2.6 External dimension measurement
3.2.7 Solderability
Conform (both after 24h steam aging and 24 hours dry air) on 80 units
3.3 FINAL TEST QUALIFICATION
Test Yield 99.75% 99.91
3.4 Reliability qualification results
Test Conditions Duration Steps Lot 1 TL431CD Lot 2 LM358D Lot 3 TL082CD TMC -65/+150°C 1000 cy 100cy 1000cy TMSK -65/+150°C 500 shks 100 shks 500shks PPT 121°C, 2atm. 480 hours 168h 240h 480h Envir. Sequ. TMC + PPT 100cy + 48h 100cy 48h HTB 125°C 1000 h 168 1000h THB 85°C, 85%HR 1000 h 168 1000h RSM 245°C 0/20 + 0/15 0/15 0/20 RSM 260°C 0/20 0/20 Test marked in blue performed in ST Muar
3.4.1 Drift analysis
HTB (mean Vref drift) TL431CD 2.57mV 1.88mV THB (mean Vref drift) TL431CD 0.54mV 1.17mV HTB (mean Vio drift) LM358D 0.047mV 0.108 THB (mean Vio drift) LM358D -0.01mV 0.05 HTB (mean Vio drift) TL082CD 0.32mV 0.29mV THB (mean Vio drift) TL082CD 0.20mV 0.15mV
Prepared by JM Bugnard Page 8/9 Process Change/ Transfer Qualification report n° QASO8N91 PROCESS CHANGE QUALI FICATION CERTIFICATE (7420046) PROCESS or PACKAGE: SO8 NRS NiPdAu preplated frame qualification PLANT: Muar Malaysia CERTIFICATE NUMBER C212SON1 GROUPS INVOLVED DSG DIVISION INVOLVED Standard linear IC’s TRANSFER TO PLANT TRANSFER FROM PLANT DESIGN RULE MANUAL 0018063 PROCESS FMEA 7141456 PROCESS FLOW CHART 7124337 PROCESS CONTROL PLAN 7124337 PARAMETRIC TESTING DOCUMENTATION N/A WLR N/A RELIABILITY REPORT QASONIP1 CONSTRUCTION ANALY SIS REPORT NO 09/02 ASSEMBLY REPORT Muar ASM PPF Qual. run QUALIFICATION REPORT QASONIP1 TEST VEHICLE PROCESS Bipolar TEST VEHICLE PACKAGE SO8 TEST VEHICLE SALES TYPE TL0431CD, LM358D, TL082CD Approval Group Name Date DSG PROD.ENG. STD LINEAR NATHALIE BANCHERI 24-DEC-2002 DSG PROD.ENG. MANAGER STD LINEAR ALAIN CHASSAGNEUX 20-DEC-2002 DSG QUALITY MANAGT GNB FRANCOISE PACCARD 07-JAN-2003 QA DIRECTOR ST MUAR RICHARD WONG 24-DEC-2002
Prepared by JM Bugnard Page 9/9 Process Change/ Transfer Qualification report n° QASO8N91 APPENDIX 1 INFRARED REFLOW SOLD ERING
Information furnished is believed to be accurate and reliable . However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from it's use. No license is granted by implication or otherwise under any patents or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorised for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics c 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hongkong - India - Israel - Italy - Japan - Malaysia - Malta - Morroco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com 2003/02/7