97-68340 ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- Convert surface mount QFP packages to a 15x15 PGA footprint
- Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs
- Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact
- Consult factory for panelized form or for mounting of consigned chips GENERAL SPECIFICATIONS
- ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces
- PADS: bare Cu protected with ENIG or immersion white Sn to eliminate copla- narity concerns and solder bridges associated with hot air solder leveling
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: 200μ [5.08μ] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per ASTM B 545 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290
- OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS
- Will plug into standard PGA sockets 18025 Rev. AA P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter
ORDERING INFORMATION
P/N 97-68340-P for Panelized Form P/N 145-PGM15024-30 for Wire Wrap PGA Socket CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW ±0.003 [±0.08] PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS