SE2605L SKYWORKS | Alldatasheet
Document overview
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Technical content
Features
Linear output power for IEEE 802.11n, 64-QAM, EVM ≤ 3% = +26 dBm @ 5.0 V High gain: 32 dB Power shutdown mode Superior gain flatness Fully matched at RF input/output ports Load insensitive power detector Small footprint QFN (16-pin, 3 x 3 mm) SMT package (MSL3, 260 C per JEDEC J-STD-020) Skyworks GreenTM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of GreenTM, document number SQ04–0074.
Description
The SE2605L is a 2 GHz Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SE2605L ideal for Wireless Local Area Network (WLAN IEEE 802.11n) applications. The device is fabricated using SiGe BiCMOS technology. The device is internally matched and mounted in a 20-pin, 4 x 4 mm Quad Flat No-Lead (QFN) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. A block diagram of the SE2605L is shown in Figure 1.The device package and pinout for the 16-pin QFN are shown in Figure 2. Signal pin assignments and functional pin descriptions are described in Table 1. RF_IN PA_EN RF_OUTInput Match Bias Inter-Stage Match Detector Y0252 Inter-Stage Match VDET VCC3VCC2VCC1 Figure 1. SE2605L Block Diagram
Figure 2. SE2605L Pinout Table 1. SE2605L Signal Descriptions
1 RF_IN RF Input 9 GND Ground
2 EN Power amplifier enable 10 RF_OUT RF output
3 GND Ground 11 RF_OUT RF output
4 VCC0 Power supply for bias circuit 12 GND Ground
5 GND Ground 13 VCC2 Power supply for second stage
6 GND Ground 14 N/C Not connected. Can be left floating or grounded.
7 DET Power detector output 15 VCC1 Power Supply driver stages
Table 2. Recommended operating conditions are specified in Table 3. Electrical specifications are provided in Tables 4, 5,
Table 2. SE2605L Absolute Maximum Ratings1 at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2605L Recommended Operating Conditions Table 4. SE2605L Electrical Specifications: DC Characteristics1 1 Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2605L Electrical Specifications: General1
11 Mbps CCK signal,
1 Performance is guaranteed only under the conditions listed in this table. Table 6. SE2605L Electrical Specifications: Power Detector Characteristics1 1 Performance is guaranteed only under the conditions listed in this table.
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 5 Evaluation Board Description The SE2605L Evaluation Board is used to test the performance of the SE2605L WLAN PA. A schematic diagram of the SE2605L Evaluation Board is shown in Figure 3. A photograph of the Evaluation Board is shown in Figure 4. Component values for the SE2605L Evaluation Board are listed in Table 7. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SE2605L has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. Refer to the schematic drawing in Figure 3 for further details. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. NOTE: A poor connection between the slug and ground increases junction temperature (T J), which reduces the life of the device. Evaluation Board Setup Procedure 1. Connect system ground to pin 1 of connector J5. 2. Apply 5.0 V to pins 3 and 4 of connector J5. 3. By applying 3.3 V on PA_EN (pin 1 of the J4 header), the PA is enabled. By placing a ground on PA_EN, the PA is disabled and placed in a shutdown state, drawing minimal current. 4. The 2 GHz amplifier performance can be monitored by applying an RF signal to connector J1 (RF_IN). Monitor the output power on the RF_OUT port connector, J1. Detector performance can be monitored on pin 4 of connector J4. CAUTION: Do not overdrive the amplifier by applying too much RF on the device input. A suitable starting input power setting is –20 dBm.
Figure 3. SE2605L Evaluation Board Schematic
Figure 4. SE2605L Evaluation Board Table 7. SE2605L Evaluation Board Bill of Materials
Figure 5. Typical part markings are shown in Figure 6. Package dimensions are provided in Figure 8. part is subjected to high temperature during solder assembly. Solder Reflow Information, document number 200164. done manually or in a production solder reflow environment.
- All dimensions are in millimeters.
- Dimensions and tolerances per ASME Y14.5M-1994.
- Unless specified, dimensions are symmetrical about center lines.
- Via hole recommendations:
Should be tented with solder mask on PCB backside and filled with solder.
- Stencil recommendations: 0.127 mm stencil thickness.
- Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage
of solder mask openings, except as noted.
0.675 Typ
0.35 Typ
0.60 Typ
1.700.58 Typ
0.50 Typ
0.25 Typ
Figure 5. PCB Layout Footprint for the SE2605L
Figure 6. Typical Part Markings
0.15 C2X
0.300 X 45°
- All measurements are in millimeters.
- Dimensioning and tolerancing according to ASME Y14.5M-1994.
- Terminal #1 identification mark located within marked area.
- Coplanarity applies to the exposed heat sink ground pad as well as the terminals.
- Unless specified, dimensions are symmetrical about center lines.
0.05 M C
0.10 M C A B
Figure 7. SE2605L Package Dimensions
- Carrier tape material: black conductive polycarbonate
- Cover tape material: transparent conductive PSA
- Cover tape size: 9.3 mm width
- ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC
- All measurements are in millimeters
Figure 8. SE2605L Tape and Reel Dimensions
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 11
Ordering Information
Model Name Manufacturing Part Number Evaluation Board Part Number SE2605L High Power WLAN Power Amplifier SE2605L SE2605L-EK1 Copyright © 2012-2014, 2016 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.