127-20 WAKEFIELDTHERMAL | Alldatasheet
Document overview
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Technical content
wakefieldthermal.com The 127-20 Series is an advanced thermal interface material, formulated as a hybrid phase change material without diluents or solvents for optimal performance. This dispensable, screen-printable compound achieves ultra-low bond line thickness and unmatched thermal conductivity. Engineered to resist pump-out, outgassing and phase separation, the 127-20 Series eliminates concerns over silicone deposition on sensitive optics and electronics. It meets the demanding thermal and reliability needs of high-speed chipsets and graphic processors while remaining halogen-free and fully RoHS and REACH compliant. With its stay-put viscosity, The 127-20 Series is ideal for precision application in the most complex assemblies. Experience thermal excellence with no tradeoffs in stability or safety - upgrade to our 127-20 Series for your next-generation designs. Thermal interface extreme Performance phase change thermal compound
features
- High thermal conductivity on par with metallic TIMs(20 W/m-K)
- Non-evaporative materials with minimal pump out
- Nonconducting & nonreactive for use on any alloy/metal
- Ultra-low BL T
- 2.5 Year shelf life
APPLICATIONs
- Interface for semiconductors requiring low pressure or spring clamp mounting
- Thermal sensors, TEC modules, thermal wells
- IGBT’s, LED
- Power Transistors, diodes, power resistors size Part Number: 127-20 (10cc Syringe) Other sizes available upon request material data sheet127-20 Disclaimer: All statements, technical information, and recommendations related to Wakefield Thermal products are based on information believed to be reliable, but accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You must assume all risks and liability associated with such use. Wakefield Thermal will not be liable for any indirect, special, incidental or consequential loss or damage arising from this product, regardless of legal theory asserted. Installation Instructions: 1. Thoroughly clean and dry the mating surfaces with Isopropyl alcohol. 2. Apply a thin layer of thermal compound to achieve 4-10 micron thickness. 3. Join surfaces while gently rotating to spread the compound evenly. 4. Apply continuous pressure of at least 30 kPa to fully mate surfaces without separating the two surfaces. 5. Thermal cycle above 50°C to fully cure and activate the phase change properties. Safety Information: Should be used with caution. Avoid contact with eyes and skin by wearing gloves and safety goggles. Do not ingest. Read all safety data sheets and instructions thoroughly prior to use. TYPICAL PROPERTY RESUL TS Type Silicone free, hybrid phase change paste Special future Extreme thermal conductivity. Zero pump out. No-solvent Color Light grey Viscosity, cps 280000 Specific gravity 2.5 Operating temperature range °C -50°C to 200°C Shelf life @25C 2.5 Years Bondline Thickness 4-10 microns (Preferred) 100 microns maximum THERMAL Thermal conductivity (W/m-K) 12 and 20 Recommended maximum temperature 130°C Phase change and cure temperature 50°C (122°F) ELECTRICAL Breakdown voltage (VAC/mil) 200 Outgassing, % TML 0.15% TML Volume resistivity 1014 ohm-cm