1110087 ARIES | Alldatasheet
Document overview
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Technical content
Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
- INFO@ARIESELEC.COMWWW.ARIESELEC.COM
FEATURES
- Convert surface-mount VQFP packages to a 13 x 13 PGA footprint.
- Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs.
- Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact.
- Consult factory for Panelized Form or for mounting of consigned chips. GENERAL SPECIFICATIONS
- ADAPTER BODY: FR-4 with 1-oz. Cu traces
- PADS: ENIG (Au over Ni) plated to eliminate coplanarity concerns
- PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE-AMS-QQ-N-290
- OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS
- Will plug into Standard PGA Sockets. 18040 Rev. AA P/N 1110087 144-Pin VQFP-to-PGA Adapter
ORDERING INFORMATION
P/N 1110087-P for Panelized Form CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW ±0.003 [±0.08] PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS