STL110N10F7 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 15

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuits
  • 4 Package mechanical data
  • 5 Packaging mechanical data
  • 6 Revision history

Features

  • Among the lowest RDS(on) on the market
  • Excellent figure of merit (FoM)
  • Low Crss/Ciss ratio for EMI immunity
  • High avalanche ruggedness

Applications

  • Switching applications

Description

This N-channel Power MOSFET utilizes the STripFET™ H7 technology with a trench gate structure combined with extremely low on- resistance. The device also offers ultra-low capacitances for higher switching frequency operations. PowerFLAT™5x6 AM15540v2 5678 12 34 Top View D(5, 6, 7, 8) G(4) S(1, 2, 3) Order code V DS RDS(on) max I D PTOT STL110N10F7 100 V 0.006 Ω (VGS= 10 V) 107 A 136 W Table 1. Device summary

1 Electrical ratings

Table 2. Absolute maximum ratings

  1. This value is rated according to R thj-c.
  2. This value is rated according to R thj-pcb.
  3. Pulse width limited by safe operating area.
  4. Starting T j=25 °C, Id=18 A, Vdd=50 V

Table 3. Thermal resistance

  1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec

2 Electrical characteristics

Table 4. On/off states Table 5. Dynamic Table 6. Switching times

Table 7. Source drain diode

  1. Pulse width limited by safe operating area
  2. Pulsed: pulse duration=300 µs, duty cycle 1.5%

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Gate charge vs gate-source voltage Figure 7. Static drain-source on-resistance

70 VDS=2V

3 Test circuits

Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Figure 19. PowerFLAT™ 5x6 type S-C mechanical data

Figure 20. PowerFLAT™ 5x6 recommended footprint (dimensions in mm) Table 8. PowerFLAT™ 5x6 type S-C mechanical data

5 Packaging mechanical data

Figure 21. PowerFLAT™ 5x6 tape (a) Figure 22. PowerFLAT™ 5x6 package orientation in carrier tape a. All dimensions are in millimeters. hole to centerline of pocket.

Figure 23. PowerFLAT™ 5x6 reel

6 Revision history

Table 9. Document revision history 03-Dec-2012 1 First release. – Updated title and features on cover page. – Updated Section 4: Package mechanical data.