MC10H158_06 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
- Propagation Delay, 1.5 ns Typical
- Power Dissipation, 197 mW Typical
- Improved Noise Margin 150 mV (Over Operating V oltage and Temperature Range)
- V oltage Compensated
- MECL 10K Compatible
- Pb−Free Packages are Available* DIP PIN ASSIGNMENT D11 D10 D01 D00 NC V EE VCC D20 D21 D30 D31 SELECT TRUTH TABLE Select D0 D1 Q LL L X LH H X HX L L HX H H Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. CDIP−16 L SUFFIX CASE 620A MARKING DIAGRAMS* PDIP−16 P SUFFIX CASE 648 http://onsemi.com *For additional marking information, refer to See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
SOEIAJ−16 CASE 966 MC10H158P AWLYYWWG MC10H158L AWLYYWW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G= P b −Free Package 10H158 ALYWG PLLC−20 FN SUFFIX CASE 775 20 1 10H158G AWLYYWW 12 0
Table 1. MAXIMUM RATINGS damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%)
- Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
maintained. Outputs are terminated through a 50 /C0087 resistor to −2.0 V. Table 3. AC PARAMETERS values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com LOGIC DIAGRAM VCC = PIN 16 VEE = PIN 8 SELECT 9 D0 1 5 D0 0 6 D1 1 3 D1 0 4 D2 1 12 D2 0 13 D3 1 10 D3 0 11 1 Q0 2 Q1 15 Q2 14 Q3 Device Package Shipping† MC10H158FN PLLC−20 46 Units / Rail MC10H158FNG PLLC−20 (Pb−Free)
46 Units / Rail
MC10H158FNR2 PLLC−20 500 / Tape & Reel MC10H158FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H158L CDIP−16 25 Unit / Rail MC10H158M SOEIAJ−16 50 Unit / Rail MC10H158MG SOEIAJ−16 (Pb−Free)
50 Unit / Rail
MC10H158MEL SOEIAJ−16 2000 / Tape & Reel MC10H158MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H158P PDIP−16 25 Unit / Rail MC10H158PG PDIP−16 (Pb−Free)
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
http://onsemi.com PACKAGE DIMENSIONS −M− −N− −L− Y BRK W V D D SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST SL−MS0.010 (0.250) N STX G1 B U Z VIEW D−D 20 1 SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST SL−MS0.010 (0.250) N ST C G VIEW S E J R Z A 0.004 (0.100) −T− SEATING PLANE SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST H VIEW S K F
20 LEAD PLLC
CASE 775−02 ISSUE E NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 /C0095/C0095/C0095/C0095
http://onsemi.com PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A HE DIM MIN MAX MIN MAX INCHES MILLIMETERS 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 BSC 0.050 BSC 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0.70 0.90 0.028 0.035 A HE LE /C009510 /C00950 /C009510 /C0095 LE /C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M L DETAIL P VIEW P c A b e 16 9 D Z E A b c D E e L M Z CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10. F E N K C SEATING PLANE AM0.25 (0.010) T M L DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01 /C0095/C0095/C0095/C0095 A B AB G 16X D BM0.25 (0.010) T T 16X J
http://onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− B F C S H G D J L M 16 PL SEATING 916 K PLANE−T− MAM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01 /C0095/C0095/C0095/C0095 PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 MC10H158/D MECL 10H and MECL 10K are trademarks of Motorola, Inc. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.