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05-JAN-2011 Rev. C Wire To Board Serial, Pitch 1.25mm DR DATE APVD DATE Angus Wu 11-NOV-2005 Wei-Jer Ke 11-NOV-2005 ©2010 Tyco Electronics Corporation Taipei, Taiwan All International Rights Reserved. * Trademark │ Indicates change For latest revision, visit our website at www.tycoelectronics.com\\documents. For Regional Customer Service, visit our website at www.tycoelectronics.com 1 of 4 LOC DW 1. SCOPE 1.1. CONTENTS This specification covers the performance, tests and quality requirements for the Wire To Board Serial connector. 1.2. QUALIFICATION When tests are performed on the subject product line, the procedures specified in AMP 109 series specifications shall be used. All inspections s hall be performed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENT The following AMP documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence.

2.1 AMP DOCUMENTS

A. 109-1: General Requirements for Test Specifications B. 109 series: Test Specification as indicated in Figure 1 (Comply with MIL-STD-202, MIL-STD-1344 and EIA RS-364) C. Corporate Bulletin 401-76: Cr oss-reference between AMP test Specifications and Military or Commercial Documents. D. 501-57299: Test Report. 3. REQUIREMENTS 3.1. DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. MATERIALS A. Contact Material: Copper Alloy. Finish: Tin-Lead or Matte-Tin over Nickel plated. B. Housing Material: Thermoplastic, natural color. 3.3. RATINGS A. Voltage: 100 VAC rms. B. Current: 1 A for AWG#28

C. Temperature: -25 °C to 85°C 3.4. PERFOMANCE AND TEST DESCRIPTION The product is designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1 unless otherwi se specified. All tests are performed at ambient environmental conditions per AMP Specification 109-1 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY Test Item Requirement Procedure

1 Examination of Product Meets requirements of product

drawing. No physical damage. Visual inspection Electrical Requirement

2 Termination Resistance 20 m: Max

Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. 3 Insulation Resistance 1000 M: Min. (Initial) 100 M: Min. (Finial) Impressed voltage 500 VDC Test between adjacent circuits and contact

4 Dielectric withstanding

flashover shall occur. Current leakage: 0.5 mA MAX

500 VAC for 1minute

Test between adjacent circuits and contact 5 Temperature Rising 30C° Max. under loaded rating current Contact series-wired, apply test current of loaded rating current to the circuit, and measure the temperature rising by probing on soldered areas of contacts, after the temperature becomes stabilized deduct ambient temperature from the measured value. Mechanical Requirement 6 Connector Mating Force 1 kgf/pin Max. Operation Speed: 10 mm/min. Measure the force required to mat e connector 7 Connector Unmating Force 0.1 kgf/pin Min. Operation Speed: 10 mm/min. Measure the force required to unmate connector 8 Durability See note. Operation Speed: 10 cycle/min. No. of Cycles: 25 Cycles Figure 1 (cont.)

Test Item Requirement Procedure Mechanical Requirement

9 Vibration

No electrical discontinuity greater than 1 microsecond shall occur. See note. Subject mated connectors to 10-55-10 Hz traversed in 1 minute at 1.52mm amplitude 2 Hours each of 3 mutually perpendicular planes, passing DC 1mA current during the test.

10 Physical Shock

No electrical discontinuity greater than 1 microsecond shall occur. See note. Accelerate Velocity: 490m/s 2 5 0 G Waveform: Half-sine shock plus Duration: 11msec No. of Drops : 3 drops each to normal and reversed directions of X,Y and Z axes, totally 18 drops, passing DC 1mA current during the test. Environmental Requirements

11 Temperature Life

(Heat Aging) See note. M a t e d C o n n e c t o r 85C°, 250 hours 12 Thermal Shock See note. M a t e d C o n n e c t o r -55+/-3C° (30 minutes), +85+/-2C° (30 minutes) Making this a cycle, repeat 5 cycles 13 Humidity-Temperature Cycle See note. M a t e d C o n n e c t o r 25 – 65C°, 95% R.H., 10 cycles (See Figure 2) 14 Salt Spray See note. Subject mated connectors to 35+/-2C° and 5+/-1% salt condition for 48 hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. Solderability The inspected area of each lead must have 95% solder coverage minimum. Steam Aging Preconditioning: 93°C +3/-5°C, 8 hours ±15 min. Reflow Temperature: 230 - 245°C Reflow Time: 50 - 70 s. JESD22-B102D, Condition C

16 Resistance to Reflow

Soldering Heat See note. Moisture Soak Preconditioning: 85°C and 85% RH. for 168 hours. Preheat Temp.: 150 – 200°C, 60 – 180 s. Time over liquidus (217°C): 60 – 150 s. Peak Temp.: 260 +0/-5°C, 20 – 40 s. Duration: 3 cycles. Tyco spec. 109-201, Condition B NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification and Rrequalification Test Sequence shown in Figure 2. Figure 1 (end)