LH0101 NSC | Alldatasheet
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Features
Y 5 Amp peak, 2 Amp continuous output current Y 300 kHz power bandwidth Y 850 mW standby power ( g15V supplies) Y 300 pA input bias current Y 10 V/ ms slew rate Y Virtually no crossover distortion Y 2 ms settling time to 0.01% Y 5 MHz gain bandwidth Schematic and Connection Diagrams TL/K/5558–1 TL/K/5558–2 Top View Order Numbers LH0101K, LH0101K-MIL, LH0101CK, LH0101AK, LH0101AK-MIL or LH0101ACK See NS Package Number K08A Note: Electrically connected internally, no connection should be made to pin. C1995 National Semiconductor Corporation RRD-B30M115/Printed in U. S. A.
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. (Note 5) Supply Voltage, V S g22V Power Dissipation at T A e 25§C, P D 5W Derate linearly at 25 §C/W to zero at 150 §C, Power Dissipation at T C e 25§C 62W Derate linearly at 2 §C/W to zero at 150 §C Differential Input Voltage, V IN g40V but k gVS Input Voltage Range, V CM g20V but k gVS Thermal ResistanceÐ See Typical Performance Characteristics Peak Output Current (50 ms pulse), I O(PK) 5A Output Short Circuit Duration (within rated power dissipation, R SC e 0.35X,T A e 25§C) Continuous Operating Temperature Range, T A LH0101AC, LH0101C b25§Ct o a85§C LH0101A, LH0101 b55§Ct o a125§C Storage Temperature Range, T STG b65§Ct o a150§C Maximum Junction Temperature, T J 150§C Lead Temperature (Soldering k10 sec.) 260 §C ESD rating to be determined. LH0101AC LH0101C Symbol Parameter Conditions LH0101A LH0101 Units Min Typ Max Min Typ Max VOS Input Offset Voltage 1 3 5 10 mV TMIN s TA s TMAX 71 5 DVOS/DPD Change in (Note 2) Input Offset Voltage 150 300 mV/W with Dissipated Power DVOS/DT Change in V CM e 0 Input Offset Voltage 10 10 mV/§C with Temperature IB Input Bias Current 300 1000 pA TA s TMAX LH0101C/AC 60 60 nA LH0101/A 300 1000 IOS Input Offset Current 75 250 pA TA s TMAX LH0101C/AC 15 15 nA LH0101/A 75 250 AVOL Large Signal V O e g10V R L e 10X 50 200 50 200 V/mVVoltage Gain VO Output Voltage Swing R SC e 0R L e 100X g12 g12.5 g12 g12.5 AV ea 1R L e 10X g11.25 g11.6 g11.25 g11.6 V Note 3 R L e 5X g10.5 g11 g10.5 g11 CMRR Common Mode DVIN e g10V 85 100 85 100Rejection Ratio dB PSRR Power Supply DVS e g5V to g15V 85 100 85 100Rejection Ratio IS Quiescent Supply 28 35 28 35 mACurrent
Symbol Parameter Conditions LH0101A LH0101AC Units Min Typ Max Min Typ Max en Equivalent Input f e 1 kHz 25 25 nV 0HzNoise Voltage CIN Input Capacitance f e 1 MHz 3.0 3.0 pF Power Bandwidth, b3 dB 300 300 kHz SR Slew Rate 7.5 10 10 V/ ms RL e 10X (Note 4) tr,t f Small Signal Rise or AV ea 1 200 200 ns Fall Time Small Signal Overshoot 10 10 % GBW Gain-Bandwidth Product 4.0 5.0 5.0 MHz RL e % (Note 4) ts Large Signal Settling 2.0 2.0 ms Time to 0.01% THD Total Harmonic Distortion P o e 10W, f e 1 kHz 0.008 0.008 %RL e 10X Note 1: Specification is at T A e 25§C. Actual values at operating temperature may differ from the T A e 25§C value. When supply voltages are g15V, quiescent operating junction temperature will rise approximately 20 §C without heat sinking. Accordingly, V OS may change 0.5 mV and I B and I OS will change significantly during warm-ups. Refer to the I B vs. temperature and power dissipation graphs for expected values. Power supply voltage is g15V. Temperature tests are made only at extremes. Note 2: Change in offset voltage with dissipated power is due entirely to average device temperature rise and not to differential thermal feedback effects. Test is performed without any heat sink. Note 3: At light loads, the output swing may be limited by the second stage rather than the output stage. See the application section under ‘‘Output swing enhancement’’ for hints on how to obtain extended operation. Note 4: These parameters are sample tested to 10% LTPD. Note 5: Refer to RETS0101AK for the LH0101AK military specifications and RETS0101K for the LH0101K military specifications.
Typical Performance Characteristics Maximum Power Dissipation Safe Operating Area Current Quiescent Power Supply Input Bias Current Warm-up Input Bias Current after Voltage Range Input Common-Mode Response (open loop) Small Signal Frequency vs. Frequency Output Voltage Swing Ratio vs. Frequency Common-Mode Rejection Ratio vs. Frequency Power Supply Rejection Settling Time Distortion vs. Frequency Total Harmonic TL/K/5558–3
Typical Performance Characteristics (Continued) Distortion vs. Gain Total Harmonic Equivalent Input Noise Voltage with Swing Enhancement Output Voltage Swing Load Resistance Output Voltage Swing vs. Open-Loop Output Resistance Resistance vs. Frequency Open-Loop Output vs. R SC Short Circuit Current TL/K/5558–4 Small Signal Pulse Response (No Load) TL/K/5558–5 Large Signal Pulse Response (R L e 10X) TL/K/5558–6
the amplifier output to the corresponding high or low state. the amplifier in a normal operating mode. ple, in a supply current monitor and/or limiter. not recommended with supply voltages greater than 3V. more than 1 mF bypass on the supply buss. means limited to the LH0101. quality insulation is a must (Kel-F and Teflon rate high). package as well as sockets and printed circuit boards. potential close to that of the inputs. puts and load can cause significant errors. ground system as shown in the figure below. FIGURE 1. Single-Point Grounding by Ott (both published by John Wiley and Sons).
Power Voltage Follower with Swing Enhancement below. See AN261 for more information. FIGURE 6. High Power Voltage Follower FIGURE 7. High Power Voltage Follower FIGURE 8. Restricting Outputs to Positive Voltages Only
30 Cook Court
LH0101 Power Operational Amplifier Physical Dimensions inches (millimeters) Lit. Ý 106400
8 Lead TO-3 Metal Can (K)
Order Number LH0101K, LH0101K-MIL, LH0101CK, LH0101AK, LH0101AK-MIL or LH0101ACK LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.
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