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\\K———_1 2 eg [Rev] fain. [_weorvconent | ont | ["A_[fScom07135| ——Tnifial release [6735/2009 [ees 00207. 062| —ali opric explain [71372009 [[Tecurroraora] Moc Ding TP] rT! 60 LI | | 0} A al Fi Q | j Solder feet*4 ML Ee Tl "| te a i j ie ek [ L+H ti q j fo) (=) of | ° on 4 ' ™ is Ly — Hr "3 | J . (| fi | 3 SoS (HI t ( He ee oe iO 00000) N QUUHUUUUE | q | } | a Hi ! = in $9 [: : | | I | | is 1PIN sPIN\\ Lg) —T 10100303## LI 64 selective 1u”gold plating on contact area,160u"Tin plating in solder tail L 65selective 3u”gold plating on contact area,160u"Tin plating in solder tail 66 selective 5u”gold plating on contact area,16Qu"Tin plating in solder tail 67 selective 10u”gold plating on contact area,160u"Tin plating in solder toil B 68 selective 15u”gold plating on contact area,160u"Tin plating in solder tail | ie 69 selective 30u”gold plating on contact area,160u"Tin plating in solder tail i SPECIFICAION: | | a 1.Material Hy ren a Housing: LCP(E6807),Black,UL94V—0,30%6/F LJ q LOooonodo an Cit I Shell: stoiniess, steel P: on = 2 == = = ET Contact: Copper Alloy | 2.Electrical characteristics 0.10 2.1 Contact current rating: 0.54 Min. I= 11.1 5£§:8 —————_+ 2.2 Contact resistance: 100m Ohm Max. initial 2.3 Insulation resistance: 500V DC 1000M ohm Min. initial 3.Environmental chatacteristics H 3.1 Operation temperature range: —20°C to +85°C Hy 4. Coplanarity is 0.10mm Max. on all the solder surface. Sze me ed ; OS tor 2 [weno || Amphenol Shouh Min Industry TE | YS | SS | |= | A - | A | SS - | - SS
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