STU100N3LF3 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Packaging mechanical data
  • 6 Revision history

N-channel 30V - 0.0045Ω - 80A - DPAK - IPAK Planar STripFET™ II Power MOSFET General features ■ 100% avalanche tested ■ Logic level threshold

Description

This Power MOSFET is the latest refinement of STMicroelectronics unique “Single Feature Size™” strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics, low gate charge and less critical alignment steps therefore a remarkable manufacturing reproducibility. This new improved device has been specifically designed for Automotive application and DC-DC converters.

Applications

■ Switching application Internal schematic diagram Type VDSSS RDS(on) ID Pw STD100N3LF3 30 V <0.0055 Ω 80 A(1) 1. Current limited by package 110 W STU100N3LF3 30 V <0.0055 Ω 80 A(1) 110 W 1 DPAK IPAK Order codes Part number Marking Package Packaging STD100N3LF3 100N3LF3 DPAK Tape & reel STU100N3LF3 100N3LF3 IPAK Tube

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Current limited by package.
  2. Pulse width limited by safe operating area
  3. I SD ≤ 80A, di/dt ≤ 360 A/µs, VDS ≤ V(BR)DSS, TJ ≤ TJMAX

Table 2. Thermal data Table 3. Avalanche characteristics

2 Electrical characteristics

Table 4. On/off states Table 5. Dynamic

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characteri stics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance

Figure 13. Allowable Iav vs time in avalanche

3 Test circuit

Figure 14. Switching times test circuit for Figure 15. Gate charge test circuit Figure 16. Test circuit for inductive load

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm inch A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A C H D LL2 1 3 = = B E G = = = = TO-251 (IPAK) MECHANICAL DATA 0068771-E

DIM. mm. inch A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 D1 5.1 0.200 E 6.4 6.6 0.252 0.260 E1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 H 9.35 10.1 0.368 0.397 L 1 0.039 (L1) 2.8 0.110 L2 0.8 0.031 L4 0.6 1 0.023 0.039 R 0.2 0.008 V2 0° 8° 0° 8° DPAK MECHANICAL DATA 0068772-F

STD100N3LF3 - STU100N3LF3 Packaging mechanical data

5 Packaging mechanical data

DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 BASE QTY BULK QTY 2500 2500 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 TAPE MECHANICAL DATA All dimensions are in millimeters

6 Revision history

Table 8. Revision history 07-Feb-2006 1 Initial release.