STD100N03L-1 STMICROELECTRONICS | Alldatasheet
Document overview
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Technical content
N-CHANNEL 30V - 0.0045Ω - 80A - DPAK - IPAK Planar STripFET™ MOSFET General features ■ 100%AVALANCHE TESTED ■ SURFACE-MOUNTING DPAK (TO-252) ■ LOGIC LEVEL THRESHOLD
Description
This MOSFET is the latest refinement of STMicroelectronic unique “Single Feature Size™” stripbased process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics, low gate charge and less critical aligment steps therefore a remarkable manufacturing reproducibility. This new improved device has been specifically designed for Automotive application and DC-DC converters.
Applications
■ HIGH CURRENT, HIGH SWITCHING DC-DC CONVERTER ■ AUTOMOTIVE Order codes Package Internal schematic diagram Type VDSSS R DS(on) ID Pw STD100N03L 30 V <0.0055 Ω 80 A(1) 110 W STD100N03L-1 30 V <0.0055 Ω 80 A(1) 110 W DPAK IPAK Sales Type Marking Package Packaging STD100N03LT4 D100N03L DPAK TAPE & REEL STD100N03L-1 D100N03L-1 IPAK TUBE
1 Electrical ratings STD100N03L - STD100N03L-1
1 Electrical ratings
Table 1. Absolute maximum ratings Table 2. Thermal Data Table 3. Avalanche characteristics
2 Electrical characteristics
Table 4. On/Off states Table 5. Dynamic Table 6. Switching time
2 Electrical characteristics STD100N03L - STD100N03L-1
Table 7. Source-Drain Diode (1) Current limited by package.
2.1 Electrical characteristics (curves)
Figure 1. Safe Operating Area Figure 2. Thermal Impedance Figure 3. Output Characteristics Figure 4. Transfer Characteristics Figure 5. Transconductance Figure 6. Static Drain-source on Resistance
Figure 7. Gate Charge vs Gate-source Figure 8. Capacitance Variation Figure 9. Normalized Gate Thereshold Figure 10. Normalized BVDSS vs Temperature Figure 11. Normalized on Resistance vs Figure 12. Source-Drain Diode Forward
Figure 13. Allowable Iav vs. Time in Avalanche
3 T est Circuits STD100N03L - STD100N03L-1
3 Test Circuits
Figure 14. Switching Times Test Circuit For Figure 15. Gate Charge Test Circuit Figure 16. Test Circuit For Indictive Load
4 Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
4 Package Mechanical Data STD100N03L - STD100N03L-1
DIM. mm inch A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 A C H D LL2 1 3 = = B E G = = = = TO-251 (IPAK) MECHANICAL DATA 0068771-E
DIM. mm inch A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0 o 8o 0o 0o P032P_B TO-252 (DPAK) MECHANICAL DATA
5 Packing mechanical data STD100N03L - STD100N03L-1
5 Packing mechanical data
DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 BASE QTY BULK QTY 2500 2500 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 TAPE MECHANICAL DATA All dimensions are in millimeters
6 Revision History
01-Sep-2005 1 Initial release. 14-Sep-2005 2 Value changed on Figure 1
6 Revision History STD100N03L - STD100N03L-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America