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Wire wound ceramic core construction High Q values High self resonant frequency Temperature Range -40oC to +125oC Industry 1008 (2520) size and surface mount land pattern 100% Tin Solder Termination Electrical Specifications @ 25°C - Operating Temperature Range -40 oC to +125oC Inductance (nH) Q (MIN) SRF (MHz MIN) RDC (Ω MAX) IDC (mA MAX) PE-1008CD100G TT PE-1008CD 120GTT 1 2 3 4 5 (Continued on next page) www.networking.pulseelectronics.com WC711.C (7/19) PE-1008CD 561GTT PE-1008CD681GTT PE-1008CD 331GTT PE-1008CD 391GTT PE-1008CD471GTT PE-1008CD1 81GTT PE-1008CD 221GTT PE-1008CD271GTT PE-1008CD10 1GTT PE-1008CD 121GTT PE-1008CD151GTT PE-1008CD 560GTT PE-1008CD 680GTT PE-1008CD820GTT PE-1008CD 330GTT PE-1008CD 390GTT PE-1008CD470GTT PE-1008CD 220GTT PE-1008CD270GTT PE-1008CD180 GTT 50 @ 500MHz 50 @ 500MHz 50 @ 350MHz 55 @ 350MHz 55 @ 350MHz 60 @ 350MHz 60 @ 350MHz 65 @ 350MHz 65 @ 350MHz 60 @ 350MHz 60 @ 350MHz 60 @ 350MHz 45 @ 100MHz 45 @ 100MHz 45 @ 100MHz 45 @ 350MHz 45 @ 100MHz 45 @ 100MHz 45 @ 100MHz 45 @ 100MHz 45 @ 100MHz 65 @ 350MHz 4100.0 3300.0 2500.0 1800.0 1500.0 1600.0 1400.0 1200.0 1100.0 950.0 900.0 950.0 625.0 650.0 625.0 525.0 500.0 475.0 450.0 415.0 375.0 1160.0 0.09 0.09 0.11 0.12 0.11 0.14 0.12 0.08 0.07 0.14 0.15 0.63 0.16 0.77 0.84 0.91 1.05 1.12 1.19 1.33 1.47 0.09 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 650 650 580 620 500 500 450 470 420 310 1000 10 @ 50MHz 12 @ 50MHz 17, 8 @ 50MHz 22 @ 50MHz 27 @ 50MHz 33 @ 50MHz 39 @ 50MHz 47 @ 50MHz 68 @ 50MHz 82 @ 50MHz 100 @ 25MHz 120 @ 25MHz 150 @ 25MHz 180 @ 25MHz 220 @ 25MHz 270 @ 25MHz 330 @ 25MHz 390 @ 25MHz 470 @ 25MHz 560 @ 25MHz 56 @ 50MHz 680 @ 25MHz 230 PE-1008CD821GTT 45 @ 100MHz 350.0 1.61820 @ 25MHz Part Number Tolerance +/-2% WIRE WOUND RF CHIP INDUCTORS 1008CD SERIES 180

Electrical Specifications @ 25°C - Operating Temperature Range -40oC to +125oC (continued) Inductance (nH) Q (MIN) SRF (MHz MIN) RDC (Ω MAX) IDC (mA MAX) 1 2 3 4 5 Notes: 1. Inductance measured using a HP4286A RF Impedance Analyzer. (Please note that inductance information is not stamped on part, because of the extremely small size). 2. Q measured using a HP4291A RF Impedance Analyzer with a HP16193A Test Fixture 3. SRF measured using a HP8753C Network Analyzer. 4. RDC measured using a Valhalla Scientific model 4100 ATC Digital Ohmeter. 5. Based on a 15C maximum temperature rise, Typical Q vs Frequency Typical Inductance vs Frequency Mechanical Unless otherwise specified, all tolerances are ± .010 0,25 mm 3 www.networking.pulseelectronics.com WC711.C (7/19) 1000 @ 25MHz 1200 @ 7.9MHz 1500 @ 7.9MHz 1800 @ 7.9MHz 2200 @ 7.9MHz 2700 @ 7.9MHz PE-1008CD182GTT PE-1008CD22 2GTT PE-1008CD27 2GTT PE-1008CD102GTT PE-1008CD12 2GTT PE-1008CD152 GTT 35 @ 50MHz 260.0 1.90 120 35 @ 50MHz 250.0 2.00 310 28 @ 50MHz 200.0 2.30 330 28 @ 50MHz 160.0 2.60 300 28 @ 50MHz 80.0 2.80 280 22 @ 50MHz 90.0 3.20 290 3300 @ 7.9MHzPE-1008CD332GTT 22 @ 25MHz 40.0 3.40 290 Part Number Tolerance +/-2% WIRE WOUND RF CHIP INDUCTORS 1008CD SERIES

4 www.networking.pulseelectronics.com WC711.C (7/19) Electrical Testing Storage and Operating Temperature Range: -40oC to +125oC Thermal: -40oC to +85oC Moisture Resistance Operating Life There shall be no deformation or change in appearance Inductance shall not change by more than ±5% Q values shall not change by more than ±10% There shall be no Damaged, Open or Shorted Windings Inductors are subjected to the extremes for 48 hours. Then tested at 25 oC Inductors are subjected to 30 cycles for 30 minutes at each extreme. Then tested at 25 oC Inductors are subjected to 10 cycles of 24 hours at 70 oC with 90 to 95% Relative Humidity Then tested at 24 oC Inductors are subjected to 1000 hours at 85 oC with 85% Relative Humidity with the rated current applied Mechanical Testing Temperature Range: Recommended Solder Heat Resistance Profile Inductors are subjected to the following: Use a solder pot at 260 oC, with RMA Flux. Each termination is immersed in 63Sn/37Pb molten solder for 4 to 6 seconds. There shall be no deformation or change in appearance Inductance shall not change by more than ±5% Q values shall not change by more than ±10% perFormanCe testing WIRE WOUND RF CHIP INDUCTORS

Notes: P1, P2 and P3 are same for all chip inductor series. Keeping the same dimensions for guide hole and pocket pitch (P1), pocket pitch (P2), guide hold pitch (P3) and tape width (8mm) for all series, enables the packaging machine to maintain the same settings while changing models. The only difference between the series are the parts per reel which contributes to a different length of tapes/reel per model. Tape and Reel Specifications Series Parts per Reel A B C D E W P1 P2 P3 H T Reels Dimensions (mm) Tape Dimensions (mm) 5 www.networking.pulseelectronics.com WC711.C (7/19) 1600 178 50 13 14.4 8.4 8 2 4 4 2.6 0.3PE-1008CD Physical Specifications Mechanical Shock Moisture Resistance Vibration (Random) Samplers are subjected to random vibrations as per NAVMAT P9492 The inductors shall withstand a minimum force of 1000 g's in any direction using a dynamometer force guage. Inductors are subjected to one half sine wave pulse (8700 g's for 0.3ms) in each directional axis for a total of 18 shocks Reflow Inductors on to test pads using 63 Sn/37 Pb solder paste (IR Reflow profile : 200 oC for 30 seconds or peak 235 oC for 20 seconds) There shall be no deformation or change in appearance Inductance shall not change by more than ±5% Q values shall not change by more than ±10% perFormanCe testing Packing Moisture Level = MSL 1 - Storage Temperature - 40oC to +125oC WIRE WOUND RF CHIP INDUCTORS