085

BTS50085-1TMA INFINEON | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 18

Technical content

Features

• Overload protection
• Current limitation
• Short circuit protection
• Over temperature protection
• Over voltage protection (including load dump)
• Clamp of negative voltage at output
• Fast deenergizing of inductive loads
• Low ohmic inverse current operation
• Diagnostic feedback with load current sense
• Open load detection via current sense
• Loss of Vbb protection
• Electrostatic discharge (ESD) protection
• Green product (RoHS compliant)
• AEC qualified Application
• Power switch with current sense diagnostic feedback for up to 48 V DC grounded loads
• Most suitable for loads with high inrush current like lamps and motors; all types of resistive and inductive loads
• Replaces electromechanical relays, fuses and discrete circuits General Description N channel vertical power FET with charge pump, current controlled input and diagnostic feedback with load current sense, integrated in Smart SIPMOS chip on chip technology. Providing embedded protection functions. IN Charge pump Level shifter Rectifier Limit for unclamped ind. loads Gate protection Current limit Overvoltage protection + Vbb PROFET OUT 4 & Tab 1,2,6,7 Load GND Load Output Voltage detection RIS IS I IS IL VIS IIN Logic GND Voltage sensor Voltage source Current Sense LogicESD Temperature sensor R bb VIN ) With additional external diode. 2) Additional external diode required fo r energized inductive loads (see page 9). Product Summary Overvoltage protection Vbb(AZ) 70 V Output clamp VON(CL) 62 V Operating voltage Vbb(on) 5.0 ... 58 V On-state resistance RON 9 mΩ Load current (ISO) IL(ISO) 44 A Short circuit current limitation IL(SC) 90 A Current sense ratio I L : IIS 13 000 PG-TO220-7-4 SMD

Infineon Technologies AG Page 2 2008-Jan-24 Pin Symbol Function 1 OUT O Output to the load. The pins 1,2,6 and 7 must be shorted with each other especially in high current applications! 2 OUT O Output to the load. The pins 1,2,6 and 7 must be shorted with each other especially in high current applications! 3)

3 IN I Input, activates the power switch in case of short to ground

4 V bb + Positive power supply voltage, the tab is electrically connected to this pin. In high current applications the tab should be used for the Vbb connection instead of this pin 4).

5 IS S Diagnostic feedback providing a sense current proportional to the load

current; zero current on failure (see Truth Table on page 7) 6 OUT O Output to the load. The pins 1,2,6 and 7 must be shorted with each other especially in high current applications! 3) 7 OUT O Output to the load. The pins 1,2,6 and 7 must be shorted with each other especially in high current applications! 3) Maximum Ratings at Tj = 25 °C unless otherwise specified Parameter Symbol Values Unit Supply voltage (over voltage protection see page 4) Vbb 62 V Supply voltage for full short circuit protection, (EAS limitation see diagram on page 10) Tj,start =-40 ...+150°C: Vbb 58 V Load current (short circuit current, see page 5) IL self-limited A Load dump protection VLoadDump = UA + Vs, UA = 13.5 V RI 5) = 2 Ω, RL = 0.23 Ω, td = 200 ms, IN, IS = open or grounded VLoad dump 6) 80 V Operating temperature range Storage temperature range Tj Tstg -40 ...+150 -55 ...+150 Power dissipation (DC), TC ≤ 25 °C Ptot 170 W Inductive load switch-off energy dissipation, single pulse Vbb = 12V, Tj,start = 150°C, TC = 150°C const., IL = 20 A, ZL = 6 mH, 0 Ω, see diagrams on page 10 EAS 1.2 J Electrostatic discharge capability (ESD) Human Body Model acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993, C = 100 pF, R = 1.5 kΩ VESD 4.0 kV Current through input pin (DC) Current through current sense status pin (DC) see internal circuit diagrams on page 7 and 8 IIN IIS +15 , -250 +15 , -250 mA 3) Not shorting all outputs will considerably increase the on-state resistance, reduce the peak current capability and decrease the current sense accuracy 4) Otherwise add up to 0.7 mΩ (depending on used length of the pin) to the RON if the pin is used instead of the tab. 5) RI = internal resistance of the load dump test pulse generator. 6) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839.

Infineon Technologies AG Page 3 2008-Jan-24 Thermal Characteristics Parameter and Conditions Symbol Values Unit min typ max Thermal resistance chip - case : RthJC 7) -- -- 0.75 K/W junction - ambient (free air): RthJA -- 60 -- SMD version, device on PCB 8): -- 33 --

Electrical Characteristics

Parameter and Conditions Symbol Values Unit at Tj = -40 ... +150 °C, Vbb = 24 V unless otherwise specified min typ max Load Switching Capabilities and Characteristics On-state resistance (Tab to pins 1,2,6,7, see measurement circuit page 7) IL = 20 A, Tj = 25 °C: VIN = 0, IL = 20 A, Tj = 150 °C: RON 7.2 14.6 mΩ IL = 80 A, Tj = 150 °C: -- 17 Vbb =6V, IL =20A, Tj =150°C: RON(Static) 17 22 Nominal load current 9) (Tab to pins 1,2,6,7) ISO 10483-1/6.7: VON = 0.5 V, Tc = 85 °C 10) IL(ISO) 38 44 -- A Nominal load current 9), device on PCB 8) TA = 85 °C, Tj ≤ 150 °C VON ≤ 0.5 V, IL(NOM) 9.9 11.1 -- A Maximum load current in resistive range (Tab to pins 1,2,6,7) VON = 1.8 V, Tc = 25 °C: see diagram on page 13 VON = 1.8 V, Tc = 150 °C: IL(Max) 185 105 A Turn-on time 11) IIN to 90% VOUT: Turn-off time I IN to 10% VOUT: ton toff 400 110 µs Slew rate on 11) (10 to 30% VOUT ) RL = 1 Ω dV/dton 1.0 1.5 2.2 V/ µs Slew rate off 11) (70 to 40% VOUT ) RL = 1 Ω -dV/dtoff 1.1 1.9 2.6 V/ µs 8) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70µm thick) copper area for Vbb connection. PCB is vertical without blown air. 9) not subject to production test, specified by design 10) TJ is about 105°C under these conditions. 11) See timing diagram on page 14.

Infineon Technologies AG Page 4 2008-Jan-24 Parameter and Conditions Symbol Values Unit at Tj = -40 ... +150 °C, Vbb = 24 V unless otherwise specified min typ max Inverse Load Current Operation On-state resistance (Pins 1,2,6,7 to pin 4) VbIN = 12 V, IL = - 20 A Tj = 25 °C: see diagram on page 10 Tj = 150 °C: R ON(inv) 7.2 14.6 mΩ Nominal inverse load current (Pins 1,2,6,7 to Tab) VON = -0.5 V, Tc = 85 °C IL(inv) 50 60 -- A Drain-source diode voltage (Vout > Vbb) IL = - 20 A, IIN = 0, Tj = +150°C -VON -- 0.6 0.7 mV Operating Parameters Operating voltage (VIN = 0) 12) Vbb(on) 5.0 -- 58 V Under voltage shutdown 13)14) VbIN(u) 1.5 3.0 4.5 V Under voltage start of charge pump see diagram page 15 VbIN(ucp) 3.0 4.5 6.0 V Over voltage protection 15) Tj =-40°C: Ibb = 15 mA Tj = 25...+150°C: VbIN(Z) 68 V Standby current Tj =-40...+25°C: IIN = 0, Vbb=35V T j = 150°C: Ibb(off) -- µA 12) If the device is turned on before a V bb-decrease, the operating voltage range is extended down to VbIN(u). For the voltage range 0..58 V the device provides embedded protection functions against overtemperature and short circuit. 13) not subject to production test, specified by design 14) VbIN = Vbb - VIN see diagram on page 15. When VbIN increases from less than VbIN(u) up to VbIN(ucp) = 5 V (typ.) the charge pump is not active and VOUT ≈Vbb - 3 V. 15) See also VON(CL) in circuit diagram on page 9.

Parameter and Conditions Symbol Values Unit at Tj = -40 ... +150 °C, Vbb = 24 V unless otherwise specified min typ max Infineon Technologies AG Page 5 2008-Jan-24 Protection Functions 16) Short circuit current limit (Tab to pins 1,2,6,7) VON = 24 V, time until shutdown max. 300 µs Tc =-40°C: see page 8 and 13 Tc =25°C: Tc =+150°C: IL(SC) IL(SC) IL(SC) 180 A Short circuit shutdown delay after input current positive slope, VON > VON(SC) 17) min. value valid only if input "off-signal" time exceeds 30 µs td(SC) -- 350 µs Output clamp (inductive load switch off) at VOUT = Vbb - VON(CL) (e.g. over voltage) IL= 40 mA VON(CL) 65 72 V Short circuit shutdown detection voltage 17) (pin 4 to pins 1,2,6,7) VON(SC) 6 -- V Thermal overload trip temperature Tjt 150 -- -- °C Thermal hysteresis ∆Tjt -- 10 -- K Reverse Battery Reverse battery voltage On-state resistance (Pins 1,2,6,7 to pin 4) Tj = 25 °C: Vbb = -12V, VIN = 0, IL = - 20 A, RIS = 1 kΩ Tj = 150 °C: RON(rev) -- 8.8 10.5 mΩ Integrated resistor in Vbb line Tj = 25 C: Tj =150°C: Rbb 90 105 120 125 135 150 Ω ) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. 17) not subject to production test, specified by design. 18) The reverse load current through the intrinsic drain-source diode has to be limited by the connected load (as it is done with all polarity symmetric loads). Note that under off-conditions (IIN = IIS = 0) the power transistor is not activated. This results in raised power dissipation due to the higher voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! To reduce the power dissipation at the integrated R bb resistor an input resistor is recommended as described on page 9.

Parameter and Conditions Symbol Values Unit at Tj = -40 ... +150 °C, Vbb = 24 V unless otherwise specified min typ max Infineon Technologies AG Page 6 2008-Jan-24 Diagnostic Characteristics Current sense ratio, IL = 80 A,Tj =-40°C: static on-condition, Tj =25°C: kILIS = IL : IIS, Tj =150°C: VON < 1.5 V VIS <VOUT - 5 v, Tj =25°C: VbIN > 4.0 V Tj =150°C: see diagram on page 12 IL = 10 A,Tj =-40°C: Tj =25°C: Tj =150°C: IL = 4 A,Tj =-40°C: Tj =25°C: Tj =150°C: kILIS 11 400 11 400 11 000 11 000 11 000 11 000 10 500 10 500 11 000 9 000 10 000 10 800 13 000 13 000 13 000 13 000 13 000 13 000 13 000 13 000 13 000 13 000 13 000 13 000 15 400 14 600 14 200 16 000 15 000 14 500 17 000 15 500 15 000 22 000 18 500 16 000 IIN = 0, IIS=0 (e.g. during deenergizing of inductive loads): -- -- -- Sense current saturation IIS,lim 6.5 -- -- mA Current sense leakage current IIN = 0 V IN = 0, IL < 0: IIS(LL) IIS(LH) 0.5 µA Current sense over voltage protection Tj =-40°C: Ibb = 15 mA Tj = 25...+150°C: VbIS(Z) 68 V Current sense settling time 20) ts(IS) -- -- 500 µs Input Input and operating current (see diagram page 13) IN grounded (VIN = 0) IIN(on) -- 0.8 1.5 mA Input current for turn-off 21) IIN(off) -- -- 80 µA 19) If V ON is higher, the sense current is no longer proportional to the load current due to sense current saturation, see IIS,lim . 20) not subject to production test, specified by design 21) We recommend the resistance between IN and GND to be less than 0.5 kΩ for turn-on and more than 500kΩ for turn-off. Consider that when the device is switched off (IIN = 0) the voltage between IN and GND reaches almost Vbb.

Infineon Technologies AG Page 7 2008-Jan-24 Truth Table Input current Output Current Sense Remark level level I IS Normal operation L H L H nominal =IL / kilis, up to IIS=IIS,lim Very high load current H H I IS, lim up to VON=VON(Fold back) IIS no longer proportional to IL Current- limitation H H 0 V ON > VON(Fold back) if VON>VON(SC), shutdown will occure Short circuit to GND L H L L Over- temperature L H L L Short circuit to Vbb L H H H <nominal 22) Open load L H Z H Negative output voltage clamp L L 0 Inverse load current L H H H L = "Low" Level H = "High" Level Over temperature reset by cooling: Tj < Tjt (see diagram on page 15) Short circuit to GND: Shutdown remains latched until next reset via input (see diagram on page 14) 22) Low ohmic short to Vbb may reduce the output current IL and can thus be detected via the sense current IIS. 23) Power Transistor "OFF", potential defined by external impedance. Terms PROFET V IN IS OUT bb VIN IIS IIN Vbb Ibb IL VOUT VON 1,2,6,7 RISVIS VbIN RIN DS VbIS Two or more devices can easily be connected in parallel to increase load current capability. RON measurement layout Sense V force Out Force bb contacts contacts (both out pins parallel) l ≤ 5.5mm Typical RON for SMD version is about 0.2 mΩ less than straight leads due to l ≈ 2 mm

Infineon Technologies AG Page 8 2008-Jan-24 Input circuit (ESD protection) IN ZD INI Vbb RbbV Z,IN VbIN VIN When the device is switched off (IIN = 0) the voltage between IN and GND reaches almost Vbb. Use a bipolar or MOS transistor with appropriate breakdown voltage as driver. V Z,IN = 74 V (typ). Short circuit detection Fault Condition: VON > VON(SC) (6 V typ.) and t> td(SC) (80 ...300 µs). Short circuit detection Logic unit + Vbb OUT VON Current sense status output IS ISR ISI ZD ISV bbV bbR Z,ISV VZ,IS = 74 V (typ.), RIS = 1 kΩ nominal (or 1 kΩ /n, if n devices are connected in parallel). IS = IL/kilis can be driven only by the internal circuit as long as Vout - VIS > 5 V. If you want measure load currents up to IL(M), RIS should be less than Vbb - 5 V IL(M) / Kilis Note: For large values of RIS the voltage VIS can reach almost Vbb. See also over voltage protection. If you don't use the current sense output in your application, you can leave it open. Inductive and over voltage output clamp + Vbb OUT PROFET VZ1 V ON IS V OUT VON is clamped to VON(Cl) = 62 V typ

Infineon Technologies AG Page 9 2008-Jan-24 Over voltage protection of logic part + Vbb VOUT IN bbR Signal GND Logic PROFET VZ,IS RIS INR IS VZ,IN RV VZ,VIS Rbb = 120 Ω typ., VZ,IN = VZ,IS = 74 V typ., RIS = 1 kΩ nominal. Note that when over voltage exceeds 79 V typ. a voltage above 5V can occur between IS and GND, if R V, VZ,VIS are not used. Reverse battery protection Logic IS IN ISR VR OUT LR Power GNDSignal GND Vbb- Power TransistorINR bbR D SD RV ≥ 1 kΩ, RIS = 1 kΩ nominal. Add RIN for reverse battery protection in applications with Vbb above 16V18); recommended value: 1 RIN + 1 RIS + 1 RV = 0.1A |Vbb| - 12V if DS is not used (or 1 RIN = 0.1A |Vbb| - 12V if DS is used). To minimize power dissipation at reverse battery operation, the overall current into the IN and IS pin should be about 120mA. The current can be provided by using a small signal diode D in parallel to the input switch, by using a MOSFET input switch or by proper adjusting the current through R IS and RV. Vbb disconnect with energized inductive load Provide a current path with load current capability by using a diode, a Z-diode, or a varistor. (VZL < 70 V or VZb < 42 V if RIN=0). For higher clamp voltages currents at IN and IS have to be limited to 250 mA. Version a: PROFET V IN OUT IS bb Vbb VZL Version b: PROFET V IN OUT IS bbVbb VZb Note that there is no reverse battery protection when using a diode without additional Z-diode VZL, VZb. Version c: Sometimes a necessary voltage clamp is given by non inductive loads RL connected to the same switch and eliminates the need of clamping circuit: PROFET V IN OUT IS bbVbb RL

Infineon Technologies AG Page 10 2008-Jan-24 Inverse load current operation PROFET V IN OUT IS bb Vbb VOUT - IL R IS VIS VIN - + IIS The device is specified for inverse load current operation (VOUT > Vbb > 0V). The current sense feature is not available during this kind of operation (IIS = 0). With IIN = 0 (e.g. input open) only the intrinsic drain source diode is conducting resulting in considerably increased power dissipation. If the device is switched on (V IN = 0), this power dissipation is decreased to the much lower value RON(INV) * I2 (specifications see page 4). Note: Temperature protection during inverse load current operation is not possible! Inductive load switch-off energy dissipation PROFET V IN OUT IS bb E E E EAS bb L R ELoad L RL {Z L RIS I IN Vbb i (t)L Energy stored in load inductance: EL = 1/2·L·I2 L While demagnetizing load inductance, the energy dissipated in PROFET is EAS= Ebb + EL - ER= ∫ VON(CL)·iL(t) dt, with an approximate solution for RL > 0 Ω: EAS= IL· L 2·RL (Vbb + |VOUT(CL)|) ln (1+ IL·RL |VOUT(CL)| ) Maximum allowable load inductance for a single switch off L = f (IL ); Tj,start = 150°C, Vbb = 40 V, RL = 0 Ω L [µH] I [A] Externally adjustable current limit If the device is conducting, the sense current can be used to reduce the short circuit current and allow higher lead inductance (see diagram above). The device will be turned off, if the threshold voltage of T2 is reached by I S*RIS . After a delay time defined by RV*CV T1 will be reset. The device is turned on again, the short circuit current is defined by IL(SC) and the device is shut down after td(SC) with latch function. PROFET IS IN ISR VR Power GND Signal GND Vbb OUT VC loadR T1 T2 IN Signal Vbb 100 1000 10000 10 100 1000

Infineon Technologies AG Page 11 2008-Jan-24 Options Overview Type BTS50085-1TMA Over temperature protection with hysteresis X Tj >150 °C, latch function 24) Tj >150 °C, with auto-restart on cooling X Short circuit to GND protection switches off when VON>6 V typ. (when first turned on after approx. 180 µs) X Over voltage shutdown - Output negative voltage transient limit to Vbb - VON(CL) X to VOUT = -15 V typ X 25) 24) Latch except when Vbb -VOUT < VON(SC) after shutdown. In most cases VOUT = 0 V after shutdown (VOUT ≠ 0 V only if forced externally). So the device remains latched unless Vbb < VON(SC) (see page 5). No latch between turn on and td(SC). 25) Can be "switched off" by using a diode DS (see page 8) or leaving open the current sense output.

Infineon Technologies AG Page 12 2008-Jan-24 Characteristics Current sense versus load current: IIS = f(IL), TJ= -40 ... +150 °C IIS [mA] IL [A] Current sense ratio: KILIS = f(IL), Tj= -40°C kilis IL [A] Current sense ratio: KILIS = f(IL), Tj= 25°C kilis IL [A] Current sense ratio: KILIS = f(IL), Tj= 150°C kilis IL [A] 0 2 04 06 08 0 max min 8000 10000 12000 14000 16000 18000 20000 0 2 04 06 08 0 typ max min 8000 10000 12000 14000 16000 18000 20000 22000 24000 0 20 40 60 80 typ min max 10000 12000 14000 16000 18000 20000 0 2 04 06 08 0 min typ max

Infineon Technologies AG Page 13 2008-Jan-24 Typ. current limitation characteristic IL = f (VON, Tj ) IL [A] 100 150 200 250 300 350 400 0 5 10 15 20 T j = -40°C 25°C150°C VON(FB) (Fold Back) VON>VON(SC) only for t < t d(SC) (otherwise immediate shutdown) V ON [V] In case of VON > VON(SC) (typ. 6 V) the device will be switched off by internal short circuit detection. Typ. on-state resistance RON = f (Vbb, Tj ); IL = 20 A; VIN = 0 RON [mOhm] 0 5 10 15 static dynamic Tj = 150°C 85°C 25°C -40°C Vbb [V] Typ. input current IIN = f (VbIN), VbIN = Vbb - VIN IIN [mA] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 2 04 06 08 0 VbIN [V]

Infineon Technologies AG Page 16 2008-Jan-24 Package and Ordering Code All dimensions in mm PG-TO220-7-4 Sales Code BTS50085-1TMA A BA0.25 M 0.1 Typical ±0.210 8.5 1) 7.551) (13.85) ±0.29.25 ±0.31 0...0.15 7 x 0.6±0.1 ±0.11.27 4.4 B 0.5±0.1 ±0.32.1 3.6±0.3 0.05 0.1 Metal surface min. X = 7.25, Y = 6.9 2.4 1.27 All metal surfaces tin plated, except area of cut. 0...0.3 B 6 x 8˚MAX. Footprint: 9.4 0.47 0.8 8.42 4.6 16.15 10.8 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb- free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

Infineon Technologies AG Page 17 2008-Jan-24

Revision History

Rev. 1.0 2008-01-24 Initial version of data sheet. Green (RoHS compliant) variant of BTS660P

81726 Munich, Germany

© Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non- infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.