04EM04-N3GM627 KINGSTON | Alldatasheet
Document overview
- PDF pages: 2
Technical content
kingston.com/emcp The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications Kingston offers a range of JEDEC standard e MCP components. eMCP integrates Embedded MultiMedia Card (e •MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. e MCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various “Internet of Things” (IoT) devices. more >> eMCP #KingstonIsWithYou
PART NUMBERS AND SPECIFICATIONS LPDDR3 based eMCP Part Number Capacity Description Package FBGA Operating TemperatureNAND (GB) DRAM (Gb) eMMC DRAM (mm) 04EM04-N3GM627 4 4 5.0 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 08EM08-N3GML36 8 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 16EM08-N3GTB29 16 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 16EM16-N3GTB29 16 16 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 32EM16-N3GTX29 32 16 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C 32EM32-N3HTX29 32 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C 64EM32-N3HTX29 64 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C LPDDR4x based eMCP Part Number Capacity Description Package FBGA Operating TemperatureNAND (GB) DRAM (Gb) eMMC DRAM (mm) 04EM08-M4EM627 4 8 5.1 LPDDR4x 8x9.5x0.8 149 -25°C ~ +85°C 16EM16-M4CTB29 16 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C 32EM16-M4CTX29 32 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C 32EM32-M4DTX29 32 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C 64EM32-M4DTX29 64 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C 128EM32-M4DTX29 128 32 5.1 LPDDR4x 11.5x13.0x1.1 254 -25°C ~ +85°C IoT Wearables AI Accelerators Smartphones and Tablets MARKET SEGMENTS
- Managed NAND flash solution that simplifies design and product sustainment with an industry standard e MMC interface. This significantly reduces the design complexity and qualification cycle.
- The highly integrated memory and storage combination reduces space on system design, making e MCP an ideal solution for small form factor applications. KEY BENEFITS
- Low-Power DRAM reduces overall power consumption, making eMCP an optimal solution for many battery powered applications such as wearables and mobile IoT products.
- Reduced Bill Of Material complexity with component count reduction.
- Multiple firmware configurations available to best fit your application requirements for performance, power, and life span. THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. MKF-961US THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. US