0483380068 MOLEX11 | Alldatasheet
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REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 1 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC Y q q q q q q q q q q q q q q q 0.8mm PITCH MINI PCI EXPRESS CONNECTOR q q q q q q q q q q q q q q q q q q q q q q q q q q q q Y
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 2 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC 6.0YPRODUCTYQUALIFICATIO*glyphdd97YA*glyphdd97DYREQUALIFICATIO*glyphdd97YTESTYSEQUE*glyphdd97CE…………………8Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y q
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 3 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC
1.0 SCOPEY
This product specification covers the performance requirements for the 0.8mm PITCH MINI PCI EXPRESS CONNECTOR .q
1.1 PRODUCTY*glyphdd97AMEYA*glyphdd97DYPARTY*glyphdd97UMBERY
ProductqNameq SeriesqNumberq 0.8mm PITCH MINI PCI EXPRESS CONNECTOR q 48338q 0.8mm PITCH MINI-PCI EXPRESS CONNECTOR,SINK TYPE 48344q q
2.0 APPLICABLEYDOCUME*glyphdd97TY
Theqfollowingqdocumentsqformqaqpartqofqthisqspecificationqtoqtheqextentqspecifiedqherein.qInqtheqeventqofq conflictqbetweenqtheqrequirementsqofqthisqspecificationqandqtheqproductqdrawing,qtheqproductqdrawingqshallqtakeq precedence.qInqtheqeventqofqconflictqbetweenqtheqrequirementsqofqthisqspecificationqandqtheqreferencedq documents,qthisqspecificationqshallqtakeqprecedence.q EIA2364q q
3.0 REQUIREME*glyphdd97TSYY
SeeqTheqAppropriateqSalesqDrawings.qqForqInformationqOnqDimensions,qMaterials,qPlantingsqandqMarkings.q “SD2483382002,qSD2483382004,qSD2483442001,qRSD2483442001”q q 4.0YRATI*glyphdd97GSY 4.1YVOLTAGEY VoltageqRatingq:q50qVACqq 4.2YCURRE*glyphdd97TY CurrentqRatingq:q0.5qAq 4.3YTEMPERATUREYY Operating:q qqqqqqqq 240°Cqqtoqq+85°Cq Non-Operating :q q 240°Cqqtoqq+85°Cq ※ Includingqterminalqtemperatureqrise.q q q q q q q q q q q q q q q q q q q q
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 4 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC
5.0 PERFORMA*glyphdd97CEY
5.1YYTESTYREQUIREME*glyphdd97TSYA*glyphdd97DYPROCEDURESYSUMMARYYY ITEM q DESCRIPTIO*glyphdd97 q TESTYCO*glyphdd97DITIO*glyphdd97 q REQUIREME*glyphdd97TYq 1Y ExaminationqofqProductq Visualqinspectionq Meetsqrequirementsqofqproductq drawing.qNoqphysicalqdamage.q 5.2YYELECTRICALYREQUIREME*glyphdd97TSYq ITEM q DESCRIPTIO*glyphdd97 q TESTYCO*glyphdd97DITIO*glyphdd97 q REQUIREME*glyphdd97T q 2q ContactqResistanceq (LowqLevel)q Mateqconnectors,qmeasureqbyqdryqcircuit,q 20mVqMax.,q100mAqMax.q EIA 2364 223 q 55qmilliohmsqMax.q(initial)q Afterqtestq:q∆R:20qmilliohmqMax.q 3q InsulationqResistanceq Mateqconnectors,qapplyq500qVqDCq betweenqadjacentqterminalqorqground.q EIA2364221q 500qMegohmqmin.q Dielectricq Withstandingq Voltageq Mateqconnectors;qapplyq300VqACqforq1q minuteqbetweenqadjacentqterminalqorq ground.q EIA2364220q Noqbreakdown;q Currentqleakage:1qmAqMAX.q 5Y TemperatureqRiseq Mateqconnectorsqandqmeasureqtheq temperatureqriseqofqcontactqwhenqtheq MaximumqACqratedqcurrentq0.5Aqisq passed.qq EIA 2364 270 q TemperatureqRise:q30°CqMax.q 6q Insertion Loss A common test fixture for connector characterization shall be used. This is differential insertion loss requirement. EIA-364-101 1dB Max. Up to 1.25 GHz; ≦[1.6*(F-1.25)+1] dB for 1.25 GHz<F ≦3.75 GHz (For example, ≦5 dB at F=3.75 GHz) 7q Return Loss A common test fixture for connector characterization shall be used. This is differential insertion loss requirement. EIA-364-108 ≦12dB up to 1.3 GHz; ≦-7dB up to 2 GHz; ≦-4dB up to 3.75 GHz; 8Y Next Cross-talk A common test fixture for connector characterization shall be used. This is differential cross-talk requirement. EIA-364-90 -32dB up to 1.25 GHz; 1.25 GHz<F ≦3.75 GHz (For example, ≦-26 dB at
3.75 GHz)
5.3YYMECHA*glyphdd97ICALYREQUIREME*glyphdd97TS q ITEM q DESCRIPTIO*glyphdd97 q TESTYCO*glyphdd97DITIO*glyphdd97 q REQUIREME*glyphdd97T q
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 5 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC 9Y Mating / Unmating Force q Card mating/Unmating sequence: a.) Insert the card at the angle specified by the manufacturer b.) Rotate the card into position. c.) Reverse the installation sequence to unmated Operation Speed ：25.4 ± 3 mm/minute. Measure the force required to mate/Unmate connector.q EIA2364213q Force: 2.3Kgf Max q 10Y Durability q The sample should be mounted in the tester and fully mated and unmated 50 cycles specified at the rate of 25.4 ± 3 mm/min. q EIA2364209q 20 milliohms MAX. (change from initial) 11Y Vibration q The electrical load condition shall be 100 mA maximum for all contacts. Subject to a simple harmonic motion having amplitude of 0.76mm (1.52mm maximum total excursion) in frequency between the limits of 10 and 55 Hz. The entire frequency range, from 10 to 55 Hz and return to 10 Hz, shall be traversed in approximately 1 minute. This motion shall be applied for 2 hours in each of three mutually perpendicular directions. EIA-364-28 q 20 milliohms MAX. (change from initial) Discontinuity< 1 microsecond 12Y Shock (Mechanical) q Subject mated connectors to
50 G’s (peak value) half-sine shock pulses
of 11 milliseconds duration. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks). The electrical load condition shall be 100mA maximum for all contacts. EIA-364-27 q 20 milliohms MAX. (change from initial) Discontinuity< 1 microsecond 13Y Terminal / Housing Retention Force q Apply axial pull out force at the speed rate of 25 ＋/－3 mm/minute on the terminal assembly in the housing q 2.5 N Min.q 14Y Nail / Housing Retention Force Apply axial pull out force at the speed rate of 25 ＋/－3 mm/minute on the terminal assembly in the housing q 2.5 N Min.q
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 6 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC 15Y Thermal Shock q Mate module and subject to follow condition for 10 cycles. 1 cycles: -55 +0/-3 □, 30 minutes +85 +3/-0 □, 30 minutes EIA-364-32 q 20 milliohms MAX. (change from initial) Visual: No Damage q 16YCyclic Temperature and Humidity q Mate module and subject to 5 cycle. Between 25 ℃ +/- 3℃ at 80% +/- 3% RH. dwell time of 1 hour; ramp time of 0.5 hours. 24 cycles. (EIA-364-31, Test condition A) 20 milliohms MAX. (change from initial) Visual: No Damage q 17Y Temperature life q Subject mated connectors to temperature life at 85 ℃±3℃ for 96 hours. Measure Signal. (EIA-364-17, Test condition A) 20 milliohms MAX. (change from initial) Visual: No Damage q 18Y Salt Spray q Subject mated/unmated connectors to 5% salt-solution concentration,35 ℃± 2 ℃fo r 48 hours. (EIA-364-26,Test condition B) q 20 milliohms MAX. (change from initial) Visual: No Damage q 19Y Solderabilityq Subject the test area of contacts into the flux for 5-10 sec. And then into solder bath, Temperature at 245 ±5℃, for 4-5 sec. (EIA-364-52) q Solder able area shall have minimum of 95% solder coverage. q 20Y Hand soldering q Hand Soldering: Temperature:360±5□, 3 sec. Visual: No Damage q
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 7 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC 21Y ResistanceqToqSolderingq Heatq INFRAREDqREFLOWqCONDITIONSq q 260 ℃qMaximumq(PEAKqTEMPERATURE)q q q 8qMINUTESqMAXIMUM q qqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqq 250 ℃qMax.q qq qqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqq 20240sec.q 3℃qMAXIMUM/SECOND q AVERAGEqRANGEqUP q q q qqqqqqqqqqqqqqqqqq qqqqqqqqqqq qqqqqqqqqqqqqqqqqqqqq qqq180qsec.qqqqq30qsec.q q (preheatqtemperature:150~200 ℃qMAXIMUM)q TEMPERATUREqCONDITIONqGRAPHq (qTEMPERATUREqONqBOARDqPATTERNqSIDEq) q qq Appearanceq:qNoqdamageq afterq1qtimeqofqreflowq
REVISION: ECR/ECN INFORMATION: TITLE: 0.8mm PITCH MINI PCI EXPRESS CONNECTOR SHEET No. EC No: S2011-0490 8 of 8 DATE: 2010 /11/30 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS -48338 -002 JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPECSIZE_A4.DOC qqqqqq 6.0YPRODUCTYQUALIFICATIO*glyphdd97YA*glyphdd97DYREQUALIFICATIO*glyphdd97YTESTYSEQUE*glyphdd97CE qqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqqq YYYYY TestqItemq TestYGroupY Aq Bq Cq Dq Eq Fq Gq Hq Iq Jq Kq Examination of Product q q q 1,10 q 1,5q q 1,9q 1,3q q 1,3q q Contact Resistance (Low Level) 1,5q 1,4q q 2,7q 2,4q 1,7q 2,8q q q q q Insulation Resistance q q q 3,8q q 2,5q 3,6q q q q q Dielectric Withstanding Voltage q q q 4,9q q 3,6q 4,7q q q q q Temperature Rise q q q q q 4q q q q q q Insertion Loss q q q q q q q q q q 1q Return Loss q q q q q q q q q q 2q Next Cross-talk q q q q q q q q q q 3q Mating / Unmating Force 2,4q q q q q q q q q q q Durability 3q q q q q q q q q q q Vibration q 2q q q q q q q q q q Shock (Mechanical) q 3q q q q q q q q q q Terminal / Housing Retention Force q q q q q q q q 1q q q Nail / Housing Retention Force q q q q q q q q 2q q q Thermal Shock q q q 5q q q q q q q q Cyclic Temperature and Humidity q q q 6q q q q q q q q Temperature life q q q q q q 5q q q q q Salt Spray q q q q 3q q q q q q q Solderability q q 1q q q q q q q q q Hand soldering q q q q q q q q q 2q q Resistance To Soldering Heat q q q q q q q 2q q q q SampleYSize* Y 5Y 5 q 5q 5q 5q 5q 5q 5q 5q 5q 5q YY AllYTestYsamplesYneedYtoYbeYPCBYmounted.Y