02011J4R7CBSTR500

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Accu-P® Thin-Film Technology THE IDEAL CAPACITOR The non-ideal characteristics of a real capacitor can be ignored at low frequencies. Physical size imparts inductance to the capacitor and dielectric and metal electrodes result in resistive losses, but these often are of negligible effect on the circuit. At the very high frequencies of radio communication (>100MHz) and satellite systems (>1GHz), these effects become important. Recognizing that a real capacitor will exhibit inductive and resistive impedances in addition to capacitance, the ideal capacitor for these high frequencies is an ultra low loss component which can be fully characterized in all parameters with total repeatability from unit to unit. Until recently, most high frequency/microwave capacitors were based on fired-ceramic (porcelain) technology. Layers of ceramic dielectric material and metal alloy electrode paste are interleaved and then sintered in a high temperature oven. This technology exhibits component variability in dielectric quality (losses, dielectric constant and insulation resistance), variability in electrode conductivity and variability in physical size (affecting inductance). An alternate thin-film technology has been developed which virtually eliminates these vari- ances. It is this technology which has been fully incorporated into Accu-P ® and Accu-P® to provide high frequency capaci- tors exhibiting truly ideal characteristics. The main features of Accu-P® may be summarized as follows:

• High purity of electrodes for very low and repeatable ESR.
• Highly pure, low-K dielectric for high breakdown field, high insulation resistance and low losses to frequencies above 40GHz.
• Very tight dimensional control for uniform inductance, unit to unit.
• Very tight capacitance tolerances for high frequency signal applications. This accuracy sets apart these Thin-Film capacitors from ceramic capacitors so that the term Accu has been employed as the designation for this series of devices, an abbreviation for “accurate.” THIN-FILM TECHNOLOGY Thin-film technology is commonly used in producing semi- conductor devices. In the last two decades, this technology has developed tremendously, both in performance and in process control. Today’s techniques enable line definitions of below 1μm, and the controlling of thickness of layers at 100Å (10 -2μm). Applying this technology to the manufacture of capacitors has enabled the development of components where both electrical and physical properties can be tightly controlled. The thin-film production facilities at AVX consist of:
• Class 1000 clean rooms, with working areas under laminar-flow hoods of class 100, (below 100 particles per cubic foot larger than 0.5μm).
• High vacuum metal deposition systems for high-purity electrode construction.
• Photolithography equipment for line definition down to 2.0μm accuracy.
• Plasma-enhanced CVD for various dielectric deposi- tions (CVD=Chemical Vapor Deposition).
• High accuracy, microprocessor-controlled dicing saws for chip separation.
• High speed, high accuracy sorting to ensure strict tolerance adherence. Alumina (Al2O3) Electrode Electrode Dielectric (SiO2 / SiNO) Terminations Seal (SiNO) Orientation Marking Alumina (Al2O3) ACCU-P® CAPACITOR STRUCTURE 6 050118

Accu-P® Thin-Film Chip Capacitors ACCU-P® TECHNOLOGY The use of very low-loss dielectric materials, silicon dioxide and silicon oxynitride, in conjunction with highly conductive elec- trode metals results in low ESR and high Q. These high-frequency characteristics change at a slower rate with increasing frequency than for ceramic microwave capacitors. Because of the thin-film technology, the above-mentioned frequency characteristics are obtained without significant compromise of properties required for surface mounting. The main Accu-P ® properties are:

• Internationally agreed sizes with excellent dimensional control.
• Ultra small size chip capacitors (01005) are available.
• Ultra tight capacitance tolerances.
• Low ESR at VHF, UHF and microwave frequencies.
• Enhanced RF power handling capablity.
• High stability with respect to time, temperature, frequency and voltage variation.
• Nickel/solder-coated terminations to provide excellent sol- derability and leach resistance. ACCU-P® FEATURES Accu-P® meets the fast-growing demand for low-loss (high-Q) capacitors for use in surface mount technology espe- cially for the mobile communications market, such as cellular radio of 450 and 900 MHz, UHF walkie-talkies, UHF cordless telephones to 2.3 GHz, low noise blocks at 11-12.5 GHz and for other VHF, UHF and microwave applications. Accu-P ® is currently unique in its ability to offer very low capacitance values (0.05pF) and very tight capacitance tolerances (±0.01pF).
• The RF power handling capability of the Accu-P ® allows for its usage in both small signal and RF power applica- tions.
• Thin Film Technology guarantees minimal batch to batch variability of parameters at high frequency.
• Inspection test and quality control procedures in accor- dance with ISO 9001, CECC, IECQ and USA MIL Standards yield products of the highest quality.
• Hand soldering Accu-P ®: Due to their construction utilizing relatively high thermal conductivity materials, Accu-P’s have become the preferred device in R & D labs and pro- duction environments where hand soldering is used.

APPLICATIONS

CT2/PCN (Cordless Telephone/Personal Comm. Networks) Satellite TV Cable TV GPS (Global Positioning Systems) Vehicle Location Systems Vehicle Alarm Systems Paging Military Communications Radar Systems Video Switching Test & Measurements Filters VCO's Matching Networks RF Amplifiers APPROVALS ISO 9001 7050118

The following 3 digit capacitance codes should be used for ordering AVX Accu-P ® capacitors CAPACITANCE EXAMPLE CODE 0.00 to 0.99pF Rxx 0.15pF = 04023JR15ABSTR 1.00 to 1.99pF Axx 1.55pF = 04023JA55PBSTR 8 050118 Accu-P® Thin-Film Chip Capacitors for RF Signal and Power Applications 0402 Size C005 0201 0402 0603 0805 1210* Voltage 2 = 200V 1 = 100V 5 = 50V 3 = 25V Y = 16V Z = 10V J Temperature Coefficient (1) J = 0±30ppm/°C (-55°C to +125°C) K = 0±60ppm/°C (-55°C to +125°C) 4R7 Capacitance Capacitance expressed in pF. (2 significant digits + number of zeros) for values <10pF, letter R denotes decimal point. Example: 68pF = 680 8.2pF = 8R2 A Tolerance for C≤2.0pF* Z = ±0.01pF P = ±0.02pF Q = ±0.03pF A = ±0.05pF B = ±0.1pF C = ±0.25pF for C≤3.0pF Q = ±0.03pF A = ±0.05pF B = ±0.1pF C = ±0.25pF for C≤5.6pF A = ±0.05pF B = ±0.1pF C = ±0.25pF for 5.6pF<C<10pF B = ±0.1pF C = ±0.25pF D = ±0.5pF for C≥10pF F = ±1% G = ±2% J = ±5% B Specification Code B = Accu-P® technology S Termination Code W = Nickel/Solder Coated Accu-P® 0402 Sn90, Pb10* T = Nickel/High Temperature Solder Coated Accu-P Sn96, Ag4 Nickel/Solder Coated Accu-P® 0603* Sn63, Pb37 **S = Nickel/Lead Free Solder Coated Accu-P ® 01005, 0201, 0402, 0603 Sn100 TR Packaging Code TR = Tape & Reel (1) TC’s shown are per EIA/IEC Specifications. \\500 Option Operating and Storage Temperature Range -55°C to +125°C Temperature Coefficients(1) 0 ± 30ppm/°C dielectric code “J” / 0 ± 60ppm/°C dielectric code “K” Capacitance Measurement 1 MHz, 1 Vrms Insulation Resistance (IR) ≥1011 Ohms (≥1010 Ohms for 0201 and 0402 size) Proof Voltage 2.5 UR for 5 secs. Aging Characteristic Zero Dielectric Absorption 0.01% ELECTRICAL SPECIFICATIONS HOW TO ORDER * Tolerances as tight as ±0.01pF are available. Please consult the factory. 01005* 0201* 0402* 0603* 0805* 1210 ACCU-P® (Signal and Power Type Capacitors) *Mount Black Side Up DIMENSIONS: millimeters (inches) +0.1 -0.0 +0.004 -0.000 +0.1 -0.0 +0.004 -0.000 Engineering Kits Available see pages 118-119 RoHS compliant * Not RoHS Compliant LEAD-FREE COMPATIBLE COMPONENT For RoHS compliant products, please select correct termination style.

Accu-P® Signal and Power Type Capacitors TEMP. COEFFICIENT CODE (1) For capacitance values higher than listed in table, please consult factory. (2) TC shown is per EIA/IEC Specifications. These values are produced with “K” temperature coefficient code only. Accu-P® Capacitance Ranges (pF) Intermediate values are available within the indicated range. Size Size Code C005 0201 0402 0603 0805 1210 Voltage 16 100 50 25 16 10 200 100 50 25 16 10 200 100 50 25 100 50 25 100 50 Cap in Cap pF(1) code 0.1 — 0R1 0.2 — 0R2 0.3 — 0R3 0.4 — 0R4 0.5 — 0R5 0.6 — 0R6 0.7 — 0R7 0.8 — 0R8 0.9 — 0R9 1.0 — 1R0 1.1 — 1R1 1.2 — 1R2 1.3 — 1R3 1.4 — 1R4 1.5 — 1R5 1.6 — 1R6 1.7 — 1R7 1.8 — 1R8 1.9 — 1R9 2.0 — 2R0 2.1 — 2R1 2.2 — 2R2 2.3 — 2R3 2.4 — 2R4 2.5 — 2R5 2.6 — 2R6 2.7 — 2R7 2.8 — 2R8 2.9 — 2R9 3.0 — 3R0 3.1 — 3R1 3.2 — 3R2 3.3 — 3R3 3.4 — 3R4 3.5 — 3R5 3.6 — 3R6 3.7 — 3R7 3.8 — 3R8 3.9 — 3R9 4.0 — 4R0 4.1 — 4R1 4.2 — 4R2 4.3 — 4R3 4.4 — 4R4 4.5 — 4R5 4.6 — 4R6 4.7 — 4R7 5.1 — 5R1 5.6 — 5R6 6.2 — 6R2 6.8 — 6R8 7.5 — 7R5 8.2 — 8R2 9.1 — 9R1 10.0 — 100 11.0 — 110 12.0 — 120 13.0 — 130 14.0 — 140 15.0 — 150 16.0 — 160 17.0 — 170 18.0 — 180 19.0 — 190 20.0 — 200 21.0 — 210 22.0 — 220 24.0 — 240 27.0 — 270 30.0 — 300 33.0 — 330 39.0 — 390 47.0 — 470 56.0 — 560 68.0 — 680 9050118

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR Accu-P®

0201 Typical Electrical Tables

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Tesonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 10 ±1% 2.8 128 70 10.65 151 114 12.96 45 148 15.41 29 155 11 ±1% 2.7 120 66 11.73 141 110 14.52 42 142 17.55 27 148 12 ±1% 2.5 112 62 12.82 132 105 16.07 39 135 19.68 24 141 13 ±1% 2.4 105 58 13.92 124 104 17.82 36 135 22.38 22 142 14 ±1% 2.4 98 54 15.02 116 103 19.57 32 135 25.08 19 142 15 ±1% 2.3 91 50 16.12 108 102 21.32 29 135 27.78 17 143 16 ±1% 2.2 86 47 17.37 102 103 24.04 27 135 NA NA NA 17 ±1% 2.2 81 44 18.63 96 105 26.76 25 136 NA NA NA 18 ±1% 2.1 76 42 19.88 90 106 29.48 23 136 NA NA NA 19 ±1% 2.1 71 39 21.14 83 108 32.20 21 136 NA NA NA 20 ±1% 2.1 65 36 22.39 77 109 34.92 19 136 NA NA NA 22 ±1% 2.0 55 30 24.90 65 112 40.36 15 137 NA NA NA Accu-P®

Accu-P®

0402 Typical Electrical Tables

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 12 050118

Accu-P® Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 10 ±1% 2.4 268 148 10.65 310 45 13.28 103 47 16.50 61 49 11 ±1% 2.3 242 133 11.77 285 44 14.98 89 46 19.04 51 49 12 ±1% 2.2 217 119 12.90 259 44 16.68 75 45 21.57 42 48 13 ±1% 2.2 202 111 14.03 241 44 18.83 68 47 25.73 38 49 14 ±1% 2.1 187 103 15.17 223 44 20.97 62 49 29.89 33 49 15 ±1% 2.1 172 94 16.30 204 45 23.12 56 51 34.05 29 50 16 ±1% 2.0 157 87 17.53 187 44 25.91 50 49 41.44 25 49 17 ±1% 1.9 143 79 18.75 169 43 28.70 45 46 48.82 21 47 18 ±1% 1.8 129 71 19.98 152 42 31.49 39 44 56.21 17 46 19 ±1% 1.8 121 67 21.11 143 42 33.51 36 44 60.92 15 47 20 ±1% 1.8 110 61 22.25 131 41 35.53 33 43 65.63 14 48 22 ±1% 1.8 98 54 24.51 116 41 39.57 26 42 75.05 10 51 24 ±1% 1.8 87 48 27.51 104 37 54.94 21 35 NA NA NA 27 ±1% 1.7 70 39 32.01 85 32 77.98 13 23 NA NA NA 30 ±1% 1.7 65 36 35.89 78 28 106.50 10 12 NA NA NA 33 ±1% 1.7 60 33 40.05 74 27 NA NA NA NA NA NA 36 ±1% 1.7 58 32 45.13 71 28 NA NA NA NA NA NA 39 ±1% 1.7 56 31 50.21 69 28 NA NA NA NA NA NA 43 ±1% 1.6 53 29 56.98 66 29 NA NA NA NA NA NA 47 ±1% 1.6 50 28 63.75 63 30 NA NA NA NA NA NA 51 ±1% 1.6 48 26 70.53 60 31 NA NA NA NA NA NA 56 ±1% 1.6 44 24 78.99 56 33 NA NA NA NA NA NA 58 ±1% 1.6 42 23 83.54 54 34 NA NA NA NA NA NA 68 ±1% 1.6 32 18 106.28 42 40 NA NA NA NA NA NA 13050118

Accu-P®

0603 Typical Electrical Tables

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 14 050118

Accu-P® Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 10 ±1% 1.8 146 80 11.37 171 95 22.05 36 121 70.00 12 127 11 ±1% 1.7 129 71 12.66 153 95 26.44 29 120 140.0 6 126 12 ±1% 1.6 112 62 13.95 134 94 30.83 22 119 231.3 1 125 13 ±1% 1.6 102 56 15.31 122 93 40.37 18 118 n/a n/a n/a 14 ±1% 1.5 92 51 16.67 111 92 49.91 15 118 n/a n/a n/a 15 ±1% 1.5 82 45 18.03 99 90 59.44 11 117 n/a n/a n/a 16 ±1% 1.4 79 43 19.61 96 90 80.00 8 117 n/a n/a n/a 17 ±1% 1.4 76 42 21.18 92 90 120.0 6 116 n/a n/a n/a 18 ±1% 1.3 73 40 22.76 89 90 190.0 4 116 n/a n/a n/a 19 ±1% 1.3 69 38 24.37 84 89 n/a n/a n/a n/a n/a n/a 20 ±1% 1.2 65 36 25.98 80 89 n/a n/a n/a n/a n/a n/a 22 ±1% 1.2 57 31 29.21 72 87 n/a n/a n/a n/a n/a n/a 24 ±1% 1.2 48 26 34.44 62 87 n/a n/a n/a n/a n/a n/a 27 ±1% 1.1 43 24 41.87 56 86 n/a n/a n/a n/a n/a n/a 30 ±1% 1.0 37 21 49.29 49 85 n/a n/a n/a n/a n/a n/a 33 ±1% 1.0 32 18 56.72 43 84 n/a n/a n/a n/a n/a n/a 36 ±1% 1.0 27 15 64.15 37 83 n/a n/a n/a n/a n/a n/a 39 ±1% 1.0 21 12 71.57 30 82 n/a n/a n/a n/a n/a n/a 15050118

Accu-P®

0805 Typical Electrical Tables

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 16 050118

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 10 ±1% 1.8 160 88 11.80 191 81 32.48 37 100 n/a n/a n/a 11 ±1% 1.7 139 77 13.17 167 81 40.90 26 101 n/a n/a n/a 12 ±1% 1.6 119 65 14.54 143 80 49.32 16 101 n/a n/a n/a 13 ±1% 1.6 110 60 16.17 134 80 n/a n/a n/a n/a n/a n/a 14 ±1% 1.5 101 55 17.79 125 80 n/a n/a n/a n/a n/a n/a 15 ±1% 1.5 92 51 19.42 116 80 n/a n/a n/a n/a n/a n/a 16 ±1% 1.4 87 48 21.13 110 79 n/a n/a n/a n/a n/a n/a 17 ±1% 1.4 83 46 22.85 104 78 n/a n/a n/a n/a n/a n/a 18 ±1% 1.3 78 43 24.57 99 77 n/a n/a n/a n/a n/a n/a 19 ±1% 1.3 73 40 26.41 92 77 n/a n/a n/a n/a n/a n/a 20 ±1% 1.3 67 37 28.26 85 76 n/a n/a n/a n/a n/a n/a 22 ±1% 1.2 57 31 31.95 72 76 n/a n/a n/a n/a n/a n/a 24 ±1% 1.2 46 25 35.64 59 75 n/a n/a n/a n/a n/a n/a 27 ±1% 1.1 41 22 44.94 54 74 n/a n/a n/a n/a n/a n/a 30 ±1% 1.0 36 20 54.24 48 73 n/a n/a n/a n/a n/a n/a 33 ±1% 1.0 30 17 63.54 42 72 n/a n/a n/a n/a n/a n/a 36 ±1% 0.9 25 14 72.84 37 71 n/a n/a n/a n/a n/a n/a 39 ±1% 0.9 20 11 82.14 31 70 n/a n/a n/a n/a n/a n/a 43 ±1% 0.9 16 9 102.9 27 66 n/a n/a n/a n/a n/a n/a 47 ±1% 0.8 12 7 123.7 23 63 n/a n/a n/a n/a n/a n/a Accu-P®

Accu-P®

1210 Typical Electrical Tables

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 18 050118

Capacitance Self Q Standard Value Frequency Frequency Frequency@ 1MHz Resonance @ 1GHz 900MHz 1900MHz 2400MHzand Tolerance Frequency C (pF) Tol. (GHz) Typ. Min. C(eff) Q ESR C(eff) Q ESR C(eff) Q ESR 10 ±1% 1.5 247 136 10.60 285 57 13.09 85 76 16.30 50 84 11 ±1% 1.5 225 124 11.71 265 56 14.79 76 74 18.94 43 82 12 ±1% 1.4 204 112 12.82 244 54 16.49 68 73 21.57 36 81 13 ±1% 1.3 193 106 13.97 230 53 18.64 61 72 26.09 32 80 14 ±1% 1.3 181 99 15.13 215 53 20.80 55 71 30.61 28 79 15 ±1% 1.2 169 93 16.28 200 52 22.95 48 70 35.13 24 78 16 ±1% 1.2 164 90 17.51 195 51 26.01 46 69 46.51 22 76 17 ±1% 1.2 159 88 18.75 189 50 29.07 43 67 57.90 19 75 18 ±1% 1.1 154 85 19.98 183 49 32.14 41 66 69.29 17 73 19 ±1% 1.1 150 82 21.21 178 49 36.34 39 66 n/a n/a n/a 20 ±1% 1.1 145 80 22.43 172 49 40.55 38 65 n/a n/a n/a 22 ±1% 1.0 136 75 24.88 162 49 48.96 34 64 n/a n/a n/a 24 ±1% 1.0 126 70 27.34 151 48 57.38 31 63 n/a n/a n/a 27 ±1% 0.9 112 62 31.02 135 48 70.00 26 62 n/a n/a n/a 30 ±1% 0.9 101 56 36.14 121 48 n/a n/a n/a n/a n/a n/a 33 ±1% 0.8 90 50 41.27 108 48 n/a n/a n/a n/a n/a n/a 36 ±1% 0.8 79 44 46.39 95 48 n/a n/a n/a n/a n/a n/a 39 ±1% 0.8 68 38 51.52 82 48 n/a n/a n/a n/a n/a n/a 43 ±1% 0.7 54 30 58.35 64 48 n/a n/a n/a n/a n/a n/a 47 ±1% 0.7 39 21 65.18 46 48 n/a n/a n/a n/a n/a n/a 82 ±1% 0.7 17 10 148.400 24 48 n/a n/a n/a n/a n/a n/a Accu-P®

Accu-P® High Frequency Characteristics 2.5 1.5 0.5 10000 1000 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 01005 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 01005 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 01005 Typical Q vs Frequency 5 10 15 20 25 30 35 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.5pF 0.8pF 1.0pF 1.2pF 1.8pF 1.0pF 0.8pF 2.4pF 20 050118 Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A

Accu-P® High Frequency Characteristics 35.0 30.0 25.0 20.0 15.0 10.0 5.0 0.0 1000 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 0201 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 0201 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 0201 Typical Q vs Frequency 0 5 10 15 20 25 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 21050118 Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A

Accu-P® High Frequency Characteristics 22 050118 30.0 25.0 20.0 15.0 10.0 5.0 0.0 1000 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 0402 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 0402 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 0402 Typical Q vs Frequency 0 10 20 30 40 50 60 70 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A

Accu-P® High Frequency Characteristics 23050118 30.0 25.0 20.0 15.0 10.0 5.0 0.0 350 300 250 200 150 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 0603 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 0603 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 0603 Typical Q vs Frequency 0 5 10 15 20 25 30 35 40 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A

Accu-P® High Frequency Characteristics 350 300 250 200 150 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 0805 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 0805 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 0805 Typical Q vs Frequency 0 10 20 30 40 50 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 8.2pF 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 8.2pF Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A 24 050118

Accu-P® High Frequency Characteristics 300 250 200 150 100 1000 100 Capacitance (pF) SRF (GHz) Frequency (MHz) Accu-P® 1210 Typical SRF vs Capacitance ESR (mΩ) Accu-P® 1210 Typical ESR vs Frequency Frequency (MHz) Q Accu-P® 1210 Typical Q vs Frequency 0 5 10 15 20 25 30 35 40 45 50 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF 0.8pF 1.2pF 1.8pF 2.2pF 3.3pF 4.7pF 6.8pF 15pF Measured on HP8720ES Measured on Agilent 4278A/4991A Measured on Agilent 4278A/4991A 25050118

Accu-P® Environmental / Mechanical Characteristics QUALITY & RELIABILITY Accu-P® is based on well established thin-film technology and materials.

• ON-LINE PROCESS CONTROL This program forms an integral part of the production cycle and acts as a feedback system to regulate and control production processes. The test procedures, which are integrated into the production process, were developed after long research work and are based on the highly developed semiconductor industry test procedures and equipment. These measures help AVX to produce a con- sistent and high yield line of products.
• FINAL QUALITY INSPECTION Finished parts are tested for standard electrical parameters and visual/mechanical characteristics. Each production lot is 100% evaluated for: capacitance and proof voltage at 2.5 U R. In addition, production is periodically evaluated for: Average capacitance with histogram printout for capacitance distribution; IR and Breakdown Voltage distribution; Temperature Coefficient; Solderability; Dimensional, mechanical and temperature stability. QUALITY ASSURANCE The reliability of these thin-film chip capacitors has been studied intensively for several years. Various measures have been taken to obtain the high reliability required today by the industry. Quality assurance policy is based on well established international industry standards. The reliability of the capacitors is determined by accelerated testing under the following conditions: Life (Endurance) 125°C, 2U R, 1000 hours Accelerated Damp Heat Steady State 85°C, 85% RH, U 1000 hours. TEST CONDITIONS REQUIREMENT Life (Endurance) 125°C, 2UR,1000 hours No visible damage MIL-STD-202F Method 108A Δ C/C ≤ 2% for C≥5pF Δ C ≤ 0.25pF for C<5pF Accelerated Damp 85°C, 85% RH, UR, 1000 hours No visible damage Heat Steady State Δ C/C ≤ 2% for C≥5pF MIL-STD-202F Method 103B Δ C ≤ 0.25pF for C<5pF Temperature Cycling -55°C to +125°C, 15 cycles – Accu-P® No visible damage MIL-STD-202F Method 107E Δ C/C ≤ 2% for C≥5pF MIL-STD-883D Method 1010.7 Δ C ≤ 0.25pF for C<5pF Resistance to Solder Heat 260°C ± 5°C for 10 secs C remains within initial limits IEC-68-2-58 ENVIRONMENTAL CHARACTERISTICS TEST CONDITIONS REQUIREMENT Solderability Components completely immersed in a Terminations to be well tinned, minimum 95% IEC-68-2-58 solder bath at 235°C for 2 secs. coverage Leach Resistance Components completely immersed in a Dissolution of termination faces ≤15% of area IEC-68-2-58 solder bath at 260±5°C for 60 secs. Dissolution of termination edges ≤25% of length Adhesion A force of 5N applied for 10 secs. No visible damage MIL-STD-202F Method 211A Termination Bond Strength Tested as shown in diagram No visible damage IEC-68-2-21 Amend. 2 Δ C/C ≤ 2% for C≥5pF Δ C ≤ 0.25pF for C<5pF Robustness of Termination A force of 5N applied for 10 secs. No visible damage IEC-68-2-21 Amend. 2 High Frequency Vibration 55Hz to 2000Hz, 20G No visible damage MIL-STD-202F Method 201A, 204D (Accu-P® only) Storage 12 months minimum with components Good solderability stored in “as received” packaging MECHANICAL CHARACTERISTICS D = 3mm Accu-P D = 1mm Accu-F 26 050118

CAPACITOR TYPE CHIP SIZE THERMAL IMPEDANCE (°C/W) Accu-P® 0805 6.5 1210 5 Microwave MLC 0505 12 1210 7.5 ADVANTAGES OF ACCU-P® IN RF POWER CIRCUITS The optimized design of Accu-P ® offers the designer of RF power circuits the following advantages:

• Reduced power losses due to the inherently low ESR of Accu-P®.
• Increased power dissipation due to the high thermal conductivity of Accu-P®. PRACTICAL APPLICATION IN RF POWER CIRCUITS
• There is a wide variety of different experimental methods for measuring the power handling performance of a capacitor in RF power circuits. Each method has its own problems and few of them exactly reproduce the conditions present in “real” circuit applications.
• Similarly, there is a very wide range of different circuit appli- cations, all with their unique characteristics and operating conditions which cannot possibly be covered by such “theoretical” testing.
• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR APPLICATION IS ITS PERFORMANCE UNDER OPERATING CONDITIONS IN THE ACTUAL CIRCUIT. Accu-P® Performance Characteristics RF Power Applications RF POWER APPLICATIONS In RF power applications capacitor losses generate heat. Two factors of particular importance to designers are:
• Minimizing the generation of heat.
• Dissipating heat as efficiently as possible. CAPACITOR HEATING
• The major source of heat generation in a capacitor in RF power applications is a function of RF current (I) and ESR, from the relationship: Power dissipation = I RMS x ESR
• Accu-P® capacitors are specially designed to minimize ESR and therefore RF heating. Values of ESR for Accu-P® capacitors are significantly less than those of ceramic MLC components currently available. HEAT DISSIPATION
• Heat is dissipated from a capacitor through a variety of paths, but the key factor in the removal of heat is the thermal conductivity of the capacitor material.
• The higher the thermal conductivity of the capacitor, the more rapidly heat will be dissipated.
• The table below illustrates the importance of thermal conductivity to the performance of Accu-P ® in power applications. PRODUCT MATERIAL THERMAL CONDUCTIVITY W/mK Accu-P® Alumina 18.9 Microwave MLC Magnesium Titanate 6.0 Power Handling Accu-P® 10pF Data used in calculating the graph: Thermal impedance of capacitors: 0402 17°C/W 0603 12°C/W 0805 6.5°C/W 1210 5°C/W Thermal impedance measured using RF generator, amplifier and strip-line transformer. ESR of capacitors measured on Boonton 34A THERMAL IMPEDANCE Thermal impedance of Accu-P ® chips is shown below com- pared with the thermal impedance of Microwave MLC’s. The thermal impedance expresses the temperature difference in °C between chip center and termination caused by a power dissipation of 1 watt in the chip. It is expressed in °C/W. 27050118

1.7 (0.068) 0.55 (0.022) 0.5 (0.020) 0.6 (0.024) 0.6 (0.024) 3.0 (0.118) 1.25 (0.049) 1.0 (0.039) 0.17 (0.007) 0.20 (0.008) 0.22 (0.009) 0.78 (0.030) 0.34 (0.013) 0.26 (-0.010) 0.26 (-0.010) 0.26 (-0.010) 1.0 (0.039) 1.0 (0.039) 4.0 (0.157) 1.0 (0.039) 2.5 (0.098) 2.0 (0.079) 1.0 (0.039) 0.8 (0.031) 2.3 (0.091) 0.6 (0.024) 0.85 (0.033) 0.85 (0.033) Accu-P® Application Notes GENERAL Accu-P® SMD capacitors are designed for soldering to printed circuit boards or other substrates. The construction of the components is such that they will withstand the time/temper- ature profiles used in both wave and reflow soldering meth- ods. CIRCUIT BOARD TYPE The circuit board types which may be used with Accu-P ® are as follows: All flexible types of circuit boards (eg. FR-4, G-10) and also alumina. For other circuit board materials, please consult factory. HANDLING SMD capacitors should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recom- mended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product gives the ideal medium for direct presentation to the placement machine. COMPONENT PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during reflow soldering. Pad designs are given below for both wave and reflow soldering. The basis of these designs is: a. Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. Pad overlap 0.5mm beneath large components. Pad overlap about 0.3mm beneath small components. c. Pad extension of 0.5mm for reflow of large components and pad extension about 0.3mm for reflow of small com- ponents. Pad extension about 1.0mm for wave soldering. REFLOW SOLDERING PAD DIMENSIONS: millimeters (inches) 0402 Accu-P® 0201 Accu-P® 01005 Accu-P® 0603 Accu-P® 0805 Accu-P® 1210 Accu-P® 28 050118

Accu-P® Application Notes PREHEAT & SOLDERING The rate of preheat in production should not exceed 4°C/ second and a recommended maximum is about 2°C/second. Temperature differential from preheat to soldering should not exceed 100°C. For further specific application or process advice, please consult AVX. COOLING After soldering, the assembly should preferably be allowed to cool naturally. In the event of assisted cooling, similar conditions to those recommended for preheating should be used. HAND SOLDERING & REWORK Hand soldering is permissible. Preheat of the PCB to 150°C is required. The most preferable technique is to use hot air sol- dering tools. Where a soldering iron is used, a temperature controlled model not exceeding 30 watts should be used and set to not more than 260°C. CLEANING RECOMMENDATIONS Care should be taken to ensure that the devices are thoroughly cleaned of flux residues, especially the space beneath the device. Such residues may otherwise become conductive and effectively offer a lossy bypass to the device. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: water and other standard PCB cleaning liquids. Ultrasonic conditions . . power-20w/liter max. frequency-20kHz to 45kHz. limited by chosen solvent system). STORAGE CONDITIONS Recommended storage conditions for Accu-P ® prior to use are as follows: 29050118 RECOMMENDED REFLOW SOLDERING PROFILE COMPONENTS WITH SnPb TERMINATIONS 330 260 250 200 150 100 Temp (ºC) Time 0:00 0:43 1:28 2:10 2:53 3:36 4:19 5:02 5:48 6:29 Peak Temperature = 260ºC RECOMMENDED REFLOW SOLDERING PROFILE LEAD FREE COMPONENTS WITH Sn100 TERMINATIONS

Accu-P® Automatic Insertion Packaging A(1) B C D E F G AVX reserves the right to change the information published herein without notice. TAPE & REEL All tape and reel specifications are in compliance with EIA 481-1-A. (equivalent to IEC 286 part 3).

• 8mm carrier
• Reeled quantities: Reels of 3,000 per 7" reel or 10,000 pieces per 13" reel 01005, 0201 and 0402 = 5,000 pieces per 7" reel and 20,000 pieces per 13" reel REEL DIMENSIONS: millimeters (inches) CARRIER DIMENSIONS: millimeters (inches) Metric dimensions will govern. Inch measurements rounded and for reference only. (1) 330mm (13 inch) reels are available. +0.1 -0.0 +0.004 -0.000 The nominal dimensions of the component compartment (W,L) are derived from the component size. P = 4mm for 0603, 0805, 1210 P = 2mm for C005, 0201 and 0402 30 050118