YFP0004

TPS22916 TI1

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 21

Technical content

ADVANCE□INFORMATION L H TPS22916xx VIN VOUT R LC L ON GND VIN C IN Copyright © 2017, Texas Instruments Incorporated Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. TPS22916 SLVSDO5 –JULY 2017 TPS22916xx1V–5.5-V,2-A,60-mΩUltra-LowLeakageLoadSwitch

1 Features

1• Input Operating Voltage Range (VIN): 1 V–5.5 V

• Maximum Continuous Current (IMAX): 2 A
• Low ON-Resistance (RON): – 5 VIN = 60 mΩ (typ), 100 mΩ (85°C max) – 1.8 VIN = 100 mΩ (typ), 150 mΩ (85°C max) – 1 VIN = 200 mΩ (typ), 325 mΩ (85°C max)
• Ultra-Low Power Consumption: – ON State (IQ): 0.5 µA (typ), 1.1 µA (85°C max) – OFF State (ISD): 15 nA (typ), 150 nA (85°C max) – TPS22916CL OFF State (ISD): 100 nA (typ), 270 nA (85°C max)
• Slow Timing in C Version Reduces Inrush Current (typical): – 5-V Turnon time (tON): 1400 µs at 5 mV/µs – 1.8-V Turnon time (tON): 3000 µs at 1 mV/µs – 1-V Turnon time (tON): 6500 µs at 0.3 mV/µs
• Fast Timing in B Version Reduces Wait Time (typ): – 5-V Turnon time (tON): 105 µs at 38 mV/µs – 1.8-V Turnon time (tON): 225 µs at 14 mV/µs – 1-V Turnon time (tON): 470 µs at 3.8 mV/µs
• Always-ON True Reverse Current Blocking (RCB): – ON State Activation Current (IRCB): –500 mA (typ) – OFF State Leakage (IIN,RCB): –300 nA (85°C max)
• Quick Output Discharge (QOD): 150 Ω (typ) (TPS22916B, TPS22916C, TPS22916CL only)
• Active Low Enable Option (TPS22916CL)

2 Applications

• Wearables
• Smartphones
• Tablets
• Portable Speakers

3 Description

The TPS22916xx is a small, single channel load switch utilizing a low leakage P-Channel MOSFET for minimum power loss. Advanced gate control design supports operating voltages as low as 1 V with minimal increase in ON-Resistance and power loss. Multiple timing options are available to support various system loading conditions. For heavy capacitive loads, the slow turnon timing in the C version minimizes the inrush current. In cases with light capacitive loads, the fast timing in the B version reduces required wait time. The switch ON state is controlled by a digital input that is capable of interfacing directly with low-voltage control signals. Both Active High and Active Low (L) versions are available. When power is first applied, a Smart Pull Down is used to keep the ON pin from floating until system sequencing is complete. Once the pin is deliberately driven high (>VIH), the Smart Pull Down is disconnected to prevent unnecessary power loss. The TPS22916xx is available in a small, space saving 0.78-mm × 0.78-mm, 0.4-mm pitch, 0.5-mm height 4-pin Wafer-Chip-Scale (WCSP) package (YFP). The device is characterized for operation over a temperature range of –40°C to +85°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS22916xx WCSP (4) 0.78 mm × 0.78 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Device Comparison Table VERSION TIMING QOD ENABLE (ON) TPS22916B Fast Yes Active High TPS22916C Slow Yes Active High TPS22916CN Slow No Active High TPS22916CL Slow Yes Active Low Simplified Schematic

ADVANCE□INFORMATION TPS22916 SLVSDO5 –JULY 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Table of Contents

12.2 Receiving Notification of Documentation Updates 14

13 Mechanical, Packaging, and Orderable

4 Revision History

July 2017 * Initial release.

ADVANCE□INFORMATION B A VOUT GND ON VIN B A VIN ON GND VOUT TPS22916 www.ti.com SLVSDO5 –JULY 2017 Product Folder Links: TPS22916 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

5 Pin Configuration and Functions

NO. NAME TYPE DESCRIPTION A1 VOUT Power Switch output A2 VIN Power Switch input B1 GND Ground Device ground B2 ON Digital input Device enable

ADVANCE□INFORMATION TPS22916 SLVSDO5 –JULY 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 6 V VON Enable voltage –0.3 6 V IMAX Maximum continuous switch current 2 A IPLS Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle 2.5 A TJ,MAX Maximum junction temperature 125 °C TSTG Storage temperature –65 150 °C TLEAD Maximum Lead temperature (10-s soldering time) 300 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 VCharged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage 1 5.5 V VOUT Output voltage 0 5.5 V VIH High-level input voltage, ON 1 5.5 V VIL Low-level input voltage, ON 0 0.35 V TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.4 Thermal Information

Thermal Parameters(1) TPS22916xx UNITYFP (WCSP)

4 PINS

θJA Junction-to-ambient thermal resistance 193 °C/W θJCtop Junction-to-case (top) thermal resistance 2.3 °C/W θJB Junction-to-board thermal resistance 36 °C/W ψJT Junction-to-top characterization parameter 12 °C/W ψJB Junction-to-board characterization parameter 36 °C/W

ADVANCE□INFORMATION TPS22916 www.ti.com SLVSDO5 –JULY 2017 Product Folder Links: TPS22916 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated (1) For more information on which devices include quick output discharge, see the Device Functional Modes section.

6.5 Electrical Characteristics

Unless otherwise noted, the specification in the following table applies over the recommended power supply voltage range of 1 V to 5.5 V. Typical Values are at 25°C. PARAMETER TEST CONDITIONS TJ MIN TYP MAX UNIT INPUT SUPPLY (VIN) IQ,VIN VIN Quiescent current Enabled, VOUT = Open 25°C 0.5 1 µA –40°C to +85°C 1.1 ISD,VIN VIN Shutdown current Disabled, VOUT = GND or Open (TPS22916B/C/CN) 25°C 15 100 nA –40°C to +85°C 150 Disabled, VOUT = GND or Open (TPS22916CL) 25°C 100 200 –40°C to +85°C 270 ON-RESISTANCE (RON) RON On-state resistance IOUT = 200 mA VIN = 5 V 25°C 60 80 mΩ –40°C to +85°C 100 –40°C to +105°C 120 VIN = 3.6 V 25°C 70 90 –40°C to +85°C 120 –40°C to +105°C 140 VIN = 1.8 V 25°C 100 125 –40°C to +85°C 150 –40°C to +105°C 175 VIN = 1.2 V 25°C 150 200 –40°C to +85°C 250 –40°C to +105°C 300 VIN = 1 V 25°C 200 275 –40°C to +85°C 325 –40°C to +105°C 375 ENABLE PIN (ON) ION ON Pin leakage –40°C to +85°C –100 1 100 nA RPD Smart pull down resistance Disabled –40°C to +85°C 1 MΩ REVERSE CURRENT BLOCKING (RCB) IRCB Reverse activation current Enabled –40°C to +85°C -500 mA tRCB RCB Activation time Enabled IIN > IRCB –40°C to +85°C 10 µs VRCB Release voltage Enabled –40°C to +85°C 25 mV IIN,RCB VIN Leakage current in RCB 0 V ≤ VIN ≤ VOUT ≤ 5.5 V –40°C to +85°C –300 nA QUICK OUTPUT DISCHARGE (QOD) QOD(1) Output discharge resistance Disabled (Not in TPS22916CN) –40°C to +85°C 150 Ω

ADVANCE□INFORMATION TPS22916 SLVSDO5 –JULY 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TPS22916B Rising slew rate SRON VIN = 1 V 3.8 mV/µs VIN = 1.2 V 6.4 VIN = 1.8 V 14 VIN = 3.6 V 44 VIN = 5 V 38 Turnon delay tD VIN = 1 V 260 µs VIN = 1.2 V 200 VIN = 1.8 V 125 VIN = 3.6 V 65 VIN = 5 V 45 Rise time tR VIN = 1 V 210 VIN = 1.2 V 150 VIN = 1.8 V 100 VIN = 3.6 V 65 VIN = 5 V 60 Turnon time tON VIN = 1 V 470 VIN = 1.2 V 350 VIN = 1.8 V 225 VIN = 3.6 V 130 VIN = 5 V 105 Turnoff time tOFF VIN = 1 V 25 VIN = 1.2 V 15 VIN = 1.8 V 10 VIN = 3.6 V 5 VIN = 5 V 5 Fall time tF Depends on RL and CL

ADVANCE□INFORMATION TPS22916 www.ti.com SLVSDO5 –JULY 2017 Product Folder Links: TPS22916 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated Switching Characteristics (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (1) See the Quick Output Discharge (QOD) section for information on how RL and CL affect Fall Time. TPS22916C, TPS22916CN, TPS22916CL Rising slew rate SRON VIN = 1 V 0.3 mV/µs VIN = 1.2 V 0.4 VIN = 1.8 V 1 VIN = 3.6 V 3.2 VIN = 5 V 5 Turnon delay tD VIN = 1 V 3500 µs VIN = 1.2 V 2700 VIN = 1.8 V 1600 VIN = 3.6 V 800 VIN = 5 V 600 Rise time tR VIN = 1 V 3000 VIN = 1.2 V 2300 VIN = 1.8 V 1400 VIN = 3.6 V 900 VIN = 5 V 800 Turnon time tON VIN = 1 V 6500 VIN = 1.2 V 5000 VIN = 1.8 V 3000 VIN = 3.6 V 1700 VIN = 5 V 1400 Turnoff time tOFF VIN = 1 V 25 VIN = 1.2 V 15 VIN = 1.8 V 10 VIN = 3.6 V 5 VIN = 5 V 5 Fall time tF Depends on RL and CL (1)

7 Parameter Measurement Information

Figure 1. TPS22916 Test Circuit Figure 2. TPS22916 Timing Waveform

ADVANCE□INFORMATION IN ON OUT GND QOD Resistance Reverse Current Blocking (Not in TPS22916CN)Smart Pull Down Resistance Control Logic Driver Copyright © 2017, Texas Instruments Incorporated TPS22916 www.ti.com SLVSDO5 –JULY 2017 Product Folder Links: TPS22916 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

8 Detailed Description

8.1 Overview

This family of devices are single channel, 2-A load switches in ultra-small, space saving 4-pin WCSP package. These devices implement a low resistance P-channel MOSFET with a controlled rise time for applications that need to limit inrush current. These devices are designed to have very low leakage current during off state. This prevents downstream circuits from pulling high standby current from the supply. Integrated control logic, driver, power supply, and output discharge FET eliminates the need for additional external components, which reduces solution size and BOM count.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 On and Off Control

The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold. It can

8.3.2 Quick Output Discharge (QOD)

The TPS22916B/C/CL include a Quick Output Discharge feature. The TPS22916CN does not include a Quick Output Discharge Feature. When the switch is disabled, a discharge resistor is connected between VOUT and GND. This resistor has a typical value of QOD and prevents the output from floating while the switch is disabled. As load capacitance and load resistance increase: tFALL increases. The larger the load resistance or load capacitance is, the longer it takes to discharge the capacitor, resulting in a longer fall time. Capacitance discharge follows Equation 1. tFALL = -RL × CL × ln(V10%/V90%)

• V10% is 10% of the initial output voltage
• V90% is 90% of the initial output voltage
• RL is the load resistance
• CL is the load capacitance (1) With the Quick Output Discharge feature, the QOD resistance is in parallel with RL. This provides a lower total load resistance as seen from the load capacitance which discharges the capacitance faster resulting in a smaller tFALL.

8.3.3 Full-Time Reverse Current Blocking

is disabled within tRCB. See Figure 3. Figure 3. Reverse Current

8.4 Device Functional Modes

Table 1. Device Function Table Table 2 shows the QOD functions. Table 2. QOD Function Table Table 3 shows the Smart-ON functions. Table 3. Smart-ON Functional Modes

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Thermal Considerations

• PD(max) = maximum allowable power dissipation
• TJ(max) = maximum allowable junction temperature
• TA = ambient temperature of the device
• θJA = junction to air thermal impedance. See the Thermal Information section. This parameter is highly dependent upon board layout. (2)

9.2 Typical Application

Figure 4. Typical Application

9.2.1 Design Requirements

For this design example, below, use the input parameters shown in Table 4. Table 4. Design Parameters

9.2.2 Detailed Design Procedure

9.2.2.1 Maximum Voltage Drop and On-Resistance

ADVANCE□INFORMATION TPS22916 SLVSDO5 –JULY 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated The maximum voltage drop is 5% which is 90 mV. The voltage drop caused by the load current across the on resistance is 50 mV.

10 Power Supply Recommendations

a large transient current or large load current step, additional bulk capacitance may be required on the input.

11 Layout

11.1 Layout Guidelines

along with minimizing the case to ambient thermal impedance.

11.2 Layout Example

ground noise seen by the device. Figure 5. TPS22916xx Layout

ADVANCE□INFORMATION TPS22916 SLVSDO5 –JULY 2017 www.ti.com Product Folder Links: TPS22916 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following: TPS22916 Load Switch Evaluation Module

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

ADVANCE□INFORMATION TPS22916 www.ti.com SLVSDO5 –JULY 2017 Product Folder Links: TPS22916 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 19-Jul-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples PTPS22916BYFPT ACTIVE DSBGA YFP 4 250 TBD Call TI Call TI -40 to 85 PTPS22916CYFPT ACTIVE DSBGA YFP 4 250 TBD Call TI Call TI -40 to 85 TPS22916BYFPR PREVIEW DSBGA YFP 4 3000 TBD Call TI Call TI -40 to 85 TPS22916BYFPT PREVIEW DSBGA YFP 4 250 TBD Call TI Call TI -40 to 85 TPS22916CYFPR PREVIEW DSBGA YFP 4 3000 TBD Call TI Call TI -40 to 85 TPS22916CYFPT PREVIEW DSBGA YFP 4 250 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 19-Jul-2017 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com PACKAGE OUTLINE C0.5 MAX 0.19 0.13 0.4 TYP 0.4 TYP 4X 0.25 0.21 B E A D 4223507/A 01/2017 DSBGA - 0.5 mm max heightYFP0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A B

0.015 C A B

SCALE 10.000

www.ti.com EXAMPLE BOARD LAYOUT 4X ( 0.23) (0.4) TYP (0.4) TYP ( 0.23) METAL

0.05 MAX

( 0.23) SOLDER MASK OPENING

0.05 MIN

DSBGA - 0.5 mm max heightYFP0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:50X A B 1 2 NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK DEFINED EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP METAL TYP 4223507/A 01/2017 DSBGA - 0.5 mm max heightYFP0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:50X A B 1 2

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers’applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS”AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non- compliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated