UPC1093 RENESAS
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© 1986 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC1093 ADJUSTABLE PRECISION SHUNT REGULATORS Document No. G10634EJ5V0DS00 (5th edition) (Previous No. IC-1791) Date Published September 1998 N CP(K) Printed in Japan The mark shows major revised points. The information in this document is subject to change without notice.
DESCRIPTION
The µPC1093 are adjustable precision shunt regulators with guaranteed thermal stability. The output voltage can be set to any value between reference voltage (2.495 V) and 36 V by two external resistors. These ICs can apply to error amplifier of switching regulators.
FEATURES
- High Accuracy V REF = 2.495 V ± 2 %
- Low Temperature Coefficient Δ VREF /Δ T ≤ 100 ppm/°C
- Adjustable Output Voltage by two External Resistors VREF ≤ VO ≤ 36 V
- Low Dynamic Impedance | Z KA | = 0.1 Ω TYP.
ORDERING INFORMATION
µPC1093J 3-pin plastic SIP (TO-92) µPC1093G 8-pin plastic SOP (225 mil) µPC1093T Power mini mold (SOT-89) µPC1093TA 5-pin plastic mini mold (SC-74A)
µPC1093 EQUIVALENT CIRCUIT PIN CONFIGURATION (Marking Side) 3-pin plastic SIP (TO-92) 8-pin plastic SOP (225 mil)
- µPC1093J • µPC1093G Power mini mold (SOT-89) 5-pin plastic mini mold (SC-74A)
- µPC1093T • µPC1093TA K REF A R 5 R 6 R 7 R 8 R 9 R 10R 1 R 2 R 3 R 4 Q 5 Q 6 Q 7 Q 8 Q 9 Q 10 Q 1 Q 2 Q 3 Q 4 Q 11 D 1 C 2 C 1 Q 12 Q 13 Q 14 Q 15 Q 16 Q 17 123 1 : REF 2 : A 3 : K 123 A K A REF NC A 13 2 REF A K REF : Reference A : Anode K : Cathode NC : No Connection K NC NC NC REF NC A NC
µPC1093 ABSOLUTE MAXIMUM RATING (T A = 25 °C, unless otherwise specified.) Parameter Symbol Ratings Unit Cathode Voltage V KA 37 V Cathode Current I K 150 mA Cathode-Anode Reverse Current –I K –100 mA Reference Voltage V REF 7V Reference Input Current I REF 50 µA Reference-Anode Reverse Current –IREF –10 mA Power Dissipation µPC1093J P T 700 mW µPC1093G 480 µPC1093T 400/2 000 Note 1 µPC1093TA 180/510 Note 2 Operating Ambient Temperature T A –20 ~ +85 °C Storage Temperature T stg –65 ~ +150 °C Notes 1. with 16 cm2 × 0.7 mm ceramic substrate 2. with 75 mm2 × 0.7 mm ceramic substrate Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceed- ing the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Cathode Voltage V KA VREF 53 6V Cathode Current I K 1 10 100 mA Power Dissipation µPC1093J P T 50 220 mW µPC1093G 50 150 µPC1093T 50 125/640Note 1 µPC1093TA 50 58/160 Note 2 Operating Ambient Temperature T A –20 +85 °C Notes 1. with 16 cm2 × 0.7 mm ceramic substrate 2. with 75 mm2 × 0.7 mm ceramic substrate
µPC1093 ELECTRICAL CHARACTERISTICS (T A = 25 °C, IK = 10 mA, unless otherwise specified.) Parameter Symbol Conditions MIN. TYP. MAX. Unit Reference Voltage V REF VKA = VREF 2.440 2.495 2.550 V Reference Voltage Deviation Over Δ VREF 0 °C ≤ TA ≤ 70 °C, VKA = VREF 71 7 m V Temperature Reference Voltage Deviation Over Δ VREF /ΔV| V REF | ≤ VKA ≤ 10 V 1.2 2.7 mV/V Cathode Voltage 10 V ≤ VKA ≤ 36 V 0.7 2 mV/V Reference Input Current I REF VKA = VREF , R1 = 10 kΩ , R2 = ∞ 14 µA Reference Input Current DeviationΔ IREF 0 °C ≤ TA ≤ 70 °C, VKA = VREF , 0.4 1.2 µA Over Temperature R 1 = 10 kΩ , R2 = ∞ Minimum Cathode Current I K min. VKA = VREF , Δ VREF = 2 % 0.4 1 mA Off-state Cathode Current I K off VKA = 36 V, VREF = 0 0.1 1 µA Dynamic Impedance | Z KA |V KA = VREF , f ≤ 1 kHz 0.1 0.5 Ω 1 mA ≤ IK ≤ 100 mA TEST AND APPLICATION CIRCUIT VIN GND K A REF R 0 R 1 R 2 VOUT VOUT (1+ ) . VREF R 1 R 2
µPC1093 TYPICAL CHARACTERISTICS 1.2 0.2 1.0 02 13 VKA - Cathode Voltage - V IK - Cathode Current - mA IK vs VKA ( I ) 0.8 0.4 0.6 TA = 25 °C VKA = VREF –10 –20 0–25 50 75 100 T A - Operating Ambient Temperature - °C VREF - Reference Voltage Deviation - mV VREF vs TA –20 VKA - Cathode Voltage - V –10 TA = 25 °C IK = 10 mA –30 IK = 10 mA VKA = VREF –30 3010 200 0.4 2.0 Pd - Power Dissipation - W Pd vs TA ( II ) 1.6 0.8 1.2 0.8 0.2 0.4 100 TA - Operating Ambient Temperature - °C Pd - Power Dissipation - W 0.6 0 8020 40 60 Pd vs TA ( I ) (with 16 cm2×0.7 mm ceramic substrate) PC1093T PC1093J PC1093TA 62.5 °C/W 180 °C/W PC1093G 260 °C/W PC1093T 315 °C/W PC1093TA 695 °C/W 245 °C/W 150 100 –50 – 2 – 1 0123 VKA - Cathode Voltage - V IK - Cathode Current - mA IK vs VKA ( II ) TA = 25 °C VKA = VREF –100 µ µ µ µ 1000 8020 40 60 TA - Operating Ambient Temperature - °C µ µ (with 75 mm2×0.7 mm ceramic substrate) VREF - Reference Voltage Deviation - mV VREF vs VKA
µPC1093 0.3 0 2 55 07 5 1 0 0 TA -Operating Ambient Temperature - °C IK off - Off-state Cathode Current - A IK off vs TA 46 1 0 T - Time - s VREF - Reference Voltage - V Pulse Response TA = 25 °C VKA = VREF R O = 220 Ω 100 100 k100 1 k 1 M f - Frequency - Hz ZKAI - Dynamic Impedance - Ω ZKA vs f 10 M f - Frequency - Hz Av - Voltage Gain - dB A v vs f 0.01 10 k TA = 25 °C VKA = VREF 1 mA≤IK≤100 mA –20
1 M10 k 100 k1 k
0.1 0.2 –25 VKA = 36 V VREF = 0 02 8 220 Ω IK νo νin 10 kΩ (IK = 10 mA) 10 kΩ 0.1 –25 0 25 50 75 100 TA -Operating Ambient Temperature - °C IREF - Reference Input Current - A IREF vs TA VKA = VREF , IK = 10 mA R 1 = 10 kΩ , R2 = ∞ µ µ µ VIN - Input Voltage - V
µPC1093 STABILITY AREA TEST CIRCUIT Caution of Stability Area If the Aluminum electrolytic capacitor is used, it should be kept CKA ≥ 2.2 µF. When using plural different types of capacitors, each capacitor is needed to be stable independently. When designing a circuit, take the characteristic variation among devices into consideration, so that the designed circuit has an enough characteristic margin supporting the standard specifications described above. 100 IKA - Cathode Current - mA C KA - Load Capacitance - F 0.001 0.01 0.1 1 10 a : VKA = VREF b : VKA = 5 V c : VKA = 10 V d : VKA = 15 V Unstable Stable a b c d a b c µ Stable IKA IKA 150 Ω 150 Ω C KA C KA 10 kΩ R a b, c, d C KA : Monolithic Ceramic Capacitors
µPC1093 PACKAGE DRAWINGS G M J UV F
3 PIN PLASTIC SIP (TO-92)
A M Y H NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. P3J-127B-2 ITEM MILLIMETERS A F G H J M N U 5.0±0.2 0.12 5.0±0.5 4.0±0.2 0.5 V Y 15.0 ±0.7 2.8 MAX. 0.5±0.1 1.27 1.33 MAX. +0.3 −0.1 N
µPC1093
8 PIN PLASTIC SOP (225 mil)
M C D F 1 4 M G E B P J K L NS detail of lead end ITEM MILLIMETERS A B C E F G H I J 5.2 1.27 (T.P.) 1.59±0.21 1.49 6.5±0.3 0.78 MAX. 0.12 1.1±0.2 4.4±0.15 M 0.1±0.1 N S8GM-50-225B-5 P3 °+7° D 0.42 +0.08 −0.07 K 0.17 +0.08 −0.07 L 0.6 ±0.2 0.10 −3° S H I A NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. +0.17 −0.20
µPC1093 POWER MINI MOLD (SOT-89) (Unit: mm) 4.5±0.1 1.6±0.2 0.41+0.03 −0.05 1.5±0.1 2.5±0.1 4.0±0.25 3.0 1.5 0.42–0.060.42±0.06 0.8 MIN. 0.47 ±0.06
µPC1093
5 PIN PLASTIC MINI MOLD
B A C 0.95 (T.P.) 2.9±0.2 0.3 S5TA-95-15A ITEM MILLIMETERS B R KM L detail of lead end J C D F N D 0.32 +0.05 −0.02 E F 1.4 MAX. 0.05±0.05 G 1.1 +0.2 −0.1 H 2.8 ±0.2 I 1.5 +0.2 −0.1 J 0.65 +0.1 −0.15 K 0.16 +0.1 −0.06 M N R5 °±5° S M S G E A H I L 0.4 ±0.2 0.19 0.1
µPC1093 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Through-hole device µPC1093J: 3-pin plastic SIP (TO-92) Process Conditions Wave soldering Solder temperature: 260 °C or below, (only to leads) Flow time: 10 seconds or less. Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Surface mount devices µPC1093G: 8-pin plastic SOP (225 mil) Process Conditions Symbol Infrared ray reflow Peak temperature: 230 °C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. VPS Peak temperature: 215 °C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
µPC1093 µPC1093T: Power mini mold (SOT-89) Process Conditions Symbol Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), IR35-00-2 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 2 times. VPS Peak temperature: 215 °C or below (Package surface temperature), VP15-00-2 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 2 times. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. µPC1093TA: 5-pin plastic mini mold (SC-74A) Process Conditions Symbol Infrared ray reflow Peak temperature: 235 °C or below (Package surface temperature), IR35-00-3 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 3 times. VPS Peak temperature: 215 °C or below (Package surface temperature), VP15-00-3 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 3 times. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
µPC1093 REFERENCE DOCUMENTS Quality Grades on NEC Semiconductor Devices C11531E Semiconductor Device Mounting Technology Manual C10535E Semiconductors Selection Guide X10679E NEC Semiconductor Device Reliability/Quality Control System IEI-1212 -Three Terminal Regulator REMARK OF THE PACKAGE MARK The package marks of the µPC1093T and the µPC1093TA are the symbols as follows. Part Number Mark µPC1093T 93 µPC1093TA K93
µPC1093 [MEMO]
µPC1093 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. [MEMO]