UPB1502GR RENESAS

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Technical content

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.

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© 1996, 1999 DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUITS µPB1502GR, 1502GR(1) 1.7 GHz/ 2.0 GHz LOW-POWER TWO-MODULUS PRESCALER DIVIDED-BY-64/65, 128/129

FEATURES

  • High toggle frequency – 2.0 GHz: µPB1502GR(1), 1.7 GHz: µPB1502GR
  • Low power consumption – 6.7 mA TYP. at 3 V
  • Operating supply voltage – 2.7 V to 3.3 V
  • High input sensitivity – 130 to 220 mVP-P: µPB1502GR(1), 100 to 320 mVP-P: µPB1502GR (@50 Ω )
  • Equipped with power-save function: 5 µA (standard) on power-save mode.
  • Packaged in 8 pins plastic SOP suitable for surface mounting.

DESCRIPTION

µPB1502GR and µPB1502GR(1) are two-modulus prescaler divided by 64/65 or 128/129. This device is designed for mobile communication applications for example 0.8-1.9 GHz cellular and cordless telephones. The ICs operate on low power and therefore are suitable for hand-held, battery-operated systems. These products are manufactured using NEC’s 20 GHz fT NESAT™ III silicon bipolar process. This process uses silicon nitride passivation film and gold metallization wirings. These materials can protect the chips from external pollution and prevent corrosion and migration. Thus, these products have excellent performance, uniformity and reliability. ORDER INFORMATION ORDER NUMBER PACKAGE SUPPLYING FORM f in MAX. µPB1502GR–E1 8 pin plastic SOP Embossed tape 12 mm wide. QTY 2.5 k/reel 1.7 GHz µPB1502GR(1)–E1 (225 mil) Pin1 is in tape pull-out direction. 2.0 GHz Document No. P10871EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan Remarks To order evaluation samples, please contact your local NEC sales office. (Order number: µPB1502GR, µPB1502GR(1)) Caution electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. The mark shows major revised points. Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 INTERNAL BLOCK DIAGRAM (2) VCC (7) VPS (5) GND M(6) OR DFF 3 OUT(4) AMP SW(3) DFF 2DFF 1 (8)IN (1)IN TQ TQ TQ TQ TQ SW DQ CK Q CK DQ CK Q CK DQ CK Q CK : pin () : pin No. TFF 1 TFF 2 TFF 3 TFF 4 TFF 5 PIN ASSIGNMENT IN IN VCC VPS SW M OUT GND (Top View) Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNIT CONDITION Supply voltage V CC –0.5 to +6 V T A = +25 °C Input voltage V IN –0.5 to VCC +0.5 V T A = +25 °C Total power dissipation P D 250 mW Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) Operating temperature T opt –40 to +85 °C Storage temperature T stg –65 to +150 °C RECOMMENDED OPERATING RANGE PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage V CC 2.7 3.0 3.3 V Operating temperature T opt –40 +25 +85 °C ELECTRICAL CHARACTERISTICS (T A = –40 to +85 °C, VCC = 2.7 to 3.3 V) µPB1502GR µPB1502GR(1) PARAMETER SYMBOL UNIT CONDITION Response frequency f in 0.5 1.7 0.5 2.0 GHz P in = –10 dBm No input signal Input power sensitivity 1 P in1 –11 — 0 –11 — 0 dBm f in = 0.5 to 0.8 GHz Input power sensitivity 2 P in2 –15 — 0 –15 — 0 dBm f in = 0.8 to 1.5 GHz Input power sensitivity 3 P in3 –15 — –6 –15 — –1 dBm f in = 1.5 to 1.7 GHz Input power sensitivity 4 P in4 ——— – 1 4 —– 9 d B m f in = 1.7 to 2.0 GHz Modulus control input high (M) V IH1 2.5 — — 2.5 — — V Modulus control input low (M) V IL1 — — 0.8 — — 0.8 V Divide ratio control input high (SW) VIH2 VCC VCC VCC VCC VCC VCC V Divide ratio control input low (SW) V IL2 OPEN OPEN OPEN OPEN OPEN OPEN V Output voltage swing V OUT 0.8 — — 0.8 — — V P–P C L = 8 pF Modulus set up time t set —1 1——1 1—n s f inMAX. Power-save input high V PS HV CC VCC VCC VCC VCC VCC V Power-save input low V inL — — 0.8 — — 0.8 V V PS L level * Circuit current on power-save mode I PS —52 0 —52 0 µAV PS L level * * Standard reference value on power-save mode. Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 PIN DESCRIPTIONS Functions and Explanation Input frequency from an external VCO output. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Supply voltage 3.0 ± 0.3 V for operation. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. Divided ratio and modulus control can be governed by following input data to these pins. This frequency output can be interfaced to CMOS PLL. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible). ON/OFF-operation control can be governed by following input data to this pin. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. H L M SW 1/64 1/65 HL H L VPS ON OFF Operation Pin No. Symbol Assignment

1 IN Frequency input pin

3 SW Divided ratio

6 M Modulus

4 OUT Divided frequency

5 GND Ground pin

8 IN Frequency-input

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 TEST CIRCUIT The application circuits and their parameters are for references only and are not intended for use in actual design-in's. To know the real application circuits, please refer to PLL synthesizer LSI's documentations (e.g.µPD3160GS). APPLICATION CIRCUIT FOR REFERENCE MIX 1 000 pF VT LPF 1 000 pF Buffer Amp. 2SC4093 ( PC2745T) 1 000 pF 1 000 pF 1 000 pF 1 000 pF µ 1 000 pF CPU ( PB1502GR) 1 000 pF 1 000 pF fIN CP PLL M EN DATA CLOCK VCC REF IN VCC SW OUT IN VPS M GND 1 000 pF 1 000 pF µ TCXO VCO 1 000 pF GND Oscillo- Scope 5 pF C41 000 pF 3.0 to 0 V 1 000 pF C3 C21 000 pF 2.7 to 3.0 V 50 Ω C1 1 000 pF 1 000 pF C7 1 000 pF 3.0 to 0 V IN VPS M GNDOUT SW V CC IN S.G. 3 pF 1 000 pF H L M SW 1/64 1/65 HL 2.7 to 3.0 V 1 MΩ 50 Ω Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 TIMING DIAGRAM Divided by 64/65 SW ’H’ (Divided by 128/129 SW ’L’) 64 clocks (128) 65 clocks (129) IN OUT (64) (64) (64) (64) (64) (64) (64) (64) (65) (64) (65) (65) 32 clocks (64) 32 clocks (64) 32 clocks (64) 33 clocks (65) Hi M LO tset tset = The minimum time required between ‘Modulus Control’ going low and next output rising edge, in order to ensure a P+1 modulus change. Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD No. Value C 1 to 4 1 000 pF C 5 8 pF C 6 to 8 1 000 pF Component List Note (1) 50 × 50 × 0.4 mm double copper clad polyimide board. (2) Back side: GND pattern (3) Solder plated on pattern (4) : Through holes VCC SW IN OUT C2C3 C8 IN GND 1pin VPS M Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 TYPICAL CHARACTERISTICS (T A = +25 °C) — µPB1502GR, µPB1502GR(1) in common — 0 246 CIRCUIT CURRENT vs. SUPPLY VOLTAGE Supply Voltage VCC (V) Circuit Current ICC (mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 OUTPUT VOLTAGE SWING vs. SUPPLY VOLTAGE Output Swing Vout (VP-P) Supply Voltage VCC (V) PB1502GR PB1502GR(1) : T A = +85 °C : TA = +25 °C : TA = –40 °C µ µ PB1502GR PB1502GR(1) : T A = +85 °C : TA = +25 °C : TA = –40 °C µ µ

2.0 GHz

1.0 GHz

VCC = 3.0 V, ICC = 6.7 mA, ZO = 50 W S11 vs. f

0.5 GHz

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR(1) TA = +85 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR TA = +25 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR TA = +85 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR TA = –40 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR(1) TA = +25 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ +60 +40 +20 –20 –40 INPUT POWER vs. FREQUENCY Input Frequency f (GHz) Input Power Pin (dBm) PB1502GR(1) TA = –40 °C : VCC = 2.7 V : VCC = 3.0 V : VCC = 3.3 V µ — PB1502GR — <Left line> — PB1502GR(1) — <Right line>µµ Guaranteed Operating Window * * * * Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 TYPICAL SYSTEM APPLICATION DEMO. I Q I Q PA 90°Driver TX RX Low Noise Tr PB1502µ PLL÷NVCC PLL Downconverter SW Digital Cellular System Block Diagram PD3160µ φ Other applicable systems 1.9 GHz digital cordless telephone, hand-held radio. Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 PACKAGE DIMENSIONS

8 PIN PLASTIC SOP (225 mil) (UNIT: mm)

NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 1 4 M detail of lead end 5.2± 0.2 1.49 0.85 MAX. 1.27 0.12 1.57± 0.2 0.1± 0.1 6.5± 0.3 0.6± 0.2 1.1± 0.2 0.10 4.4± 0.15 +7° −3° 0.17 +0.08 −0.07 0.42 +0.08 −0.07 Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent abnormal operation). (3) Keep the wiring length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the V CC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPB1502GR, 1502GR(1) Soldering method Infrared ray reflow VPS Wave soldering Pin part heating Soldering conditions Package peak temperature: 235 °C, Hour: within 30 s. (more than 210 °C), Time: 3 times, Limited days: no.* Package peak temperature: 215 °C, Hour: within 40 s. (more than 200 °C), Time: 3 times, Limited days: no.* Soldering tub temperature: less than 260 °C, Hour: within 10 s. Time: 1 time, Limited days: no. Pin area temperature: less than 300 °C, Hour: within 3 s./pin Limited days: no.* Recommended condition symbol IR35–00-3 VP15–00-3 WS60–00-1 *: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Note 1.The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 [MEMO] Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 [MEMO] Discontinued Product

µPB1502GR, 1502GR(1) Data Sheet P10871EJ3V0DS00 [MEMO] Discontinued Product

µPB1502GR, 1502GR(1) NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES

  • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
  • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
  • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
  • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
  • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
  • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8 Discontinued Product