TSML100 LEIDITECH

Document overview

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Technical content

Features

 Small size of 0603  Low resistance  Lead-free and compliant with the European Union RoHS Directive 2011/65/EU  Fast time-to-trip  Agency Recognition: UL、CSA、TUV Product Dimensions (mm) Part number A B C D E Part

Electrical Characteristics

IH IT Vmax Imax Ttrip Pd typ Rmin R1max (A) (A) (V) (A) Current(A) Time(S) (W) (Ω) (Ω) IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Ttrip=Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. R1max=Maximum device resistance measured in the nontripped state 1 hour post reflow. Thermal Derating LP-TSML100 Maximum ambient operating temperature(℃) -40 -20 0 20 25 40 50 60 70 85 TSML100 Rev : www.leiditech.com 01.06.2015 1/2

Solder Reflow Recommendations B BA C Solder Pad Layouts Part number A B C (mm) (mm) (mm) TSML100 0.60 1.10 1.00 * Recommended reflow methods: IR, Vapor phase, hot air oven. * Devices can be cleaned using standard industry methods and solvents. Notes:  If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  Devices are not designed to be wave soldered to the bottom side of the board.

Package Information

Tape & Reel: 5000pcs per reel. Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2015 2/2