USB 2.0 HIGH-SPEED (480Mbps) AND AUDIO SWITCHES WITH NEGATIVE SIGNAL CAPABILITY datasheet (Rev. A)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SCDS306,A]
  • PDF pages: 22

Technical content

R L GND VAUDIO D–/L D+/R VBUS ASEL TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 USB2.0High-Speed(480Mbps)andAudioSwitcheswithNegativeSignalCapabilityand 1.8-VLogicCompatibility Check forSamples: TS5USBA224 1FEATURES APPLICATIONS

  • CellularPhones• High-Speed USB Switch:
  • PersonalDigitalAssistants(PDAs)– 4 Ω R DSON Typical
  • PortableInstrumentation– 12.5pF C ON Typical
  • DigitalStillCameras– 650-MHz Bandwidth (–3 dB)
  • PortableNavigationDevices• Audio Switch: – 3 Ω R DSON Typical RSW PACKAGE (TOP VIEW)– NegativeRailCapability – Low THD: <0.05% – InternalShunt ResistorsforClick-and-Pop Reduction – Powered From VAUDIO (2.7Vto5.5V)
  • 1.8-VCompatible ControlInput(ASEL and VBUS ) Threshold
  • IOFF Supports PartialPowerdown Mode
  • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B,Class II) – 1000-V Charged-DeviceModel (C101) – 200-V Machine Model (A115-A)

DESCRIPTION

The TS5USBA224 isa double-pole,doublethrow(DPDT) multiplexerthatincludesa low-distortionaudioswitch and a USB 2.0 High-Speed (480Mbps) switchin the same package. This configurationallowsthe system designerto use a common connectorforaudioand USB data.The audioswitchisdesignedto allowaudio signalstoswingbelowgroundwhichmakes thiscommon connectorconfigurationpossible. The TS5USBA224 ispowered up usingVAUDIO .When ASEL =High,theaudiopathisselectedregardlessofthe logiclevelatVBUS .IfASEL =Low and VBUS =High,theUSB pathisselected.OtherwiseifASEL =Low and VBUS =Low, theaudiopathisselected. The TS5USBA224 alsofeaturesshuntresistorson theaudiopathtoreduceclicksand pops thatmay be heard when theaudioswitchesareselected.

ORDERING INFORMATION

TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN 0.4-MM PITCH – RSW–40°C to85°C Tape and reel TS5USBA224RSWR A5R(Pb-Free) (1) Package drawings,thermaldata,and symbolizationareavailableatwww.ti.com/packaging. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SCDS306 –OCTOBER 2010 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. SUMMARY OF TYPICAL CHARACTERISTICS USB PATH AUDIO PATH Number ofswitches 2 2 ON-stateresistance(ron) 4 Ω 3 Ω ON-stateresistancematch (Δron) < 0.3Ω < 0.3Ω ON-stateresistanceflatness(ron(flat)) N/A 1.5Ω Turn-on/turn-offtime(tON /tOFF ) < 2 µs < 4 µs Bandwidth(BW) 650 MHz N/A OFF isolation(OISO) –22 dB –83 dB Crosstalk(XTALK ) –31 dB –83 dB Totalharmonicdistortion(THD) N/A 0.05% PIN DESCRIPTION TABLE PIN NO. NAME TYPE

1 D – I/O USB Data (Differential–)

2 R I/O RightChannelAudio

3 L I/O LeftChannelAudio

4 GND Ground Ground

5 VAUDIO Power SupplyVoltage

6 D –/L I/O USB/Audio Common Connector

7 D+/R I/O USB/Audio Common Connector

8 ASEL Input ControlInputforAudioPath

9 VBUS Input ControlInputforUSB Path

10 D+ I/O USB Data (Differential+)

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USB 2.0 Phy Audio Amplifier D+/R D–/L R L VAUDIO VBUS Alternatively, wire VBUS to the USB connector for auto USB detection TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 FUNCTION TABLE A SEL VAUDIO VBUS L,R D+, D – L L L OFF OFF L L H OFF OFF L H L ON OFF L H H OFF (1) ON H L L OFF OFF H L H OFF OFF H H L ON OFF H H H ON OFF (1) 100Ω shuntresistorsareenabledinthisstate. TYPICAL APPLICATION BLOCK DIAGRAM Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TS5USBA224

D–/L R L Control Logic ASEL Rshunt Rshunt Rpd1 Rpd2 TS5USBA224 SCDS306 –OCTOBER 2010 www.ti.com SWITCH BLOCK DIAGRAM

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www.ti.com SCDS306 –OCTOBER 2010 ABSOLUTE MAXIMUM RATINGS (1)(2) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VAUDIO Supplyvoltagerange(3) –0.5 6.5 V VD+ –0.5 6.5 VVD – AnalogvoltageRange (3) VR VAUDIO – 6.5 VAUDIO + 0.5 VVL IK Analogportdiodecurrent VD+ ,VD – < 0 –50 mA ID+ ,ID – VD+ ,VD – = 0 toVAUDIO ,ON-stateswitchcurrent –100 100 mAIR ,IL VR ,VL VD+/R,VD –/L= VAUDIO – 5.5V toVAUDIO ID+/R ON-statepeak switchcurrent(4) –200 200ID –/L VI Digitalinputvoltagerange –0.5 6.5 V IIK Digitallogicinputclamp current(3) VI< 0 –50 mA IAUDIO ContinuouscurrentthroughVAUDIO 100 mA IGND ContinuouscurrentthroughGND –100 mA Tstg Storagetemperaturerange –65 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) The algebraicconvention,whereby themost negativevalueisa minimum and themost positivevalueisa maximum. (3) Allvoltagesarewithrespecttoground,unlessotherwisespecified. (4) Pulseat1-ms duration<10% dutycycle. PACKAGE THERMAL IMPEDANCE (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) PARAMETER TEST CONDITIONS TYP UNIT qJA Package thermalimpedance RSW package 175 °C/W (1) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7.

ELECTRICAL CHARACTERISTICS

TA = –40°C to85°C, typicalvaluesareatVAUDIO = 3.3V,TA = 25°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT USB SWITCH VD+ ,VD – Analogvoltagerange 0 5.5 V ron ON-stateresistance VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchON 4 7 Ω VD+/D– = 0 V,0.4V,ION = –8 mA Δron ON-stateresistancematch VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchON 0.3 Ω between channels VD+/D– = 0 V,0.4V,ION = –8 mA ID+(OFF) D+ ,D- VAUDIO = 3.6V,VBUS = 0 V,VASEL = 3.6 SwitchOFF ±50 nA V,ID –(OFF) OFF leakagecurrent VD+ ,VD – = 0.3V,VD+/R ,VD –/L= 0.3V ID+(ON) D+ ,D– VAUDIO = 3.6V,VBUS = 5 V,VASEL = 0 SwitchON ±50 nA V,ID –(ON) ON leakagecurrent VD+ ,VD – = 0.3V,VD+/R = Open AUDIO SWITCH VR ,VL Analogvoltagerange VAUDIO VAUDIO V – 5.5 ron ON-stateresistance VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchON 3 5 Ω VL/R = –2 V,0 V,0.7V,ION = –26 mA Δron ON-stateresistancematch VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchON 0.3 Ω between channels VL/R = 0.7V,ION = –26 mA ron (flat) ON-stateresistanceflatnessVAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchON 1.5 2.5 Ω VL/R = –2 V,0 V,0.7V,ION = –26 mA Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TS5USBA224

SCDS306 –OCTOBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) TA = –40°C to85°C, typicalvaluesareatVAUDIO = 3.3V,TA = 25°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT rSHUNT Shuntresistance VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchOFF 100 200 Ω VL/R = 0.7V,IOSHUNT = 10 mA IL(OFF) L ,R OFF leakagecurrent VAUDIO = 3.6V,VBUS = 5 V,VASEL = 0 SwitchOFF ±50 nA V,VR ,VL = 0.3V,VAUDIO –0.3V,IR(OFF) VD+/R,VD –/L= 0.3V,VAUDIO –0.3V IL(ON) L ,R ON leakagecurrent VAUDIO = 3.6V,VBUS = 0 V,VASEL = 3.6 SwitchON ±50 nA V,D+/R,D –L = 0.3V,VR ,VL = 0.3V,IR(ON) VAUDIO –0.3V,VAUDIO –0.3V VD+/R,VD –/L=Open DIGITAL CONTROL INPUTS (ASEL ,VBUS ) VIH Inputlogichigh VAUDIO = 2.7Vto5.5V 1.2 V VIL Inputlogiclow VAUDIO = 2.7Vto5.5V 0.5 V IIN Inputleakagecurrent VAUDIO = 3.6V VIN = 3.6V ±10 mA VIN = 0V ±1 rPD1 Internalpulldownresistance 3 M Ω rPD2 Internalpulldownresistance 5 M Ω

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www.ti.com SCDS306 –OCTOBER 2010 DYNAMIC CHARACTERISTICS TA = –40°C to85°C, typicalvaluesareatVAUDIO = 3.3V,TA = 25°C (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT USB SWITCH VAUDIO = 3 V,VBUS = 0 V to5 V,VASEL = 0 V, 2 mstON Turn-ontime VD+/R, D –/L= 1 V,Figure10 VAUDIO = 3 V,VBUS = 5 V to0 V,VASEL = 0 V, 1 mstOFF Turn-offtime VD+/R, D –/L= 1 V,Figure10 f= 240 MHz, 35 pstSK(O) Channel-to-channelskew Figure11 Skew ofopposite 25 psf= t240 MHz,tSK(P) transitionsofsame Figure11output C D+(OFF) VAUDIO = 3 V,VBUS = 0 V,ASEL = 3 V, SwitchOFF 2.8 pFD+, D-OFF capacitanceC D –(OFF) f= 240 MHz C D+(ON) VAUDIO = 3 V,VBUS = 5 V,ASEL = 0 V, SwitchON 12.5 pFD+, D – ON capacitanceC D –(ON) f= 240 MHz VAUDIO = 3 V,VBUS = 0 V,ASEL = 0 V, 2.2 pFC I Digitalinputcapacitance f= 1 MHz BW Bandwidth VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V,Figure12 SwitchON 650 MHz VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchOFF –22 dBO ISO OFF Isolation R L = 50 Ω,f= 240 MHz, Figure14 VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchON –31 dBXTALK Crosstalk R L = 50 Ω,f= 240 MHz, Figure13 AUDIO SWITCH VAUDIO = 3 V,VBUS = 0 V or5 V,VASEL = 0 V to3 V, 4 mstON Turn-ontime VD+/R,D–/L= 1 V,Figure10 VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V to0 V, 1 mstOFF Turn-offtime VD+/R,D–/L= 1 V,Figure10 C L(OFF) VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchOFF 4.5 pFL ,R OFF capacitanceC R(OFF) f= 20 kHz C L(ON) VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchON 15 pFL,R ON capacitanceC R(ON) f= 20 kHz VAUDIO = 3 V,VBUS = 5 V,VASEL = 0 V, SwitchOFF –83 dB O ISO OFF Isolation R L = 50 Ω, f= 20 kHz,Figure14 VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V, SwitchON –83 dB XTALK Crosstalk R L = 50 Ω, f= 20 kHz,Figure13 VAUDIO = 3 V,VBUS = 0 V,VASEL = 3 V,f= 20 Hz to20 kHz, 0.05 %THD TotalharmonicdistortionR L = 600 Ω,VIN = 2 Vpp SUPPLY VAUDIO Power supplyvoltage 2.7 5.5 V IAUDIO Positivesupplycurrent VAUDIO = 3.6V,VBUS = 0 or5 V,VASEL = 0 to3.6V,IOUT = 0 6 10 mA Power offleakage ±10 mAIOFF VAUDIO = 0 V,VD+/R, D –/L,D+, D –,L,R = 0 to5.5Vcurrent Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TS5USBA224

0.5 1.5 2.5 3.5 4.5 r -□On-State□Resistance□-on /c87 V -□Input□Voltage□-□VI V -□Input□Voltage□-□VI r -□On-State□Resistance□-on /c87 0.005 0.01 0.015 0.02 0.025 0.03 0 5000 10000 15000 20000 25000 f□-□Frequency□-□Hz THD□-□Total□Harmonic□Distortion□-□% -10 f□-□Frequency□-□Hz Attenuation□-□dB TS5USBA224 SCDS306 –OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS Figure1. ON Resistancevs VIforAudio Switch Figure2.ON Resistancevs VIforUSB Switch Figure3.THD vs Frequency forAudio Switch Figure4.Gain vs Frequency forUSB Switch

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-100 -90 -80 -70 -60 -50 -40 -30 -20 -10 f□-□Frequency□-□Hz Attenuation□-□dB -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 f□-□Frequency□-□Hz Attenuation□-□dB -120 -100 -80 -60 -40 -20 f□-□Frequency□-□Hz Attenuation□-□dB -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 f□-□Frequency□-□Hz Attenuation□-□dB TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 TYPICAL CHARACTERISTICS (continued) Figure5.OffIsolationvs Frequency forAudio Switch Figure6.OffIsolationvs Frequency forUSB Switch Figure7.Cross Talkvs Frequency forAudio Switch Figure8.Cross Talkvs Frequency forUSB Switch Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TS5USBA224

SCDS306 –OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure9.USB 2.0Eye PatternforUSB Switch

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(see Note A) TEST CIRCUIT 2 /c215VDD Open GND RL RL NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 /c87, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. t PLZ and tPHZ are the same as t or t .dis OFF F. t PZL and tPZH are the same as t or t .en ON 50 /c87 VG1 VDD DUT 50 /c87 VIN 50 /c87 VG2 50 /c87 VI TEST RLS1 V/c68CLVAUDIO DD(V ) Vin tPLZ/tPZL 2 /c215VDD 200 /c87 GND 10 pF 0.3 V Input Generator Input Generator VO tPHZ/tPZH 3.3 V 3.3 V GND 200 /c87 VDD 10 pF 0.3 V tPZL VOH - 10% VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VDD/2 VDD/2 Output Control (VIN) V /2DD VDD VOH VOL + 10% VOH VOL 0 V V /2DD tPZH tPLZ tPHZ Output Waveform 2 S1 at GND (see Note B) Output Waveform 1 S1 at 2 V DD (see Note B) VOL VO VI VO TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 PARAMETER MEASUREMENT INFORMATION (Enableand DisableTimes) Figure10. TestCircuitand VoltageWaveforms Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TS5USBA224

(see Note A) TEST CIRCUIT 2 /c215VDD Open GND RL RL VOH VOL VOLTAGE WAVEFORMS OUTPUT SKEW (tsk(o)) Data Out at YB1 or YB2 NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 /c87, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. 50 /c87 VG1 VDD DUT 50 /c87 VIN 50 /c87 VG2 50 /c87 VI TEST RLS1 CL 3.3 V /c1770.3 V Vin tsk(p) tsk(o) 3.3 V /c1770.3 V Open Open 200 /c87 200 /c87 VDD or GND VDD or GND 10 pF 10 pF Input Generator Input Generator VO (VOH + VOL)/2 VOH VOL Data Out at XB1 or XB2 (VOH + VOL)/2 3.5 V 1.5 V Data In at Ax or Ay 2.5 V tPLHx tPHLx tsk(o) tsk(o) tPLHy tPHLy tsk(o) = t PLHy - t PLHx or t PHLy - t PHLx VOH VOL VOLTAGE WAVEFORMS PULSE SKEW [tsk(p)] Output (VOH + VOL)/2 Input 2.5 V tPLH tPHL tsk(p) = t PHL - t PLH 3.5 V 1.5 V VO VI VO V (V )AUDIO DD TS5USBA224 SCDS306 –OCTOBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Skew) Figure11. TestCircuitand VoltageWaveforms

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(HP8753ES) EXT TRIGGER BIAS P1 P2 DUT SEL 0B1 VSEL VDD VBIAS CL = 10 pF (see Note A) TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 PARAMETER MEASUREMENT INFORMATION A. C L includesprobeand jigcapacitance. Figure12. TestCircuitforFrequency Response (BW) Frequencyresponseismeasured attheoutputoftheON channel.For example,when VSEL = 0 and A0 isthe input,theoutputismeasured at0B1.Allunused analogI/Oportsareleftopen. HP8753ES Setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 s P1 = 0 dBM Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TS5USBA224

(HP8753ES) RL = 50 /c87 EXT TRIGGER BIAS P1 P2 DUT SEL 0B1 VSEL VDD VBIAS 1B2 1B1 RL = 50 /c87 2B1 3B1 0B2 3B2 2B2 TS5USBA224 SCDS306 –OCTOBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) A. C L includesprobeand jigcapacitance. B. A 50-Ω terminationresistorisneeded tomatch theloadingofthenetworkanalyzer. Figure13. TestCircuitforCrosstalk(XTALK ) Crosstalkismeasured attheoutputofthenonadjacentON channel.For example,when VSEL = 0 and A1 isthe input,the outputismeasured at A3. Allunused analoginput(A)portsare connectedto GND, and output(B) portsareleftopen. HP8753ES Setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 s P1 = 0 dBM

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(HP8753ES) RL = 50 /c87 EXT TRIGGER BIAS P1 P2 DUT SEL 0B1 VSEL VDD VBIAS 0B2 A1 1B1 1B2 TS5USBA224 www.ti.com SCDS306 –OCTOBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) A. C L includesprobeand jigcapacitance. B. A 50-Ω terminationresistorisneeded tomatch theloadingofthenetworkanalyzer. Figure14. TestCircuitforOFF Isolation(OISO) OFF isolationismeasured attheoutputoftheOFF channel.For example,when VSEL = GND and A1 istheinput, theoutputismeasured at1B2.Allunused analoginput(A)portsareconnectedtoground,and output(B)ports areleftopen. HP8753ES Setup Average= 4 RBW = 3 kHz VBIAS = 0.35V ST = 2 s P1 = 0 dBM Copyright© 2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLink(s):TS5USBA224

www.ti.com 11-Feb-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TS5USBA224RSWR Active Production UQFN (RSW) | 10 3000 | LARGE T&R Yes NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 (A5R, A5V) TS5USBA224RSWR.B Active Production UQFN (RSW) | 10 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (A5R, A5V) TS5USBA224RSWRG4.B Active Production UQFN (RSW) | 10 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 A5V (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5USBA224RSWR UQFN RSW 10 3000 210.0 185.0 35.0 TS5USBA224RSWR UQFN RSW 10 3000 189.0 185.0 36.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 1.45 1.35 1.85 1.75 0.55 0.45 NOTE 3 0.05 0.00 6X 0.4 2X 0.8 9X 0.45 0.35 10X 0.25 0.15 0.55 0.45 (0.13) TYP UQFN - 0.55 mm max heightRSW0010A PLASTIC QUAD FLATPACK - NO LEAD 4224897/A 03/2019 0.05 C

0.07 C A B

0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package complies to JEDEC MO-288 variation UDEE, except minimum package height. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM SYMM 3 5 810 SCALE 7.000 AB

www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP

0.05 MAX

0.05 MIN

9X (0.6) (0.7)10X (0.2) (1.2) (1.6) 6X (0.4) UQFN - 0.55 mm max heightRSW0010A PLASTIC QUAD FLATPACK - NO LEAD 4224897/A 03/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 30X SEE SOLDER MASK DETAIL 3 5 810 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN 9X (0.6) 10X (0.2) 6X (0.4) (1.2) (1.6) (R0.05) TYP (0.7) UQFN - 0.55 mm max heightRSW0010A PLASTIC QUAD FLATPACK - NO LEAD 4224897/A 03/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 30X SYMM 3 5 810

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