TPA6040A4

2-W Stereo Audio Power Amplifier with DirectPath(TM) Headphone and Regulator datasheet (Rev. A)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SLOS519,A]
• PDF pages: 32

Technical content

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FEATURES

DESCRIPTION

APPLICATIONS

SPKR_LIN– BYPASS SGND HP_EN SPKR_EN SPKR_RIN– SPKR_LIN+ HP_INR HP_INL HPVDD CPVDD VDD REG_EN REG_OUT SPKR_RIN+ ROUT+ LOUT+ ROUT– LOUT– SPVDD CPVSS C1P HPVSS SPGND CPGND C1N GAIN0 GAIN1 OUTL OUTR HPR HPL SPKL TPA6040A4 Shutdown Control 3□V – 5.5□V 4.5□V – 5.5□V Regulator□Enable 4.75□V□(To□CODEC) 4.5□V – 5.5□V Gain Control TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 2-W STEREO AUDIO POWER AMPLIFIER WITH DirectPath STEREO HEADPHONE DRIVE AND REGULATOR Microsoft Windows Vista Compliant The TPA6040A4 is a stereo audio power amplifier and DirectPath headphone amplifier in a thermally Fully Differential Architecture and High PSRR enhanced, space-saving, 32-pin QFN package. The Provide Excellent RF Rectification Immunity speaker amplifier is capable of driving W per 2-W, 10% THD+N Into Ω Speakers and channel continuously into Ω loads at The 85-mW, THD+N Into 16- Ω Headphones headphone amplifier achieves a minimum of mW From 5-V Supply at THD+N from a 5-V supply. A built-in internal DirectPath Headphone Amplifier Eliminates 4-step gain control for the speaker amplifier and a fixed 1.5 V/V gain for the headphone amplifier Output Capacitors (1) minimizes external components needed. Internal 4-Step Speaker Gain Control: 10, 15.6, 21.6 dB and Fixed 1.5-V/V Headphone Independent shutdown control and dedicated inputs for the speaker and headphone allow the 4.75-V Low Dropout Regulator for CODEC TPA6040A4 to simultaneously drive both Independent Shutdown Controls for Speaker, headphones and internal speakers. Differential inputs Headphone Amplifier, and Low Dropout to the speaker amplifiers offer superior power-supply Regulator (LDO) and common-mode noise rejection. Output Short-Circuit and Thermal Protection Notebook Computers Portable DVD (1) US Patent Number 5289137 Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. DirectPath, PowerPAD are trademarks of Texas Instruments. Microsoft, Windows Vista are trademarks of Microsoft Corporation. PRODUCTION DATA information is current as of publication date. Copyright 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com Bias Control LDOHP_EN BYPASS REG_EN SPKR_RIN+ SPKR_RIN– Gain Control SPKR_LIN+ SPKR_LIN– Charge Pump CPVDD CPVSS CPGND C1P C1N VDD ROUT+ ROUT– SPVDD SPGND LOUT+ LOUT– SPVDD SPGND HP_INL HP_INR HP_OUTL HP_OUTR HPVDD 1 /c109F 1 /c109F

1 F/c109

SPKR_EN

0.47 F/c109

3 V 5.5 V– SPVDD4.5 V – 5.5 V HPVSS (4.75□V Output) REG_OUT TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Functional Block Diagram Submit Documentation Feedback

www.ti.com BYP ASSSPKR_RIN– Thermal Pad CPVDD GAIN1 1 1 241 232 223 214 205 196 187 178 SPKR_EN GAIN0 HP_EN VDD SPGND REG_OUT ROUT+ SGND ROUT– HP_INL SPVDD HP_INR HPVDD REG_EN TP A6040A4RHB (TOP VIEW) SPKR_RIN+ C1P SPKR_LIN+ CPGND SPKR_LIN– C1N SPGND CPVSS LOUT+ HPVSS LOUT– HP_OUTR SPVDD HP_OUTL TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 AVAILABLE PACKAGE OPTIONS T A PACKAGED DEVICE (1) (2) SYMBOL 32-Pin QFN (RHB) C to C TPA6040A4RHB RHB (1) The RHB package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA6040A4RHBR). (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com TERMINAL FUNCTIONS TERMINAL I/O/P NO. SPKR_RIN I Right-channel negative differential audio input for speaker amplifier SPKR_RIN+ I Right-channel positive differential audio input for speaker amplifier SPKR_LIN+ I Left-channel positive differential audio input for speaker amplifier SPKR_LIN I Left-channel negative differential audio input for speaker amplifier SPGND P Speaker power ground LOUT+ O Left-channel positive audio output LOUT O Left-channel negative audio output SPVDD P Supply voltage terminal for speaker amplifier CPVDD P Charge pump positive supply, connect to HPVDD via star connection C1P I/O Charge pump flying capacitor positive terminal CPGND P Charge pump ground C1N I/O Charge pump flying capacitor negative terminal CPVSS P Charge pump output (negative supply for headphone amplifier), connect to HPVSS HPVSS P Headphone amplifier negative supply, connect to CPVSS HP_OUTR O Right-channel capacitor-free headphone output HP_OUTL O Left-channel capacitor-free headphone output HPVDD P Headphone amplifier supply voltage, connect to CPVDD ROUT O Right-channel negative audio output Submit Documentation Feedback

www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TERMINAL FUNCTIONS (continued) TERMINAL I/O/P NO. ROUT+ O Right-channel positive audio output HP_EN I Headphone channel enable logic input; active high enable. HIGH=ENABLE. SPKR_EN I Speaker channel enable logic input; active low enable. LOW=ENABLE. BYPASS P Common-mode bias voltage for speaker preamplifiers REG_EN I Enable pin (Active HIGH) for turning on/off LDO. HIGH=ENABLE HP_INR I Headphone right-channel audio input HP_INL I Headphone left-channel audio input SGND P Signal ground, connect to CPGND and SPGND REG_OUT O Regulated 4.75-V output VDD P Positive power supply GAIN0 I Bit MSB, of gain select bits GAIN1 I Bit LSB, of gain select bits Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for Thermal Pad Die Pad P mechanical stability and will enhance thermal performance. over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Supply voltage HPVDD, VDD, SPVDD, CPVDD -0.3 to V SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-, -0.3 to 6.3 HP_EN,GAIN0, GAIN1, SPK_EN REG_EN V I Input voltage V HP_INL, HP_INR HP Enabled -3.5 to 3.5 HP_INL, HP_INR HP not Enabled -0.3 to 3.5 Continuous total power dissipation See Dissipation Rating Table T A Operating free-air temperature range -40 to C T J Operating junction temperature range -40 to 150 C T stg Storage temperature range -65 to 150 C Lead temperature 1,6 mm (1/16 inch) from case for seconds 260 C Electrostatic discharge HBM for HP_OUTL and HP_OUTR kV CDM 500 V Electrostatic discharge, all other pins HBM kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE (1) T A C DERATING FACTOR T A C T A C RHB 5.06 W mW/ C 4.04 W 3.23 W (1) The PowerPAD must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document, PowerPAD Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the PowerPAD package. MIN MAX UNIT Supply voltage VDD, SPVDD 4.5 5.5 V Supply voltage HPVDD, CPVDD 5.5 V Submit Documentation Feedback

www.ti.com GENERAL DC ELECTRICAL CHARACTERISTICS SPEAKER AMPLIFIER DC CHARACTERISTICS SPEAKER AMPLIFIER AC CHARACTERISTICS TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 RECOMMENDED OPERATING CONDITIONS (continued) MIN MAX UNIT V IH High-level input voltage SPKR_EN HP_EN, GAIN0, GAIN1, REG_EN V V IL Low-level input voltage SPKR_EN HP_EN, GAIN0, GAIN1, REG_EN 0.8 V T A Operating free-air temperature -40 C T A VDD SPVDD HPVDD CPVDD V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SPKR_EN HP_EN, GAIN0, GAIN1, I IH High-level input current 0.02 µ A REG_EN VDD SPKR_EN HP_EN, GAIN0, GAIN1, I IL Low-level input current 0.02 µ A REG_EN V Supply current, speaker amplifier I DD(Speaker) SPKR_EN HP_EN REG_EN V mA ONLY enabled Supply current, headphone I DD(HP) SPKR_EN HP_EN REG_EN V 7.5 mA amplifier ONLY enabled Supply current, regulator ONLY I DD(REG) SPKR_EN REG_EN HP_EN V 0.65 mA enabled I DD(SD) Supply current, shutdown mode SPKR_EN HP_EN REG_EN V 2.5 µ A T A VDD SPVDD R L k Ω Gain dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V OO Output offset voltage (measured differentially) Inputs AC-coupled to GND, Gain dB 0.5 mV PSRR Power supply rejection ratio VDD SPVDD 4.5 V to 5.5 V -60 -74 dB T A VDD SPVDD R L Ω Gain dB (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT THD+N 1%, f kHz, R L Ω 1.25 THD+N 10%, f kHz, R L Ω 1.5 P O Output power THD+N 1%, f kHz, R L Ω W THD+N 10%, f kHz, R L Ω 2.3 P O R L Ω f Hz to kHz 0.1% THD+N Total harmonic distortion plus noise P O 0.5 R L Ω f Hz to kHz 0.08% f kHz, CBYPASS 0.47 µ kSVR Supply ripple rejection ratio -60 dB V RIPPLE 200 mVp-p Maximum output at THD+N <1%, f kHz, SNR Signal-to-noise rejection ratio dB Gain dB f kHz, P o Gain dB -80 dB Crosstalk (Left-Right; Right-Left) f kHz, P o Gain dB -75 dB CBYPASS 0.47 µ f Hz to kHz, Vn Noise output voltage µ Vrms Gain dB, No weighting Z I Input Impedance Gain 21.6 dB k Ω GAIN0, GAIN1 0.8 V 5.4 6.6 GAIN0 0.8 GAIN1 V 9.4 10.6 G Gain dB GAIN0 GAIN1 0.8 V 15.6 16.2 GAIN0, GAIN1 V 21.6 22.2 Gain Matching Channel-to Channel 0.01 dB Start-up time from shutdown CBYPASS 0.47 µ F ms Submit Documentation Feedback

www.ti.com HEADPHONE AMPLIFIER DC ELECTRICAL CHARACTERISTICS HEADPHONE AMPLIFIER AC CHARACTERISTICS LDO CHARACTERISTICS TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 T A HPVDD CPVDD VDD R L Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V OS Output offset voltage Inputs grounded mV PSRR Power supply rejection ratio HPVDD 4.5 V to 5.5 V -75 -100 dB T A HPVDD R L Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT THD+N 10%, Rl Ω f kHz 200 P O Output power (outputs in phase) mW THD+N 10%, Rl Ω f kHz 100 P O mW, f Hz to kHz, 0.03% R L Ω THD+N Total harmonic distortion plus noise P O mW, f Hz to20 kHz, 0.04% R L Ω Dynamic Range with Signal Present A-Weighted, f Hz to kHz -100 dB FS kSVR Supply ripple rejection ratio f kHz, 200-mVpp ripple -60 dB Crosstalk P o mW, f Hz to kHz -80 dB SNR Signal-to-noise ratio Maximum output at THD+N 1%, f kHz dB V n Noise output voltage f Hz to kHz, No weighting µ Vrms Z I Input Impedance k Ω Gain Closed-loop voltage gain R L Ω -1.45 -1.5 -1.55 V/V Start-up time from shutdown ms T A VDD V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V I Input voltage V DD 4.5 5.5 V I O Continuous output current 120 mA V O Output voltage I O 120 mA; 4.9 V Vin 5.5 V 4.65 4.75 4.85 V Dropout voltage I O 120 mA 100 mV Line regulation I L mA; 4.9 V Vin 5.5 V mV Load regulation I L 120 mA, Vin V 0.13 0.23 mV/ mA Power supply ripple rejection V DD 4.9V, I L mA f 100 Hz dB Submit Documentation Feedback

www.ti.com TYPICAL CHARACTERISTICS Default graph conditions: Vcc Freq kHz, AES17 Filter. f − Frequency − Hz 20 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 0.005 0.1 20k Gain = 6 dB R L = 4 Ω VCC = 5 V G001 0.01 PO = 1.5 W PO = 1 W PO = 0.25 W f − Frequency − Hz 20 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 0.005 0.1 20k Gain = 6 dB R L = 8 Ω VCC = 5 V G002 0.01 PO = 1 W PO = 0.25 W PO = 0.1 W f − Frequency − Hz 10 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 100k G003 0.1 PO = 100 mW Gain = 3.5 dB R L = 16 Ω VCC = 5 V PO = 50 mW PO = 2.8 mW f − Frequency − Hz 10 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 100k G004 0.1 Gain = 3.5 dB R L = 32 Ω VCC = 5 V PO = 1.4 mW PO = 50 mW PO = 25 mW TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TOTAL HARMONIC DISTORTION NOISE (SP) TOTAL HARMONIC DISTORTION NOISE (SP) vs vs FREQUENCY FREQUENCY Figure Figure TOTAL HARMONIC DISTORTION NOISE (HP) TOTAL HARMONIC DISTORTION NOISE (HP) vs vs FREQUENCY FREQUENCY Figure Figure Submit Documentation Feedback

www.ti.com PO − Output Power − W 10m 100m 1 THD+N − Total Harmonic Distortion + Noise − % 0.01 0.1 Gain = 6 dB R L = 4 Ω G005 VCC = 4.5 V VCC = 5 V VCC = 5.5 V PO − Output Power − W 10m 100m 1 THD+N − Total Harmonic Distortion + Noise − % 0.01 0.1 Gain = 6 dB R L = 8 Ω G006 VCC = 4.5 V VCC = 5 V VCC = 5.5 V PO − Output Power − W 100µ 1m 100m THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 Gain = 3.5 dB R L = 16 Ω VCC = 5 V G007 0.1 10m In Phase VCC = 5 V PO − Output Power − W 100µ 1m 100m THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 Gain = 3.5 dB R L = 32 Ω VCC = 5 V G008 0.1 10m VCC = 5 V In Phase TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) TOTAL HARMONIC DISTORTION NOISE (SP) TOTAL HARMONIC DISTORTION NOISE (SP) vs vs OUTPUT POWER OUTPUT POWER Figure Figure TOTAL HARMONIC DISTORTION NOISE (HP) TOTAL HARMONIC DISTORTION NOISE (HP) vs vs OUTPUT POWER OUTPUT POWER Figure Figure Submit Documentation Feedback

www.ti.com −140 −130 −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 f − Frequency − Hz Gain = 6 dB PO = 1 W R L = 4 Ω VCC = 5 V Crosstalk − dB 10 100 1k 100k 10k G009 L to R R to L −140 −130 −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 f − Frequency − Hz Gain = 6 dB PO = 1 W R L = 8 Ω VCC = 5 V Crosstalk − dB 10 100 1k 100k 10k G010 L to R R to L −140 −130 −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 f − Frequency − Hz Gain = 6 dB PO = 2 W R L = 4 Ω VCC = 5 V Crosstalk − dB 10 100 1k 100k 10k G011 Left SPKR to LDO Right SPKR to LDO −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 f − Frequency − Hz Gain = 3.5 dB PO = 35 mW R L = 16 Ω VCC = 5 V Crosstalk − dB 10 100 1k 100k 10k G012 L to R R to L TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) CROSSTALK (SP) CROSSTALK (SP) vs vs FREQUENCY FREQUENCY Figure Figure 10. CROSSTALK (LDO) CROSSTALK (HP) vs vs FREQUENCY FREQUENCY Figure 11. Figure 12. Submit Documentation Feedback

www.ti.com −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 f − Frequency − Hz Gain = 3.5 dB PO = 35 mW R L = 32 Ω VCC = 5 V Crosstalk − dB 10 100 1k 100k 10k G013 L to R R to L VCC − Supply Voltage − V 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 PO − Output Power − W G014 Gain = 6 dB R L = 4 Ω THD+N = 10% THD+N = 1% VCC − Supply Voltage − V 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 PO − Output Power − W G015 Gain = 6 dB R L = 8 Ω THD+N = 1% THD+N = 10% VCC − Supply Voltage − V 0.00 0.05 0.10 0.15 0.20 0.25 0.30 PO − Output Power − W G016 Gain = 3.5 dB R L = 16 Ω THD+N = 1% THD+N = 10% TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) CROSSTALK (HP) OUTPUT POWER (SP) vs vs FREQUENCY SUPPLY VOLTAGE Figure 13. Figure 14. OUTPUT POWER (SP) OUTPUT POWER (HP) vs vs SUPPLY VOLTAGE SUPPLY VOLTAGE Figure 15. Figure 16. Submit Documentation Feedback

www.ti.com PO − Output Power − W 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 ICC − Supply Current − A G017 Gain = 6 dB R L = 4 Ω VCC = 5.5 V VCC = 4.5 V VCC = 5 V PO − Output Power − W 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 ICC − Supply Current − A G018 Gain = 6 dB R L = 8 Ω VCC = 5.5 V VCC = 4.5 V VCC = 5 V PO − Output Power − W 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 PD − Power Dissipation − W G019 Gain = 6 dB R L = 4 Ω VCC = 4.5 V VCC = 5 V VCC = 5.5 V PO − Output Power − W 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 PD − Power Dissipation − W G020 Gain = 6 dB R L = 8 Ω VCC = 4.5 V VCC = 5 V VCC = 5.5 V TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT (SP) SUPPLY CURRENT (SP) vs vs OUTPUT POWER OUTPUT POWER Figure 17. Figure 18. POWER DISSIPATION (SP) POWER DISSIPATION (SP) vs vs OUTPUT POWER OUTPUT POWER Figure 19. Figure 20. Submit Documentation Feedback

www.ti.com VDD − V 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 VCC − Regulator Output Voltage − V G021 IL = −120 mA IL = −10 mA IL = −50 mA IL = −1 mA IL − Load Current − mA 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 0 25 50 75 100 125 150 175 200 VCC − Supply Voltage − V G022 VDD = 5.5 V VDD = 4.5 V VDD = 5 V IL − Load Current − mA 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 0 20 40 60 80 100 120 Dropout Voltage − V G023 LDO V oltage = 4.65 V −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 Input Level = 0.2 Vpp R L = 4 Ω VCC = 5 V CMRR − Common−Mode Rejection Ratio − dB G024 f − Frequency − Hz 20 100 1k 10k 20k TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) REGULATOR OUTPUT VOLTAGE (LDO) SUPPLY VOLTAGE (LDO) vs vs SUPPLY VOLTAGE LOAD CURRENT Figure 21. Figure 22. DROPOUT VOLTAGE (LDO) COMMON-MODE REJECTION RATIO (SP) vs vs LOAD CURRENT FREQUENCY Figure 23. Figure 24. Submit Documentation Feedback

www.ti.com −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 Input Level = 0.2 Vpp R L = 8 Ω VCC = 5 V CMRR − Common−Mode Rejection Ratio − dB G025 f − Frequency − Hz 20 100 1k 10k 20k −80 −70 −60 −50 −40 −30 −20 −10 IO = 10 mA VRipple = 0.2 Vpp PSRR − Power Supply Rejection Ratio − dB G026 f − Frequency − Hz 20 100 1k 10k 20k −80 −70 −60 −50 −40 −30 −20 −10 PSRR − Power Supply Rejection Ratio − dB G027 f − Frequency − Hz 20 100 1k 10k 20k Gain = 6 dB R L = 8 Ω VCC = 5 V −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 PSRR − Power Supply Rejection Ratio − dB G028 f − Frequency − Hz Gain = 3.5 dB R L = 16 Ω VCC = 5 V 10 100 1k 10k 100k TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) COMMON-MODE REJECTION RATIO (SP) POWER SUPPLY REJECTION RATIO (LDO) vs vs FREQUENCY FREQUENCY Figure 25. Figure 26. POWER SUPPLY REJECTION RATIO (SP) POWER SUPPLY REJECTION RATIO (SP) vs vs FREQUENCY FREQUENCY Figure 27. Figure 28. Submit Documentation Feedback

www.ti.com R L − Load Resistance − Ω 100 150 200 250 300 350 400 450 500 PO − Output Power − mW G029 fIN = 1 kHz Gain = 3.5 dB VDD = 5 V THD+N = 10% THD+N = 1% 10 100 1k R L − Load Resistance − Ω 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 4 6 8 10 12 14 16 18 20 22 24 26 28 30 PO − Output Power − W G030 fIN = 1 kHz Gain = 6 dB VDD = 5 V THD+N = 10% THD+N = 1% TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 TYPICAL CHARACTERISTICS (continued) OUTPUT POWER (HP) OUTPUT POWER (SP) vs vs LOAD RESISTANCE LOAD RESISTANCE Figure 29. Figure 30. Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION TPA6040A4 LOUT+ SPKR_RIN– SPKR_RIN+ SPGND SPVDD CPVDD CPVSSHPVSS HP_OUTR HP_OUTLCPGNDC1P C1N LOUT- BYPASS GAIN1GAIN0 VDD SGNDHP_INLHP_INR REG_OUT REG_EN SPKR□Right□Input SPKR_LIN+SPKR□Left□Input SPKR_LIN– 4.5□V□-□5.5□V

10 F/c109

3□V□-□5.5□V SPKR_EN HP_EN Headphone□Enable Speaker□Enable 0.47 /c109F Regulator□Enable{ 4-Step Gain□Control 2.2 /c109F 0.1/c109F 1/c109F 4.5 V - 5.5 V 4.75□V (Output) HP Right□Input HP Left□Input 3□V□-□5.5□V 4.5□V□-□5.5□V TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 Figure 31. Single-Ended Input Application Circuit Submit Documentation Feedback

www.ti.com TPA6040A4 LOUT+ SPKR_RIN– SPKR_RIN+ SPGND SPVDD CPVDD CPVSSHPVSS HP_OUTR HP_OUTLCPGNDC1P C1N LOUT- BYPASS GAIN1GAIN0 VDD SGNDHP_INLHP_INR REG_OUT REG_EN SPKR□Right□(+)□Input SPKR□Right□(–)□Input SPKR_LIN+SPKR□Left□(+)□Input 4.5□V□-□5.5□V 3□V□-□5.5□V SPKR_EN HP_EN Headphone□Enable Speaker□Enable 0.47 /c109F Regulator□Enable{ 4-Step Gain□Control 2.2 /c109F 0.1/c109F 1/c109F 4.5 V - 5.5 V 4.75□V (Output) HP Right□Input HP Left□Input (continued) Figure 32. Differential Input Application Circuit The TPA6040A4 allows disable of any or all of the main circuit blocks when not in use in order to reduce operating power to an absolute minimum. The SPKR_EN control can be used to disable the speaker amplifier while the HP_EN can be used separately to turn off the headphone amplifier. The LDO also has an independent power control, REG_EN. With all circuit blocks disabled, the supply current in shutdown mode is only µ See the General DC Electrical Characteristics for operating currents with each circuit block operating independently. The speaker amplifier is capable of driving W/ch of continuous RMS power into a Ω load at An internal 4-step control allows variation of the gain from dB to 21.6 dB. The TPA6040A4 speaker amplifier is a fully differential amplifier with differential inputs and outputs. The fully differential architecture consist of a differential amplifier and a common mode amplifier. The differential amplifier ensures that the amplifier outputs a differential voltage that is equal to the differential input times the gain. The common-mode voltage at the output is biased around V DD regardless of the common-mode voltage at the input. Submit Documentation Feedback

www.ti.com Gain Setting via GAIN0 and GAIN1 Inputs Input Capacitor, C I (1) C I/C00431 2/C0112R Ifc (2) TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 APPLICATION INFORMATION (continued) One of the primary advantages of the fully differential amplifier is improved RF immunity. GSM handsets save power by turning on and off the RF transmitter at a rate of 217 Hz. The transmitted signal is picked up on input and output traces. The fully differential amplifier cancels the signal and others of this type much better than typical audio amplifiers. The gain of the TPA6040A4 is set by two terminals, GAIN0 and GAIN1. The gains listed in Table are realized by changing the taps on the input resistors and feedback resistors inside the amplifier. This causes the input impedance I to vary as a function of the gain setting. Gain Setting AMPLIFIER GAIN INPUT IMPEDANCE Ω (dB) GAIN1 GAIN0 TYPICAL TYPICAL 108 15.6 21.6 The input capacitor allows the amplifier to bias the input signal to the proper dc level for proper operation. In this case, the input capacitor, C I and the input impedance of the amplifier, R I form a high-pass filter with the corner frequency determined in Equation Figure shows how the input capacitor and the input resistor within the amplifier interact. Figure 33. Input Resistor and Input Capacitor The value of C I is important to consider as it directly affects the low-frequency, or bass, performance of the circuit. Furthermore, the input impedance changes with a change in volume. The higher the volume, the lower the input impedance is. To determine the appropriate capacitor value, reconfigure Equation into Equation The value of the input resistor, R I can be determined from Equation Submit Documentation Feedback

www.ti.com Bridge-Tied Load Versus Single-Ended Mode V (RMS) /C0043 V O(PP) 2 2/C0504 Power /C0043 V (RMS) R L (3) R L 2x VO(PP) VO(PP) −VO(PP) VDD VDD TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 Low-leakage tantalum or ceramic capacitors are recommended. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most VCC/2, which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in each specific application. Recommended capacitor values are between 0.1 µ F and µ Windows Vista Premium Mode Specifications Windows Premium Mobile Vista Device Type Requirement TPA6040A4 Typical Performance Specifications THD+N -65 dB FS [20 Hz, kHz] -74 dB FS[20 Hz, kHz] Analog Speaker Output Jack Dynamic Range with Signal -80 dB FS A-Weight -89 dB FS A-Weight L Ω FS 0.707 Vrms) Present Line Output Crosstalk -60 dB [20 Hz, kHz] -100 dB [20 Hz, kHz] THD+N -45 dB FS [20 Hz, kHz] -81 dB FS [20 Hz, kHz] Dynamic Range with Signal Analog Headphone Out Jack -80 dB FS A-Weight -100 dB FS A-Weight Present L Ω FS 0.300Vrms) Headphone Output -60 dB [20 Hz, kHz] -82 dB [20 Hz, kHz] Crosstalk Figure shows a Class-AB audio power amplifier (APA) in a bridge-tied-load (BTL) configuration. The TPA6040A4 speaker amplifier consists of two Class-AB differential amplifiers per channel driving the positive and negative terminals of the load. Specifically, differential drive means that as one side of the amplifier (the positive terminal, for example) is slewing up, the other side is slewing down, and vice versa. This doubles the voltage swing across the load as opposed to a ground-referenced load, or a single-ended load. Power is proportional to the square of the voltage. Plugging VO(PP) into the power equation yields the output power from the same supply rail and load impedance as would have been obtained with a ground-referenced load (see Equation Figure 34. Differential Output Configuration Submit Documentation Feedback

www.ti.com RL CC VO(PP) VO(PP) VDD –3□dB fc Headphone Amplifier (4) C O /C00431 2/C0112R Lfc (5) TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 Figure 35. Single-Ended Configuration and Frequency Response Bridge-tying the outputs in a typical computer audio, LCD TV, or multimedia LCD monitor application drastically increases output power. For example, if an amplifier in a single-ended configuration was capable of outputting a maximum of 250 mW for a given load with a supply voltage of then that same amplifier would be able to output W of power in a BTL configuration with the same supply voltage and load. In addition to the increase in output power, the BTL configuration does not suffer from the same low-frequency issues that plague the single-ended configuration. In a BTL configuration, there is no need for an output capacitor to block dc, so no unwanted filtering occurs. In addition, the BTL configuration saves money and space, as the dc-blocking capacitors needed for single-ended operation are large and expensive. For example, with an Ω load in SE operation, the user needs a 1000- µ F capacitor to obtain a cutoff frequency below Hz. This capacitor is expensive and large. The headphone amplifier has a fixed gain of -1.5 V/V. It uses single-ended (SE) inputs. The DirectPath amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a negative voltage rail. Combining the user-provided positive rail and the negative rail generated by the IC, the device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts with the capability to swing to the positive rail or negative rail. The DirectPath amplifier requires no output dc blocking capacitors and does not place any voltage on the sleeve. The block diagram and waveform of Figure illustrate the ground-referenced headphone architecture. This is the architecture of the TPA6040A4. Single-supply headphone amplifiers typically require dc-blocking capacitors. The capacitors are required because most headphone amplifiers have a dc bias on the outputs pin. If the dc bias is not removed, the output signal is severely clipped, and large amounts of dc current rush through the headphones, potentially damaging them. The left-side drawing in Figure illustrates the conventional headphone amplifier connection to the headphone jack and output signal. DC blocking capacitors are often large in value. The headphone speakers (typical resistive values of Ω or Ω combine with the dc blocking capacitors to form a high-pass filter. Equation shows the relationship between the load impedance L the capacitor O and the cutoff frequency C C O can be determined using Equation where the load impedance and the cutoff frequency are known. If f c is low, the capacitor must then have a large value because the load resistance is small. Large capacitance values require large package sizes. Large package sizes consume PCB area, stand high above the PCB, increase cost of assembly, and can reduce the fidelity of the audio output signal. Two different headphone amplifier capacitors. The capacitor-less amplifier architecture is implemented in the same manner as the conventional amplifier with the exception of the headphone jack shield pin. This amplifier provides a reference voltage, which Submit Documentation Feedback

www.ti.com CO CO VOUT VOUT GND GND VDD VDD V /2DD VBIAS Conventional Capacitor-Less GND VDD VSS VBIAS DirectPath TM Input-Blocking Capacitors C(DCINPUT-BLOCKING) 2CIN = (6) fcIN /C00431 2/C0112R IN C IN C IN /C00431 2/C0112fcIN R IN or (7) TPA6040A4 SLOS519A APRIL 2007 REVISED APRIL 2007 is connected to the headphone jack shield pin. This is the voltage on which the audio output signals are centered. This voltage reference is half of the amplifier power supply to allow symmetrical swing of the output voltages. Do not connect the shield to any GND reference, or large currents will result. The scenario can happen if, for example, an accessory other than a floating GND headphone is plugged into the headphone connector. See the second block diagram and waveform in Figure Figure 36. Amplifier bias. Maximum performance is achieved when the inputs of the TPA6040A4 are properly biased. Performance issues such as pop are optimized with proper input capacitors. The dc input-blocking capacitors can be removed, provided the inputs are connected differentially and within the input common-mode range of the amplifier, the audio signal does not exceed and pop performance is sufficient. C IN is a theoretical capacitor used for mathematical calculations only. Its value is the series combination of the dc input-blocking capacitors, C (DCINPUT-BLOCKING) Use Equation to determine the value of C (DCINPUT-BLOCKING) For example, if C IN is equal to 0.22 µ then C (DCINPUT-BLOCKING) is equal to about 0.47 µ The two C (DCINPUT-BLOCKING) capacitors form a high-pass filter with the input impedance of the TPA6040A4. Use Equation to calculate C IN then calculate the cutoff frequency using C IN and the differential input impedance of the TPA6040A4, R IN using Equation Note that the differential input impedance changes with gain. See Figure for input impedance values. The frequency and/or capacitance can be determined when one of the two values are given. Submit Documentation Feedback

www.ti.com Charge Pump Flying Capacitor and CPVSS Capacitor Decoupling Capacitors Midrail Bypass Capacitor, C BYPASS LOW DROPOUT REGULATOR (LDO) a high-pass filter with a -3-dB point of no more than Hz is desired over all gain settings, the minimum impedance would be used in the Equation The minimum input impedance for TPA6040A4 is k Ω The capacitor value by Equation would be 0.399 µ However, this is C IN and the desired value is for C (DCINPUT-BLOCKING) Multiplying C IN by yields 0.80 µ which is close to the standard capacitor value of µ Place µ F capacitors at each input terminal of the TPA6040A4 to complete the filter. The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The CPVSS capacitor must be at least equal to the flying capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of µ F is typical. The TPA6040A4 is a DirectPath headphone amplifier that requires adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are as low as possible. To filter high-frequency transients, spikes, and digital hash on the power line, use good low equivalent-series-resistance (ESR) ceramic capacitors, typically µ Find the smallest package possible, and place as close as possible to the device V DD lead. Placing the decoupling capacitors close to the TPA6040A4 is important for the performance of the amplifier. Use a µ F or greater capacitor near the TPA6040A4 to filter lower frequency noise signals; however, the high PSRR of the TPA6040A4 makes the 10- µ F capacitor unnecessary in most applications. The midrail bypass capacitor, C (BYPASS) has several important functions. During start-up or recovery from shutdown mode, C BYPASS determines the rate at which the amplifier starts up. A µ F capacitor yields a start-up time of approximately ms. C BYPASS also reduces the noise coupled into the output signal by the power supply. This improves the power supply ripple rejection (PSRR) of the amplifier. Ceramic or polyester capacitors with low ESR and values in the range of 0.47 µ F to µ F are recommended. The TPA6040A4 contains a 4.75-V output low dropout regulator (LDO) capable of providing a maximum of 120 mA with a drop of less than 150 mV from the 5-V supply. This can be used to power an external CODEC. A 10- µ F decoupling capacitor is recommended at the output of the LDO as well as 0.1- µ F capacitor to filter high-frequency noise from the supply line. Solder the exposed thermal pad (metal pad on the bottom of the part) on the TPA6040A4 QFN package to a pad on the PCB. It is important to keep the TPA6040A4 external components close to the body of the amplifier to limit noise pickup. One should lay out the differential input leads symmetrical and close together to take advantage of the inherent common mode rejection of the TPA6040A4. The layout of the TPA6040A4 evaluation module (EVM) is a good example of component placement and the layout files are available at ti.com Submit Documentation Feedback

www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TPA6040A4RHBR Active Production VQFN (RHB) | 32 3000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 TPA 6040A4 TPA6040A4RHBR.A Active Production VQFN (RHB) | 32 3000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 TPA 6040A4 TPA6040A4RHBR.B Active Production VQFN (RHB) | 32 3000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 85 TPA 6040A4 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2023 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2023 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA6040A4RHBR VQFN RHB 32 3000 346.0 346.0 33.0 Pack Materials-Page 2

www.ti.com GENERIC PACKAGE VIEW Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRHB 32 PLASTIC QUAD FLATPACK - NO LEAD5 x 5, 0.5 mm pitch 4224745/A

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4228523/A 02/2022 www.ti.com VQFN - 1 mm max height PLASTIC QUAD FLATPACK-NO LEAD RHB0032D A 0.08 C

0.1 C A B

0.05 C B SYMM SYMM 5.1 4.9 5.1 4.9

1 MAX

0.05 0.00 SEATING PLANE C PIN 1 INDEX AREA PIN 1 ID (OPTIONAL) 2X 3.5 3.5 28X 0.5 9 16 32 25 32X 0.3 0.2 32X 0.5 0.3 3.25 3.05 (0.2) TYP

NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. EXAMPLE BOARD LAYOUT 4228523/A 02/2022 www.ti.com VQFN - 1 mm max heightRHB0032D PLASTIC QUAD FLATPACK-NO LEAD SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X

0.07 MAX

0.07 MIN

SOLDER MASKNON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED (4.8) (4.8) ( 3.15) 9 16 32 25 32X (0.25) 28X (0.5) 32X (0.6) (Ø0.2) VIA TYP (R0.05) TYP (1.33) 2X (1.33) EXPOSED METAL EXPOSED METAL

NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. EXAMPLE STENCIL DESIGN 4228523/A 02/2022 www.ti.com VQFN - 1 mm max heightRHB0032D PLASTIC QUAD FLATPACK-NO LEAD SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 75% PRINTED COVERAGE BY AREA SCALE: 15X SYMM SYMM (4.8) (4.8) 4X ( 1.37) 9 16 32 25 32X (0.25) 28X (0.5) 32X (0.6) (R0.05) TYP (0.785) 2X (0.785)

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