TMP421

±1°C Remote and Local Temperature Sensor datasheet (Rev. C)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SBOS398,C]
• PDF pages: 36

Technical content

+5V SCL GND SDA SMBus Controller TMP421 DXP DXN 1□Channel□Local 1□Channel□Remote TMP422 DX1 DX2 DX3 DX4 1□Channel□Local 2□Channels□Remote TMP423 DXP1 DXP2 DXP3 DXN 1□Channel□Local 3□Channels□Remote TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 ±1°C RemoteandLocalTEMPERATURESENSOR Check forSamples: TMP421 ,TMP422 ,TMP423 1FEATURES DESCRIPTION The TMP421, TMP422, and TMP423 are remote 234• SOT23-8 and DSBGA (WCSP) PACKAGES temperaturesensor monitorswith a built-inlocal• ±1°C REMOTE DIODE SENSOR (MAX) temperaturesensor.The remote temperaturesensor

• ±1.5°C LOCAL TEMPERATURE SENSOR (MAX) diode-connectedtransistorsare typicallylow-cost, NPN- or PNP-type transistorsor diodesthatare an• SERIES RESISTANCE CANCELLATION integralpartof microcontrollers,microprocessors,or• n-FACTOR CORRECTION FPGAs.
• TWO-WIRE/ SMBus ™ SERIAL INTERFACE Remote accuracy is ±1°C for multiple IC• MULTIPLE INTERFACE ADDRESSES manufacturers,withno calibrationneeded. The two-
• DIODE FAULT DETECTION wireserialinterfaceacceptsSMBus writebyte,read byte,send byte,and receivebyte commands to• RoHS COMPLIANT AND NO Sb/Br configurethedevice. APPLICATIONS The TMP421, TMP422, and TMP423 includeseries resistancecancellation,programmable non-ideality• PROCESSOR/FPGA TEMPERATURE factor,wide remote temperaturemeasurement rangeMONITORING (upto+150°C),and diodefaultdetection.• LCD/ DLP ® /LCOS PROJECTORS The TMP421, TMP422, and TMP423 areallavailable• SERVERS in a SOT23-8 package. The TMP421C is also
• CENTRAL OFFICE TELECOM EQUIPMENT availableina DSBGA (WCSP) package.
• STORAGE AREA NETWORKS (SAN) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2DLP isa registeredtrademarkofTexas Instruments. 3SMBus isa trademarkofIntelCorporation. 4Allothertrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2007–2012,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. PACKAGE INFORMATION (1) TWO-WIRE PACKAGE PACKAGE PRODUCT DESCRIPTION ADDRESS PACKAGE-LEAD DESIGNATOR MARKING TMP421 SingleChannel 100 11xx SOT23-8 DCN DACI Remote Junction TMP421C 100 11xx DSBGA-8 YZD TMP421TemperatureSensor DualChannel TMP422 Remote Junction 100 11xx SOT23-8 DCN DADI TemperatureSensor TMP423A TripleChannel 100 1100 SOT23-8 DCN DAEI Remote Junction TMP423B 100 1101 SOT23-8 DCN DAFITemperatureSensor (1) Forthemost currentpackage and orderinginformationsee thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operatingfree-airtemperaturerange,unlessotherwisenoted. TMP421, TMP422, TMP423 UNIT Power Supply,VS +7 V Pins1,2,3,and 4 only –0.5toVS + 0.5 V InputVoltage Pins6 and 7 only –0.5to7 V InputCurrent 10 mA OperatingTemperatureRange –55 to+127 °C StorageTemperatureRange –60 to+130 °C JunctionTemperature(TJ max) +150 °C Human Body Model (HBM) 3000 V ESD Rating Charged DeviceModel (CDM) 1000 V Machine Model (MM) 200 V (1) Stressesabove theseratingsmay cause permanentdamage. Exposuretoabsolutemaximum conditionsforextendedperiodsmay degradedevicereliability.These arestressratingsonly,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thosespecifiedisnotimplied.

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 ELECTRICAL CHARACTERISTICS: TMP421, TMP422, TMP423 AtTA = –40°C to+125°C and V+ = 2.7Vto5.5V,unlessotherwisenoted. TMP421, TMP422, TMP423 PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR LocalTemperatureSensor TE LOCAL TA = –40°C to+125°C ±1.25 ±2.5 °C Remote TemperatureSensor(1) TE REMOTE TA = +15°C to+85°C, TD = –40°C to+150°C, V+ = 3.3V ±0.25 ±1 °C TA = –40°C to+100°C, TD = –40°C to+150°C, V+ = 3.3V ±1 ±3 °C TA = –40°C to+125°C, TD = –40°C to+150°C ±3 ±5 °C vs Supply(Local/Remote) V+ = 2.7Vto5.5V ±0.2 ±0.5 °C/V TEMPERATURE MEASUREMENT ConversionTime (perchannel) 100 115 130 ms Resolution LocalTemperatureSensor(programmable) 12 Bits Remote TemperatureSensor 12 Bits Remote SensorSourceCurrents High SeriesResistance3kΩ Max 120 μA Medium High 60 μA Medium Low 12 μA Low 6 μA Remote TransistorIdealityFactor η TMP421/22/23 OptimizedIdealityFactor 1.008 SMBus INTERFACE LogicInputHighVoltage(SCL,SDA) VIH 2.1 V LogicInputLow Voltage(SCL,SDA) VIL 0.8 V Hysteresis 500 mV SMBus OutputLow SinkCurrent 6 mA SDA OutputLow Voltage VOL IOUT = 6mA 0.15 0.4 V LogicInputCurrent 0 ≤ VIN ≤ 6V –1 +1 μA SMBus InputCapacitance(SCL,SDA) 3 pF SMBus ClockFrequency 3.4 MHz SMBus Timeout 25 30 35 ms SCL FallingEdge toSDA ValidTime 1 μs DIGITAL INPUTS InputCapacitance 3 pF InputLogicLevels InputHighVoltage VIH 0.7(V+) (V+)+0.5 V InputLow Voltage VIL –0.5 0.3(V+) V Leakage InputCurrent IIN 0V ≤ VIN ≤ V+ 1 μA POWER SUPPLY SpecifiedVoltageRange V+ 2.7 5.5 V QuiescentCurrent IQ 0.0625ConversionsperSecond 32 38 μA EightConversionsperSecond 400 525 μA SerialBus Inactive,Shutdown Mode 3 10 μA SerialBus Active,fS = 400kHz,Shutdown Mode 90 μA SerialBus Active,fS = 3.4MHz,Shutdown Mode 350 μA UndervoltageLockout UVLO 2.3 2.4 2.6 V Power-On ResetThreshold POR 1.6 2.3 V TEMPERATURE RANGE SpecifiedRange –40 +125 °C StorageRange –60 +130 °C ThermalResistance θJA SOT23 100 °C/W (1) Testedwithlessthan5Ω effectiveseriesresistanceand 100pF differentialinputcapacitance. Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TMP421 TMP422 TMP423

SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS: TMP421C AtTA = –40°C to+125°C and V+ = 2.55Vto5.5V,unlessotherwisenoted. TMP421C PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR LocalTemperatureSensor TE LOCAL TA = –40°C to+125°C ±1.25 ±2.5 °C Remote TemperatureSensor(1) TE REMOTE TA = +15°C to+85°C, TD = –40°C to+150°C, V+ = 3.3V ±0.25 ±1 °C TA = –40°C to+100°C, TD = –40°C to+150°C, V+ = 3.3V ±1 ±3 °C TA = –40°C to+125°C, TD = –40°C to+150°C ±3 ±5 °C vs Supply(Local/Remote) V+ = 2.55Vto5.5V ±0.2 ±0.5 °C/V TEMPERATURE MEASUREMENT ConversionTime (perchannel) 100 115 130 ms Resolution LocalTemperatureSensor(programmable) 12 Bits Remote TemperatureSensor 12 Bits Remote SensorSourceCurrents High SeriesResistance3kΩ Max 120 μA Medium High 60 μA Medium Low 12 μA Low 6 μA Remote TransistorIdealityFactor η TMP421C OptimizedIdealityFactor 1.008 SMBus INTERFACE LogicInputHighVoltage(SCL,SDA) VIH 2.1 V LogicInputLow Voltage(SCL,SDA) VIL 0.8 V Hysteresis 500 mV SMBus OutputLow SinkCurrent 6 mA SDA OutputLow Voltage VOL IOUT = 6mA 0.15 0.4 V LogicInputCurrent 0 ≤ VIN ≤ 6V –1 +1 μA SMBus InputCapacitance(SCL,SDA) 3 pF SMBus ClockFrequency 3.4 MHz SMBus Timeout 25 30 35 ms SCL FallingEdge toSDA ValidTime 1 μs DIGITAL INPUTS InputCapacitance 3 pF InputLogicLevels InputHighVoltage VIH 0.7(V+) (V+)+0.5 V InputLow Voltage VIL –0.5 0.3(V+) V Leakage InputCurrent IIN 0V ≤ VIN ≤ V+ 1 μA POWER SUPPLY SpecifiedVoltageRange V+ 2.55 5.5 V QuiescentCurrent IQ 0.0625ConversionsperSecond 32 38 μA EightConversionsperSecond 400 525 μA SerialBus Inactive,Shutdown Mode 3 10 μA SerialBus Active,fS = 400kHz,Shutdown Mode 90 μA SerialBus Active,fS = 3.4MHz,Shutdown Mode 350 μA UndervoltageLockout UVLO 2.3 2.4 2.5 V Power-On ResetThreshold POR 1.6 2.3 V TEMPERATURE RANGE SpecifiedRange –40 +125 °C StorageRange –60 +130 °C ThermalResistance θJA DSBGA 128 °C/W (1) Testedwithlessthan5Ω effectiveseriesresistanceand 100pF differentialinputcapacitance.

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 TMP421 PIN CONFIGURATION DCN PACKAGE YZD PACKAGESOT23-8 DSBGA-8(TOP VIEW) (TOP VIEW) TMP421 PIN ASSIGNMENTS TMP421 NO. NAME DESCRIPTION 1 DXP Positiveconnectiontoremotetemperaturesensor. 2 DXN Negativeconnectiontoremotetemperaturesensor.

3 A1 Addresspin

4 A0 Addresspin

5 GND Ground

6 SDA SerialdatalineforSMBus, open-drain;requirespull-upresistortoV+. 7 SCL SerialclocklineforSMBus, open-drain;requirespull-upresistortoV+. 8 V+ Positivesupplyvoltage(2.7Vto5.5VfortheTMP421; 2.55Vto5.5VfortheTMP421C) TMP422 PIN CONFIGURATION DCN PACKAGE SOT23-8 (TOP VIEW) TMP422 PIN ASSIGNMENTS TMP422 NO. NAME DESCRIPTION 1 DX1 Channel1 remotetemperaturesensorconnectionpin.AlsosetstheTMP422 address;see Table10. 2 DX2 Channel1 remotetemperaturesensorconnectionpin.AlsosetstheTMP422 address;see Table10. 3 DX3 Channel2 remotetemperaturesensorconnectionpin.AlsosetstheTMP422 address;see Table10. 4 DX4 Channel2 remotetemperaturesensorconnectionpin.AlsosetstheTMP422 address;see Table10. 6 SDA SerialdatalineforSMBus, open-drain;requirespull-upresistortoV+. 7 SCL SerialclocklineforSMBus, open-drain;requirespull-upresistortoV+. 8 V+ Positivesupplyvoltage(2.7Vto5.5V) Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TMP421 TMP422 TMP423

SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com TMP423 PIN CONFIGURATION DCN PACKAGE SOT23-8 (TOP VIEW) TMP423 PIN ASSIGNMENTS TMP423 NO. NAME DESCRIPTION 1 DXP1 Channel1 positiveconnectiontoremotetemperaturesensor. 2 DXP2 Channel2 positiveconnectiontoremotetemperaturesensor. 3 DXP3 Channel3 positiveconnectiontoremotetemperaturesensor. 4 DXN Common negativeconnectiontoremotetemperaturesensors,Channel1,Channel2,Channel3. 6 SDA SerialdatalineforSMBus, open-drain;requirespull-upresistortoV+. 7 SCL SerialclocklineforSMBus, open-drain;requirespull-upresistortoV+. 8 V+ Positivesupplyvoltage(2.7Vto5.5V)

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/c45 1 /c45 2 /c45 3 Ambient□T emperature,□T ( C)/c176A /c45 50 /c45 25 1251007550250 Remote□T emperature□Error□( C) /c176 V+□=□3.3V T =□+25 CREMOTE /c176 30□T ypical□Units□Shown /c104 =□1.008 Local□T emperature□Error□( ) /c176C Ambient□T emperature,□T (A /c176 C) /c45 1 /c45 2 /c45 3 /c45 50 125/c45 25 0 25 50 75 100 50□Units□ShownV+□=□3.3V /c45 20 /c45 40 /c45 60 Leakage□Resistance□(M )/c87 0 5 10 15 20 25 30 Remote□T emperature□Error□( C) /c176 R GND/c45 R V+/c45 Remote□T emperature□Error□( ) /c176C R /c87( )S 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 0 3500500 1000 1500 2000 2500 3000 V+□=□2.7V V+□=□5.5V TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 TYPICAL CHARACTERISTICS AtTA = +25°C and V+ = +5.0V,unlessotherwisenoted. REMOTE TEMPERATURE ERROR LOCAL TEMPERATURE ERROR vs TEMPERATURE vs TEMPERATURE Figure1. Figure2. REMOTE TEMPERATURE ERROR REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE vs LEAKAGE RESISTANCE (Diode-ConnectedTransistor,2N3906 PNP) Figure3. Figure4. Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TMP421 TMP422 TMP423

/c45 1 /c45 2 /c45 3 Capacitance□(nF) Remote□T emperature□Error□( C) /c176 Remote□T emperature□Error□( ) /c176C R ( /c87 )S 2.0 1.5 1.0 0.5 /c45 0.5 /c45 1.0 /c45 1.5 /c45 2.0 0 3500500 1000 1500 2000 2500 3000 V+□=□2.7V V+□=□5.5V /c45 5 /c45 10 /c45 15 /c45 20 /c45 25 Frequency□(MHz) 0 5 10 15 T emperature□Error□( C) /c176 Local□100mV NoisePP Remote□100mV NoisePP Local□250mV NoisePP Remote□250mV NoisePP 500 450 400 350 300 250 200 150 100 Conversion□Rate□(conversions/sec) 0.0625 0.125 0.25 0.5 1 2 4 8 I ( /c109A) Q V+□=□2.7V V+□=□5.5V 500 450 400 350 300 250 200 150 100 SCL□CLock□Frequency□(Hz) 1k 10k 100k 1M 10M I ( A) /c109 Q V+□=□3.3V V+□=□5.5V I ( )Q /c109A V+□(V) TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) AtTA = +25°C and V+ = +5.0V,unlessotherwisenoted. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE REMOTE TEMPERATURE ERROR (GND Collector-ConnectedTransistor,2N3906 PNP) vs DIFFERENTIAL CAPACITANCE Figure5. Figure6. TEMPERATURE ERROR QUIESCENT CURRENT vs POWER-SUPPLY NOISE FREQUENCY vs CONVERSION RATE Figure7. Figure8. SHUTDOWN QUIESCENT CURRENT SHUTDOWN QUIESCENT CURRENT vs SCL CLOCK FREQUENCY vs SUPPLY VOLTAGE Figure9. Figure10.

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0.1 F/c109 10k/c87

(typ) 10k/c87 (typ) TMP421 DXP DXN R S (2) RS (2) CDIFF (3) CDIFF (3) RS (2) RS (2) GND SCL SDA +5V SMBus Controller Diode-connected□configuration :(1) Series□Resistance Transistor-connected□configuration :(1) TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012

APPLICATION INFORMATION

The TMP421 is a two-channeldigitaltemperature Forproperremotetemperaturesensingoperation,the sensor that combines a local die temperature- TMP421 requires only a transistorconnected measurement channel and a remote-junction between DXP and DXN pins.Iftheremotechannelis temperature-measurementchannel,and isavailable notutilized,DXP can be leftopen ortiedtoGND. containmultipleregistersfor holdingconfiguration The TMP421/22/23 SCL and SDA interfacepinseach informationand temperaturemeasurement results. requirepull-upresistorsas partofthecommunication bus. A 0.1μF power-supplybypass capacitoris recommended for local bypassing. Figure 11, Figure12,and Figure13 show typicalconfigurations fortheTMP421, TMP422, and TMP423, respectively. (1)Diode-connectedconfigurationprovidesbettersettlingtime.Transistor-connectedconfigurationprovidesbetterseriesresistance cancellation. (2)R S (optional)shouldbe < 1.5kΩ inmost applications.SelectionofR S depends on application;see theFilteringsection. (3)C DIFF (optional)shouldbe < 1000pF in most applications.Selectionof C DIFF depends on application;see the Filteringsectionand Figure6,Remote TemperatureErrorvs DifferentialCapacitance. Figure11. TMP421 Basic Connections Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TMP421 TMP422 TMP423

DX1(4) DX2(4) RS (2) RS (2) CDIFF (3) CDIFF (3) RS (2) RS (2) GND Diode-connected□configuration :(1) Series□Resistance Transistor-connected□configuration :(1) DX3(4) DX4(4)4 3RS (2) RS (2) CDIFF (3) (typ) 10k/c87 (typ) SCL SDA +5V SMBus Controller DXP1 DXN1 DXP2 DXN2 +5V TMP423 DXP1 DXP2 DXP3 DXP DXN DXN SCL GND SDA RS (2) RS (2) RS (2) RS (2) RS (2) RS (2) CDIFF (3) CDIFF (3) CDIFF (3) Transistor-connected□configuration : (1) CDIFF (3) RS (2) RS (2) Diode-connected□configuration :(1) (typ) 10k/c87 (typ) SMBus Controller Series□Resistance TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com (1)Diode-connectedconfigurationprovidesbettersettlingtime.Transistor-connectedconfigurationprovidesbetterseriesresistance cancellation. (2)R S (optional)shouldbe < 1.5kΩ inmost applications.SelectionofR S depends on application;see theFilteringsection. (3)C DIFF (optional)shouldbe < 1000pF in most applications.Selectionof C DIFF depends on application;see the Filteringsectionand Figure6,Remote TemperatureErrorvs DifferentialCapacitance. (4)TMP422 SMBus slaveaddressis1001 100 when connectedas shown. Figure12. TMP422 Basic Connections (1)Diode-connectedconfigurationprovidesbettersettlingtime.Transistor-connectedconfigurationprovidesbetterseriesresistance cancellation. (2)R S (optional)shouldbe < 1.5kΩ inmost applications.SelectionofR S depends on application;see theFilteringsection. (3)C DIFF (optional)shouldbe < 1000pF in most applications.Selectionof C DIFF depends on application;see the Filteringsectionand Figure6,Remote TemperatureErrorvs DifferentialCapacitance. Figure13. TMP423 Basic Connections

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 SERIES RESISTANCE CANCELLATION changingbit2 (RANGE) of ConfigurationRegister1 DIFFERENTIAL INPUT CAPACITANCE Table1.Temperature Data Format (Localand Remote Temperature High Bytes)The TMP421/22/23 tolerate differentialinput capacitanceofup to1000pF withminimalchange in LOCAL/REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE (1°C RESOLUTION)temperatureerror.The effectof capacitanceon sensed remote temperatureerroris illustratedin STANDARD BINARY (1) EXTENDED BINARY (2) TEMP Figure6, Remote TemperatureErrorvs Differential (°C) BINARY HEX BINARY HEX Capacitance. –64 1100 0000 C0 0000 0000 00 –50 1100 1110 CE 0000 1110 0E TEMPERATURE MEASUREMENT DATA –25 1110 0111 E7 0010 0111 27 0 0000 0000 00 0100 0000 40Temperaturemeasurement data may be takenover an operatingrangeof–40°C to+127°C forbothlocal 1 0000 0001 01 0100 0001 41 and remotelocations. 5 0000 0101 05 0100 0101 45 10 0000 1010 0A 0100 1010 4AHowever, measurements from –55°C to +150°C can 25 0001 1001 19 0101 1001 59be made both locallyand remotelyby reconfiguring 50 0011 0010 32 0111 0010 72the TMP421/22/23 for the extended temperature range,as describedbelow. 75 0100 1011 4B 1000 1011 8B 100 0110 0100 64 1010 0100 A4Temperaturedatathatresultfrom conversionswithin 125 0111 1101 7D 1011 1101 BDthe defaultmeasurement range are representedin 127 0111 1111 7F 1011 1111 BFbinaryform,as shown in Table 1, StandardBinary 150 0111 1111 7F 1101 0110 D6column.Note thatalthoughthedeviceisratedtoonly measure temperaturesdown to –55°C, itmay read 175 0111 1111 7F 1110 1111 EF temperatures below this level. However, any 191 0111 1111 7F 1111 1111 FF temperaturebelow –64°C resultsina data valueof to measure over an extendedtemperaturerange by offset. Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TMP421 TMP422 TMP423

One-Shot□Start□Register Configuration□Registers Status□Register Identification□Registers N-Factor□Correction□Registers Conversion□Rate□Register Local□and□Remote□T emperature□Registers SDA SCL Pointer□Register I/O Control Interface Software□Reset TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com Standard Decimal toBinaryTemperature DataBoth localand remote temperaturedata use two CalculationExamplebytes for data storage.The high byte storesthe temperaturewith1°C resolution.The second or low Forpositivetemperatures(forexample,+20°C):byte stores the decimal fractionvalue of the (+20°C)/(+1°C/count)= 20 → 14h → 0001 0100temperature and allows a higher measurement Convert the number to binarycode with 8-bit,resolution,as shown in Table 2. The measurement right-justifiedformat,and MSB = '0'to denote aresolutionfortheboththelocaland remotechannels positivesign.is0.0625°C, and isnotadjustable. +20°C isstoredas 0001 0100 → 14h. Table2.Decimal FractionTemperature Data Fornegativetemperatures(forexample,–20°C):Format (Localand Remote Temperature Low (|–20|)/(+1°C/count)= 20 → 14h → 0001 0100Bytes) Generate the two'scomplement of a negativeTEMPERATURE REGISTER LOW BYTE VALUE (0.0625°C RESOLUTION) (1) number by complementing the absolutevalueTEMP binarynumber and adding1.(°C) STANDARD AND EXTENDED BINARY HEX 0 0000 0000 00 –20°C isstoredas 1110 1100 → ECh. 0.0625 0001 0000 10 REGISTER INFORMATION0.1250 0010 0000 20 0.1875 0011 0000 30 The TMP421/22/23 containmultipleregistersfor 0.2500 0100 0000 40 holding configurationinformation,temperature 0.3125 0101 0000 50 measurement results,and statusinformation.These 0.3750 0110 0000 60 registersaredescribedinFigure14 and Table3. 0.4375 0111 0000 70 POINTER REGISTER0.5000 1000 0000 80 0.5625 1001 0000 90 Figure14 shows theinternalregisterstructureofthe 0.6250 1010 0000 A0 TMP421/22/23.The 8-bitPointerRegisterisused to 0.6875 1011 0000 B0 addressa givendata register.The PointerRegister identifieswhich ofthedataregistersshouldrespond0.7500 1100 0000 C0 toa readorwritecommand on thetwo-wirebus.This0.8125 1101 0000 D0 registeris set with every writecommand. A write0.8750 1110 0000 E0 command must be issuedto setthe propervaluein0.9385 1111 0000 F0 the Pointer Register before executing a read (1) Resolutionis0.0625°C/count.Allpossiblevaluesareshown. command. Table 3 describesthe pointeraddressof the TMP421/22/23 registers.The power-on reset Standard BinarytoDecimal Temperature Data (POR) value of the PointerRegisteris 00h (0000CalculationExample 0000b). Highbyteconversion(forexample,0111 0011): Convert the right-justifiedbinaryhigh byte to hexadecimal. From hexadecimal,multiplythe firstnumber by 160 = 1 and thesecond number by 161 = 16. The sum equalsthedecimalequivalent. 0111 0011b → 73h → (3× 160)+ (7× 161)= 115 Low byteconversion(forexample,0111 0000): To convertthe left-justifiedbinarylow-byteto decimal,use bits7 through4 and ignorebits3 through0 because theydo notaffectthevalueof thenumber. × 1/2)4 = 0.4375 Figure14. InternalRegisterStructure Note thatthefinalnumericalresultisthesum ofthe highbyteand low byte.Innegativetemperatures,the unsignedlow byteadds tothenegativehighbyteto resultina valuelessthanthehighbyte(forinstance,

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 Table3.RegisterMap BIT DESCRIPTIONPOINTER (HEX) POR (HEX) 7 6 5 4 3 2 1 0 REGISTER DESCRIPTION 00 00 LT11 LT10 LT9 LT8 LT7 LT6 LT5 LT4 LocalTemperature(HighByte)(1) Remote Temperature101 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 (HighByte)(1) Remote Temperature202 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 (HighByte)(1)(2)(3) Remote Temperature303 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 (HighByte)(1)(3)

08 BUSY 0 0 0 0 0 0 0 StatusRegister

09 00 0 SD 0 0 0 RANGE 0 0 ConfigurationRegister1 1C/3C(2)/0A 0 REN3 (3) REN2 (2)(3) REN LEN RC 0 0 ConfigurationRegister27C (3) 0B 07 0 0 0 0 0 R2 R1 R0 ConversionRate Register 0F X X X X X X X X One-ShotStart(4) 10 00 LT3 LT2 LT1 LT0 0 0 PVLD 0 LocalTemperature(Low Byte) 11 00 RT3 RT2 RT1 RT0 0 0 PVLD OPEN Remote Temperature1 (Low Byte) Remote Temperature212 00 RT3 RT2 RT1 RT0 0 0 PVLD OPEN (Low Byte)(2)(3) 13 00 RT3 RT2 RT1 RT0 0 0 PLVD OPEN Remote Temperature3 (Low Byte)(3) 21 00 NC7 NC6 NC5 NC4 NC3 NC2 NC1 NC0 N Correction1 22 00 NC7 NC6 NC5 NC4 NC3 NC2 NC1 NC0 N Correction2(2)(3) 23 00 NC7 NC6 NC5 NC4 NC3 NC2 NC1 NC0 N Correction3(3) FC X X X X X X X X SoftwareReset(5) FE 55 0 1 0 1 0 1 0 1 ManufacturerID 0 0 1 0 0 0 0 1 TMP421 DeviceID FF 21 0 0 1 0 0 0 1 0 TMP422 DeviceID 0 0 1 0 0 0 1 1 TMP423 DeviceID (1) CompatiblewithTwo-ByteRead; see Figure19. (2) TMP422. (3) TMP423. (4) X = undefined.Writingany valuetothisregisterinitiatesa one-shotstart;see theOne-ShotConversionsection. (5) X = undefined.Writingany valuetothisregisterinitiatesa softwarereset;see theSoftwareResetsection. The TMP421/22/23 containcircuitryto assurethataTEMPERATURE REGISTERS lowbyteregisterreadcommand returnsdatafromthe same ADC conversionas theimmediatelyprecedingThe TMP421/22/23 have multiple8-bitregistersthat high byte read command. This assurance remainshold temperaturemeasurement results.The local validonlyuntilanotherregisterisread.For properchanneland each oftheremotechannelshave a high operation,the high byte of a temperatureregisterbyte registerthatcontainsthe most significantbits shouldbe read first.The low byteregistershouldbe(MSBs) ofthetemperatureanalog-to-digitalconverter readinthenextreadcommand. The low byteregister(ADC) resultand a low byteregisterthatcontainsthe may be leftunread ifthe LSBs are not needed.leastsignificantbits(LSBs) of the temperatureADC Alternatively,the temperatureregistersmay be readresult.The localchannelhigh byte address is00h; as a 16-bitregisterby usinga singletwo-bytereadthe localchannel low byte address is 10h. The command from address 00h forthe localchannelremote channel high byte is at address 01h; the result,or from address 01h forthe remote channelremote channel low byte address is 11h. For the result(02hforthesecond remotechannelresult,andTMP422, the second remote channel high byte 03h forthe thirdremote channel).The high byte isaddressis02h;thesecond remote channellow byte outputfirst,followedby the low byte.Both bytesofis12h.The TMP 423 uses thesame localand remote this read operation are from the same ADCaddressas the TMP421 and TMP422, withthe third conversion.The power-on reset value of allremote channel high byte of 03h; the thirdremote temperatureregistersis00h.channellow byte is13h. These registersare read- only and are updated by the ADC each time a temperaturemeasurement iscompleted. Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TMP421 TMP422 TMP423

SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com STATUS REGISTER shutdown mode. When SD is set to '0'again,the The temperaturerange is set by configuringtheThe BUSY bit= '1'iftheADC ismaking a conversion; RANGE bit(bit2) of the ConfigurationRegister.itissetto'0'iftheADC isnotconverting. Settingthisbitlow configuresthe TMP421/22/23 for thestandardmeasurement range(–40°C to+127°C);CONFIGURATION REGISTER 1 temperature conversions willbe stored in the standardbinaryformat.Settingbit2 highconfiguresConfigurationRegister1 (pointeraddress 09h) sets the TMP421/22/23 for the extended measurementthe temperaturerange and controlsthe shutdown range (–55°C to +150°C); temperatureconversionsmode. The ConfigurationRegisterissetby writingto willbe storedin the extended binaryformat(seepointeraddress09h and readby readingfrompointer Table1).address 09h. Table 5 summarizes the bits of ConfigurationRegister1. The remainingbitsof the ConfigurationRegisterare reservedand must alwaysbe setto'0'.The power-onThe shutdown (SD) bit(bit6)enablesordisablesthe resetvalueforthisregisteris00h.temperaturemeasurement circuitry.IfSD = '0',the TMP421/22/23 convertcontinuouslyattheratesetin CONFIGURATION REGISTER 2the conversionrateregister.When SD isset to '1', the TMP421/22/23 stopconvertingwhen the current ConfigurationRegister 2 (pointeraddress 0Ah)conversion sequence is complete and enter a controlswhich temperaturemeasurement channels are enabledand whethertheexternalchannelshave the resistancecorrectionfeatureenabled or not. Table 6 summarizes the bits of Configuration Register2. Table4.StatusRegisterFormat STATUS REGISTER (Read = 08h,Write= NA) BIT # D7 D6 D5 D4 D3 D2 D1 D0 BIT NAME BUSY 0 0 0 0 0 0 0 POR VALUE 0(1) 0 0 0 0 0 0 0 (1) FOR TMP421/TMP423: The BUSY changes to'1'almostimmediately(< 100μs)followingpower-up,as theTMP421/TMP423 beginthe firsttemperatureconversion.Itishighwhenever theTMP421/TMP423 converta temperaturereading. FOR TMP422: The BUSY bitchanges to'1'approximately1ms followingpower-up.Itishighwhenever theTMP422 convertsa temperaturereading. Table5.ConfigurationRegister1 BitDescriptions CONFIGURATION REGISTER 1 (Read/Write= 09h,POR = 00h) POWER-ON RESET BIT NAME FUNCTION VALUE

7 Reserved — 0

0 = Run6 SD 01 = ShutDown 5,4,3 Reserved — 0 0 = –40°C to+127°C2 TemperatureRange 01 = –55°C to+150°C 1,0 Reserved — 0

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 The RC bit(bit2) enablesthe resistancecorrection For the TMP423 only,the REN3 bit(bit6) enables featurefortheexternaltemperaturechannels.IfRC = the thirdexternalmeasurement channel.IfREN3 = '1',seriesresistancecorrectionisenabled;ifRC = '0', '1',the thirdexternalchannelisenabled;ifREN3 = resistance correction is disabled. Resistance '0',thethirdexternalchannelisdisabled. The LEN bit(bit3) enables the localtemperature CONVERSION RATE REGISTER measurement channel.IfLEN = '1',thelocalchannel The ConversionRate Register(pointeraddress0Bh)isenabled;ifLEN = '0',thelocalchannelisdisabled. controlsthe rateat which temperatureconversions The REN bit(bit4) enables externaltemperature are performed.This registeradjuststhe idletime measurement forchannel 1. IfREN = '1',the first between conversionsbut not the conversiontiming externalchannelisenabled;ifREN = '0',theexternal itself,thereby allowingthe TMP421/22/23 power channelisdisabled. dissipationto be balanced with the temperature Table6.ConfigurationRegister2 BitDescriptions CONFIGURATION REGISTER 2 (Read/Write= 0Ah, POR = 1Ch forTMP421; 3Ch forTMP422; 7Ch forTMP423) POWER-ON RESET BIT NAME FUNCTION VALUE 0 = ExternalChannel3 Disabled 1 (TMP423)6 REN3 1 = ExternalChannel3 Enabled 0 (TMP421, TMP422) 0 = ExternalChannel2 Disabled 1 (TMP422, TMP423)5 REN2 1 = ExternalChannel2 Enabled 0 (TMP421) 0 = ExternalChannel1 Disabled4 REN 11 = ExternalChannel1 Enabled 0 = LocalChannelDisabled3 LEN 11 = LocalChannelEnabled 0 = ResistanceCorrectionDisabled2 RC 11 = ResistanceCorrectionEnabled 1,0 Reserved — 0 Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLink(s):TMP421 TMP422 TMP423

=/c104 eff 1.008 300/c180

300 N ADJUST/c45

N =□300ADJUST /c45 300 1.008/c180 /c104 eff =V VBE2 BE1/c45 /c104 kT q ln I2 TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com Table7.Conversion Rate Register CONVERSION RATE REGISTER (Read/Write= 0Bh, POR = 07h) AVERAGE IQ (TYP)(μA) R7 R6 R5 R4 R3 R2 R1 R0 CONVERSIONS/SEC V+ = 2.7V V+ = 5.5V 0 0 0 0 0 0 0 0 0.0625 11 32 0 0 0 0 0 0 0 1 0.125 17 38 0 0 0 0 0 0 1 0 0.25 28 49 0 0 0 0 0 0 1 1 0.5 47 69 0 0 0 0 0 1 0 0 1 80 103 0 0 0 0 0 1 0 1 2 128 155 0 0 0 0 0 1 1 0 4(1) 190 220 0 0 0 0 0 1 1 1 8(2) 373 413 (1) Conversionrateshown isforonlyone ortwo enabledmeasurement channels.When threechannelsareenabled,theconversionrateis 2 and 2/3conversions-per-second.When fourchannelsareenabled,theconversionrateis2 persecond. (2) Conversionrateshown isforonlyone enabledmeasurement channel.When two channelsareenabled,theconversionrateis4 conversions-per-second.When threechannelsareenabled,theconversionrateis2 and 2/3conversions-per-second.When four channelsareenabled,theconversionrateis2 conversions-per-second. The valueη inEquation1 isa characteristicof theONE-SHOT CONVERSION particulartransistorused fortheremotechannel.The power-on resetvalue forthe TMP421/22/23 isη =When the TMP421/22/23 are in shutdown mode 1.008.The valueintheη-FactorCorrectionRegister(SD = 1 in the ConfigurationRegister1),a single may be used toadjusttheeffectiveη-factoraccordingconversionis startedon allenabled channels by toEquation2 and Equation3.writingany value to the One-Shot StartRegister, pointeraddress0Fh. Thiswriteoperationstartsone conversion;the TMP421/22/23 returnto shutdown mode when thatconversioncompletes.The valueof (2)thedatasentinthewritecommand isirrelevantand is not stored by the TMP421/22/23. When the TMP421/22/23 areinshutdown mode, theconversion sequence currentlyin process must be completed (3)beforea one-shotcommand can be issued.One-shot The η-correctionvalue must be stored in two's-commands issuedduringa conversionareignored. complement format,yieldingan effectivedata range from –128 to +127. The n-correctionvaluemay beη-FACTOR CORRECTION REGISTER writtentoand read from pointeraddress21h.The η-The TMP421/22/23 allowfora differentη-factorvalue correctionvalue for the second remote channelto be used for converting remote channel (TMP422 and TMP423) may be writtenand readfrommeasurements to temperature.The remote channel pointeraddress 22h. The η-correctionvaluefortheuses sequentialcurrent excitationto extracta thirdremote channel(TMP423 only)may be writtendifferentialVBE voltagemeasurement to determine to and read from pointeraddress 23h. The register the temperatureof the remote transistor.Equation1 power-on resetvalueis00h, thus havingno effectdescribesthisvoltageand temperature. unlesstheregisteriswrittento. (1)

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 SOFTWARE RESET addressFEh. The deviceID isobtainedby reading supportresetviathe two-wiregeneralcalladdress BUS OVERVIEW(00000000).The GeneralCallResetsectioncontains more information. The TMP421/22/23 are SMBus interface-compatible. In SMBus protocol,the device that initiatesthe Table8.η-FactorRange transferiscalleda master,and thedevicescontrolled by themasterareslaves.The bus must be controlledN ADJUST by a master devicethatgeneratesthe serialclockBINARY HEX DECIMAL η (SCL),controlsthe bus access,and generatesthe 0111 1111 7F 127 1.747977 START and STOP conditions. 0000 1010 0A 10 1.042759 To addressa specificdevice,a START conditionis0000 1000 08 8 1.035616 initiated.START isindicatedby pullingthe data line0000 0110 06 6 1.028571 (SDA) from a high-to-lowlogiclevelwhileSCL is0000 0100 04 4 1.021622 high.Allslaveson thebus shiftintheslaveaddress 0000 0010 02 2 1.014765 byte,withthe lastbitindicatingwhether a read or 0000 0001 01 1 1.011371 writeoperationis intended.During the ninthclock 0000 0000 00 0 1.008 pulse,the slave being addressed responds to the 1111 1111 FF –1 1.004651 master by generatingan Acknowledge and pulling 1111 1110 FE –2 1.001325 SDA low. 1111 1100 FC –4 0.994737 Data transferis then initiatedand sent over eight 1111 1010 FA –6 0.988235 clockpulsesfollowedby an Acknowledge bit.During 1111 1000 F8 –8 0.981818 data transferSDA must remain stablewhileSCL is 1111 0110 F6 –10 0.975484 high,because any change inSDA whileSCL ishigh 1000 0000 80 –128 0.706542 isinterpretedas a controlsignal. Once alldata have been transferred,the master GENERAL CALL RESET generatesa STOP condition.STOP isindicatedby pullingSDA fromlowtohigh,whileSCL ishigh.The TMP421/22/23 supportresetvia the two-wire General Call address 00h (0000 0000b). The SERIAL INTERFACETMP421/22/23 acknowledge the General Call address and respond to the second byte.If the The TMP421/22/23 operateonlyas a slavedeviceon second byteis06h (0000 0110b),theTMP421/22/23 eitherthetwo-wirebus ortheSMBus. Connectionsto executea softwarereset.Thissoftwareresetrestores eitherbus aremade viatheopen-drainI/Olines,SDA the power-on reset state to all TMP421/22/23 and SCL. The SDA and SCL pinsfeatureintegrated registers,and abortsany conversioninprogress.The spike suppressionfiltersand Schmitt triggersto TMP421/22/23 take no actionin response to other minimizethe effectsof inputspikesand bus noise. valuesinthesecond byte. The TMP421/22/23 supportthetransmissionprotocol forfast(1kHz to 400kHz) and high-speed(1kHz to IDENTIFICATION REGISTERS 3.4MHz) modes. Alldatabytesare transmittedMSB first.The TMP421/22/23 allow for the two-wire bus controllerto query the deviceformanufacturerand device IDs to enable softwareidentificationof the deviceat the particulartwo-wirebus address.The manufacturerID isobtainedby readingfrom pointer Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLink(s):TMP421 TMP422 TMP423

Address□=□1001100 Address□=□1001101 Address□=□1001110 Address□=□1001111 SCL SDA GND DX1 DX2 DX3 DX4 SCL SDA GND DX1 DX2 DX3 DX4 SCL SDA GND DX1 DX2 DX3 DX4 SCL SDA GND TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com SERIAL BUS ADDRESS DXN connectionshould be leftunconnected.The polarityofthetransistorforexternalchannel2 (pins3To communicate withtheTMP421/22/23,themaster and 4) sets the leastsignificantbitof the slavemust firstaddressslavedevicesviaa slaveaddress address.The polarityof the transistorforexternalbyte.The slave address byte consistsof seven channel 1 (pins 1 and 2) sets the next leastaddressbits,and a directionbitindicatingthe intent significantbitoftheslaveaddress.ofexecutinga readorwriteoperation. Table9.TMP421 SlaveAddress OptionsTwo-Wire InterfaceSlaveDevice Addresses TWO-WIRE SLAVE The TMP421 supportsnine slavedeviceaddresses ADDRESS A1 A0 and the TMP422 supports four slave device 0011 100 Float 0 addresses.The TMP423 has one of two factory- 0011 101 Float 1presetslaveaddresses. 0011 110 0 Float The slavedeviceaddressforthe TMP421 issetby 0011 111 1 Float theA1 and A0 pinsaccordingtoTable9. 0101 010 Float Float The slavedeviceaddressforthe TMP422 issetby 1001 100 0 0 theconnectionsbetween theexternaltransistorsand 1001 101 0 1 theTMP422 accordingtoFigure15 and Table10.If 1001 110 1 0one of the channelsisunused,the respectiveDXP 1001 111 1 1connectionshould be connected to GND, and the Table10.TMP422 SlaveAddress Options TWO-WIRE SLAVE ADDRESS DX1 DX2 DX3 DX4 1001 100 DXP1 DXN1 DXP2 DXN2 1001 101 DXP1 DXN1 DXN2 DXP2 1001 110 DXN1 DXP1 DXP2 DXN2 1001 111 DXN1 DXP1 DXN2 DXP2 Figure15. TMP422 Connections forDevice Address Setup

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www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 The TMP422 checks the polarityof the external READ/WRITE OPERATIONS does notpullup tonear V+, theTMP422 uses pin2 When readingfromtheTMP421/22/23,thelastvalue forDXP ofchannel1,and setsthesecond LSB ofthe storedinthePointerRegisterby a writeoperationis slaveaddressto'1'.Ifbothpinsare shortedtoGND used to determinewhich registerisread by a read or ifboth pinsare open, the TMP422 uses pin1 as operation.To change whichregisterisreadfora read DXP and setsthe addressbitto '0'.Thisprocessis operation,a new valuemust be writtentothePointer thenrepeatedforchannel2 (pins3 and 4). Register.Thistransactionisaccomplishedby issuing thefirstbyteread,and shouldleaveSDA highduring the Acknowledge timeof the second byteread from theslave. Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLink(s):TMP421 TMP422 TMP423

t(LOW) tR tF t(HDST A) t(HDST A) t(HDDA T) t(BUF) t(SUDA T) t(HIGH) t(SUST A) t(SUSTO) P S S P TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com TIMING DIAGRAMS Data Transfer:The number ofdatabytestransferred between a START and a STOP conditionis notThe TMP421/22/23 are two-wire and SMBus- limitedand isdeterminedby themasterdevice.Thecompatible.Figure 16 to Figure 19 describethe receiveracknowledgesdatatransfer.timingforvariousoperationson the TMP421/22/23. Parameters forFigure16 are definedin Table 11. Acknowledge: Each receiving device, when Bus definitionsare: addressed,is obligedto generatean Acknowledge bit.A devicethatacknowledgesmust pulldown theBus Idle:BothSDA and SCL linesremainhigh. SDA lineduringtheAcknowledge clockpulseinsuch a way thattheSDA lineisstablelow duringthehighStartData Transfer:A change in the stateof the periodof the Acknowledge clockpulse.Setup andSDA line,fromhightolow,whiletheSCL lineishigh, holdtimesmust be takenintoaccount.On a masterdefines a START condition.Each data transfer receive,datatransferterminationcan be signaledbyinitiateswitha START condition.Denoted as S in themastergeneratinga Not-Acknowledgeon thelastFigure16. bytethathas been transmittedby theslave.Stop Data Transfer:A change in the stateof the SDA linefrom low tohighwhiletheSCL lineishigh defines a STOP condition.Each data transfer terminateswith a repeated START or STOP condition.Denoted as P inFigure16. Figure16. Two-Wire Timing Diagram Table11.Timing CharacteristicsforFigure16 FAST MODE HIGH-SPEED MODE PARAMETER MIN MAX MIN MAX UNIT SCL OperatingFrequency f(SCL) 0.001 0.4 0.001 3.4 MHz Bus FreeTime Between STOP and START Condition t(BUF) 600 160 ns HoldtimeafterrepeatedSTART condition.Afterthisperiod,thefirstclock t(HDSTA) 100 100 nsisgenerated. Repeated START ConditionSetupTime t(SUSTA) 100 100 ns STOP ConditionSetupTime t(SUSTO) 100 100 ns Data HoldTime t(HDDAT) 0(1) 0(2) ns Data SetupTime t(SUDAT) 100 10 ns SCL ClockLOW Period t(LOW) 1300 160 ns SCL ClockHIGH Period t(HIGH) 600 60 ns Clock/DataFallTime tF 300 160 ns Clock/DataRiseTime tR 300 160 ns forSCL ≤ 100kHz tR 1000 (1) ForcaseswithfalltimeofSCL lessthan20ns and/ortheriseorfalltimeofSDA lessthan20ns,theholdtimeshouldbe greaterthan 20ns. (2) Forcaseswitha falltimeofSCL lessthan10ns and/ortheriseorfalltimeofSDA lessthan10ns,theholdtimeshouldbe greaterthan 10ns.

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Frame□1□T wo-Wire□Slave□Address□Byte Frame□2□Pointer□Register□Byte Start□By Master ACK□By TMP421/22/23 ACK□By TMP421/22/23 1 9 1 Frame□3□Data□Byte□1 ACK□By TMP421/22/23 D7SDA (Continued) SCL (Continued) D6 D5 D4 D3 D2 D1 D0 SDA SCL 0 0 1 1 0 0 (1) R/W P7 P6 P5 P4 P3 P2 P1 P0 /c188 /c188 Stop□By Master Frame□1□T wo-Wire□Slave□Address□Byte Frame□2□Pointer□Register□Byte Start□By Master ACK□By TMP421/22/23 ACK□By TMP421/22/23 Frame□3□T wo-Wire□Slave□Address□Byte Frame□4□Data□Byte□1□Read□Register Start□By Master ACK□By TMP421/22/23 NACK□By Master(2) From TMP421/22/23 1 9 1 9 1 9 1 9 SDA SCL 0 0 1 R/ W P7 P6 P5 P4 P3 P2 P1 P0 /c188 /c188 /c188 /c188 SDA (Continued) SCL (Continued) 1 0 0 1 1 0 0 (1) 1 0 0 (1) R/ W D7 D6 D5 D4 D3 D2 D1 D0 TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 (1)Slaveaddress1001100 shown. Figure17. Two-Wire Timing Diagram forWriteWord Format (1)Slaveaddress1001100 shown. (2)MastershouldleaveSDA hightoterminatea single-bytereadoperation. Figure18. Two-Wire Timing Diagram forSingle-ByteRead Format Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLink(s):TMP421 TMP422 TMP423

Frame□1□T wo-Wire□Slave□Address□Byte Frame□2□Pointer□Register□Byte Start□By Master ACK□By TMP421/22/23 ACK□By TMP421/22/23 Frame□3□T wo-Wire□Slave□Address□Byte Frame□4□Data□Byte□1□Read□Register Start□By Master ACK□By TMP421/22/23 ACK□By Master From TMP421/22/23 1 9 1 9 1 9 1 9 SDA SCL 0 0 1 R/ W P7 P6 P5 P4 P3 P2 P1 P0 /c188 /c188 /c188 /c188 SDA (Continued) SCL (Continued) SDA (Continued) SCL (Continued) 1 0 0 1 1 0 0 (1) 1 0 0 (1) R/W D7 D6 D5 D4 D3 D2 D1 D0 Frame□5□Data□Byte□2□Read□Register Stop□By Master NACK□By Master(2) From TMP421/22/23 1 9 D7 D6 D5 D4 D3 D2 D1 D0 TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com (1)Slaveaddress1001100 shown. (2)MastershouldleaveSDA hightoterminatea two-bytereadoperation. Figure19. Two-Wire Timing Diagram forTwo-Byte Read Format HIGH-SPEED MODE to initiatea data transferoperation.The bus continuesto operate in Hs-mode untila STOPInorderforthetwo-wirebus tooperateatfrequencies conditionoccurs on the bus. Upon receivingtheabove 400kHz,themasterdevicemust issuea High- STOP condition,the TMP421/22/23 switchthe inputSpeed mode (Hs-mode)mastercode (0000 1xxx)as and outputfiltersback tofastmode operation.the firstbyteaftera START conditionto switchthe bus to high-speedoperation.The TMP421/22/23 do TIMEOUT FUNCTIONnotacknowledgethisbyte,butswitchtheinputfilters on SDA and SCL and the outputfilteron SDA to The TMP421/22/23 resettheserialinterfaceifeither operate in Hs-mode, allowingtransfersat up to SCL or SDA are heldlow for30ms (typical)between 3.4MHz. Afterthe Hs-mode master code has been a START and STOP condition.Ifthe TMP421/22/23 issued,themastertransmitsa two-wireslaveaddress are holdingthebus low,thedevicereleasesthebus and waitsfora START condition.To avoidactivating the timeoutfunction,itis necessaryto maintaina communicationspeed of at least1kHz forthe SCL operatingfrequency.

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T =ERR /c104 1.008/c45 1.008 TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 SHUTDOWN MODE (SD) DX4 (TMP422), to minimize the effectsof noise. exactvaluesareapplication-specific.SENSOR FAULT REMOTE SENSINGThe TMP421 can sense a faultat the DXP input bitsshouldbe ignored. Errorsin remote temperaturesensor readingsare pinscan be leftopen orconnectedtoGND. The idealityfactor(η) isa measured characteristicof a remote temperaturesensordiodeas compared to an idealdiode.The TMP421/22/23 allowfordifferentUNDERVOLTAGE LOCKOUT η-factorvalues;see theN-FactorCorrectionRegisterThe TMP421/22/23 sense when the power-supply section.voltagehas reacheda minimum voltagelevelforthe The idealityfactorforthe TMP421/22/23 istrimmedADC tofunction.The detectioncircuitryconsistsofa to be 1.008.For transistorsthathave an idealityvoltagecomparatorthatenablesthe ADC afterthe factorthat does not match the TMP421/22/23,power supply (V+) exceeds 2.45V (typical).The Equation4 can be used tocalculatethetemperaturecomparatoroutputiscontinuouslychecked duringa error.Note thatfortheequationtobe used correctly,conversion.The TMP421/22/23 do not perform a actualtemperature(°C) must be convertedtokelvinstemperatureconversionifthe power supply is not (K).valid.The PVLD bit(bit1, see Table 3) of the individualLocal/RemoteTemperatureRegisterisset to'1'and thetemperatureresultmay be incorrect. (4) FILTERING Where: Remote junctiontemperaturesensors are usually η = idealityfactorofremotetemperaturesensor implementedin a noisyenvironment.Noise ismost T(°C) = actualtemperatureoftencreatedby fastdigitalsignals,and itcan corrupt TERR = errorinTMP421/22/23 because η ≠ 1.008measurements. The TMP421/22/23 have a built-in Degree deltaisthesame for°C and K65kHz filteron the inputs of DXP and DXN (TMP421/TMP423), or on the inputsof DX1 through Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLink(s):TMP421 TMP422 TMP423

TERR /C0043/C04661.004/C00421.008 1.008 /C0467/C0032/C0466273.15/C0041100/C0176C /C0467 TERR /C00431.48/C0176C TMP421 TMP422 TMP423 SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com Forη = 1.004and T(°C) = 100°C: power dissipatedas a resultof excitingthe remote temperaturesensorisnegligiblebecause ofthesmall currentsused. For a 5.5V supply and maximum conversionrateofeightconversionsper second,the TMP421/22/23 dissipate2.3mW (PDIQ = 5.5V × (5) 415μA). A θJA of 100°C/W (forSOT23 package) causes thejunctiontemperaturetoriseapproximatelyIf a discretetransistoris used as the remote +0.23°C above theambient.temperaturesensorwiththeTMP421/22/23,thebest accuracycan be achievedby selectingthetransistor LAYOUT CONSIDERATIONSaccordingtothefollowingcriteria: Remote temperaturesensingon the TMP421/22/231. Base-emittervoltage> 0.25V at 6μA, at the measures very small voltages using very lowhighestsensed temperature. 4. Tightcontrolof VBE characteristicsindicatedby noisy environment.Layout should adhere to the smallvariationsinhFE (thatis,50 to150). followingguidelines: 1. Place the TMP421/22/23 as closeto the remoteBased on these criteria,two recommended small- junctionsensoras possible.signaltransistorsare the 2N3904 (NPN) or 2N3906 (PNP). 2. Route the DXP and DXN tracesnext to each other and shieldthem from adjacentsignals MEASUREMENT ACCURACY AND THERMAL through the use of ground guard traces;see CONSIDERATIONS Figure20.Ifa multilayerPCB isused,burythese transistor(ora small,SOT23 transistor)placedclose 4. Use a 0.1μF localbypass capacitordirectly to the devicebeing monitored,thisdelayisusually between theV+ and GND oftheTMP421/22/23; nota concern. see Figure 21. Minimize filtercapacitance PCB and forcedairflowtemperaturesrepresentthe 6. Thoroughlycleanand remove allfluxresiduein temperaturethatthe TMP421/22/23 is measuring. and around the pins of the TMP421/22/23 to Additionally,the internalpower dissipationof the avoidtemperatureoffsetreadingsas a resultof TMP421/22/23 can cause the temperatureto rise leakagepathsbetween DXP or DXN and GND, above theambientor PCB temperature.The internal orbetween DXP orDXN and V+.

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Ground□or□V+□layer on□bottom□and/or top,□if□□possible. TMP421 0.1/c109F□Capacitor GND PCB□Via DXP DXN TMP422 0.1/c109F□Capacitor GND PCB□Via DX1 DX2 DX3 DX4 TMP423 0.1/c109F□Capacitor GND PCB□Via DXP1 DXP2 DXP3 DXN TMP421C 0.1/c109F□Capacitor GND PCB□Via DXP DXN TMP421 TMP422 TMP423 www.ti.com SBOS398C –JULY 2007–REVISED MAY 2012 NOTE: Use minimum 5 mil(0.127mm)traceswith5 milspacing. Figure20. Suggested PCB Layer Cross-Section Figure21. Suggested Bypass CapacitorPlacement and Trace Shielding Copyright© 2007–2012,Texas InstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLink(s):TMP421 TMP422 TMP423

SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com

REVISION HISTORY

NOTE: Page numbers forpreviousrevisionsmay differfrompage numbers inthecurrentversion. Changes from RevisionB (March 2008)toRevisionC Page

26 SubmitDocumentationFeedback Copyright© 2007–2012,Texas InstrumentsIncorporated

ProductFolderLink(s):TMP421 TMP422 TMP423

www.ti.com 23-Jun-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TMP421AIDCNR Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421AIDCNR.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421AIDCNR.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421AIDCNR1G4 Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421AIDCNR1G4.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421AIDCNR1G4.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DACI TMP421YZDR Active Production DSBGA (YZD) | 8 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TMP421 TMP421YZDR.B Active Production DSBGA (YZD) | 8 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 125 TMP421 TMP421YZDT Obsolete Production DSBGA (YZD) | 8 - - Call TI Call TI -40 to 125 TMP421 TMP422AIDCNR Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP422AIDCNR.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP422AIDCNR.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP422AIDCNR1G4 Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP422AIDCNR1G4.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP422AIDCNR1G4.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DADI TMP423AIDCNR Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNR.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNR.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNR1G4 Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNR1G4.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNR1G4.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAEI TMP423AIDCNT Obsolete Production SOT-23 (DCN) | 8 - - Call TI Call TI -40 to 125 DAEI TMP423BIDCNR Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNR.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNR.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNR1G4 Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNR1G4.A Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNR1G4.B Active Production SOT-23 (DCN) | 8 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 125 DAFI TMP423BIDCNT Obsolete Production SOT-23 (DCN) | 8 - - Call TI Call TI -40 to 125 DAFI Addendum-Page 1

www.ti.com 23-Jun-2026 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP421, TMP422, TMP423 :

• Automotive : TMP421-Q1 , TMP422-Q1 , TMP423-Q1
• Enhanced Product : TMP422-EP NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 13-Jun-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-Jun-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP421AIDCNR SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP421AIDCNR1G4 SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP421YZDR DSBGA YZD 8 3000 182.0 182.0 20.0 TMP422AIDCNR SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP422AIDCNR1G4 SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP423AIDCNR SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP423AIDCNR1G4 SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP423BIDCNR SOT-23 DCN 8 3000 213.0 191.0 35.0 TMP423BIDCNR1G4 SOT-23 DCN 8 3000 213.0 191.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C0.625 MAX 0.35 0.15 1.5 TYP

0.5 TYP

8X 0.35 0.25 B E A D 4219545/A 12/2018 DSBGA - 0.625 mm max heightYZD0008 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2

0.015 C A B

B C D SCALE 8.000 D: Max = E: Max = 2.218 mm, Min = 1.028 mm, Min = 2.158 mm 0.968 mm

www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 8X ( 0.245) (0.5) TYP (0.5) TYP ( 0.245) SOLDER MASK OPENING ( 0.245) METAL 4219545/A 12/2018 DSBGA - 0.625 mm max heightYZD0008 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 A B D LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 30X NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED METAL UNDER SOLDER MASK EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (0.5) TYP (0.5) TYP 4219545/A 12/2018 DSBGA - 0.625 mm max heightYZD0008 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM 1 2 C A B D SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE: 30X METAL TYP

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