TMD2725 OSRAM
Document overview
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- PDF pages: 51
Technical content
Datasheet, Public Page 1 [v2-00] 2023-Feb-22 Document Feedback TMD2725 ALS, and Small Aperture Proximity Sensor Module The device features advanced proximity measurement and digital ambient light sensing (ALS). The package has been designed to accommodate a single small aperture approach. The slim module incorporates an IR LED and factory calibrated LED driver. The proximity detection feature provides object detection (e.g. mobile device screen to user’s ear) by photodiode detection of reflecte d IR energy (sourced by the integrated LED). Detect/release events are interrupt driven, and occur when proximity result crosses upper and/or lower threshold settings. The proximity engine features offset adjustment registers to compensate for unwanted IR energy reflection at the sensor. Proximity results are further improved by automatic ambient light su btraction. The ALS detection feature provides photopic li ght intensity data. The ALS photodiode has UV and IR blocking filters and a dedicated data converter producing 16-bit data. This architecture allows applications to accurately measure ambient light which enables devices to calculate illuminance to control display backlight. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TMD2725, ALS, and Small Aperture Proximity Sensor Module are listed below: Figure 1: Added Value of Using TMD2725 Benefits Features
- Small aperture requirements • 1.055mm emitter to detector distance
- Single device integrated optical solution
- ALS + proximity
- 2mm x 3.65mm x 1mm
- Integrated IR LED
- Power management features
- I²C fast mode interface compatible
- Accurate ambient light sensing
- Photopic Ambient Light Sensor (ALS)
- UV / IR blocking filters
- Programmable gain and integration time
- Reduced power consumption • 1.8V power supply with 1.8V I²C bus General Description
Page 2 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − General Description
Applications
The TMD2725 applications include:
- Ambient light sensing
- Single hole proximity sensing
- Mobile phone touc h screen disable Block Diagram The functional blocks of this device are shown below: Figure 2: Functional Blocks of TMD2725 Wa it Control Pr ox im ity LED Current Sink I²C Interface Lower Upper Prox DataProx ADC Prox Integration Prox Control INT SCL SDA VDD Optically Isolated IR LE D VSS ALS Thresholds ALS ADC IR ADC ALS Data ALS Control IR Data Interrupt Out / Threshol d Status LEDA Lower Upper Prox Thresholds Photopic PGND TMD2725 IR LEDK/LDR
Datasheet, Public Page 3 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Pin Assignments Figure 3: Pin Diagram of TMD2725 Figure 4: Pin Description of TMD2725 (8-Pin Module) Pin Number Pin Name Description
1 VDD Supply voltage
2 SDA I²C serial data I/O terminal
3 SCL I²C serial clock input terminal
4 LEDA LED anode
5L E D K / L D R This test point is the junction of the LED cathode and internal current source. Do not connect.
6 PGND Ground for LED current sink and digital core
7 INT Interrupt. Open drain output (active low) 8 VSS Ground. All voltages are referenced to GND Pin Assignments 9'' 6'$ 6&/ /('$ 966 ,17 3*1' /('./LDR
Page 4 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters VDD Supply Voltage to Ground -0.3 2.2 V LEDA LED Voltage to PGND -0.3 3.6 V VIO Digital I/O terminal voltage -0.3 3.6 V IIO SDA, INT Output terminal current -1 20 mA Electrostatic Discharge ISCR Input Current (latch up immunity) JEDEC JESD78D ± 100 mA Class II ESD HBM Electrostatic Discharge HBM JS-001-2014 ± 2000 V ESDCDM Electrostatic Discharge CDM JEDEC JESD22-C101F ± 500 V Temperature Ranges and Storage Conditions TSTRG Storage Temperature Range -40 85 °C IPC/JEDEC J-STD-020 The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” RH NC Relative Humidity (non-condensing) 58 5% MSL Moisture Sensitivity Level 3 Maxi mum floor life time 168 hours Absolute Maximum Ratings
Datasheet, Public Page 7 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Typical Operating Characteristics Figure 10: Proximity Optical Characteristics, VDD = 1.8V, T A = 25°C (unless otherwise noted) Note(s): 1. Production tested result is the average of 5 readings expressed relative to a calibrated response. 2. Representative result by characterization. 3. Production tested result is the average of 20 readings divided by the maximum proximity value 255. Parameter Conditions Min Typ Max Unit Part to part variation (1) Conditions: PGAIN = 2 (4x) PLDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (8μs) d=23mm round target 30mm target distance 75 100 125 % Response, absolute Basic proximity measurement (2) Conditions: PGAIN = 2 (4x), PLDRIVE = 16 (102mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 2 (16μs) Target material: 90% reflective surface of Kodak gray card Target Size: 100mm x 100mm Target Distance: 100mm 128 160 192 counts Response, no target PGAIN = 2 (4x) ILEDDRIVE = 16 (102mA) PPULSE = 16 (17 Pulses) Pulse Length = 2 (16μs) 02 0 Noise/Signal (3) PGAIN = 2 (4x) IRLEDDRIVE = 8 (54mA) PPULSE = 15 (16 pulses) PPULSE_LEN = 1 (8μs) d=23mm round target 30mm target distance 1.2 %
Page 10 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Detailed Description Proximity Proximity results are affected by three fundamental factors: the integrated IR LED emission, IR reception, and environmental factors, including target distance and surface reflectivity. The IR reception signal path be gins with IR detection from a photodiode and ends with the 8- bit proximity result in PDATA register. Signal from the photodiode is amplified, and offset adjusted to optimize performance. Offset correction or cross-talk compensation is accomplished by adjustment to the POFFSET register. The analog circuitry of the device applies the offset value as a subtraction to the signal accumulation; therefore a positive offset value has the effect of decreasing the results. Ambient Light Sensing, ALS The ALS reception signal path begins as photodiodes receive filtered light and ends with the 16-bit results in the PHOTOPICL/H and ALS_IRL/H registers. The Photopic photodiode is filtered with a UV and IR filter. The ALS_IR photodiode is filtered to receive only IR. Signal from the photodiodes simultaneously accumulate for a period of time set by the value in ATIME before the results are available. Gain is adjustable from 1x to 64x to facilitate operation over a wide range of lighting conditions. Custom LUX equations are used to calculate the amount of ambient light, as well as, determine the light type (e.g. LED, fluorescent, incandescent, etc.) using the two ALS results. I²C Characteristics The device uses I²C serial communication protocol for communication. The device support s 7-bit chip addressing and both standard and fast clock frequency modes with a chip address of 0x39. Read and Write transactions comply with the standard set by Ph ilips (now NXP). Internal to the device, an 8-bit buffer stores the register address location of the desired byte to read or write. This buffer auto-increments upon each byte transfer and is retained between transaction events (I.e. valid even after the master issues a STOP command and the I²C bus is released). During consecutive Read transactions, the future/repeated I²C Read transaction may omit the memory address byte normally following the chip address byte; the buffer retains the last register address + 1. Detailed Description
Datasheet, Public Page 11 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Detailed Description I²C Write Transaction A Write transaction consists of a START, CHIP-ADDRESS WRITE, REGISTER-ADDRESS, DATA BYTE(S ), and STOP . Following each byte (9TH clock pulse) the slave places an ACKNOWLEDGE/ NOT-ACKNOWLEDGE (ACK/NACK) on the bus. If NACK is transmitted by the slave, the master may issue a STOP . I²C Read Transaction A Read transaction consists of a START, CHIP-ADDRESS WRITE, REGISTER-ADDRESS, START, CHIP-ADDRESS READ, DATA BYTE(S), and STOP . Following all but the final byte the master places an ACK on the bus (9TH clock pulse). Termination of the Read transaction is indicated by a NACK being placed on the bus by the master, followed by STOP . Alternately, if the previous I²C transaction was a Read, the internal register address buffer is still valid, allowing the transaction to proceed without “re”-specifying the register address. In this case the transaction consists of a START, CHIP-ADDRESS READ , DATA BYTE(S), and STOP . Following all but the final byte the master places an ACK on the bus (9TH clock pulse). Termination of the Read transaction is indicated by a NACK being placed on the bus by the master, followed by STOP . The I²C bus protocol was develo ped by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification at: https://www.i2c-bus.org/references/ Timing Diagrams Figure 15: I²C Timing
Page 12 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Principles of Operation System State Machine An internal state machine provides system control of the ALS, proximity detection, and power management features of the device. At power up, an internal power-on-reset initializes the device and puts it in a lowpower Sleep state. When a write on I²C bus to the Enable register (0x80) PON bit is set, the device transitions to the Idle state. If PON is disabled, the device will return to the Sleep state to save power. Otherwise, the device will remain in the Idle state unti l a Proximity or ALS function is enabled. Once enabled, the device will execute the ALS, Proximity and Wait states in sequence as indicated in Figure 16 and Figure 17 . Upon completion, the device will automatically begin a new ALS-Prox-Wait cycle as long as PON and either PEN or AEN remain enabled. If the Prox or ALS function generates an interrupt and the Sleep-After-Interrupt (SAI) feature is enabled, the device will transition to the Sleep state and remain in a low-power mode until an I²C command is received clearing the interrupts in the STATUS register. See Interrupts for additional information. Principles of Operation
Datasheet, Public Page 13 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Principles of Operation Figure 16: Detailed State Diagram aen Run ALS Integration pen Run Proximity Offset Calibration Run Proximity Integration yes yes Run Autozero Calibration no no ~aen Oscillator On (IDLE) Oscillator Off (SLEEP) pon no yes az-done yes az-done = 1 aen | pen yes start-offset-calibno yes no no aen | pen wen yes aen==1 && az-done==0 no yes az-done = 1 yes no Run Autozero Calibration Run WTIME timer no az-done & wtime-done yes yes ~wen | (~aen & ~pen) wtime-done = 0 wtime-done = 1 autozero calibration is executed in parallel to running WTIME timer wen==0 | (aen==0 & pen==0) aborts WTIME timer aen==0 aborts ALS An I2C Write to az-nth-iteration register, except of the value 00h(disable-az), resets az-done independent of actual cntrl-state. In consequence, a new autozero calibration will be started in advance to the next ALS integration cycle. az-done = 0 (reset) az-done = 0, if az-nth iterations passed since last AZ calibration. (refer to note 1 for exceptions) aen no
Page 14 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Principles of Operation Figure 17: Simplified State Diagram aen=1 Run ALS Integration Run Proximity Offset Calibration Run Autozero Calibration yes Oscillator On (IDLE) Oscillator Off (SLEEP) pon=1no yes CNTRL Typical Flow rev 1v0, 24.08.2016 1st ALS iteration yes aen=0 & pen=0 no start-offset-calibyes yes no no no wen=0 | (aen=0 & pen=0) aborts WTIME timer aen=0 aborts ALS Az_nth_iteration is assumed 0x7f – Run Autozero once before 1st ALS integration This makes the flow chart simpler, and this is the more usual case pen=1 Run Proximity Integration yes wen=1 Run WTIME timer no yes aen=0 & pen=1yes aen=1 & pen=x no yes no
Datasheet, Public Page 15 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description Register Overview Figure 18: Register Overview Address Register Name R/W Register Function Reset Value 0x80 ENABLE R/W Enables states and functions 0x00 0x81 ATIME R/W ALS integration time 0x00 0x82 PRATE R/W Proximity sampling time 0x1F 0x83 WTIME R/W Wait time 0x00 0x84 AILTL R/W ALS interrupt low threshold low byte 0x00 0x85 AILTH R/W ALS interrupt low threshold high byte 0x00 0x86 AIHTL R/W ALS interrupt high threshold low byte 0x00 0x87 AIHTH R/W ALS interrupt high threshold high byte 0x00 0x88 PILT R/W Proximity interrupt low threshold 0x00 0x8A PIHT R/W Proximity interrupt high threshold 0x00 0x8C PERS R/W Interrupt persistence filters 0x00 0x8D CFG0 R/W Configuration register zero 0x80 0x8E PCFG0 R/W Proximity configuration register zero 0x4F 0x8F PCFG1 R/W Proximity configuration register one 0x80 0x90 CFG1 R/W Configuration register one 0x00 0x91 REVID R Revision ID 0x20 0x92 ID R Device ID 0xE4 0x93 STATUS R Device status register 0x00 0x94 PHOTOPICL R Photopic channel data low byte 0x00 0x95 PHOTOPICH R Photopic channel data high byte 0x00 0x96 ALS_IRL R IR channel data low byte 0x00 0x97 ALS_IRH R IR channe l data high byte 0x00 0x9C PDATA R Proximity channel data 0x00 0x9E REVID2 R Auxiliary ID 0x00 0x9F CFG2 R/W Configuration register two 0x04 0xAB CFG3 R/W Configuration register three 0x4C Register Description
Page 16 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description Note(s): 1. Address 0x98 and 0x99 will contain the results fo r the IR photodiode when controlled by the Green/IR MUX. Register Access: R = Read Only W = Write Only R/W = Read or Write SC = Self Clearing after access 0xC0 POFFSETL R/W Proximity offset magnitude 0x00 0xC1 POFFSETH R/W Proximity offset sign 0x00 0xD6 AZ_CONFIG R/W Autozero configuration 0x7F 0xD7 CALIB R/W Calibration start 0x00 0xD9 CALIBCFG R/W Calibration configuration 0x50 0xDC CALIBSTAT R/W Calibration status 0x00 0xDD INTENAB R/W Interrupt enables 0x00 Address Register Name R/W Register Function Reset Value
Datasheet, Public Page 17 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description Detailed Register Description Enable Register (Address 0x80) Figure 19: Enable Register Before activating AEN or PEN, preset each applicable operating mode registers and bits. Addr: 0x80 Enable Bit Bit Name Default Access Bit Description 7:4 RESERVED 0000 RW Reserved. 3 WEN 0 RW This bit activates the wait feature. Active high. 2 PEN 0 RW This bit activates the proximity detection. Active high. 1A E N 0 R W This bit actives the ALS function. Active high. *Set AEN=1 and PON=1 in the same command to ensure auto-zero function is run prior to the first measurement. 0P O N 0 R W This field activates the internal oscillator and ADC channels. Active high.
Page 22 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description PIHT Register (Address 0x8A) Figure 28: PIHT Register The proximity channel is compared against high-going 8-bit threshold value set by PIHT. If the value generated by the Proximity channel is above the PIHT threshold and the PPERS value is reached, the PINT bit is asserted. If PIEN is set, then the INT pin will also assert. PERS Register (Address 0x8C) Figure 29: PERS Register Addr: 0x8A PIHT Bit Bit Name Default Access Bit Description 7:0 PIHT 0x00 RW This register sets the Proximity ADC channel high threshold. Addr: 0x8C PERS Bit Bit Name Default Access Bit Description 7:4 PPERS 0000 RW This register sets the Proximity persistence filter. Value Interrupt
0 Every Proximity Cycle
1 Any value outside PILT/PIHT thresholds
2 2 consecutive proximity values out of range 3 3 consecutive proximity values out of range …… . 15 15 consecutive proximity values out of range
Datasheet, Public Page 23 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description The frequency of consecutive proximity channel results outside of threshold limits are counted; this count value is compared against the PPERS value. If the counter is equal to the PPERS value an interrupt is asserted . Any time a pr oximity channel result is inside the threshold values the counter is cleared. The frequency of consecutive photopic channel results outside of threshold limits are counted; this count value is compared against the APERS value. If the counter is equal to the APERS setting an interrupt is asserted . Any time a photopic channel result is inside the threshold values the counter is cleared. 3:0 APERS 0000 RW This register sets the ALS persistence filter. 0E v e r y A L S C y c l e
1 Any value outside ALS thresholds
2 2 consecutive ALS values out of range 3 3 consecutive ALS values out of range 4 5 consecutive ALS values out of range 5 10 consecutive ALS values out of range 6 15 consecutive ALS values out of range 7 20 consecutive ALS values out of range 13 50 consecutive ALS values out of range 14 55 consecutive ALS values out of range 15 60 consecutive ALS values out of range Addr: 0x8C PERS Bit Bit Name Default Access Bit Description
Page 24 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description CFG0 Register (Address 0x8D) Figure 30: CFG0 Register The wait timer is implemented using a down counter. Wait time = (value +1) x 2.8ms. If WLONG is enabled then Wait time = (value +1) x 2.8ms x 12. Addr: 0x8D CFG0 Bit Bit Name Default Access Bit Description 7:3 Reserved 10000 RW This field must be set to the default value. 2W L O N G 0 R W When Wait Long is asserted the wait period as set by WTIME is increased by a factor of 12. 1:0 Reserved 00 RW This field must be set to the default value.
Datasheet, Public Page 25 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description PCFG0 Register (Address 0x8E) Figure 31: PCFG0 Register The PPULSE_LEN field sets the width of all IR LED pulses within the proximity cycle. Longer pulses result in increased proximity range and typically result in less electrical noise generated in the analog front end. However, a setting of 8μs is recommended because less cumulative noise is generated during a proximity cycle. The PPULSE field sets the maximum number of IR LED pulses that may occur in a proximity cycle. The proximity engine will automatically continue to add IR LED pulses, up to the value set in PPULSE or if a near-s aturation condition occurs. The dynamic range of the sensor is automatically adjusted to detect distant targets as well as prevent saturation from close targets. This operation also reduces power consumption because proximity integration period is automatically shortened when a target is either to close or far from the sensor. Addr: 0x8E PCFG0 Bit Bit Name Default Access Bit Description 7:6 PPULSE_LEN 01 RW Proximity Pulse Length Value Pulse Length 04 μ s 18 μ s 21 6 μ s 33 2 μ s 5:0 PPULSE 001111 RW Maximum Number of Pulses in a single proximity cycle. Value Maximum Number of Pulses 63 64
Page 26 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description PCFG1 Register (Address 0x8F) Figure 32: PCFG1 Register Addr: 0x8F PCFG1 Bit Bit Name Default Access Bit Description 7:6 PGAIN 10 RW This field sets the gain of the proximity IR sensor. Gain Value Bit Field 1x 0 00b 2x 1 01b 4x 2 10b 8x 3 11b
5 Reserved 0 RW Reserved
4:0 PLDRIVE 00000 RW This field sets the drive strength of the IR LED current. Values are approximate; actual current through LED is factory trimmed to normalize IR intensity. Value LED Current 06 m A 11 2 m A i LED = 6(PLDRIVE +1) mA 30 186mA 31 192mA
Page 28 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description Status Register (Address 0x93) Figure 36: Status Register All flags in this register can be cleared by setting the bit high. Alternatively, if the CFG3.int_read_clear bit is set, then simply reading this register automatically clears all eight flags. PHOTOPICL Register (Address 0x94) Figure 37: PHOTOPICL Register Addr: 0x93 Status Register Bit Bit Name Default Access Bit Description
7 ASAT 0 R, SC The Analog Saturation flag signals that the ALS results
may be unreliable due to saturation of the AFE.
6 PSAT 0 R, SC
The Proximity Saturation flag indicates that an ambient- or reflective-saturation event occurred during a previous proximity cycle. 5P I N T 0 R , S C The Proximity Interrupt flag indicates that proximity results have exceeded thresholds and persistence settings. 4A I N T 0 R , S C The ALS Interrupt flag indicates that ALS results (photopic channel) have exceeded thresholds and persistence settings. 3C I N T 0 R , S C The Calibration Interrupt flag indicates that calibration has completed.
2 Reserved 0 R, SC Reserved
1 PSAT_REFLECTIVE 0 R, SC
The Reflective Proximity Saturation Interrupt flag signals that the AFE has saturated during the IR LED active portion of proximity integration.
0 PSAT_AMBIENT 0 R, SC
The Ambient Proximity Saturation Interrupt flag signals that the AFE has saturated during the IR LED inactive portion of proximity integration. Addr: 0x94 PHOTOPICL Bit Bit Name Default Access Bit Description 7:0 PHOTOPICL 0x00 RO This register contains the low byte of the 16-bit photopic channel data.
Page 30 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description REVID2 Register (Address 0x9E) Figure 42: REVID2 Register CFG2 Register (Address 0x9F) Figure 43: CFG2 Register The ALS gain can be adjusted using by setting the two AGAIN bits as well as the AGAINL bit which yields an overall range from ½ x to 128x. Addr: 0x9E REVID2 Bit Bit Name Default Access Description 7:4 Reserved 0000 RO Reserved 3:0 REVID2 0000 RO Package Identification Addr: 0x9F CFG2 Bit Bit Name Default Access Bit Description 7:5 Reserved 000 RW Reserved 4A G A I N M A X 0 R W This bit adjusts the overall ALS gain factor. See Figure 44 for recommended settings and corresponding overall ALS gain factor.
3 Reserved 0 RW Reserved
This bit adjusts the overall ALS gain factor. See Figure 44 for recommended settings and corresponding overall ALS gain factor. 1:0 Reserved 00 RW Reserved
Datasheet, Public Page 31 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description Figure 44: AGAIN Range CFG3 Register (Address 0xAB) Figure 45: CFG3 Register AGAIN[1] AGAIN[0] AGAINMAX AGAINL Overall ALS Gain 000 0 ½ 000 1 1 010 1 4 100 1 1 6 110 1 6 4 111 1 1 2 8 Addr: 0xAB CFG3 Bit Bit Name Default Access Bit Description
7 INT_READ_CLEAR 0 RW
If the Interrupt-Clear-by-Read bit is set, then all flag bits in the STATUS register will be reset whenever the STATUS register is read over I²C. 6:5 Reserved 10 RW Reserved 4S A I 0 R W The Sleep After Interrupt bit is used to place the device into a low power mode upon an interrupt pin assertion. PON SAI INT Oscillator 0XX O F F 10X O N
111 O N
110 O F F
3:0 Reserved 1100 RW Reserved
Page 32 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description The SAI bit sets the device operational mode following the completion of an ALS or proximity cycle. If AINT and AIEN are both set or if PINT and PIEN ar e both set, causing an interrupt on the INT pin, and the SAI bit is set, then the oscillator will deactivate. The Device will appear as if PON = 0, however, PON will read as 1. The device can only be reactivated (oscillator enabled) by clearing the interrupts in the STATUS register. POFFSETL Register (Address 0xC0) Figure 46: POFFSETL Register Typically, optical and/or electrical crosstalk negatively influence proximity operation and results. The POFFSETL/POFFSETH registers provide a mechanism to remove system crosstalk from the proximity data. POFFSETL and POFFSETH contains the magnitud e and sign of a value which adjusts PDATA generated in the AFE. An offset value in the range of ± 255 is possible. POFFSETH Register (Address 0xC1) Figure 47: POFFSETH Register Addr: 0xC0 POFFSETL Bit Bit Name Default Access Bit Description 7:0 POFFSETL 0x00 RW This register contains the magnitude portion of proximity offset adjust value. Addr: 0xC1 POFFSETH Bit Bit Name Default Access Bit Description 7:1 Reserved 0000000 RW Reserved
0 POFFSET_SIGN 0 RW This register contains the sign portion of
proximity offset adjust value.
Datasheet, Public Page 33 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description AZ_CONFIG Register (Address 0xD6) Figure 48: AZ_CONFIG Register CALIB Register (Address 0xD7) Figure 49: CALIB Register Proximity response in systems with electrical and optical crosstalk may be improved by using the calibration feature. Optical crosstalk is caused when the photodiode receives a small portion of the LED IR whic h was unintentionally reflected by a surface other than the target. Electrical offset is caused by electrical disturbance in the sensor AFE, and also influences the proximity result. The calibratio n routine adjusts the value in registers C0 and C1 until the proximity result is as close to BINSRCH_TARGET as possible without becoming zero. Optical and electrical calibration function identically, except that during an electrical cali bration the proximity photodiode is disconnected from the AFE. An electrical only calibration can be initiated by setting the ELECTRICAL_CALIBRATION an d START_OFFSET_CALB bits. To perform an optical (and electr ical) calibration do not set the ELECTRICAL_CALIBRATION bi t when setting the START_ OFFSET_CALIB. The CINT flag will assert after calibration has Addr: 0xD6 AZ_CONFIG Bit Bit Name Default Access Description 7 Reserved 0 RW Reserved. 6:0 AZ_NTH_ ITERATION 1111111 RW Run autozero automatically before every nth ALS cycle (00h = never, n = every nth ALS cycle, and 7Fh = only before the first ALS cycle).Addr: 0xD7 CALIB Bit Bit Name Default Access Bit Description 7:6 Reserved 00 RO Reserved
5 ELECTRICAL_
Selects proximity calibration type. 1 = electrical offset only. 0 = calibration compensates for electrical and optical crosstalk. 4:1 Reserved 0000 RW Reserved
0 START_OFFSET_
CALIB 0 RW Set to 1 to start a calibration sequence.
Page 34 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Register Description finished. Upon completion Proximity offset registers are automatically loaded with calibration result. CALIBCFG Register (Address 0xD9) Figure 50: CALIBCFG Register Addr: 0xD9 CALIBCFG Bit Bit Name Default Access Bit Description 7:5 BINSRCH_ TARGET 010 RW Proximity Result Target Value PDATA Target 41 5 53 1 66 3 71 2 7
4 Reserved 1 RW Reserved
3 AUTO_
OFFSET_ADJ 0R W The Proximity Auto Offset Adjust bit causes the value in POFFSETL register to decrement when PDATA equals zero at the completion of the proximity cycle. 2:0 PROX_AVG 000 RW The Proximity Averaging field defines the number of ADC samples collected and averaged during a cycle which become the proximity result. Value Sample Size 0D i s a b l e 41 6 53 2 66 4 71 2 8
Datasheet, Public Page 35 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Register Description The binary search target field is used by the calibration feature to set the baseline value for PDATA when no target is present. For example, calibration of a device in open air, with no target, and BINSEARCH_TARGET setting of 4 causes the PDATA value will be approximately 15 counts. This feature is useful because it forces PDATA result to always be above zero. The PROX_AVG field sets the number of ADC samples that are averaged to calculate the PDATA result. CALIBSTAT Register (Address 0xDC) Figure 51: CALIBSTA T Register INTENAB Register (Address 0xDD) Figure 52: INTENAB Register Addr: 0xDC CALIBSTAT Bit Bit Name Default Access Bit Description 7:1 Reserved 0000000 RW Reserved
0 CALIB_FINISHED 0 RW
This flag indicates that calibration has finished. It can only be cleared by setting this bit high.Addr: 0xDD INTENAB Bit Bit Name Default Access Bit Description
7 ASIEN 0 RW ALS Saturation Interrupt Enable
6 PSIEN 0 RW Proximity Saturation Interrupt Enable
5 PIEN 0 RW Proximity Interrupt Enable
4 AIEN 0 RW ALS Interrupt Enable
3 CIEN 0 RW Calibration Interrupt Enable
2:0 Reserved 000 RW Reserved
Page 36 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Application Information Schematic Figure 53: Typical Applications Circuit Typical Applications Circuit: It is important to place the 4.7μF (VDD) and 10μF (LEDA) capacitors at the package pins.
Application Information
1.8V 3.0V RPU 10μF 4.7μF VBUS INT SCL SDA Bulk System Capacitance R = 22Ω TMD2725 LEDA VSS VDD PGND INT SCL SDA LEDK/LDR RINT = 10KΩ
Datasheet, Public Page 37 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Application Information PCB Layout Figure 54: Typical Applications Circuit The dominant factor governing device performance is the component placement, not necessarily component value. The placement of the decoupling capacitor, C1, is the most critical. Place the component on the same side of PCB as device as shown in the figure above. Make connection as close as possible to minimize series inductance and resistance. This is critical.
Page 38 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Package Drawings & Markings Figure 55: Package Drawings Note(s): 1. All linear dimensions are in millimeters. 2. Contact finish is Au. 3. This package contains no lead (Pb). 4. This drawing is subject to change without notice. Package Drawings & Markings 3$57&/ 72352;&/ 3,1,1',&$725 /('$3(5785( /('&/ 72352;&/ 3$57&/ 72$/6&/ 5&/ 0 & $% 0 & $% Green RoHS
Datasheet, Public Page 39 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Package Drawings & Markings Figure 56: Recommended PCB Layout Note(s): 1. All dimensions are in millimeters. 2. Dimension tolerances are 0.05mm unless otherwise noted. 3. This drawing is subject to change without notice.
Page 40 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Tape & Reel Information Figure 57: Tape and Reel Information Note(s): 1. All linear dimensions are in millimeters. 2. For missing tolerances and dimensions, refer to EIA-481. 3. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. Tape & Reel Information /g36/g16/g36 /g3/g46/g19/g32/g20/g17/g21/g3 /g3/g20/g19/g131/g80/g68/g91/g17/g3 /g147/g19/g17/g19/g24/g3/g3/g36/g19/g32/g21/g17/g21/g24/g3/g147/g19/g17/g19/g24/g3 /g11/g21/g29/g20/g12 /g3/g21/g3/g147/g19/g17/g19/g24/g3 /g3/g20/g21/g3 /g3/g23/g91/g20/g19/g32/g23/g19/g3 /g3/g23/g3 /g147/g19/g17/g21 /g20/g17/g24/g3/g19 /g147/g19/g17/g20/g3 /g19/g17/g20 /g3/g19/g17/g20 /g3 /g19/g17/g22 /g3 /g14 /g147/g19/g17/g19/g24/g3/g24/g17/g24/g3 /g16 /g3 /g147/g19/g17/g20/g3/g20/g17/g26/g24/g3 /g14 /g3 /g3/g147/g19/g17/g20/g3/g23/g3 /g3 /g3 /g3/g20/g17/g20/g3/g147/g19/g17/g20/g3 /g36 /g36 /g37 /g37 /g74 /g88/g81/g90/g76/g81/g71/g76/g81/g74/g3/g71/g76/g85/g72/g70/g87/g76/g82/g81/g3/g72/g80/g83/g87/g92 /g37/g16/g37 /g3 /g3/g147/g19/g17/g19/g24/g3/g19/g17/g21/g27/g3 /g3/g37/g19/g32/g22/g17/g28/g3/g147/g19/g17/g19/g24 /g3/g20/g19/g131/g80/g68/g91/g17/g3
Datasheet, Public Page 41 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Soldering & Storage Information The module has been tested an d has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 58: Solder Reflow Profile Note(s): 1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. Profile Feature Preheat/ Soak Sn-Pb Eutectic Assembly Pb-Free Assembly Temperature Min ( Tsmin) 100 °C 150 °C Temperature Max ( Tsmax) 150 °C 200 °C Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds Ramp-up rate (TL to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) Time (tL) maintained above TL 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body temperature (TP) For users TP must not exceed the Classification temp of 235 °C For suppliers TP must equal or exceed the Classification temp of 235 °C For users TP must not exceed the Classification temp of 260 °C For suppliers TP must equal or exceed the Classification temp of 260 °C Time (tP) (1) within 5 °C of the specified classification temperature (Tc) 20 (1)seconds 30 (1)seconds Ramp-down rate (TP to TL) 6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Soldering & Storage Information
Page 42 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Soldering & Storage Information Figure 59: Solder Reflow Profile Graph Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed mois ture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with sili ca gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 24 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 24 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 24 months shelf life and the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Not to Scale – For Reference Only TP Temperature (°C) Time (seconds) tL TL TC - 5°C tP Tsmin Tsmax Preheat Area Max Ramp Up Rate = 3°C/s Max Ramp Down Rate = 6°C/s
Datasheet, Public Page 43 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Page 44 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Ordering & Contact Information Figure 60:
Ordering Information
Buy our products or get free samples online at: www.ams.com/Products Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/Contact Headquarters ams-OSRAM AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code I²C Bus I²C Address Delivery Form Delivery Quantity TMD27253M 1.8V 39h Tape & Reel (7”) 1000 pcs/reel TMD27253 Tape & Reel (13”) 10000 pcs/reel Ordering & Contact Information
Datasheet, Public Page 45 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams-OSRAM AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br/Cl): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) and do not contain Chlorine (Cl not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams-OSRAM AG knowledge and belief as of the date that it is provided. ams-OSRAM AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams-OSRAM AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams-OSRAM AG and ams-OSRAM AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Page 46 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Copyrights & Disclaimer Copyright ams-OSRAM AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams-OSRAM AG are covered by the warranty and patent indemnification provis ions appearing in its General Terms of Trade. ams-OSRAM AG makes no warranty, express, statutory, implied, or by desc ription regarding the information set forth herein. ams-OSRAM AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams-OSRAM AG for current information. This product is intended for use in commercial applications. Applications re quiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams-OSRAM AG for each application. This product is provided by ams-OSRAM AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams-OSRAM AG shall not be liable to recipient or any third party for any damages, including but no t limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams-OSRAM AG rendering of technical or other services. Copyrights & Disclaimer
Datasheet, Public Page 47 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Page 48 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-13 (2018-Feb-23) to current revision 2-00 (2023-Feb-22) Page Updated “Shelf Life” to 24 months 42 Revision Information
Datasheet, Public Page 49 [v2-00] 2023-Feb-22 Document Feedback TMD2725 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignments
4A b s o l u t e M a x i m u m R a t i n g s
5 Electrical Characteristics
6 Typical Operating Characteristics
10 Detailed Description
10 Proximity
10 Ambient Light Sensing, ALS
10 I²C Characteristics
11 I²C Write Transaction
11 I²C Read Transaction
11 Timing Diagrams
12 Principles of Operation
12 System State Machine
15 Register Description
15 Register Overview
17 Detailed Register Description
17 Enable Register (Address 0x80)
18 ATIME Register (Address 0x81)
18 PTIME Register (Address 0x82)
19 WTIME Register (Address 0x83)
19 AILTL Register (Address 0x84)
20 AILTH Register (Address 0x85)
20 AIHTL Register (Address 0x86)
21 AIHTH Register (Address 0x87)
21 PILT Register (Address 0x88)
22 PIHT Register (Address 0x8A)
22 PERS Register (Address 0x8C)
24 CFG0 Register (Address 0x8D)
25 PCFG0 Register (Address 0x8E)
26 PCFG1 Register (Address 0x8F)
27 CFG1 Register (Address 0x90)
27 REVID Register (Address 0x91)
27 ID Register (Address 0x92)
28 Status Register (Address 0x93)
28 PHOTOPICL Register (Address 0x94)
29 PHOTOPICH Register (Address 0x95)
29 ALS_IRL Register (Address 0x96)
29 ALS_IRH Register (Address 0x97)
29 PDATA Register (Address 0x9C)
30 REVID2 Register (Address 0x9E)
30 CFG2 Register (Address 0x9F)
31 CFG3 Register (Address 0xAB)
32 POFFSETL Register (Address 0xC0)
32 POFFSETH Register (Address 0xC1)
33 AZ_CONFIG Register (Address 0xD6)
33 CALIB Register (Address 0xD7)
Page 50 Datasheet, Public Document Feedback [v2-00] 2023-Feb-22 TMD2725 − Content Guide