TMD2672 OSRAM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
- PDF pages: 44
Technical content
[v1-00] 2015-Mar-23 Document Feedback TMD2672 Digital Proximity Detector The TMD2672 family of devices provides a complete proximity detection system and digital interface logic in a single 8-pin surface mount module. The devices are register-set and pin-compatible with the TMD2671 series and includes new and improved proximity detection features. The proximity detection includes improved si gnal-to-noise and accuracy. A proximity offset register allows compensation for optical system crosstalk between the IR LED and the sensor. To prevent false proximity data measurement readings, a proximity saturation indicator bit signals that the internal analog circuitry has reached saturation. Interrupts have been enhanced with the addition of a sleep-on-interrupt feature that also allows for a single cycle operation. The device internal state machine provides the ability to put the device in a low-power mode in between proximity measurements, providing very low average power consumption. The proximity detection system in cludes an LED driver and an IR LED, which are factory trimmed to eliminate the need for end-equipment calibration due to component variations. Ordering Information and Content Guide appear at end of datasheet. General Description
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − General Description Key Benefits & Features The benefits and features of the TMD2672 digital proximity detector, are listed below: Figure 1: Added Value of Using TMD2672 Note(s) and/or Footnote(s): 1. New or improved feature
Applications
- Mobile Handset Touchscreen Control and Automatic Speakerphone Enable
- Mechanical Switch Replacement
- P a p e r A l i g n m e n t Benefits Features
- Eliminates need for customer end-product calibration.
- Reduces the proximity noise
- Control of system crosstalk and offset
- Prevents false proximity detection in bright light
- Selectable IR power-level without external resistor
- Enables wide operating range
- Digital Proximity Detector, LED Driver, and IR LED in a Single Optical Module
- Register Set- and Pin-Compatible with the TMD2671 Series
- Proximity Detection - Reduced Proximity Count Variation (1) - Programmable Offset Control Register (1) -S a t u r a t i o n I n d i c a t o r (1) - Programmable Integration Time and Offset - Current Sink Driver for IR LED - 16,000:1 Dynamic Range
- Reduces external processor burden
- Maskable Proximity Interrupt - Programmable Upper and Lower Thresholds with Persistence Filter
- Enables dynamic power dissipation control
- Power Management - Low Power 2.2μA Sleep State with User-Selectable Sleep-After-Interrupt Mode (1) - 90μA Wait State with Programmable Wait Time from 2.7ms to > 8 seconds
- Industry standard two-wire interface
- I²C Fast Mode Compatible Interface - Data Rates up to 400kbit/s - Input Voltage Levels Compatible with V DD or 1.8V Bus
- Small foot-print module • 3.9 4mm × 2.36mm × 1.35mm Package
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − General Description End Products and Market Segments
- Mobile Handsets, Tablets, Laptops and HDTVs
- W h i t e G o o d s
- T o y s
- Digital Signage
- P r i n t i n g Block Diagram The functional blocks of this device for reference are shown below: Figure 2: TMD2672 Block Diagram SDA INT SCL Wait Control Prox ADC Prox Control Prox Data IR LED Constant Current Sink Prox Integration Upper Limit Lower Limit Interrupt I2C Interface GND Channel 1 LEDA LEDK VDDLDR Channel 0
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Detailed Description A fully integrated proximity detect ion solution is provided with an 850nm IR LED, LED driver ci rcuit, and proximity detection engine. An internal LED driver (LDR) pin, is externally connected to the LED cathode (LEDK) to provide a controlled LED sink current. This is accomplished with a proprietary current calibration technique that accounts for all variances in silicon, optics, package, and most important, IR LED output power. This eliminates or greatly reduces the need for factory calibration that is required for most discrete proximity sensor solutions. The device is factory calibrated to achieve a proximity count reading at a specified distance wi th a specific number of pulses. In use, the number of proximity LED pulses can be programmed from 1 to 255 pulses, which allows different proximity distances to be achieved. Each pulse has a 16μs period, with a 7.2μs on time. The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted an d remains asserted until cleared by the controlling firmware. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many consecutive exceeded thresholds are necessary to trigger an interrupt. Detailed Description
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Pin Assignments The TMD2672 pin assignments are described below: Figure 3: Pin Diagram (Top View) Figure 4: Terminal Func tions Package Module-8: Package drawing is not to scale Terminal Type Description Name No. VDD 1S u p p l y v o l t a g e SCL 2 I I²C serial clock in put terminal - clock signal for I²C serial data GND 3 Power supply ground. All voltages are referenced to GND. LEDA 4 LED anode LEDK 5 LED cathode. Connect to LDR pin when using internal LED driver circuit. LDR 6 O LED driver input for proximity IR LED, constant current source LED driver INT 7 O Interrupt - open drain (active low) SDA 8 I/O I²C serial data I/O terminal - serial data I/O for I²C Pin Assignments VDD 1 SCL 2 GND 3 LEDA 4
8 SDA
7 INT
6 LDR
5 LEDK
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)Note(s) and/or Footnote(s): 1. All voltages are with respect to GND. Symbol Parameter Min Max Unit VDD Supply voltage (1) 3.8 V Input terminal voltage -0.5 3.8 V Output terminal voltage (except LDR) -0.5 3.8 V Output terminal voltage (LDR) 3.8 V Output terminal current (except LDR) -1 20 mA T stg Storage temperature range -40 85 °C ESD tolerance, human body model ±2000 V Absolute Maximum Ratings
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Electrical Characteristics Figure 8: Proximity Characteristics, V DD = VLEDA = 3V, TA = 25°C, PEN = 1 (unless otherwise noted) Note(s) and/or Footnote(s): 1. Value is factory-adjusted to meet the Prox count specificat ion. Considerable variation (relative to the typical value) is po ssible after adjustment. 2. Proximity offset varies with power supply characteristics and noise. 3. I LEDA is factory calibrated to achieve this specification. Offset an d crosstalk directly sum with this value and is system dependent . 4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings. 5. These parameters are ensured by design and characterization and are not 100% tested. 6. Proximity test was done using the following circuit. See “Application Information: Hardware” on page 31. section for recommen ded application circuit. Symbol Parameter Test Conditions Min Typ Max Unit IDD Supply current LED On 3 mA ILEDA LEDA current (1) LED On, PDRIVE = 0 100 mA LED On, PDRIVE = 1 50 LED On, PDRIVE = 2 25 LED On, PDRIVE = 3 12.5 PTIME ADC conversion steps 1 256 steps PTIME ADC conversion time PTIME = 0xFF (= 1 conversion step) 2.58 2.73 2.9 ms PTIME ADC counts per step PTIME = 0xFF (= 1 conversion step) 0 1023 counts PPULSE LED pulses (5) 02 5 5 p u l s e s LED On LED pulse width PPULSE = 1, PDRIVE = 0 7.3 μs LED pulse period PPULSE = 2, PDRIVE = 0 16.0 μs Proximity response, no target (offset) PPULSE = 8, PDRIVE = 0, PGAIN = 4× (2) 100 counts Prox count, 100mm target (3) 73mm × 83mm, 90% reflective Kodak Gray Card, PGAIN = 4×, PPULSE = 8, PDRIVE = 0, PTIME = 0xFF (4) 450 520 590 counts
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Principles of Operation System State Machine An internal state machine provides system control of the proximity detection and power management features of the device. At power up, an internal power-on-reset initializes the device and puts it in a low-power Sleep state. When a start condition is detected on the I²C bus, the device transitions to the Idle state where it checks the Enable register (0x00) PON bit. If PON is disabled, the device will return to the Sleep state to save power. Otherwise, the device will remain in the Idle state until a proximity function is enabled. Once enabled, the device will execute the Prox and Wait states in sequence as indicated in Figure 18 . Upon completion and return to Idle, the device will automatically begin a new prox-wait cycle as long as PON and PEN are enabled. If the Prox function generates an interrupt and the Sleep-After-Interrupt (SAI) feature is enabled the device will transition to the Sleep state and remain in a low-power mode until an I²C command is received. See Interrupts for additional information. Figure 18: Simplified State Diagram Principles of Operation !PEN & WEN !WEN PEN Sleep Idle Wait Prox I2C Start !PON INT & SAI WEN
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation In many practical proximity appl ications, a number of optical system and environmental conditions can produce an offset in the proximity measurement result. To counter these effects, a proximity offset (POFFSET) is provided which allows the proximity data to be shifted positive or negative. Additional information on the use of the proximity offset feature is provided in available ams application notes. Once the first proximity cycle has completed, the proximity valid (PVALID) bit in the Status register will be set and remain set until the proximity detection function is disabled (PEN). For additional information on using the proximity detection function behind glass and for optical system design guidance, please see available ams application notes.
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Principles of Operation Interrupts The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for proximity values outside a user-defined range. While the interrupt function is always enabled and its status is available in the Status register (0x13), the output of th e interrupt state can be enabled using the proximity interrupt enab le (PIEN) field in the Enable register (0x00). Two 16-bit interrupt threshold re gisters allow the user to set limits below and above a desired proximity range. An interrupt can be generated when the proximity data (PDATA) falls below the proximity interrupt low threshold (PILTx) or exceeds the proximity interrupt high threshold (PIHTx). It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only the low threshold is evaluated. To further control when an interrupt occurs, the device provides an interrupt persistence feature. The persistence filter allows the user to specify the number of consecutive out-of-range proximity occurrences before an interrupt is generated. The persistence filter register (0x0C) allows the user to set the proximity persistence filter (PPERS) values. See the persistence filter register for details on the persistence filter values. Once the persistence filter generates an interrupt, it will continue until a special function interrupt clear command is received (see Command Register ). Figure 21: Programmable Interrupt Prox ADC Prox Data Prox Integration Channel 0 Upper Limit Lower Limit Prox Persistence PILTH(r 0x09), PILTL(r 0x08) PIHTH(r 0x0B), PIHTL(r 0x0A) PPERS(r 0x0C, b7:4) Channel 1
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation State Diagram The system state machine shown in Figure 18 provides an overview of the states and state transitions that provide system control of the device. This section highlights the programmable features that affect the state machine cycle time, and provides details to determine system level timing. When the proximity detection feature is enabled (PEN), the state machine transitions through the Prox Init, Prox Accum, Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times are a fixed 2.73ms, whereas the Prox Accum time is determined by the number of proximity LED pulses (PPULSE) and the Prox ADC time is determined by the integration time (PTIME). The formulas to determine the Prox Accum and Prox ADC times are given in the associated boxes in Figure 22 . If an interrupt is generated as a result of the proximity cycle, it will be asserted at the end of the Prox ADC state and transition to the Sleep state if SAI is enabled. When the power management feature is enabled (WEN), the state machine will transition in turn to the Wait state. The wait time is determined by WLONG, which extends normal operation by 12× when asserted, and WTIME. The formula to determine the wait time is given in the bo x associated with the Wait state in Figure 22 . Figure 22: Expanded State Diagram Prox Wait Sleep Idle Wait Prox Init Prox Accum Prox ADC Prox Time: 2.73 ms PPULSE: 0 ~ 255 pulses Time: 16.0 μs/pulse Range: 0 ~ 4.1 ms Time: 2.73 ms PTIME: 1 ~ 256 steps Time: 2.73 ms/step Range: 2.73 ms ~ 699 ms WTIME: 1 ~ 256 steps WLONG = 0 WLONG = 1 Time: 2.73 ms/step 32.8 ms/step Range: 2.73 ms ~ 699 ms 32.8 ms ~ 8.39s !WEN !PON I2C Start WEN !PEN & WEN Note: PON, PEN, WEN, and SAI are fields in the Enable register (0x00). PEN INT & SAI
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation I²C Protocol Interface and control are accomplished through an I²C serial compatible interface (standard or fast mode) to a set of registers that provide access to device cont rol functions and output data. The devices support the 7-bit I²C addressing protocol. The I²C standard provides for three types of bus transaction: read, write, and a combined protocol ( Figure 25 ). During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the register address from the previous command will be used for data access. Likewise, if the MSB of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. The command byte contains either control information or a 5-bit register address. The control commands can also be used to clear interrupts. The I²C bus protocol was develo ped by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification at http://www.i2c-bus.org/references . Figure 25: I²C Protocols W Data ByteSlave AddressS AA A 811 1 8 Command Code P ... I2C Write Protocol I2C Read Protocol I2C Read Protocol — Combined Format R DataSlave AddressS AA A 811 1 8 Data P ... W Slave AddressSlave AddressS AR A 811 1 7 1 1 Command Code Sr A Data AA 81 8 Data P ... A Acknowledge (0) N Not Acknowledged (1) P Stop Condition R Read (1) S Start Condition Sr Repeated Start Condition W Write (0) ... Continuation of protocol Master-to-Slave Slave-to-Master
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Principles of Operation Register Set The device is controlled and monitored by data registers and a command register accessed throug h the serial interface. These registers provide for a variety of control functions and can be read to determine results of th e ADC conversions. The Register Set is summarized in Figure 26 . Figure 26: Register Address The mechanics of accessing a spec ific register depends on the specific protocol used. See the section on I²C protocols on the previous pages. In general, the Command register is written first to specify the specific control/ status register for following read/write operations. Address Register Name R/W Register Function Reset Value ---- COMMAND W Specifies register address 0x00 0x00 ENABLE R/W Enables states and interrupts 0x00 0x02 PTIME R/W Proximity ADC time 0xFF 0x03 WTIME R/W Wait time 0xFF 0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00 0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00 0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00 0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00 0x0C PERS R/W Interrupt persistence filter 0x00 0x0D CONFIG R/W Configuration 0x00 0x0E PPULSE R/W Proximity pulse count 0x00 0x0F CONTROL R/W Control register 0x00 0x11 REVISION R Die re vision number Rev Num. 0x12 ID R Device ID ID 0x13 STATUS R Device status 0x00 0x18 PDATAL R Proximity ADC low data register 0x00 0x19 PDATAH R Proximity ADC high data register 0x00 0x1E POFFSET R/W Proximity Offset register 0x00
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation Command Register The Command Register specifies the address of the target register for future write and read operations. Figure 27: Command Register 76 5 4 3210 COMMAND TYPE ADD Field Bits Description COMMAND 7 Select Command Register. Must write as 1 when addressing Command Register. TYPE 6:5 Selects type of transaction to follow in subsequent data transfers: Field Value Description
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved - Do not use
11 Special function - See description below
Transaction type 00 will repeatedly read the same register with each data access. Transaction type 01 will provide an auto-increment function to read successive register bytes. ADD 4:0 Address Register/Special Function Register. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-register for following write and read transactions: Field Value Description
00000 Normal - no action
00101 Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing.
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation Proximity Pulse Count Register (0x0E) The Proximity Pulse Count Register sets the number of proximity pulses that will be transmitted. PPULSE defines the number of pulses to be transmitted at a 62.5kHz rate. Figure 34: Proximity Pulse Count Register 76 5 4 3210 PPULSE Field Bits Description PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Principles of Operation Control Register (0x0F) The Control Register provides four bits of control to the analog block. These bits control the diode drive current and diode selection functions. Figure 35: Control Register Note(s) and/or Footnote(s): 1. LED STRENGTH values (italic) are nomina l operating values. Specifications can be found in the Proximity Characteristics tabl e. 76 5 4 3210 PDRIVE PDIODE PGAIN Reserved Field Bits Description PDRIVE (1) 7:6 Proximity LED Drive Strength Field Value LED STRENGTH - PDL = 0 LED STRENGTH - PDL = 1 00 100mA 11.1mA 01 50mA 5.6mA 10 25mA 2.8mA 11 12.5mA 1.4mA PDIODE 5:4 Proximity Diode Selector Field Value Diode Selection
00 Proximity uses neither diode
01 Proximity uses the CH0 diode
10 Proximity uses the CH1 diode
11 Reserved - Do not write
PGAIN 3:2 Proximity Gain Field Value Proximity Gain Value 00 1× gain 01 2× gain 10 4× gain 11 8× gain Reserved 1:0 Reserved
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Principles of Operation Proximity Offset Register (0x1E) The 8-bit Proximity Offset Register provides compensation for proximity offsets caused by devic e variations, optical crosstalk, and other environmental factors. Proximity offset is a sign-magnitude value where the sign bit, bit 7, determines if the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power up, the register is set to 0x00. The magnitude of the offset compensation depends on th e proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE). Because a number of environmental factors contribute to proximity offset, this register is best suited for use in an adaptive closed-loop control system. See available ams application notes for proximit y offset register application information. Figure 40: Proximity Offset Register 76 5 4 3210 SIGN MAGNITUDE Field Bits Description SIGN 7 Proximity Offset Sign. The offset sign shifts the proximity data negative when equal to 0 and positive when equal to 1. MAGNITUDE 6:0 Proximity Offset Magnitude. The offset magnitude shifts the proximity data positive or negative, depending on the proximity offset sign. The actual amount of the shift depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and the number of proximity pulses (PPULSE).
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Application Information: Hardware LED Driver Pin with Proximity Detection In a proximity sensing system, the included IR LED can be pulsed with more than 100mA of rapidl y switching current, therefore, a few design considerations must be kept in mind to get the best performance. The key goal is to reduce the power supply noise coupled back into the device during the LED pulses. Averaging of multiple proximit y samples is recommended to reduce the proximity noise. The first recommendation is to use two power supplies; one for the device V DD and the other for the IR LED. In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quiet supply to the V DD pin and the noisy supply to the LEDA pin, the key goal can be met. Place a 1μF low-ESR decoupling capacitor as close as possible to the V DD pin and another at the LEDA pin, and at least 10μF of bulk capacitance to supply the 100mA current surge. This may be distributed as two 4.7μF capacitors. Figure 41: Proximity Sensing Using Separate Power Supplies If it is not possible to provide two separate power supplies, the device can be operated from a si ngle supply. A 22Ω resistor in series with the V DD supply line and a 1μF low ESR capacitor effectively filter any power supply noise. The previous capacitor placement considerations apply. Application Information: Hardware TMD2672 INT SDA SCL VDD LEDA 1 /C0109F Voltage Regulator Voltage Regulator /C0046 10 /C0109F * Cap Value Per Regulator Manufacturer Recommendation GND VBUS RP RP RPI 1 /C0109F LDR LEDK
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Application Information: Hardware Figure 42: Proximity Sensing Using Single Power Supply VBUS in the above figures refers to the I²C bus voltage which is either V DD or 1.8V. Be sure to apply the specified I²C bus voltage shown in the Ordering Information table for the specific device being used. The I²C signals and the Interrupt are open-drain outputs and require pull-up resistors. The pull-up resistor (RP) value is a function of the I²C bus speed, the I²C bus voltage, and the capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ resistors. A 10kΩ pull-up resistor (R PI) can be used for the interrupt line. 1 /C0109F Voltage Regulator /C0046 10 /C0109F 1 /C0109F 22 /C0087 TMD2672 INT SDA SCL VDD LEDA GND VBUS RP RP RPILDR LEDK
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Application Information: Hardware PCB Pad Layout Suggested PCB pad layout guidelines for the surface mount module are shown in Figure 43 . Flash Gold is recommended surface finish for the landing pads. Figure 43: Suggested Module PCB Layout Note(s) and/or Footnote(s): 1. All linear dimensions are in mm. 2. This drawing is subject to change without notice. 0.72 /C0043 0.05 0.25 /C0043 0.05 0.60 /C0043 0.05 0.80 /C0043 0.05
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Package Information Figure 44: Module Packaging Configuration Note(s) and/or Footnote(s): 1. All linear dimensions are in millimeters. Dime nsion tolerance is ± 0.05mm unless otherwise noted. 2. Contacts are copper with NiPdAu plating. 3. This package contains no lead (Pb). 4. This drawing is subject to change without notice.
Package Information
0.60 0.25 BOTTOM VIEW 0.05 0.72 0.80 END VIEW 2.36 /C0043 0.2 2.10 /C0043 0.1 1.35 /C0043 0. MODULE Dual Flat No-Lead /C0106 1.0 3.73 /C0043 0.1 3.94 /C0043 0.2 Detector LED TOP VIEW SIDE VIEW /C0106 0.9 1.18 0.58 2.40 Green RoHS
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Carrier Tape & Reel Information Figure 45: Module Carrier Tape Note(s) and/or Footnote(s): 1. All linear dimensions are in millimeters. Di mension tolerance is ±0.1 0mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purpos es only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing A o, Bo, and K o are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 330 millimeters in diameter and contains 2500 parts. 5. ams packaging tape and reel conform to th e requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. 7. This drawing is subject to change without notice. Carrier Tape & Reel Information Unit Orientation TOP VIEW DETAIL A 2.70 Ao 0.29 /C0043 0.02 8/C0053 Max 4.00 12.00 5.50 /C0043 0.05 /C0106 1.50 2.00 /C0043 0.05 + 0.30 − 0.10 1.75 B AA /C0106 1.00 /C0043 0.05 DETAIL B 4.30 Bo 6/C0053 Max 1.70 Ko 8.00 B
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Soldering & Storage Information Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The Moisture Barrier Bags should be stored under the following conditions:
- Temperature Range: < 40°C
- Relative Humidity: < 90%
- Total Time: No longer than 12 months from the date code on the aluminized envelope if unopened. Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and the Humidity Indicator Card shows the parts to be out of the allowable moisture region. Opened reels should be used within 168 hours if exposed to the following conditions:
- Temperature Range: < 30°C
- Relative Humidity: < 60% If rebaking is required, it should be done at 50°C for 12 hours. The Module has been assigned a moisture sensitivity level of MSL 3.
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Ordering & Contact Information Figure 48:
Ordering Information
Note(s) and/or Footnote(s): 1. Contact ams for availability. Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Device Address Leads Interface Description Ordering Number TMD26721 0x39 Module-8 I²C Vbus = VDD Interface TMD26721 TMD26723 0x39 Module-8 I²C Vbus = 1.8V Interface TMD26723 TMD26725 (1) 0x29 Module-8 I²C Vbus = VDD Interface TMD26725 TMD26727 (1) 0x29 Module-8 I²C Vbus = 1.8V Interface TMD26727 Ordering & Contact Information
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Document Feedback [v1-00] 2015-Mar-23 TMD2672 − Revision Information 1. Page and figure numbers for the previous version may di ffer from page and figure numbers in the current revision 2. Correction of typographical er rors is not explicitly mentioned. Changes from 149C (2012-Aug) to current revision 1-00 (2015-Mar-23) Page Content of TAOS datasheet was converted to the latest ams design Revision Information
[v1-00] 2015-Mar-23 Document Feedback TMD2672 − Content Guide
1 General Description
2 Key Benefits & Features
2 Applications
3 End Products and Market Segments
3 Block Diagram
4 Detailed Description
5 Pin Assignments
6A b s o l u t e M a x i m u m R a t i n g s
7 Electrical Characteristics
11 Parameter Measurement Information
12 Typical Operating Characteristics
14 Principles of Operation
14 System State Machine
15 Proximity Detection
17 Interrupts
18 State Diagram
19 Power Management
20 I²C Protocol
21 Register Set
22 Command Register
23 Enable Register (0x00)
23 Proximity Time Control Register (0x02)
24 Wait Time Register (0x03)
24 Proximity Interrupt Threshold Register
(0x08 - 0x0B)