TL8 VISHAY

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www.vishay.com Vishay Sprague Revision: 11-May-16 1 Document Number: 40156 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Solid Tantalum Chip Capacitors, MICROTAN®, High CV Leadframeless Molded Low Profile

FEATURES

  • Ultra-low profile: 0.8 mm to 1.0 mm in a variety of case sizes
  • Highest capacitance-voltage product in industry
  • Lead (Pb)­free L-shaped terminations for superior board mounting
  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PERFORMANCE CHARACTERISTICS www.vishay.com/doc?40169 Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Capacitance Tolerance: ± 10 % ± 20 % Voltage Range: 4 VDC to 25 VDC Capacitance Range: 0.68 μF to 220 μF Note
  • Preferred tolerance and reel sizes are in bold.  We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage substitutions will be marked with the higher voltage rating.

ORDERING INFORMATION

TYPE CASE CODE CAPACITANCE CAPACITANCE TOLERANCE DC VOLTAGE RATING AT +85 °C TERMINATION / PACKAGING See Ratings and Case Codes table. This is expressed in pF. The first two digits are the significant figures. The third is the number of zeros to follow. M = ± 20 % K = ± 10 % This is expressed in V. To complete the three-digit block, zeros precede the voltage rating. A decimal point is indicated by an “R” (6R3 = 6.3 V). C = 100 % tin 7" (178 mm) reel DIMENSIONS in inches [millimeters] CASE CODE H (MAX.) L W P1 P2 (REF.) C W9 0.035 [0.9] 0.079 ± 0.008 [2.00 ± 0.20] 0.050 ± 0.008 [1.25 ± 0.20] 0.020 ± 0.004 [0.50 ± 0.10] 0.040 [1.00] 0.035 ± 0.004 [0.90 ± 0.10] A0 0.039 [1.0] 0.126 ± 0.008 [3.20 ± 0.20] 0.063 ± 0.008 [1.60 ± 0.20] 0.031 ± 0.004 [0.80 ± 0.10] 0.063 [1.60] 0.047 ± 0.004 [1.20 ± 0.10] B0 0.039 [1.0] 0.138 ± 0.008 [3.50 ± 0.20] 0.110 ± 0.008 [2.80 ± 0.20] 0.031 ± 0.004 [0.80 ± 0.20] 0.078 [1.95] 0.095 ± 0.004 [2.40 ± 0.10] L Anode Polarity BarAnode Termination HW C P2P1 Cathode Termination

www.vishay.com Vishay Sprague Revision: 11-May-16 2 Document Number: 40156 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RATINGS AND CASE CODES μF 4 V 6.3 V 10 V 16 V 20 V 25 V

0.68 W9 W9

1 . 0 W 9W 9W 9W 9 1.5 W9 2 . 2 W 9W 9W 9

3.3 W9 W9

4 . 7 W 9W 9W 9 6.8

10 W9 W9 W9

15 W9 W9

22 W9 W9 W9

33 W9 W9 B0

47 W9 A0

100 A0 A0

VOLTAGE CODE CAPACITANCE CODE VC O D E C A P , μ F C O D E 2.5 e 0.68 w 4.0 G 1.0 A 6.3 J 2.2 J 10 A 3.3 N 16 C 4.7 S 20 D 6.8 W

25 E 10 

35 V 15 e

50 T 22 j

code (pF)107J Voltage code Polarity bar Bx-cases

2 Vishay

E Voltage codePolarity bar 33 20 VoltageCapacitancePolarity bar

www.vishay.com Vishay Sprague Revision: 11-May-16 3 Document Number: 40156 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 STANDARD RATINGS CAPACITANCE (μF) CASE CODE PART NUMBER MAX. DCL AT +25 °C (μA) MAX. DF AT +25 °C 120 Hz (%) MAX. ESR AT +25 °C 100 kHz () MAX. RIPPLE 100 kHz IRMS (A) 4 VDC AT +40 °C; 2.5 VDC +85 °C; 1.6 VDC AT +125 °C 10 W9 TL8W9106(1)004C 0.5 8 5.0 0.084 22 W9 TL8W9226M004C 0.9 15 4.0 0.094 33 W9 TL8W9336M004C 2.6 30 4.0 0.094 47 W9 TL8W9476M004C 3.8 40 7.5 0.068 220 A0 TL8A0227M004C 88 80 7.0 0.089 6.3 VDC AT +40 °C; 4.0 VDC +85 °C; 2.5 VDC AT +125 °C 2.2 W9 TL8W9225(1)6R3C 0.5 10 5.0 0.084 3.3 W9 TL8W9335(1)6R3C 0.5 8 6.0 0.076 4.7 W9 TL8W9475(1)6R3C 0.5 8 3.0 0.108 10 W9 TL8W9106(1)6R3C 0.6 8 5.0 0.084 15 W9 TL8W9156(1)6R3C 1.0 20 7.0 0.071 22 W9 TL8W9226M6R3C 2.8 20 5.5 0.080 33 W9 TL8W9336M6R3C 4.2 30 7.5 0.068 100 A0 TL8A0107M6R3C 6.3 30 1.1 0.220 10 VDC AT +40 °C; 6.3 VDC +85 °C; 4.0 VDC AT +125 °C 1.0 W9 TL8W9105(1)010C 0.5 6 12.0 0.054 1.5 W9 TL8W9155(1)010C 0.5 6 14.0 0.050 2.2 W9 TL8W9225(1)010C 0.5 10 10.0 0.059 3.3 W9 TL8W9335(1)010C 0.5 8 6.0 0.076 4.7 W9 TL8W9475(1)010C 0.5 6 5.0 0.084 10 W9 TL8W9106(1)010C 1.0 20 7.5 0.068 15 W9 TL8W9156M010C 1.5 30 7.5 0.068 22 W9 TL8W9226M010C 22 40 10.0 0.084 47 A0 TL8A0476M010C 15 30 5.0 0.105 100 A0 TL8A0107M010C 100 50 7.0 0.089 16 V DC AT +40 °C; 10 VDC +85 °C; 6.3 VDC AT +125 °C 1.0 W9 TL8W9105(1)016C 0.5 6 12.0 0.054 2.2 W9 TL8W9225(1)016C 0.5 10 12.0 0.054 4.7 W9 TL8W9475M016C 0.8 12 12.0 0.054

20 VDC AT +40 °C; 13 VDC +85 °C; 8 VDC AT +125 °C

0.68 W9 TL8W9684(1)020C 0.5 6 20.0 0.042 1.0 W9 TL8W9105(1)020C 0.5 6 10.0 0.059 33 B0 TL8B0336M020C 33 15 5.0 0.118

25 VDC AT +40 °C; 17 VDC +85 °C; 10 VDC AT +125 °C

0.68 W9 TL8W9684(1)025C 0.5 6 20.0 0.042 1.0 W9 TL8W9105(1)025C 0.5 6 10.0 0.059 Note

  • Part number definition: (1) Capacitance tolerance: K = 10 %, M = 20 %

www.vishay.com Vishay Sprague Revision: 11-May-16 4 Document Number: 40156 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 STANDARD PACKAGING QUANTITY CASE CODE QUANTITY (pcs/reel) 7" REEL A0 2500 W9 3000 B0 3000 RECOMMENDED VOLTAGE DERATING -55 °C TO +40 °C RATING +40 °C TO + 85 °C RATING +85 °C TO +125 °C RATING RATED VOLTAGE (V) CATEGORY VOLTAGE (V) CATEGORY VOLTAGE (V) 4.0 2.5 1.6 6.3 4.0 2.5 10 6.3 4.0 16 10 6.3 20 13 8.0 25 17 10 VOLTAGE VS. TEMPERATURE RATING POWER DISSIPATION CASE CODE MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR A0 0.055 W9 0.035 B0 0.070 PRODUCT INFORMATION Micro Guide www.vishay.com/doc?40115 Pad Dimensions Packaging Dimensions Moisture Sensitivity www.vishay.com/doc?40135 Typical Performance Characteristics www.vishay.com/doc?40169 SELECTOR GUIDES Solid Tantalum Selector Guide www.vishay.com/doc?49053 Solid Tantalum Chip Capacitors www.vishay.com/doc?40091 FAQ Frequently Asked Questions www.vishay.com/doc?40110 120 100 100 % 40 % - 55 + 400 + 85 + 125 RATED VOLTAGE (%) 80 % 33 % 63 % 80 % TEMPERATURE (°C) 100 % 100 % 80 % 50 % Rated range Recommended derating TL8 recommended derating

www.vishay.com Vishay Sprague Revision: 12-Sep-17 1 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Guide for Leadframeless Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability, and long service life are primary considerations. The stability and resistance to elevated temperatures of the tantalum / tantalum oxide / manganese dioxide system make solid tantalum capacitors an appropriate choice for toda y’s surface mount assembly technology. Vishay Sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. Tantalum is not found in its pure state. Rather, it is commonly found in a number of oxide minerals, often in combination with Columbium ore. This combination is known as “tantalite” when its contents are more than one-half tantalum. Important sources of tantalite include Australia, Brazil, Canada, China, an d several African countries. Synthetic tantalite concentrates produced from tin slags in Thailand, Malaysia, and Brazil are also a significant raw material for tantalum production. Electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. Other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. Vishay Sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperature vacuum processing. THE BASICS OF TANTALUM CAPACITORS Most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. A few metals form dens e, stable, tightly adhering, electrically insulating oxides. These are the so-called “valve” metals and include titanium, zi rconium, niobium, tantalum, hafnium, and aluminum. Only a few of these permit the accurate control of oxide thickness by electrochemical means. Of these, the most valuable for the electronics industry are aluminum and tantalum. Capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. Their function is to store an electrical charge for later use. Capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. They are separated by an insulating material or dielectric. The dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. Tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. As capacitors are being manufactured, a film of tantalum pentoxide is applied to their electrodes by means of an electrolytic process. The film is applied in various thicknesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. This coloring occurs on the tantalum electrodes of all types of tantalum capacitors. Rating for rating, tantalum capacitors tend to have as much as three times better capacitance / volume efficiency than aluminum electrolytic capacitors. An approximation of the capacitance / volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. Th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. In the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: where C= c a p a c i t a n c e e = dielectric constant A = surface area of the dielectric t = thickness of the dielectric Tantalum capacitors contain either liquid or solid electrolytes. In solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. A tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. The drawings show the construction details of the surface mount types of tantalum capacitors shown in this catalog. COMPARISON OF CAPACITOR DIELECTRIC CONSTANTS DIELECTRIC e DIELECTRIC CONSTANT Air or Vacuum 1.0 Paper 2.0 to 6.0 Plastic 2.1 to 6.0 Mineral Oil 2.2 to 2.3 Silicone Oil 2.7 to 2.8 Quartz 3.8 to 4.4 Glass 4.8 to 8.0 Porcelain 5.1 to 5.9 Mica 5.4 to 8.7 Aluminum Oxide 8.4 Tantalum Pentoxide 26 Ceramic 12 to 400K C eA

www.vishay.com Vishay Sprague Revision: 12-Sep-17 2 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SOLID ELECTROLYTE TANTALUM CAPACITORS Solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. The pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. The pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. Molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost. Surface mount designs of “So lid Tantalum” capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. TANTALUM CAPACITORS FOR ALL DESIGN CONSIDERATIONS Solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. They will typically withstand up to about 10 % of the rated DC working voltage in a revers e direction. Also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. Vishay Sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. Vishay Sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. Data sheets covering the various types and styles of Vishay Sprague capacitors for consumer and entertainment electronics, industry, and military applications are available where detailed performance characteristics must be specified. Fig. 1 - Leadframeless Molded Capacitors, All Types Side Cathode Termination (-) Sintered Tantalum Pellet MnO2/Carbon/ Silver Coating Bottom Cathode Termination (-) Silver Adhesive Epoxy Glass Reinforced Epoxy Resin Bottom Anode Termination (+) Side Anode Termination (+) Polarity Bar Marking Epoxy Resin EncapsulationVoltage Code Excluding 0402 (1005 metric) case size

www.vishay.com Vishay Sprague Revision: 12-Sep-17 3 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TL8 298D 298W TR8 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Small size including 0603 and 0402 foot print Ultra low profile Industrial grade Industrial grade, extended range Low ESR TEMPERATURE RANGE Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 40 °C, voltage derating is required) Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) CAPACITANCE RANGE 0.68 μF to 220 μF 0.33 μF to 220 μF 2.2 μF to 220 μF 1 μF to 220 μF VOLTAGE RANGE 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V CAPACITANCE TOLERANCE ± 20 %, ± 10 % DISSIPATION FACTOR 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 % CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B TERMINATION 100 % tin 100 % tin or gold plated SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED SERIES TP8 TM8 DLA 11020 T42 PRODUCT IMAGE TYPE Solid tantalum leadframeless molded chip capacitors Small size including 0603 and 0402 foot print Built in fuse, double-stacked High performance, automotive grade High reliability High reliability, DLA approved High reliability, ultra-low ESR TEMPERATURE RANGE Operating Temperature: -55 °C to +125 °C (above 85 °C, voltage derating is required) CAPACITANCE RANGE 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF VOLTAGE RANGE 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V CAPACITANCE TOLERANCE ± 20 %, ± 10 % DISSIPATION FACTOR 6 % to 30 % 6 % to 20 % 6 % to 8 % 6 % to 15 % CASE CODES M, W, R, P, A, N, T, B K, M, G, W, R, P, A, N, T M, W, R, P, A, N, T M2 TERMINATION 100 % tin Tin / lead solder plated, 100 % tin and gold plated Tin / lead solder plated or gold plated Tin / lead solder plated or 100 % tin

www.vishay.com Vishay Sprague Revision: 12-Sep-17 4 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes

  • Metric dimensions will govern . Dimensions in inches are rounded and for reference only. (1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body dimensions of the component. The clearance between the ends of the terminals or body of the co mponent to the sides and depth of the rotation of the component within the cavity of not more than 20°. (2) Tape with components shall pass around radius “R” without damage . The minimum trailer length may require additional length to provide “R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum. (3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed cavities or to the edge of the cavity whichever is less. (4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity or to the edge of the cavity whichever is less. (5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of embossement location shall be applied independent of each other. (6) B1 dimension is a reference dimension tape feeder clearance only. Notes (1) For reference only (2) Packaging of M case in plastic tape is available per request PLASTIC TAPE AND REEL PACKAGING in inches [millimeters] Tape and Reel Specifications: all case sizes are available on plastic embo ssed tape per EIA-481. Standard reel diameter is 7" [178 mm]. CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8 CASE CODE TAPE SIZE B 1 (MAX.) (1) D1 (MIN.) F K 0 (MAX.) P 1 W 0.004 [0.10] max. K Tape thickness B1 (max.) (6) 0.014 [0.35] max. 10 pitches cumulative tolerance on tape ± 0.008 [0.200] Embossment 0.069 ± 0.004 [1.75 ± 0.10] D 1 (min.) for components Maximum USER DIRECTION OF FEED Center lines of cavity A F W 0.030 [0.75] min. (3) 0.030 [0.75] min. (4) 0.079 ± 0.002 [2.0 ± 0.05] 0.157 ± 0.004 [4.0 ± 0.10] [1.5 + 0.10 - 0.0] B Maximum component rotation (Side or front sectional view) 20° For tape feeder reference only including draft. Concentric around B (5) Deformation between embossments Top cover tape Top cover tape cavity size (1) Cathode (-) Anode (+) DIRECTION OF FEED 20° maximum component rotation Typical component cavity center line Typical component center lineA (Top view) 0.9843 [250.0] Tape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. Camber Allowable camber to be 0.039/3.937 [1/100] (Top view) Non-cumulative over 9.843 [250.0]

www.vishay.com Vishay Sprague Revision: 12-Sep-17 5 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) For reference only Note (1) For reference only Note (1) A0, B0 are determined by the maximum dimensions to the ends of the terminals e xtending from the component body and / or the body dimensions of the component. The clearance between the ends of the terminals or body of the co mponent to the sides and depth of the of the component within the cavity of not more than 20°. CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8 CASE CODE TAPE SIZE B 1 (MAX.) (1) D1 (MIN.) F K 0 (MAX.) P 1 W CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42 CASE CODE TAPE SIZE B 1 (MAX.) (1) D1 (MIN.) F K 0 (MAX.) P 1 W PAPER TAPE AND REEL PACKAGING in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8, TM8 (K case only) CASE SIZE TAPE SIZE A0 B0 D0 P0 P1 P2 EF W T K8 m m 0.033 ± 0.002 [0.85 ± 0.05] 0.053 ± 0.002 [1.35 ± 0.05] 0.06 ± 0.004 [1.5 ± 0.1] 0.157 ± 0.004 [4.0 ± 0.1] 0.078 ± 0.004 [2.0 ± 0.1] 0.079 ± 0.002 [2.0 ± 0.05] 0.069 ± 0.004 [1.75 ± 0.1] 0.0138 ± 0.002 [3.5 ± 0.05] 0.315 ± 0.008 [8.0 ± 0.2] 0.03 ± 0.002 [0.75 ± 0.05] M8 m m 0.041 ± 0.002 [1.05 ± 0.05] 0.071 ± 0.002 [1.8 ± 0.05] 0.06 ± 0.004 [1.5 ± 0.1] 0.157 ± 0.004 [4.0 ± 0.1] 0.157 ± 0.004 [4.0 ± 0.1] 0.079 ± 0.002 [2.0 ± 0.05] 0.069 ± 0.004 [1.75 ± 0.1] 0.0138 ± 0.002 [3.5 ± 0.05] 0.315 ± 0.008 [8.0 ± 0.2] 0.037 ± 0.002 [0.95 ± 0.05] Ø D0 T Bottom cover tape F B0 E2 W Cavity size (1) Bottom cover tape USER FEED DIRECTION Cavity center lines Top cover tape [10 pitches cumulative tolerance on tape ± 0.2 mm] GAnode

www.vishay.com Vishay Sprague Revision: 12-Sep-17 6 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RECOMMENDED REFLOW PROFILES Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles. PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY PREHEAT AND SOAK Temperature min. (T Smin.) 100 °C 150 °C Temperature max. (TSmax.) 150 °C 200 °C Time (tS) from (TSmin. to TSmax.) 60 s to 90 s 60 s to 150 s RAMP UP Ramp-up rate (T L to Tp) 3 °C/s maximum Liquidus temperature (TL) 183 °C 217 °C Time (tL) maintained above TL 60 s to 150 s Peak package body temperature (Tp) max. 235 °C 260 °C Time (tp) within 5 °C of the peak max. temperature 20 s 30 s RAMP DOWN Ramp-down rate (T p to TL) 6 °C/s maximum Time from 25 °C to peak temperature 6 min maximum 8 min maximum PAD DIMENSIONS in inches [millimeters] CASE CODE A (NOM.) B (MIN.) C (NOM.) D (MIN.) Time Temperature tS Time 25 °C to Peak tp TP TL TSmin. tLTSmax. Preheat Area Max. Ramp Up Rate = 3 °C/s Max. Ramp Down Rate = 6 °C/s A B C D

www.vishay.com Vishay Sprague Revision: 12-Sep-17 7 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes

  • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
  • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
  • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table TYPICAL LEAKAGE CURRENT FACTOR RANGE TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY 100 1.0 0.1 0.01 0.001 01 0 4 0 7 0 8 0 9 0 605020 30 100 + 125 °C + 85 °C + 55 °C + 25 °C 0 °C - 55 °C PERCENT OF RATED VOLTAGE LEAKAGE CURRENT FACTOR 100 0.1 1 10 100 1000 FREQUENCY , kHz “M” Case 22 μF - 4 V IMPEDANCE ESR ESR/Z, Ω 0.1 100 0.1 1 10 100 1000 FREQUENCY, kHz ESR/Z, Ω “M” Case 47 μF - 4 V IMPEDANCE ESR 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz ESR/Z, Ω “M” Case 10 μF - 6 V IMPEDANCE ESR 0.1 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz ESR/Z, Ω “M” Case 4.7 μF - 10 V IMPEDANCE ESR

www.vishay.com Vishay Sprague Revision: 12-Sep-17 8 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY 100 1000 0.1 1 10 100 1000 FREQUENCY, kHz ESR/Z, Ω “M” Case 10 μF - 10 V IMPEDANCE ESR 100 1000 10 000 0.1 1 10 100 1000 FREQUENCY, kHz ESR/Z, Ω “M” Case 1 μF - 16 V IMPEDANCE ESR 100.0 10.0 1.0 0.1 ESR/Z, Ω 0.1 1 10 100 1000 33 μF - 10 V IMPEDANCE ESR “P” CASE FREQUENCY , kHz 1000.0 100.0 10.0 1.0 0.1 0.1 1 10 100 1000 IMPEDANCE ESR FREQUENCY, kHz ESR/Z, Ω “P” CASE 4.7 μF - 25 V 100.0 1.0 10.0 0.1 0.1 1 10 100 1000 ESR/Z, Ω FREQUENCY, kHz “P” CASE IMPEDANCE ESR 47 μF - 10 V 10.0 1.0 0.1 0.1 1 10 100 1000 ESR/Z, Ω FREQUENCY, kHz “P” CASE 220 μF - 4 V IMPEDANCE ESR

www.vishay.com Vishay Sprague Revision: 12-Sep-17 9 Document Number: 40115 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: where, P = power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) R ESR = the capacitor equivalent series resistance at the specified frequency 2. AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, P = power dissipation in watts at +25 °C (see paragraph number 5 and the table Power Dissipation as given in the tables in the product datasheets) R ESR = the capacitor equivalent series resistance at the specified frequency Z = the capacitor impedance at the specified frequency

2.1 The sum of the peak AC voltage plus the applied DC

voltage shall not exceed the DC voltage rating of the capacitor.

2.2 The sum of the negative peak AC voltage plus the

applied DC voltage shall not allow a voltage reversal exceeding 10 % of the DC working voltage at +25 °C. 3. Reverse Voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the DC rating at +25 °C, 5 % of the DC rating at +25 °C, 5 % of the DC rating at +85 °C, and 1 % of the DC rating at +125 °C. 4. Temperature Derating: if these capacitors are to be operated at temperatures above +25 °C, the permissible RMS ripple curre nt shall be calculated using the derating factors as shown: 5. Power Dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent I RMS value be established when calculating permissible operating levels. (Power Dissipation calculated using +25 °C temperature rise.) 6. Printed Circuit Board Materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). 7. Attachment:

7.1 Solder Paste: the recommended thickness of the

solder paste after applic ation is 0.007" ± 0.001" [0.178 mm ± 0.025 mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatu res below the liquidous state of the solder.

7.2 Soldering: capacitors can be attached by

conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. The Soldering Profile charts show recommended time / temperature conditions for soldering. Preheating is recommended. The recommended maximum ramp rate is 2 °C per s. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor.

7.2.1 Backward and Forward Compatibility: capacitors

with SnPb or 100 % tin termination finishes can be soldered using SnPb or lead (Pb)-free soldering processes. 8. Cleaning (Flux Removal) After Soldering: molded capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous clea ning media. However, CFC / ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material.

8.1 When using ultrasonic cleaning, the board may

resonate if the output power is too high. This vibration can cause cracking or a decrease in the adherence of the termination. DO NOT EXCEED 9W/l at 40 kHz for 2 min. 9. Recommended Mounting Pad Geometries: proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to minimize component rework due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and / or circuit board design. TEMPERATURE DERATING FACTOR +25 °C 1.0 +85 °C 0.9 +125 °C 0.4 IRMS P RESR VRMS Z P RESR VRMS IRMS x Z=

Typical Performance Characteristics www.vishay.com Vishay Sprague Revision: 20-Jan-14 1 Document Number: 40169 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Solid Tantalum Chip Capacitors MICROTAN® Leadframeless Molded Capacitors 298D, 298W, TR8 and TL8 ELECTRICAL PERFORMANCE CHARACTERISTICS ITEM PERFORMANCE CHARACTERISTICS Category temperature range - 55 °C to +85 °C (to +125 °C with voltage derating) Capacitance tolerance ± 20 %, ± 10 %, tested vi a bridge method, at 25 °C, 120 Hz Dissipation factor Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz. ESR Limits per Standard Rating s table. Tested via bridge method, at 25 °C, 100 kHz. Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k  resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in Standard Ratings table. Note that the leakage current varies wi th temperature and applied voltage. See graph below for the appropriate adjustment factor. Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to:  10 % of the DC rating at +25 °C 5 % of the DC rating at +85 °C 1 % of the DC rating at +125 °C Vishay does not recommend intentional or repetitive application of reverse voltage. Ripple current and Temperature derating For maximum permissible ripple current (I RMS) or/and voltage (V RMS) please refer to product datasheet and Guide to Application. If capacitors are to be used at temperatures above +25 °C, the permissible RMS ripple current or voltage shall be calculated using the derating factors: 1.0 at +25 °C 0.9 at +85 °C 0.4 at +125 °C Maximum operating voltage 298W AND TL8 RATED VOLTAGE (V) CATEGORY VOLTAGE (V) AT TEMPERATURE RANGE -55 °C to +40 °C +40 °C to +85 °C -85 °C to +125 °C 4.0 4.0 2.5 1.6 6.3 6.3 4.0 2.5 10 10 6.3 4.0 16 16 10 6.3 20 20 13 8 25 25 17 10 35 35 23 14 298D AND TR8 RATED VOLTAGE (V) CATEGORY VOLTAGE (V) AT TEMPERATURE RANGE -55 °C to +85 °C +85 °C to +125 °C 2.5 2.5 1.7 4.0 4.0 2.7 6.3 6.3 4.0 10 10 7.0 16 16 10 20 20 13 25 25 17 35 35 23 50 50 33

Typical Performance Characteristics www.vishay.com Vishay Sprague Revision: 20-Jan-14 2 Document Number: 40169 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes

  • At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
  • At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
  • At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table. Note
  • All measurements to be performed after 24 h conditioning at room temperature. TYPICAL LEAKAGE CURRENT FACTOR RANGE ENVIRONMENTAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Thermal shock At -55 °C/+125 °C , 30 min each, for 5 cycles. MIL-STD-202 method 107 Capacitance change ± 30 % Dissipation factor Not to exceed 150 % of initial Leakage current Not to exceed 200 % of initial Surge voltage 85 °C, 1000 su ccessive test cycles at 1.3 of category voltage in series with a 1 k resistor at the rate of 30 s ON, 30 s OFF, MIL-PRF-55365 Capacitance change ± 30 % Dissipation factor Not to exceed 150 % of initial Leakage current Not to exceed 200 % of initial Life test at +85 °C 1000 h application of category voltage at 85 °C with a 3  series resistance, MIL-STD-202 method 108 Capacitance change ± 30 % Dissipation factor Not to exceed 150 % of initial Leakage current Not to exceed 200 % of initial Humidity test At 40 °C/90 % RH 500 h, no voltage applied. MIL-STD-202 method 103 Capacitance change ± 30 % Dissipation factor Not to exceed 150 % of initial Leakage current Not to exceed 200 % of initial MECHANICAL PERFORMANCE CHARACTERISTICS ITEM CONDITION POST TEST PERFORMANCE Terminal strength/ Shear stress test Apply a pressure load of 5 N for 10 s ± 1 s horizontally to the center of capacitor side body. AEC-Q200-006 There shall be no visual damage when viewed at 20 x magnification and the component shall meet the original electrical requirements. Vibration MIL-STD-202, method 204, condition D,

10 Hz to 2000 Hz, 20 g peak

There shall be no mechanical or visual damage to capacitors post-conditioning. Shock (specified pulse) MIL-STD-202, method 213, condition I, 100 g peak Capacitance change ± 30 % Dissipation factor Initial specified value or less Leakage current Initial specified value or less There shall be no mechanical or visual damage to capacitors post-conditioning. Resistance to solder heat MIL-STD-202, method 210, condition K Capacitance change ± 30 % Dissipation factor Not to exceed 150 % of initial Leakage current Not to exceed 200 % of initial There shall be no mechanical or visual damage to capacitors post-conditioning. Solderability MIL-STD-202, method 208, ANSI/J-STD-002, test B. Applies only to solder and tin plated terminations. Does not apply to gold terminations. All terminations shall exhibit a continuous solder coating free from defects for a minimum of 95 % of the critical area of any individual lead. Resistance to solvents MIL-STD-202, method 215 Marking has to remain legible, no degradation of encapsulation material. Flammability Encapsulation materials meet UL 94 V-0 with an oxygen index of 32 % Leakage Current Factor Percent of Rated Voltage 100 1.0 0.1 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 +125 °C +85 °C +55 °C +25 °C -55 °C 0 °C

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