Single Differential Comparator, TL331-EP datasheet

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SLVSBU6,*]
  • PDF pages: 12

Technical content

(TOP VIEW) IN− VCC− /GND IN+ VCC OUT TL331-EP www.ti.com SLVSBU6 –JUNE 2013 SINGLEDIFFERENTIALCOMPARATOR Check forSamples: TL331-EP 1FEATURES

  • SingleSupply or Dual Supplies SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS• Wide Range ofSupply Voltage:2 V to36 V
  • ControlledBaseline• Low Supply-CurrentDrainIndependentof Supply Voltage:0.4mA Typ. • One Assembly and TestSite
  • Low InputBias Current:25 nA Typ. • One FabricationSite
  • Low InputOffsetVoltage:2 mV Typ. • AvailableinMilitary(–55°C to125°C) Temperature Range• Common-Mode InputVoltageRange Includes Ground • Extended Product LifeCycle
  • DifferentialInputVoltageRange Equal to • Extended Product-Change Notification Maximum-Rated Supply Voltage:±36 V • Product Traceability
  • Low Output SaturationVoltage
  • Output Compatible With TTL, MOS, and CMOS DESCRIPTION/ORDERING INFORMATION Thisdeviceconsistsofa singlevoltagecomparatordesignedtooperatefroma singlepower supplyovera wide rangeofvoltages.Operationfromdualsuppliesalsoispossibleifthedifferencebetween thetwo suppliesis2 V to 36 V and VCC is at least1.5 V more positivethan the inputcommon-mode voltage.Currentdrainis independentof the supplyvoltage.To achievewired-AND relationships,one can connectthe outputto other open-collectoroutputs. ORDERING INFORMATION (1) ORDERABLE PART TOP-SIDETA VIO(MAX) at25°C PACKAGE VID NUMBERNUMBER MARKING –55°C to125°C 5 mV SOT-23 (DBV) Reelof250 TL331MDBVTEP TEPU V62/13611-01XE (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

80-µA Current Regulator 80 µA60 µA 10 µA VCC 10 µA OUT GND IN+ IN− Epi-FET Diodes Resistors Transistors COMPONENT COUNT IN+ IN− OUT TL331-EP SLVSBU6 –JUNE 2013 www.ti.com LOGIC DIAGRAM SCHEMATIC Note: Currentvaluesshown arenominal. ABSOLUTE MAXIMUM RATINGS (1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) VCC Supplyvoltage(2) 36 V VID Differentialinputvoltage(3) ±36 V VI Inputvoltagerange(eitherinput) –0.3V to36 V VO Outputvoltage 36 V IO Outputcurrent 20 mA Durationofoutputshort-circuittoground(4) Unlimited TJ Operatingvirtualjunctiontemperature 150°C Tstg Storagetemperaturerange –65°C to150°C (1) Stressesbeyond thoselistedunderAbsoluteMaximum Ratingsmay cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderrecommended operating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagevalues,exceptdifferentialvoltages,arewithrespecttothenetworkground. (3) DifferentialvoltagesareatIN+ withrespecttoIN–. (4) ShortcircuitsfromoutputstoVCC can cause excessiveheatingand eventualdestruction.

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ProductFolderLinks:TL331-EP

www.ti.com SLVSBU6 –JUNE 2013 THERMAL INFORMATION TL331-EP THERMAL METRIC (1) DBV UNITS

5 PINS

θJA Junction-to-ambientthermalresistance(2) 299 θJCtop Junction-to-case(top)thermalresistance(3) 65.4 θJB Junction-to-boardthermalresistance(4) 97.1 °C/W ψJT Junction-to-topcharacterizationparameter(5) 0.8 ψJB Junction-to-boardcharacterizationparameter(6) 95.5 θJCbot Junction-to-case(bottom)thermalresistance(7) N/A (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . (2) The junction-to-ambientthermalresistanceundernaturalconvectionisobtainedina simulationon a JEDEC-standard,high-Kboard,as specifiedinJESD51-7,inan environmentdescribedinJESD51-2a. (3) The junction-to-case(top)thermalresistanceisobtainedby simulatinga coldplateteston thepackage top.No specificJEDEC- standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. (4) The junction-to-boardthermalresistanceisobtainedby simulatinginan environmentwitha ringcoldplatefixturetocontrolthePCB temperature,as describedinJESD51-8. (5) The junction-to-topcharacterizationparameter,ψJT,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA,usinga proceduredescribedinJESD51-2a (sections6 and 7). (6) The junction-to-boardcharacterizationparameter,ψJB,estimatesthejunctiontemperatureofa deviceina realsystemand isextracted fromthesimulationdataforobtainingθJA ,usinga proceduredescribedinJESD51-2a (sections6 and 7). (7) The junction-to-case(bottom)thermalresistanceisobtainedby simulatinga coldplateteston theexposed (power)pad.No specific JEDEC standardtestexists,buta closedescriptioncan be foundintheANSI SEMI standardG30-88. Spacer

ELECTRICAL CHARACTERISTICS

atspecifiedfree-airtemperature,VCC = 5 V (unlessotherwisenoted) PARAMETER TEST CONDITIONS (1) TA MIN TYP MAX UNIT 25°C 2 5VCC = 5 V to30 V,VO = 1.4V,VIO Inputoffsetvoltage mVVIC = VIC(min) –55°C to125°C 9 25°C 5 50 IIO Inputoffsetcurrent VO = 1.4V nA –55°C to125°C 250 25°C –25 –250 IIB Inputbiascurrent VO = 1.4V nA –55°C to125°C –400 0 to25°C VCC – 1.5Common-mode inputvoltageVICR Vrange(2) 0 to–55°C to125°C VCC – 2 Large-signaldifferential-voltageVCC = 15 V,VO = 1.4V to11.4V,AVD 25°C 50 200 V/mVamplification R L ≥ 15 kΩ toVCC VOH = 5 V,VID = 1 V 25°C 0.1 50 nA IOH High-leveloutputcurrent VOH = 30 V,VID = 1 V –55°C to125°C 1 μA 25°C 150 400 VOL Low-leveloutputvoltage IOL = 4 mA, VID = –1 V mV –55°C to125°C 700 IOL Low-leveloutputcurrent VOL = 1.5V,VID = –1 V 25°C 6 mA ICC Supplycurrent R L = ∞,VCC = 5 V 25°C 0.4 0.7 mA (1) Allcharacteristicsaremeasured withzerocommon-mode inputvoltage,unlessotherwisespecified. (2) The voltageateitherinputorcommon-mode shouldnotbe allowedtogo negativeby more than0.3V.The upperend ofthecommon- mode voltagerangeisVCC+ – 1.5V,buteitherorbothinputscan go to30 V withoutdamage. Copyright© 2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:TL331-EP

SLVSBU6 –JUNE 2013 www.ti.com SWITCHING CHARACTERISTICS VCC = 5 V,TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT 100-mV inputstepwith5-mV overdrive 1.3 Response time R L connectedto5 V through5.1kΩ,C L = 15 pF (1)(2) μs TTL-levelinputstep 0.3 (1) C L includesprobeand jigcapacitance. (2) The responsetimespecifiedistheintervalbetween theinputstepfunctionand theinstantwhen theoutputcrosses1.4V.

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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TL331MDBVTEP Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 TEPU TL331MDBVTEP.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 TEPU V62/13611-01XE Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 TEPU (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL331-EP :

  • Catalog : TL331 Addendum-Page 1

www.ti.com 11-Nov-2025

  • Automotive : TL331-Q1 NOTE: Qualified Version Definitions:
  • Catalog - TI's standard catalog product
  • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331MDBVTEP SOT-23 DBV 5 250 200.0 183.0 25.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15

0.00 TYP

5X 0.5 0.3 0.6

0.3 TYP

0 TYP

1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4

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