TL331B, TL391B and TL331 Single Comparators datasheet (Rev. L)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SLVS238,L]
  • PDF pages: 27

Technical content

TL331B, TL391B and TL331 Single Comparators

1 Features

  • NEW TL331B and TL391B
  • Improved specifications of B-version – Maximum rating: up to 38V – ESD rating (HBM): 2kV – Improved reverse voltage performance – Low input offset: 0.37mV – Low input bias current: 3.5nA – Low supply-current: 430µA – Faster response time of 1µsec – TL391B provides an alternate pinout
  • TL331B is improved drop-in replacement for TL331
  • Common-mode input voltage range includes ground
  • Differential input voltage range equal to maximum- rated supply voltage: ±38V
  • Low output saturation voltage
  • Output compatible with TTL, MOS, and CMOS

2 Applications

  • Vacuum robot
  • Single phase UPS
  • Server PSU
  • Cordless power tool
  • Wireless infrastructure
  • Appliances
  • Building automation
  • Factory automation & control
  • Motor drives
  • Infotainment & cluster

3 Description

The TL331B and TL391B devices are the next generation versions of the industry-standard TL331 comparator. These next generation devices provide outstanding value for cost-sensitive applications, with features including lower offset voltage, higher supply voltage capability, lower supply current, lower input bias current, lower propagation delay, wider temperature range and improved 2kV ESD performance with drop-in replacement convenience. The TL331B is a drop-in improved replacement for both the TL331I and TL331K versions, while the TL391B provides an alternate pinout of the TL331B to replace competitive devices. Operation from dual supplies also is possible as long as the difference between the two supplies is within 2V to 36V, and VCC is at least 1.5V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. Device Information PART NUMBER(1) PACKAGE BODY SIZE (NOM) (2) TL331, TL331B, TL391B SOT-23 (5) 2.90mm × 1.60mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. Family Comparison Table Specification TL331B TL391B TL331I TL331K Units Supply Voltage 2 to 36 2 to 36 2 to 36 V Total Supply Current (5V to 36V maximum) 0.43 0.7 0.7 mA Temperature Range −40 to 125 -40 to 85 -40 to 105 °C ESD (HBM) 2000 1000 1000 V Offset Voltage (maximum over temp) ± 4 ± 9 ± 9 mV Input Bias Current (typical / maximum) 3.5 / 25 25 / 250 25 / 250 nA Response Time (typical) 1 1.3 1.3 µsec TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

5.5 Recommended Operating Conditions, TL331B

5.6 Recommended Operating Conditions, TL331

10 Mechanical, Packaging, and Orderable

TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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4 Pin Configuration and Functions

Note reversed inputs compared to similar common pinout Figure 4-1. TL331, TL331B DBV Package, 5-Pin SOT-23, Top View 3 4 IN+ VCC IN- OUT GND Note reversed inputs compared to similar common pinout Figure 4-2. TL391B DBV Package, 5-Pin SOT-23, Top View Pin Functions PIN TYPE DESCRIPTIONTL331, TL331B TL391B NAME NO. NO. IN+ 3 4 I Positive Input IN– 1 3 I Negative Input OUT 4 1 O Open Collector/Drain Output VCC 5 5 — Power Supply Input GND 2 2 — Ground www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TL331 TL331B TL391B

5 Specifications

5.1 Absolute Maximum Ratings, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage(2) 0 36 V VID Differential input voltage(3) –36 36 V VI Input voltage range (either input) –0.3 36 V VO Output voltage 0 36 V IO Output current 0 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed.

5.2 Absolute Maximum Ratings, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage(2) -0.3 38 V VID Differential input voltage(3) –38 38 V VI Input voltage range (either input) –0.3 38 V VO Output voltage -0.3 38 V IO Output current 20 mA Duration of output short-circuit to ground(4) Unlimited IIK Input current(5) –50 mA TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. (5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input current is removed. TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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5.3 ESD Ratings - TL331B and TL391B

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.4 ESD Ratings, TL331 and TL331K

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.5 Recommended Operating Conditions, TL331B and TL391B

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 36 V TJ Junction temperature –40 125 °C

5.6 Recommended Operating Conditions, TL331 and TL331K

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 36 V TJ Junction temperature, TL331 –40 85 °C TJ Junction temperature, TL331K –40 105 °C

5.7 Thermal Information

THERMAL METRIC(1) TL331x, TL391x UNITDBV (SOT-23)

5 PINS

RθJA Junction-to-ambient thermal resistance 211.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 133.6 °C/W RθJB Junction-to-board thermal resistance 79.9 °C/W ψJT Junction-to-top characterization parameter 56.4 °C/W ψJB Junction-to-board characterization parameter 79.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report. www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TL331 TL331B TL391B

5.8 Electrical Characteristics, TL331B and TL391B

VS = 5V, VCM = (V–) ; TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV VS = 5 to 36V, TA = –40°C to +125°C –4 4 IB Input bias current –3.5 –25 nA TA = –40°C to +125°C –50 nA IOS Input offset current –10 ±0.5 10 nA TA = –40°C to +125°C –25 25 nA VCM Input voltage range AVD Large signal differential voltage amplification VS = 15V, VO = 1.4V to 11.4V; RL ≥ 15k to (V+) 50 200 V/mV VOL Low level output Voltage {swing from (V–)} ISINK ≤ 4mA, VID = -1V 110 400 mV ISINK ≤ 4mA, VID = -1V TA = –40°C to +125°C 550 mV IOH-LKG High-level output leakage current (V+) = VO = 5V; VID = 1V 0.1 20 nA IOH-LKG High-level output leakage current (V+) = VO = 36V; VID = 1V; TA = –40°C to +125°C 1000 nA IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 18 mA IQ Quiescent current VS = 5V, no load 210 330 µA VS = 36V, no load, TA = –40°C to +125°C 275 430 µA

5.9 Switching Characteristics, TL331B and TL391B

VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tresponse Propagation delay time, high-to-low; Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns tresponse Propagation delay time, high-to-low; TTL input signal (1) TTL input with Vref = 1.4V 300 ns (1) High-to-low and low-to-high refers to the transition at the input. TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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5.10 Electrical Characteristics, TL331 and TL331K

at specified free-air temperature, VCC = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS(1) TA (3) MIN TYP MAX UNIT VIO Input offset voltage VCC = 5V to 30V, VO = 1.4V, VIC = VIC(min) 25°C 2 5 mV Full range 9 IIO Input offset current VO = 1.4V 25°C 5 50 nA Full range 250 IIB Input bias current VO = 1.4V 25°C –25 –250 nA Full range –400 VICR Common-mode input voltage range(2) Full range 0 to VCC – 1.5 V AVD Large-signal differential voltage amplification VCC = 15V, VO = 1.4V to 11.4V, RL ≥ 15 kΩ to VCC 25°C 50 200 V/mV IOH High-level output current VOH = 5V, VID = 1V 25°C 0.1 50 nA VOH = 30V, VID = 1V Full range 1 μA VOL Low-level output voltage IOL = 4mA, VID = –1V 25°C 150 400 mV Full range 700 IOL Low-level output current VOL = 1.5V, VID = –1V 25°C 6 mA ICC Supply current RL = ∞, VCC = 5V 25°C 0.4 0.7 mA (1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3V. The upper end of the common- mode voltage range is VCC+ – 1.5V, but either or both inputs can go to 30V without damage. (3) Full range TA is –40°C to +85°C for I-suffix devices and –40°C to +105°C for K-suffix devices.

5.11 Switching Characteristics, TL331 and TL331K

VCC = 5V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Response time RL connected to 5V through 5.1kΩ, CL = 15pF(1) (2) 100mV input step with 5mV overdrive 1.3 μs TTL-level input step 0.3 (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4V. www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TL331 TL331B TL391B

5.12 Typical Characteristics

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Supply Voltage (V) Supply Current (PA) 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 100 120 140 160 180 200 220 240 260 280 300 No Load, Output High -40°C 0°C 25°C 85°C 125°C Figure 5-1. Supply Current vs. Supply Voltage Input Voltage (V) Total Supply Current (PA) 110 130 150 170 190 210 230 250 VS=3V -40°C 0°C 25°C 85°C 125°C Figure 5-2. Total Supply Current vs. Input Voltage at 3V Input Voltage (V) Total Supply Current (PA) 110 130 150 170 190 210 230 250 VS=5V -40°C 0°C 25°C 85°C 125°C Figure 5-3. Total Supply Current vs. Input Voltage at 3.3V Input Voltage (V) Total Supply Current (PA) 110 130 150 170 190 210 230 250 VS=5V -40°C 0°C 25°C 85°C 125°C Figure 5-4. Total Supply Current vs. Input Voltage at 5V Input Voltage (V) Total Supply Current (PA) -1 0 1 2 3 4 5 6 7 8 9 10 11 110 130 150 170 190 210 230 250 VS=12V -40°C 0°C 25°C 85°C 125°C Figure 5-5. Total Supply Current vs. Input Voltage at 12V Input Voltage (V) Total Supply Current (PA) -1 2 5 8 11 14 17 20 23 26 29 32 35 160 180 200 220 240 260 280 300 VS=36V -40°C 0°C 25°C 85°C 125°C Figure 5-6. Total Supply Current vs. Input Voltage at 36V TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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5.12 Typical Characteristics (continued)

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Supply Voltage (V) Input Bias Current (nA) 3 6 9 12 15 18 21 24 27 30 33 36 -4.5 -3.5 -2.5 -1.5 -0.5 VCM=0V 125°C 85°C 25°C 0°C -40°C Figure 5-7. Input Bias Current vs. Supply Voltage Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=5V 125°C 85°C 25°C 0°C -40°C Figure 5-8. Input Bias Current vs. Input Voltage at 5V Input Voltage (V) Input Bias Current (nA) -4.5 -3.5 -2.5 -1.5 -0.5 VS=12V 125°C 85°C 25°C 0°C -40°C Figure 5-9. Input Bias Current vs. Input Voltage at 12V Input Voltage (V) Input Bias Current (nA) 0 4 8 12 16 20 24 28 32 36 -4.5 -3.5 -2.5 -1.5 -0.5 0.5 VS=36V 125°C 85°C 25°C 0°C -40°C Figure 5-10. Input Bias Current vs. Input Voltage at 36V Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = -40°C

63 Channels

Figure 5-11. Input Offset Voltage vs. Supply Voltage at -40°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 25°C 63 Channels Figure 5-12. Input Offset Voltage vs. Supply Voltage at 25°C www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TL331 TL331B TL391B

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 85°C Figure 5-13. Input Offset Voltage vs. Supply Voltage at 85°C Supply Voltage (V) Input Offset Voltage (mV) 3 6 9 12 15 18 21 24 27 30 33 36 -1.5 -0.5 0.5 1.5 TA = 125°C 63 Channels Figure 5-14. Input Offset Voltage vs. Supply Voltage at 125°C Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 3V

63 Units

Figure 5-15. Input Offset Voltage vs. Temperature at 3V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 5V 63 Units Figure 5-16. Input Offset Voltage vs. Temperature at 5V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 12V VS = 12V Figure 5-17. Input Offset Voltage vs. Temperature at 12V Temperature (°C) Input Offset Voltage (mV) -40 -25 -10 5 20 35 50 65 80 95 110 125 -1.5 -0.5 0.5 1.5 VS = 36V 63 Units Figure 5-18. Input Offset Voltage vs. Temperature at 36V TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 3V 125°C 85°C 25°C 0°C -40°C Figure 5-19. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 5V 125°C 85°C 25°C 0°C -40°C Figure 5-20. Output Low Voltage vs. Output Sinking Current at Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 12V 125°C 85°C 25°C 0°C -40°C Figure 5-21. Output Low Voltage vs. Output Sinking Current at 12V Output Sinking Current (A) Output Voltage to GND (V) 10P 100P 1m 10m 100m 10m 100m VS = 36V 125°C 85°C 25°C 0°C -40°C Figure 5-22. Output Low Voltage vs.Output Sinking Current at 36V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-23. Output High Leakage Current vs.Temperature at 5V Temperature (°C) Output High Leakage to GND (nA) -40 -25 -10 5 20 35 50 65 80 95 110 125 0.01 0.02 0.05 0.1 0.2 0.5 100 Output set high VOUT = VS Figure 5-24. Output High Leakage Current vs. Temperature at 36V www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TL331 TL331B TL391B

TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-25. High to Low Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 5V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-26. Low to High Propagation Delay vs. Input Overdrive Voltage, 5V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-27. High to Low Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 12V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-28. Low to High Propagation Delay vs. Input Overdrive Voltage, 12V Input Overdrive (mV) Propagation Delay, High to Low (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-29. High to Low Propagation Delay vs. Input Overdrive Voltage, 36V Input Overdrive (mV) Propagation Delay, Low to High (ns) 5 6 78 10 20 30 4050 70 100 200 300 500 1000 100 200 300 400 500 600 700 800 900 1000 VS = 36V VCM = 0V CL = 15pF RP = 5.1k 125°C 85°C 25°C -40°C Figure 5-30. Low to High Propagation Delay vs. Input Overdrive Voltage, 36V TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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TA = 25°C, VS = 5V, RPULLUP = 5.1k, CL = 15pF, VCM = 0V, VUNDERDRIVE = 100mV, VOVERDRIVE = 100mV unless otherwise noted. Time (Ps) Output Voltage (V) VREF = VCC/2 20mV Overdrive 5mV Overdrive 100mV Overdrive Figure 5-31. Response Time for Various Overdrives, High-to- Low Transition Time (Ps) Output Voltage (V) 20mV Overdrive 5mV Overdrive 100mV Overdrive VREF = VCC/2 Figure 5-32. Response Time for Various Overdrives, Low-to- High Transition www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TL331 TL331B TL391B

6 Detailed Description

6.1 Overview

The TL331 family is a single comparator with the ability to operate up to 36V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to its very wide supply voltages range (2V to 36V), low Iq, and fast response. The open-collector output allows the user to configure the output's logic low voltage (V OL) and can be utilized to enable the comparator to be used in AND functionality. The TL331B and TL391B are performance upgrades to standard TL331 using the latest process technologies allowing for lower offset voltages, lower input bias and supply currents and faster response time over an extended temperature range. The TL331B can drop-in replace the "I" or "K" versions of TL331. The TL391B is an alternate pinout for replacing competitive devices.

6.2 Functional Block Diagram

  • Input Q9 Q10 Q11 Q5 Q6 D2 D3 Q12 + Input Output VCC Internal Bias Itail I1 I2 Q13 Q14 ESD ESD VCM Clamp Q15

6.3 Feature Description

TL331x family consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing TL331x to accurately function from ground to V CC – 1.5V differential input. In later revisions, a clamp was added around Q3 to mimic the outside-of-input voltage range behavior of the original classic silicon. The output consists of an open collector NPN (pull-down or low side) transistor. The output NPN will sink current when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is resistive and will scale with the output current. Please see the "Output Low Voltage vs. Output Sinking Current" graphs in Typical Characteristics for VOL values with respect to the output current.

6.4 Device Functional Modes

6.4.1 Voltage Comparison

The TL331x operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input differential polarity. TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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7 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

7.1 Application Information

TL331x will typically be used to compare a single signal to a reference or two signals against each other. Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes TL331x optimal for level shifting to a higher or lower voltage.

7.2 Typical Application

5 VVref

Figure 7-1. Typical Application Schematic

7.2.1 Design Requirements

For this design example, use the parameters listed in Table 7-1 as the input parameters. Table 7-1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input Voltage Range 0V to VCC – 1.5V Supply Voltage 2V to 36V Logic Supply Voltage (RPULLUP Voltage) 2V to 36V Output Current (VLOGIC/RPULLUP) 1µA to 4mA Input Overdrive Voltage 100mV Reference Voltage 2.5V Load Capacitance (CL) 15pF

7.2.2 Detailed Design Procedure

When using TL331x in a general comparator application, determine the following:

  • Input voltage range
  • Minimum overdrive voltage
  • Output and drive current
  • Response time www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TL331 TL331B TL391B

7.2.2.1 Input Voltage Range

When choosing the input voltage range, the input common mode voltage range (V ICR) must be taken in to account. If temperature operation is above or below 25°C the V ICR can range from 0V to V CC – 1.5V. This limits the input voltage range to as high as V CC – 1.5V and as low as 0V. Operation outside of this range can yield incorrect comparisons. Below is a list of input voltage situation and their outcomes: 1. When both IN- and IN+ are both within the common mode range: a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting 2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current 3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and the output transistor is not conducting 4. When IN- and IN+ are both higher than common mode, please see the Both Inputs Above Input Range Behavior section of the LM339 Family Application Note (SNOAA35).

7.2.2.2 Minimum Overdrive Voltage

Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (V IO). To make an accurate comparison the Overdrive Voltage (V OD) should be higher than the input offset voltage (V IO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 7-2 and Figure 7-3 show positive and negative response times with respect to overdrive voltage.

7.2.2.3 Output and Drive Current

Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current produces a output low voltage (V OL) from the comparator. In which V OL is proportional to the output current. Use Output Low Voltage vs Output Current (IOL) to determine VOL based on the output current. The output current can also effect the transient response. More is explained in the next section.

7.2.2.4 Response Time

Response time is a function of input over drive. See Section 7.2.3 for typical response times. The rise and fall times can be determined by the load capacitance (C L), load/pullup resistance (R PULLUP), and equivalent collector-emitter resistance (RCE).

  • The rise time (τR) is approximately τR ~ RPULLUP × CL
  • The fall time (τF) is approximately τF ~ RCE × CL – RCE can be determined by taking the slope of Output Low Voltage vs Output Current (IOL) in its linear region at the desired temperature, or by dividing the VOL by Iout TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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Product Folder Links: TL331 TL331B TL391B

7.2.3 Application Curves

The following curves were generated with 5V on VCC and VLogic, RPULLUP = 5.1kΩ, and 50pF scope probe. Output Voltage, Vo(V) Time (usec) 5mV OD 20mV OD 100mV OD C004 Figure 7-2. Response Time for Various Overdrives (Positive Transition) Output Voltage (Vo) Time (usec) 5mV OD 20mV OD 100mV OD C006 Figure 7-3. Response Time for Various Overdrives (Negative Transition)

7.2.4 ESD Protection

The "B" and TiB versions add dedicated ESD protections on all the pins for improved ESD performance. Please see Application Note SNOAA35 for more information.

7.2.5 Power Supply Recommendations

For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the comparator's input common mode range and create an inaccurate comparison.

7.2.6 Layout

7.2.6.1 Layout Guidelines

For accurate comparator applications without hysteresis it is important maintain a stable power supply with minimized noise and glitches, which can affect the high level input common mode voltage range. To achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground.

7.2.6.2 Layout Example

1IN– IN+ 3 4 VCC5 0.1 Fμ GND 0.1 Fμ Ground Bypass Capacitor Positive Supply Negative Supply or Ground Ground Only needed for dual power supplies Figure 7-4. TL331 Layout Example www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TL331 TL331B TL391B

8 Device and Documentation Support

8.1 Documentation Support

8.1.1 Related Documentation

Analog Engineers Circuit Cookbook: Amplifiers (See Comparators section) - SLYY137 Precision Design, Comparator with Hysteresis Reference Design- TIDU020 Window comparator circuit - SBOA221 Reference Design, Window Comparator Reference Design- TIPD178 Comparator with and without hysteresis circuit - SBOA219 Inverting comparator with hysteresis circuit - SNOA997 Non-Inverting Comparator With Hysteresis Circuit - SBOA313 Zero crossing detection using comparator circuit - SNOA999 PWM generator circuit - SBOA212 How to Implement Comparators for Improving Performance of Rotary Encoder in Industrial Drive Applications - SNOAA41 A Quad of Independently Func Comparators - SNOA654

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 www.ti.com

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9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision K (September 2023) to Revision L (November 2024) Page Changes from Revision J (November 2020) to Revision K (September 2023) Page Changes from Revision I (August 2020) to Revision J (November 2020) Page Changes from Revision H (April 2020) to Revision I (August 2020) Page Changes from Revision G (January 2015) to Revision H (April 2020) Page

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com TL331, TL331B, TL391B SLVS238L – AUGUST 1999 – REVISED NOVEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: TL331 TL331B TL391B

www.ti.com 11-Jul-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) TL331BIDBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 331B TL331BIDBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 331B TL331BIDBVRG4 Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 331B TL331BIDBVRG4.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 331B TL331IDBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (T1I8, T1IG, T1IL, T1IS) TL331IDBVR.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I8, T1IG, T1IL, T1IS) TL331IDBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (T1I8, T1IG, T1IL, T1IU) TL331IDBVT.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I8, T1IG, T1IL, T1IU) TL331IDBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I8, T1IG, T1IL, T1IU) TL331IDBVTG4 Obsolete Production SOT-23 (DBV) | 5 - - Call TI Call TI -40 to 85 T1IG TL331KDBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL331KDBVR.A Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL331KDBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL331KDBVT Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL331KDBVT.A Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL331KDBVT.B Active Production SOT-23 (DBV) | 5 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 105 (T1K8, T1KG, T1KJ, T1KL) TL391BIDBVR Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 125 391B TL391BIDBVR.B Active Production SOT-23 (DBV) | 5 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 391B (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 11-Jul-2026 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL331, TL331B, TL391B :

  • Automotive : TL331-Q1, TL331B-Q1 , TL391B-Q1
  • Enhanced Product : TL331-EP NOTE: Qualified Version Definitions:
  • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
  • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 27-Jun-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 27-Jun-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331BIDBVR SOT-23 DBV 5 3000 208.0 191.0 35.0 TL331BIDBVRG4 SOT-23 DBV 5 3000 210.0 185.0 35.0 TL331IDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TL331IDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TL331IDBVR SOT-23 DBV 5 3000 208.0 191.0 35.0 TL331IDBVT SOT-23 DBV 5 250 210.0 185.0 35.0 TL331IDBVT SOT-23 DBV 5 250 210.0 185.0 35.0 TL331KDBVR SOT-23 DBV 5 3000 208.0 191.0 35.0 TL331KDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TL331KDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TL331KDBVT SOT-23 DBV 5 250 210.0 185.0 35.0 TL391BIDBVR SOT-23 DBV 5 3000 208.0 191.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.22

0.08 TYP

0.25 3.0 2.6 2X 0.95 1.9 1.45 0.90 0.15

0.00 TYP

5X 0.5 0.3 0.6

0.3 TYP

0 TYP

1.9 (0.1) (0.15) 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25 mm per side. 5. Support pin may differ or may not be present.

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

5X (1.1) 5X (0.6) (2.6) (1.9) 2X (0.95) (R0.05) TYP 4214839/K 08/2024 SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (2.6) (1.9) 2X(0.95) 5X (1.1) 5X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0005A SMALL OUTLINE TRANSISTOR 4214839/K 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4

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