T10XB ETC

Document overview

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Technical content

Maximum Ratings & Characteristics Single Phase, 60 Hz, Resistive or Inductive Load T a = 25ºC Unless Otherwise Specified CHARACTERISTIC SYMBOL T10XB40 T10XB60 T10XB80 UNIT Peak Repetitive Reverse Voltage V RRM 400 600 800 V RMS Reverse Voltage V R(RMS) 280 420 560 V Average Rectified Output Current @ TC = 108ºC w/ cooling fin I o 10.0 A Average Rectified Output Current @ Ta = 25ºC w/o cooling fin I o 2.7 A Non-Repetitive Peak Forward Surge Current 10 mS single half sine-wave superimposed on rated load IFSM 120 A Maximum Forward Voltage per Element, IF = 5.0 A V F 1.05 V Peak Reverse Current per element at VR = VRRM I R 10 µA Operating and Storage Temperature Range T J ,Tstg -40 to +150 °C Reference Table for Heat-Sink Size Average Rectified Output Current in Amps 3.0 5.0 7.5 9 11 Cooling Fin Single-face Area S1 (cm2) 4 75 180 500 900 Cooling Fin Single-face Area S2 (cm2) 8 65 100 310 490 Note: Vertical Mounting at T a = 40ºC. HS Material: S1 = 1.5mm-Thick Aluminum, S2 = 3.0mm-Thick Copper Manufactured by Tianjin Zhong – Huan Semiconductor Co., Ltd. Rev 0, Sep 2002 T10XB Series (SIP) 10-AMPERE SILICON BRIDGE RECTIFIER

FEATURES

  • Low Reverse Leakage Current
  • Surge Overload Rating to 120A Peak
  • Ideal for Printed Circuit Board Applications
  • Epoxy Material – UL Recognition Flammability Classification 94V-0 Mechanical Data
  • Case: Molded Epoxy Resin
  • Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208
  • Polarity: Molded on Body UNIT: mm 2542 Highlander Way !!!! Carrollton, TX 75006 972-248-2888 www.collmer.com

T10XB Series (SIP) In order to avoid damaging devices, please observe the following precautions: 1. When using automated soldering equipment, use 60/40 (Sn/Pb) solder (melting point of 180ºC) with a neutral flux similar to rosin. Preheat time should be limited to 1 – 2 minutes at 150ºC. 2. When using a soldering iron, use a tip temperature of less than 300ºC (or a soldering iron power of less than 60W). Keep the soldering time below 5 seconds. 3. After soldering, remove any flux residue to avoid corrosion. 4. Because over-voltage or over-current testing may cause permanent damage to the devices, be sure to check the test equipment for proper voltage, current and ground connection prior to beginning the test. 5. If the devices are to be encapsulated, they should be cleaned and dried at 120º ± 5ºC for at least 24 hours prior to encapsulation. Test for compatibility between the device package and the encapsulation material. Forward Voltage V F (V) IF (A) TJ=150C TJ=25C P - Io Curve 0123456 Io (A) P (W) Current Derating Without HS: Tc at PCB Pad (5 mm) With HS: Tc Next to HS Mounting 0 25 50 75 100 125 150 175 Tc (C) Io (A) W/O HS W/ HS Surge Forward Current 100 110 120 130 11 0 1 0 0 Cycles IFSM (A)