STD01N

STD01N ALLEGRO

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Technical content

Description

The STD01N and STD01P are enhanced Darlington transistors with built-in drivers and temperature compensation diode. Manufactured using the unique Sanken thin-wafer production technology, these devices achieve higher power levels through decreased thermal resistance, and can withstand higher voltages than similar devices on the market. The temperature compensation diode is integrated on the same chip as the power transistors. By this design, the STD01N and STD01P eliminate delays that would otherwise be induced between thermal sensing at the heat source, and the operation of the compensation circuitry. Thus, these transistors are ideal for applications where enhanced thermal stability is required. This device is provided in a 5-pin TO-3P plastic package with pin 4 removed. Contact Allegro ® for application support and additional information on device performance. Applications include: ▪ General amplifier applications ▪ Professional audio amplifiers ▪ Car audio amplifiers Features and Benefits ▪ Built-in temperature compensation diodes ▪ High power (100 W) handling in a small package (TO-3P), for minimized heat sink requirements ▪ Built-in drivers and temperature compensation diodes, reducing external component count and simplifying circuit design ▪ NPN and PNP versions ▪ Emitter terminals placed symmetrically, pin 5 on NPN and pin 1 on PNP models, allowing adjacent placement on PCB to minimize trace length and output skew when used in pairs ▪ Approved by major manufacturers Darlington Transistors for Audio Amplifiers Equivalent Circuits Package: 5 pin TO-3P (MT-100) Not to scale Datasheet 28104.01 STD01N STD01P STD01N 1 2 3 4 5 STD01P 1 2 3 4 5 Emitter pins symmetrical

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 2Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature of +25°C, unless oth er wise stated. ABSOLUTE MAXIMUM RATINGS at TA = 25°C Characteristic Symbol Rating Unit Collector-Base Voltage1 VCBO 150 V Collector-Emitter Voltage1 VCEO 150 V Emitter-Base Voltage1 VEBO 5V Collector Current1 IC 10 A Base Current1 IB 1A Collector Power Dissipation2 PC 100 W Diode Forward Current I F 10 mA Junction Temperature T J 150 °C Storage Temperature T stg –55 to150 °C 1For PNP type (STD01P), voltage and current values are negative. 2TC = 25°C. SELECTION GUIDE Part Number Type h FE Rating Packing STD01N* NPN Range O: 5000 to 12000 Bulk, 100 pieces Range Y: 8000 to 20000 STD01P* PNP Range O: 5000 to 12000 Range Y: 8000 to 20000 *Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y, depending upon availability. ELECTRICAL CHARACTERISTICS at TA = 25°C Characteristic Symbol Test Conditions Min. Typ. Max. Unit Collector-Cutoff Current1 ICBO VCB = 150 V – – 100 μA Emitter Cutoff Current1 IEBO VEB = 5 V – – 100 μA Collector-Emitter Voltage1 VCEO IC = 30 mA 150 – – V DC Current Transfer Ratio2,3 hFE VCE = 4 V, IC = 6 A 5000 – 20000 – Collector-Emitter Saturation Voltage1 VCE(sat) IC = 6 A, IB = 6 mA – – –2.0 V Base-Emitter Saturation Voltage1 VBE(sat) IC = 6 A, IB = 6 mA – – –2.5 V Base-Emitter Voltage V BE STD01N V CE = 20 V, IC = 40 mA – 1220 – mV STD01P V CE = –20 V, IC = –40 mA – 1230 – mV Diode Forward Voltage V F STD01N I F = 2.5 mA – 705 – mV STD01P I F = 2.5 mA – 1580 – mV 1For PNP type (STD01P), voltage and current values are negative. 2hFE rating: 5000 to 12000(O brand on package), 8000 to 20000 (Y). 3When the transistor is used in pairs, the following conditions must be satis fi ed: Total VF ≤ Total VBE of the transistors (the above measurement conditions shall be applied), and ∆V = 0 to 500 mV.

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 3Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 02 4 6 V CE (V) IC (A) 0.0001 0.001 0.01 0.1 1VCE(sat) (V) 6 A 8 A IC=4 A 0 0.5 1.0 1.5 2.0 1 10 100 1000 0.01 0.10 1.00 10.00 11 0 1 0 0 1000 PC vs. TA 100 0 25 50 75 100 125 150 T A (°C) PC (W) Without Heatsink With Infinit eH eatsink 3.5 IC vs. VCE VCE(sat) vs. IB hFE vs. ICIC vs. VBE RθJA vs. t IF vs. VF For Diode Safe Operating Area RθJA (°C/W) 10 mA 2.0mA1.5 mA 1.0 mA 0.8 mA 0.5 mA 0.3 mA 125°C 25°C–30°C 125°C 10 ms DC 100 ms 25°C –30°C IB= 0.2 mA IC (A) VCE = 4 V Continuous VCE = 4 V Continuous Single pulse No heatsink Natural cooling T A=25° VBE (V) IF (mA) VF (V) t( m s ) IB (A) IC (A) hFE 102 103 104 105 106 0.01 0.1 1.0 10.0 100.0 VCE (V) IC (A) STD01N Performance Characteristics at TA = 25°C

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 4Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 02 4 6 CE (V) –IC (A) 0.0001 0.001 0.01 0.1 1–VCE(sat) (V) 6 A 8 A –IC=4 A 0.01 0.10 1.00 10.00 11 0 1 0 0 1000 PC vs. TA 100 0 25 50 75 100 125 150 T A (°C) PC (W) Without Heatsink Wit h Infinite Heatsink 3.5 IC vs. VCE VCE(sat) vs. IB hFE vs. ICIC vs. VBE RθJA vs. t IF vs. VF For Diode Safe Operating Area RθJA (°C/W) 10 mA 2.0mA 1.5 mA 1.0 mA 0.8 mA 0.5 mA 0.3 mA 125°C 25°C–30°C 125°C 10 ms DC 100 ms 25°C –30°C –IB= 0.2 mA –IC (A) –VCE = 4 V Continuous –VCE = 4 V Continuous Single pulse No heatsink Natural cooling TA=25° –VBE (V) IF (mA) VF (V) t( m s ) –IB (A) –IC (A) hFE 102 103 104 105 106 0.01 0.1 1.0 10.0 100.0 –VCE (V) IC (A) STD01P Performance Characteristics at TA = 25°C

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 5Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com STD01N Terminal Configuration STD01P Terminal Configuration 15.6 ±0.3 15.8 ±0.2 4.8 ±0.2 1.7 ±0.1 Terminal dimensions at case surface Terminal dimension at case surface Terminal dimension at lead tips 1.74 +0.2 –0.1 1.34 +0.2 –0.1 1.05 +0.2 –0.1 0.65 +0.2 –0.1 20.5 –0.5 +0.2 –0.1 3.2 +0.1 –0.2 19.9 ±0.3 14.9 ±0.2 2 ±0.2

3 MAX

(35.4) Gate Burr Branding XXXXXXXX XXXXXXXX Gate burr: 0.3 mm (max.), mold flash may appear at opposite side Terminal core material: Cu Terminal treatment: Ni plating and solder dip Heat sink material: Cu Heat sink treatment: Ni plating Leadform: 2804 Weight (approximate): 6.0 g Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: STD01 X Where: X is the transistor type ( N or P) 2nd line, lot: YMDD H Where: Y is the last digit of the year of manufacture M is the month ( 1 to 9, O, N, D) DD is the 2-digit date H is the h FE rating (O or Y; for values see footnote, Electrical Characteristics table) 12345 12345 PACKAGE OUTLINE DRAWING, TO-3P Leadframe plating Pb-free. Device composition includes high-temperature solder (Pb >85%), which is exempted from the RoHS directive.

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 6Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Pre cau tions must be taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage

• Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and avoid direct sunlight.
• Reinspect for rust in leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress.
• Volatile-type silicone greases may produce cracks after long periods of time, resulting in reduced heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heatsink.
• Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Toshiba Silicone Co., Ltd. SC102 Dow Corning Toray Silicone Co., Ltd. Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance increases when tightening torque is low, and radiation effects are decreased. When the torque is too high, the screw can strip, the heatsink can be deformed, and distortion can arise in the product frame. To avoid these problems, observe the recommended tightening torques for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7 to 9 kgf•cm).
• Diameter of Heatsink Hole: < 4 mm. The defl ection of the press mold when making the hole may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. Soldering
• When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge
• When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M Ω of resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the equipment should be grounded.
• When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products.
• The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil.

Darlington Transistors for Audio AmplifiersSTD01N and STD01P 7Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im- prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this publication is current before placing any order. When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products at a certain rate is in ev i ta ble. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus (home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aero space equipment) is not supported. When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your spec i fi ca tions. The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equip- ment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. Copyright © 2007 Allegro MicroSystems, Inc.