SPLPL85 OSRAM

Document overview

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Technical content

Features

 Low cost plastic package  Reliable strained InGaAs/GaAs material  High power large-optical-cavity (LOC) structure for a narrow far-field  Lateral laser aperture 200 μm

Applications

 Range finding  Security, surveillance  Illumination, ignition  Test and measurement systems Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 “Safety of laser products”.

Grenzwerte (TA = 25 °C) Maximum Ratings Parameter Parameter Symbol Symbol Werte Values Einheit Unit min. max. Spitzenausgangsleistung Peak output power Ppeak – 13 W Durchlaßstrom Forward current IF – 12 A Pulsbreite (Halbwertsbreite) Pulse width (FWHM) tp – 100 ns Tastverhältnis Duty cycle d.c. – 0.1 % Sperrspannung Reverse voltage VR – 3 V Betriebstemperatur Operating temperature Top - 40 + 85 °C Lagertemperatur Storage temperature Tstg - 40 + 100 °C Löttemperatur (tmax = 10 s, 2 mm von Gehäuseunterseite) Soldering temperature (tmax = 10 s, 2 mm from bottom edge of case) Ts – + 260 °C

Optische Kennwerte (TA = 25 °C) Optical Characteristics Parameter Parameter Symbol Symbol Werte Values Einheit Unit min. typ. max. Zentrale Emissionswellenlänge1) Emission wavelength1) λpeak 840 850 860 nm Spektrale Breite (Halbwertsbreite)1) Spectral width (FWHM)1) Δλ – 4 – nm Spitzenausgangsleistung1) Peak output power1) Pop 7 10 13 W Schwellstrom Threshold current Ith 0.5 0.75 1 A Betriebsspannung1) Operating voltage1) Vop 2.0 2.5 3.0 V Minimale Anstiegs- und Abfallzeit (10% … 90%) Minimum rise and fall time (10% … 90%) tr, tr - 1 - ns Austrittsöffnung Aperture size w × h 200 × 2 μm2 Strahldivergenz (Halbwertsbreite) Beam divergence (FWHM) deg. Temperaturkoeffizient der Wellenlänge2) Temperature coefficient of wavelength2) Temperaturkoeffizient der opt. Ausgangsleistung Temperature coefficient of optical power ∂Pop/Pop∂T – -0.4 – %/K Thermischer Widerstand Thermal resistance Rth JA – 160 – K/W 1) Standardbetriebsbedingungen beziehen sich auf eine Pulsbreite von 100 ns bei einer Frequenz von 1 kHz und einem Betriebsstrom von 10 A bei TA = 25 °C. Standard operating conditions refer to pulses of 100 ns width at 1 kHz rate with 10 A operating current at TA = 25 °C.

Optical output power Popt and forward voltage VF vs. forward current IF (TA = 25 °C) Far-field distribution parallel to junction Irel vs. θ|| (TA = 25 °C, Popt = 10 W) Optical spectrum, relative intensity Irel vs. Wavelength λ (TA = 25 °C, Popt = 10 W) Far-field distribution perpendicular to junction Irel vs. θ⊥ (TA = 25 °C, Popt = 10 W) OHW00914 FV FI 5 10 15 20A V optP V P W Deg-30 θ 0.25 0.50 0.75 Irel 1.00 OHL00746 -20 -10 0 10 30 OHW00901 0 838 λ Ιrel 100 842 846 850 854 858nm OHL00747 0-40 0.25 0.50 0.75 1.00 Deg Irel θ -30 -20 -10 0 10 20 40

Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). 4.2 (0.165) 5.0 (0.197) 27.0 (1.063) 29.0 (1.142) 1.8 (0.071) 1.2 (0.047) spacing 2.54 (0.100) mm 0.4 (0.016) 0.6 (0.024) 0.8 (0.031) 0.4 (0.016) Cathode Chip position Area not flat 5.5 (0.217) 5.9 (0.232) Bottom view 0.4 (0.016) 0.6 (0.024) Chip position GEOY6066 3.5 (0.138) 4.8 (0.189) 1.7 (0.067) 3.7 (0.146) 1.9 (0.075) A Aø0.3 X Y Detail X Detail Y

OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.