SPA02N80C3 ISC

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 IscN-ChannelMOSFETTransistor SPA02N80C3

  • FEATURES
  • WithTO-220Fpackage
  • Lowinputcapacitanceandgate charge
  • Reducedswitchingand conductionlosses
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 800 V VGSS Gate-SourceVoltage ±30 V ID DrainCurrent-Continuous@Tc=25℃ (VGS at10V) Tc=100℃ 1.2 A IDM DrainCurrent-SinglePulsed 6 A PD TotalDissipation@TC=25℃ 30.5 W Tj Max.OperatingJunctionTemperature 150 ℃ Tstg StorageTemperature -55~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 4.1 ℃/W Rth(ch-a) Channel-to-ambientthermalresistance 80 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 IscN-ChannelMOSFETTransistor SPA02N80C3 ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=0.25mA 800 V VGS(th) GateThresholdVoltage VDS=VGS;ID=0.12mA 2.1 3.9 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=1.2A 2400 2700 mΩ IGSS Gate-SourceLeakageCurrent VGS=±20V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=800V;VGS=0V;Tj=25℃ VDS=800V;VGS=0V;Tj=150℃ 100 μA VSDF Diodeforwardvoltage ISD=2A,VGS =0V 1.0 1.2 V