SP3012-04UTG LEIDITECH

Document overview

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Technical content

Features

Mechanical Characteristics

Applications

ULTRA LOW CAPACITANCE TVS DIODE ARRAY Dimensions DFN2510P10 Pin Configuration Absolute Maximum Ratings (Tamb=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppp 40 W ESD per IEC 61000−4−2 (Air) V ESD Kv ESD per IEC 61000−4−2 (Contact) Operating Temperature Range T J -55 to +125 Storage Temperature Range T STJ -55 to +150 Marking Information Rev : www.leiditech.com 01.06.2017 1/7  Ultra low capacitance: 0.3pF typical (I/O to I/O)  Ultra low leakage: nA level  Operating voltage: 5V  Low clamping voltage  Up to four lines protects  Leadless flow-through package  Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±15kV Contact discharge: ±8kV – IEC61000-4-5 (Lightning) 4A (8/20μs)  RoHS Compliant  HDMI 1.3 & 1.4, USB 2.0 & 3.0 and MDDI ports  Monitors and flat panel displays  Set-top box and Digital TV  Video graphics cards  Digital Visual Interface (DVI)  Notebook Computers  PCI Express and Serial SATA Ports  Package: DFN2510-10 (2.5×1.0×0.5mm)  Lead Finish: Matte Tin  Case Material: “Green” Molding Compound.  Moisture Sensitivity: Level 3 per J-STD-020  Terminal Connections: See Diagram Below  Marking Information: See Below 117XY= Device Marking Code Dot denotes Pin1 117XY

Electrical Characteristics (TA=25°C unless otherwise specified) Rev : www.leiditech.com 01.06.2017 2/7 Parameter Symbol Min Typ Max Unit Test Condition Reverse Working Voltage VRWM 5 V Any I/O pin to ground Breakdown Voltage VBR 5.8 V IT = 2μA, any I/O pin to ground Breakdown Voltage VBR 8 V IT = 1mA, any I/O pin to ground Reverse Leakage Current IR 0.5 µA VRWM = 5V, any I/O pin to ground Clamping Voltage VC 9 V IPP = 1A (8 x 20µs pulse), any I/O pin to ground Clamping Voltage VC 10 V IPP = 4A (8 x 20µs pulse), any I/O pin to ground Junction Capacitance CJ 0.3 0.4 pF VR = 0V, f = 1MHz, between I/O pins Junction Capacitance CJ 0.6 0.8 pF VR = 0V, f = 1MHz, any I/O pin to ground SP3012-04UTG

Typical Performance Characteristics (TA=25°C unless otherwise Specified) Rev : www.leiditech.com 01.06.2017 3/7 Junction Capacitance vs. Reverse Voltage Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current Power Derating Curve

8 X 20μs Pulse Waveform Contact discharge current waveform

Note：Data is taken with a 10x attenuator SP3012-04UTG

The SP3012-04UTG is designed for easy PCB layout by allowing the traces to run straight through the device. The PCB traces could be used to connect the pin pairs for each line. For example, line 1 enters at pin 1 and exits at pin 10 and the PCB trace connects Pin 1 and Pin 10 together. Ground is connected at Pin 3 and Pin 8. SP3012-04UTG on USB 3.0 Port Application Vbus ID GND MicB_SSTX- MicB_SSTX+ MicB_SSRX- MicB_SSRX+ GND_DRAIN Vbus 1 24 5 3 10 97 6 8 Line 1 Line 1 Line 2 Line 2 Line 3 Line 3 Line 4 Line 4 Rev : www.leiditech.com 01.06.2017 4/7 SP3012-04UTG

SP3012-04UTG on DVI Port Application Data 2- Data 2+ Data 4- Data 4+ DDC Clock DDC Data Data 1- Data 1+ Data 3- Data 3+ Data 0- Data 0+ Data 5- Data 5+ Clock+ Clock- Red Green Blue Hysnc DVI Graphic Video Controller Rev : www.leiditech.com 01.06.2017 5/7 SP3012-04UTG

SP3012-04UTG on HDMI Port Application TMDS D2+ TMDS D2- TMDS D1+ TMDS D1- TMDS D0+ TMDS D0- TMDS Clock+ TMDS Clock- CEC NC SCL SDA GND 5V Power Hot Plug Detect GND GND GND HDMI Graphic Video Controller GND Rev : www.leiditech.com 01.06.2017 6/7 SP3012-04UTG

e 0.50BSC 0.020BSC Nd 2.00BSC 0.080BSC L1 0.075REF 0.003REF L2 0.050REF 0.002REF SYM DIMENSIONS MILLIMETERS INCHES X1 0.200 0.008 X2 0.400 0.016 X3 0.500 0.020 Y 0.600 0.024 Z 1.400 0.056 L E TOP VIEW SIDE VIEW BOTTOM VIEW Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2017 7/7 SP3012-04UTG