Datasheet - SMM4FxxA - 400 W TVS in STmite Flat

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 13

Technical content

Features

  • Peak pulse power: 400 W (10/1000 μs) and 2.5 kW (8/20 μs)
  • Flat and thin package: 0.85 mm
  • Stand-off voltage range from 5 V to 33 V
  • Unidirectional type
  • Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
  • Operating T j max: 175 °C
  • High power capability at T j max.: up to 160 W (10/1000 µs)
  • Lead finishing: matte tin plating Complies with the following standards
  • UL94, V0
  • J-STD-020 MSL level 1
  • J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
  • JESD-201 class 2 whisker test
  • IPC7531 footprint and JEDEC registered package outline
  • IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 30 kV (contact discharge) – 30 kV (air discharge)
  • IEC 61000-4-4 – 4 kV

Description

The SMM4F TVS series are designed to protect sensitive circuits against transient surges. The planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. Product status link SMM4F SMM4F5.0A, SMM4F6.0A, SMM4F6.5A, SMM4F8.5A, SMM4F10A, SMM4F12A, SMM4F13A, SMM4F15A, SMM4F18A, SMM4F20A, SMM4F24A, SMM4F26A, SMM4F28A, SMM4F33A

400 W TVS in STmite Flat

DS5630 - Rev 6 - April 2020 For further information contact your local STMicroelectronics sales office.

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C) Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics

Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)

  1. To calculate V BR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25))
  2. To calculate V CL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25))
  3. To calculate V CLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli
  4. Surge capability given for both directions

1.1 Characteristics (curves)

Figure 3. Maximum peak power dissipation versus initial Figure 4. Maximum peak pulse power versus exponential Figure 5. Maximum clamping voltage versus peak pulse Figure 6. Dynamic resistance versus pulse duration Figure 7. Junction capacitance versus reverse applied Figure 8. Leakage current versus junction temperature

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

2.1 STmite Flat package information

Figure 12. STmite Flat package outline Table 3. STmite Flat mechanical data

Package information

Figure 19. Tape and reel outline Table 4. Tape and reel mechanical data

Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting

3 Ordering information

Figure 21. Ordering information scheme

4 F = 4 0 0 W i n f l a t p a c k a g e

Table 5. Ordering information

Ordering information

Table 6. Marking

Revision history

Table 7. Document revision history 19-Dec-2007 2 Updated IPP and RD parameters in columns 10 and 11 of Table 4. 19-Aug-2014 3 Updated package name. 19-Jan-2017 4 Updated cover page and Table 4. Section 1.1 Characteristics (curves). 15-Apr-2020 6 Updated Figure 5 and Figure 11.