SMW02 ETC1

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Technical content

Supersedes data of 7th August 2000 File under BCcomponents, BC08

2001 Mar 15

Stand-up miniature power resistors

2001 Mar 15 2

BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05

FEATURES

  • High power dissipation in small volume
  • High pulse load handling capabilities
  • 2e pitch mounting
  • Designed in stand-up configuration for stand-up mounting.

APPLICATIONS

  • Ballast switching
  • Power supplies
  • Shunts.

DESCRIPTION

SMW: The resistor element is a resistive wire which is wound in a single layer on a ceramic rod. Metal caps are pressed over the ends of the rod. The ends of the resistance wire and the leads are connected to the caps by welding. SMF: The resistor element is a metal film resistor consisting of a metal layer deposited over a high grade ceramic rod. The resistive film is adjusted to final value by means of a helical groove. The leads are connected to the caps by welding. SMW/SMF: Tinned copper-clad iron leads with poor heat conductivity are employed permitting the use of relatively short leads to obtain stable mounting without overheating the solder joint. The resistor body and lead ends are housed within a rectangular ceramic case which is non-flammable, will not melt even at high overloads and is resistant to most commonly used cleaning solvents, in accordance with “MIL-STD-202E, method 215” and “IEC 60068-2-45”. QUICK REFERENCE DATA Note 1. Higher values are available on request. SMW02 SMF02 SMW03 SMF03 SMW05 SMF05 Resistance range; note 1 0.1 to 200 Ω 220 Ω to 47 kΩ 0.1 to 560 Ω 620 Ω to 47 kΩ 0.1 to 560 Ω 620 Ω to 47 kΩ Resistance tolerance ±5%; E24 series Maximum permissible body temperature 300 °C Rated dissipation at Tamb =7 0 °C2 W 3 W 5 W Climatic category (IEC 60068) 40/200/56 Basic specification IEC 60115-1 Stability after: load, 1000 hours ∆R/R max.: ±5% + 0.1 Ω climatic tests ∆R/R max.: ±3% + 0.1 Ω short time overload ∆R/R max.: ±2% + 0.1 Ω Insulation voltage >2000 V

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BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05

ORDERING INFORMATION

Table 1 Ordering code indicating resistor type and packaging TY P E LOOSE IN BOX 500 units SMW02 0 03... SMF02 5 03... SMW03 1 03... SMF03 6 03... SMW05 2 03... SMF05 7 03... Ordering code (12NC)

  • The resistors have a 12-digit ordering code starting with 2306 34
  • The subsequent 3 digits indicate the resistor type and packaging; see Table 1.
  • The remaining 3 digits indicate the resistance value: – The first 2 digits indicate the resistance value. – The last digit indicates the resistance decade in accordance with Table 2. Table 2 Last digit of 12NC RESISTANCE DECADE LAST DIGIT 0 . 1t o0 . 9 1Ω 7 1t o9 . 1Ω 8 10 to 91 Ω 9 1 0 0t o9 1 0Ω 1 1t o9 . 1kΩ 2 10 to 47 kΩ 3 ORDERING EXAMPLE The ordering code of a SMW02 resistor, value 47 Ω , supplied loose in box of 500 units is: 2306 340 03479.

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BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05 FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5%. The values of the E24 series are in accordance with “IEC publication 60063 ”. Limiting values Note 1. The maximum voltage that may be continuously applied to the resistor element, see “IEC publication 60266 ”. TYPE LIMITING VOLTAGE (1) (V) LIMITING POWER (W) SMW02 2 SMF02 350 SMW03 3 SMF03 350 SMW05 5 SMF05 600 VP n R×= VP n R×= VP n R×= The maximum permissible hot-spot temperature is 300 °C, and the minimum breakdown voltage of the encapsulation is 2000 V. DERATING The power that the resistor can dissipate depends on the operating temperature; see Fig.1. Fig.1 Maximum dissipation (P max) as a function of the ambient temperature (Tamb). MBG629 70 10040 50 Tamb ( C)o (%P ) rated 100 200150 Pmax PULSE LOADING CAPABILITY Detailed pulse loading information is available on request.

Application information

The resistors must be mounted in such a way that no stress is exerted on the leads and that thermal expansion is possible over the temperature range. Ensure that the temperature rise of the resistor body by conducted or convected heat, does not affect nearby components or materials. The temperature rise at the soldering point of the leads must not reach the melting point of the solder. The temperature rise at the soldering point as a function of dissipated power is shown in Fig.2. Fig.2 Solder spot temperature rise ( ∆T) as a function of dissipated power. 0 40 120 %P nom 160 120 MBG543 (K) 5 W 3 W 2 W

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BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05 MECHANICAL DATA Mass per 100 units Marking The resistor is marked with the resistor type designation, the production week, nominal resistance value, the tolerance on the resistance and the rated dissipation at T amb =7 0 °C. For values up to 910 Ω the R is used as a decimal point. For values of 1 kΩ or greater the letter K is used as the decimal point for the kΩ indication. Outlines TY P E MASS (g) SMW02 370SMF02 SMW03 530 SMF03 SMW05 640SMF05 Fig.3 Outlines. For dimensions see Table 3. W H L P D CCB358 C ∅ d B2B1 Table 3 Resistor type and relevant physical dimensions; see Fig.3 TYPE W (mm) D (mm) C (mm) H (mm) ∉B1 − B2∉ (mm) L (mm) P (mm) ∅ d (mm) SMF02 SMW05

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BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05 TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the schedule of “IEC publications 60115-1 and 60115-4 ”, category 40/200/56 (rated temperature range −40 °Ct o +200 °C; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. The tests are carried out in accordance with IEC publication 60068, “Recommended basic climatic and mechanical robustness testing procedure for electronic components ” and under standard atmospheric conditions according to “IEC 60068-1”, subclause 5.3. In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 60115-1, 60115-4 and 68 ”; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Table 4 Test procedures and requirements IEC 60115-1 CLAUSE IEC 60068 TEST METHOD TEST PROCEDURE REQUIREMENTS Tests in accordance with the schedule of IEC publication 60115-1 4.15 robustness of resistor body load 200 ±10 N no visible damage

4.16 U robustness of

terminations: Ua tensile all samples load 10 N; 10 s no visible damage

4.17 Ta solderability 2 s; 235 °C good tinning; no damage

4.18 Tb resistance to soldering

thermal shock: 3 s; 350 °C; 2.5 mm from body 4.19 14 (Na) rapid change of temperature 30 minutes at −40 °C and 30 minutes at +200 °C; 5 cycles no visible damage ∆R/R max.: ±1% + 0.05 Ω

4.22 Fc vibration frequency 10 to 500 Hz; displacement

0.75 mm or acceleration 10 g; 3 directions; total 6 hours (3 × 2 hours) no damage

4.20 Eb bump 4000 ±10 bumps; 390 m/s2 no damage

4.23 climatic sequence:

4.23.2 Ba dry heat 16 hours; 200 °C

4.23.3 Db damp heat

(accelerated) 1st cycle 24 hours; 55 °C; 95 to 100% RH

4.23.4 Aa cold 2 hours; −40 °C

4.23.5 M low air pressure 1 hour; 8.5 kPa; 15 to 35 °C

4.23.6 Db damp heat

(accelerated) remaining cycles 5d a y s ; 5 5 °C; 95 to 100% RH ∆R/R max.: ±3% + 0.05 Ω

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BCcomponents Product specification Stand-up miniature power resistors SMW02/03/05 SMF02/03/05 4.24.2 3 (Ca) damp heat (steady state) 56 days; 40 °C; 90 to 95% RH; dissipation ≤0.01 Pn no visible damage ∆R/R max.: ±3% + 0.1 Ω 4.8.4.2 temperature coefficient SMW: R < 10 Ω TC ≤± 600 × 10−6/K SMW: R ≥ 10 Ω− 80 × 10−6 ≤ TC TC ≤ +140 × 10−6/K SMF TC ≤ +250 × 10−6/K 4.13 short time overload room temperature; dissipation 10 × Pn; 5 s O(voltage not more than 1000 V/25 mm) ∆R/R max.: ±2% + 0.1 Ω 4.25.1 endurance (at 70 °C) 1000 hours loaded with 0.9 P n; 1.5 hours on and 0.5 hours off no visible damage ∆R/R max.: ±5% + 0.1 Ω

4.23.2 Ba endurance at upper

1000 hours; 200 °C; no load no visible damage ∆R/R max.: ±5% + 0.1 Ω IEC 60115-1 CLAUSE IEC 60068 TEST METHOD TEST PROCEDURE REQUIREMENTS