SMD2018P030 LEIDITECH

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

  • RoHS compliant, lead-free and halogen-free
  • Fast response to fault currents
  • Compact design saves board space
  • Low resistance
  • Low-profile
  • Compatible with high temperature solders

Applications

  • USB peripherals
  • Disk drives
  • CD-ROMs
  • Plug and play protection for motherboards and peripherals
  • Mobile phones - battery and port protection
  • Disk drives
  • PDAs / digital cameras
  • Game console port protection PTC 01 ROHS MARKING CODE VARIES WITH AMPERAGE RATING (See Electrical Characteristic Table) SHOWN IS 1.0AMP RATING Dimension C Side View Top View Bo Bo t t tom tom Vi Vi ew ew D D E A B N N N Model A B C D 1.5 1.5 4.6 3.4 All data is subject to change,Please check our data sheets at www.leiditech.com for updates.

Electriacl Characteristics PTC 02 Thermal Derating Chart-IH(A) Type Number I hold I trip V max I max P d max. Maximum Time To Trip Resistance (A) (A) V (dc) (A) (W) Current (A) Time (Sec.) R min (Ω) R 1max (Ω) I hold = Hold current: maximum current device will pass without tripping in 20°C still air. I trip = Trip current: minimum current at which the device will trip in 20°C still air. V max = Maximum voltage device can withstand without damage at rated current (I max I max = Maximum fault current device can withstand without damage at rated voltage (V max P d = Power dissipated from device when in the tripped state at 20°C still air. R min = Minimum resistance of device in initial (un-soldered) state. Model Maximum ambient operating temperature (Tmao) vs. hold current (Ihold) -40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C Thermal Deratin g T evruC yp ical Time-To-Tri p At 25° C Derating Curves for SMD2018 Series 100 120 140 160 -40- 20 02 04 06 08 0 Temperature (°C) Percentage of Derated Current Average Time Current Curves 0.001 0.01 0.1 100 0.11 10 100 Current In Amperes Time In Second 050 100 150 200 133 030 All data is subject to change,Please check our data sheets at www.leiditech.com for updates.

Recommended Solder Reflow Conditions Soldering

  • Recommended reflow methods：IR, vapor phase oven, hot air oven.
  • Devices are not designed to be wave soldered to the bottom side of the board.
  • Recommended maximum paste thickness is 0.25 mm (0.010 inch).
  • Devices can be cleaned using standard method and solvents. Note：If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Ta p e And Reel S p ecifications mm EIA Ta p e Com p onent Dimentions Governing Specifications EIA 481-2 02.0 0.21W P 4.0 ± 0.10 P 8.0 ± 0.10 P 2.0 ± 0.05 A 4.40 ± 0.10 B 5.50 ± 0.10 B max. 8.2 D 1.5 + 0.1, -0.0 50.0 5.5F E 1.75 ± 0.10 E min. 10.25 6.0.xamT T max. 0.1 K 1.36 ± 0.1 Leader min. 390 061.nim reliarT Reel Dimensions 871.xam A 05.nim N W 12.4 + 2.0, -0.0 W max. 18.4 Stora g e And Handlin g
  • Storage conditions：40°C max, 70% R.H.
  • Devices may not meet specified performance if storage conditions are exceeded. akcaPnoitamrofnI redrO g in g Tape & reel packaging per EIA481-1 Tape & Reel Quantity050SMD2018 SMD：surface mount device Hold Current 0.50A Product name 100, 100-33V, 150, 200 2,500 pcs/reel Size 5045 mm / 2018 mils gnilooCgnitaeherP 030, 050 1,500 pcs/reel B K T Cover tape D P A E Embossment W E F P T B P W2(measured at hub) N(hub dia.) W1(measured at hub) A EIA Reel Dimentions Carrier tape Embossed cavity Cover tape 60-120 sec. 120 sec. 30-60 sec. 300 200 160 250 190 100 Temperature(°C) All data is subject to change,Please check our data sheets at www.leiditech.com for updates.

Leiditech Electronics are trademarks. Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Leiditech Electronics reserves the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction, processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes and replaces all information previously supplied. Without expressed or written consent by an officer of Leiditech Electronics, Leiditech Electronics does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. Leiditech Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness for a particular purpose. Leiditech Electronics’ only obligations are those in the Leiditech Electronics Standard Terms and Conditions of Sale and in no case will Leiditech Electronics be liable for any incidental, indirect, or consequential damages. SHANGHAI LEIDITECH ELECTRONICS CO.,LTD Tel: +86- 021 50828806 Fax: +86- 021 50477059-8008 Email: sale1@leiditech.com Website: http://www.leiditech.com All data is subject to change,Please check our data sheets at www.leiditech.com for updates.