SMD0603P002TF-60

SMD0603P002TF-60 LEIDITECH

Document overview

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Technical content

Rev 2.0 : www.leiditech.com 01.09.2021 1/3 Table1:DIMENTION(Unit:mm) Model Marking A B C D E Table2:PERFORMANCERATINGS: Model Marking Vmax (Vdc) Imax (A) Ihold @25℃ (A) Itrip @25℃ (A) Pd Typ (W) Maximum TimeToTrip Resistance Current (A) Time (Sec) R1min (Ω) R1max (Ω) Table3:TestConditonsandStandards Item TestConditon Standard InitialResistance 25℃ 12.00～70.000Ω IH 25℃，0.02A，60min NoTrip Ttrip t r i p 25℃，0.2A ≤1.0S Tripendurance 60V，40A，60min Noarcingorburning Operating Temperature：-40℃ TO 85℃ Packaging：Bulk ,4000pcs per bag Terminalpadmaterials:Tin-PlatedNickle-copper Terminal pad solderability : Meets EIA specification RS186-9EandANSI/J-STD-002Category3. Marking:Partidentification X=002 Surface Mountable PTC Resettable Fuse

Rev 2.0 : www.leiditech.com Solder reflow conditions 01.09.2021 R e c o m m e n d e d r e f l o w m e t h o d s I R v a p o r p h a s e o v e n h o t a i r o v e n N e n v i r o n m e n t f o r l e a d f r e e D e v i c e s a r e n o t d e s i g n e d t o b e w a v e s o l d e r e d t o t h e b o t t o m s i d e o f t h e b o a r d R e c o m m e n d e d m a x i m u m p a s t e t h i c k n e s s i s m m i n c h D e v i c e s c a n b e c l e a n e d u s i n g s t a n d a r d i n d u s t r y m e t h o d s a n d s o l v e n t s S o l d e r i n g t e m p r a t u r e p r o f i l e m e e t s R o H s l e a d f r e e p r o c e s s Notes:Ifreflowtemperaturesexceedtherecommendedprofile,devicesmaynotmeetthe performancerequirements SMD0603P002TF/60

Rev 2.0 : www.leiditech.com Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 01.09.2021 Recommended pad layout (mm) WARNING

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be usedwhenrepeatedfaultconditionsorprolongedtripeventsareanticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,thermal,andmechanicalproceduresforelectroniccomponents.
• UsePPTCwithalargeinductanceincircuitwillgenerateacircuitvoltage(Ldi/dt)abovetheratedvoltageofthePPTC.
• AvoidimpactPPTCdeviceitsthermalexpansionlikeplacedunderpressureorinstalledinlimitedspace.
• Contamination of the PPTC material with certain silicon basedoils or some aggressive solvents can adversely impact the performanceofthedevices.PPTCSMDcanbecleanedbystandardmethods.
• Requeststhatcustomerscomplywithourrecommendedsolderpadlayoutsandrecommendedreflowprofile.Improper boardlayoutsorreflowprofilecouldnegativelyimpactsolderabilityperformanceofourdevices. SMD0603P002TF/60