SMD1210P150L LEIDITECH
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features： RoHS Compliant ＆ Halogen Free Faster tripping, 1210 Dimension, Surface mountable, Solid state Operating Current: 1.5A~7.5A Maximum V oltage: 6V/12V Operating Temperature：-40℃~ 85℃ Certification: CSA Product Dimensions (mm) A B C D E Min Max Min Max Min Max Min Min SMD1210P150L~750L Series Surface-mount Devices Model Rev : www.leiditech.com 01.06.2018 1/8
Min Max Min Max Min Max Min Min Recommended Solder Pad Layout Dimensions (mm) F G H Device Normal Value Normal Value Normal Value 1210 Series 1.0 2.0 2.5
Electrical Characteristics
(V) I MAX (A) I H (A) I T (A) P D (W) (A) (Sec) (Ω) ( Ω) Model Rev : www.leiditech.com 01.06.2018 2/8 SMD SMD1210P150L-12 12.0 50.0 SMD1210P175L 6.0 50.0 1210P150L 6.0 50.0 SMD1210P150L~750L Series
H (A) Maximum ambient operating temperature (℃) Model -40 -20 0 25 40 50 60 70 85 SMD1210P175L-12 12.0 50.0 SMD1210P200L-12 12.0 50.0 SMD1210P260L 6.0 50.0 SMD1210P750L-12 12.0 50.0 Rev : www.leiditech.com 01.06.2018 3/8 SMD1210P190L 6.0 50.0 SMD1210P190L-12 12.0 50.0 SMD1210P200L 6.0 50.0 SMD1210P260L-12 12.0 50.0 SMD1210P300L 6.0 50.0 SMD1210P300L-12 12.0 50.0 SMD1210P350L 6.0 50.0 SMD1210P350L-12 12.0 50.0 SMD1210P380L 6.0 50.0 SMD1210P380L-12 12.0 50.0 SMD1210P400L 6.0 50.0 SMD1210P400L-12 12.0 50.0 SMD1210P450L 6.0 50.0 SMD1210P450L-12 12.0 50.0 SMD1210P500L 6.0 50.0 SMD1210P500L-12 12.0 50.0 SMD1210P550L 6.0 50.0 SMD1210P550L-12 12.0 50.0 SMD1210P600L 6.0 50.0 SMD1210P600L-12 12.0 50.0 SMD1210P650L 6.0 50.0 SMD1210P650L-12 12.0 50.0 SMD1210P700L 6.0 50.0 SMD1210P700L-12 12.0 50.0 SMD1210P750L 6.0 50.0 SMD1210P150L~750L Series
Test Procedures and Requirements Test Item Test Conditions Accept/Reject Criteria Initial Resistance In still air at 25℃ Ri MIN ≤R≤R1 MAX Time to Trip Specified current, V MAX , 25℃ T ≤Maximum Time to Trip Holding Current 30min, at I H , 25℃ No trip Trip Cycle Life V MAX , I MAX , 100 cycles No arcing or burning Trip Endurance V MAX , I MAX , 1 hour No arcing or burning SMD Rev : www.leiditech.com 01.06.2018 4/8 SMD1210P150L~750L Series
Terminal Materials Tin-Plated Nickle-copper Soldering Zone Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Moisture Sensitivity Level 2a, per IPC/JEDEC J-STD 020C Environmental Specifications Test Item Test Conditions Resistance Change Passive Aging 85℃,1000 hours ±10% typical Humidity Aging 85℃/85%RH.100 hours ±5% typical Thermal Shock MIL-STD-202,Method 107G +85℃/-40℃,20 times -30% typical Solvent Resistance MIL-STD-202,Method 215 No change Vibration ML-STD-883C,Test Condition A No change Electrical Specifications I H =Hold current: Maximum current at which the device will not interrupt in 25℃ still air. I T =Trip current: Minimum current at which the device from low resistance to high resistance in 25℃ still air. V MAX =Maximum continuous voltage device can withstand without damage at rated current. I MAX =Maximum fault current device can withstand without damage at rated voltage. Maximum Time-to-trip: Maximum time to trip at assigned current. P D =Typical power dissipation: Typical amount of power dissipated from the device when in 25℃ still air environment. Ri MIN =Minimum resistance of device at 25℃ prior to tripping. MAX = Maximum device resistance is measured one hour post reflow. Solder Reflow Profiles Rev : www.leiditech.com 01.06.2018 5/8 SMD1210P150L~750L Series
- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
- Devices are not designed to be wave soldered to the bottom side of the board.
- Recommended maximum paste thickness is 0.25mm (0.010inch).
- Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package,measured on the package body surface. Note 2: If reflow temperature exceed the recommended profile,devices may not meet the performance requirements. Pr o f i l e F e a t u r e P b - F r e e A s s e m b l y Average ramp up rate(Ts MAX to T p ) 3℃/second max. Preheat
- Temperature min.(Ts MIN ) 1 5 0 ℃
- Temperature max.( Ts MAX ) 2 0 0 ℃
- Time (Ts MIN to Ts MAX ) 6 0 - 1 2 0 s e c o n d s Time maintained above:
- Temperature (T L ) 2 1 7 ℃
- Time (T L ) 6 0 - 1 5 0 s e c o n d s Peak/Classification temperature (T P ) 2 6 0 ℃ Time within 5℃ of actual peak temperature Time (T P ) 3 0 s e c o n d s m a x . Ramp down rate 3 ℃/second max. Time 25℃ to peak temperature 8 m i n u t e s m a x . Rev : www.leiditech.com 01.06.2018 6/8 SMD1210P150L~750L Series
Tape Specifications and Reel Dimensions Coverning Specifications EIA 481-1 W 8.0 ± 0.3 P 4.0 ± 0.10 P 4.0± 0.10 P 2.0 ± 0.05 A 2.8 2 ± 0.10 B 3.4 6 ± 0.10 D 1.5 5 ± 0.05 F 3 .50± 0.05 E 1.7 5 ± 0.10 T 0.2 5 ± 0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A 178±1.0 N 59±1 W 8.5 +1.0/-0.2 W2 12. 0±1 Rev : www.leiditech.com 01.06.2018 7/8 SMD1210P150L~750L Series
The m aximum ambient temperature shall not exceed 40 ℃.Storage temperatures higher than 40 ℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%.High humidity with high temperature can accelerate the oxid ation the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use, the products shall not be stored in areas where harmful gases containing sulfur of chlorine are present. Wa r n i n g
- Please read this specification before using the product.
- Use PPTC beyond the maximum ratings or improper use may result in device damage, electrical arcing and flame.
- PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
- Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
- Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
- Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
- Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices. PPTC can be cleaned by standard methods.
- Requests that customers comply with our recommended so lder pad layouts and recommended reflow profile. Improper board layouts or reflow profile could negatively impact solderability performance of our devices. Rev : www.leiditech.com 01.06.2018 8/8 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 SMD1210P150L~750L Series