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Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
- Low Power Consumption
- 3.3V Supply Voltage
- RoHS Compliant / Halogen-Free
- Pb-Free TDFN-12 Package Pin Configuration VDD PM_SLP_S3_N PM_SLP_S4_N PM_SLP_S5_N S4_LED_DRV DSW_LED_DRV S5_LED_DRV PM_SLP_M_N TDFN-12 TOP VIEW Thermal Pad connected to GND SLG7NT4082 5 PM_SLP_SUS_N ME_LED_DRV S3_LED_DRV GND Output Summary
- 3 Outputs – Open Drain
- 2 Outputs – Open Drain Double Current
SLG7NT4082_DS_r101 Page 2 Block Diagram Typical Application Circuit +V3.3A_DSW SLG7NT4082 VDD data I data I/O data I/O data I/O data I/O data I/O GND 7data I/O 8data I/O 9data I/O 10data I/O 11IN IN IN OUT OUT OUT OUT 100nF +V3.3A_VAL PM_SLP_S3_N PM_SLP_S4_N PM_SLP_S5_N S4_LED_DRV S3_LED_DRV PM_SLP_M _N PM_SLP_SUS_N M E_LED_DRV DSW_LED_DRV S5_LED_DRV IN IN OUT +V3.3A_DSW LED LED LED LED LED
SLG7NT4082_DS_r101 Page 3 Pin Configuration Pin # Pin Name Type Pin Description
1 VDD PWR Supply Voltage
2 PM_SLP_S3_N Input Digital Input
3 PM_SLP_S4_N Input Digital Input
4 PM_SLP_S5_N Input Digital Input
5 PM_SLP_SUS_N Input Digital Input
6 ME_LED_DRV Output Open Drain 2x current
7 GND GND Ground
8 S3_LED_DRV Input Open Drain
9 PM_SLP_M_N Input Digital Input
10 S5_LED_DRV Output Open Drain
11 S4_LED_DRV Output Open Drain
12 DSW_LED_DRV Output Open Drain 2x current
Exposed Bottom Pad GND Ground
Ordering Information
SLG7NT4082V V = TDFN-12 SLG7NT4082VTR VTR = TDFN-12 - Tape and Reel (3k units)
SLG7NT4082_DS_r101 Page 4 Absolute Maximum Conditions Parameter Min. Max. Unit VHIGH to GND -0.3 7 V Voltage at input pins -0.3 7 V Current at input pin -1.0 1.0 mA Storage temperature range -65 150 °C Junction temperature -- 150 °C
Electrical Characteristics
(@ 25°C, unless otherwise stated) Symbol Parameter Condition/Note Min. Typ. Max. Unit VDD Supply Voltage 3.0 3.3 3.6 V IQ Quiescent Current Static inputs and outputs -- 1 -- μA TA Operating Temperature -40 25 85 °C IL Input Leakage Current Leakage Current for Analog/Digital Inputs or outputs in High impedance state -100 -- 100 nA VIH HIGH-Level Input Voltage Logic I nput at VDD=3.3V 1.8 -- -- V VIL LOW-Level Input Voltage Logic Input at VDD=3.3V -- -- 1.1 V VOL Output Voltage Low Open Drain Logic Level Output at VDD=3.3V, IOL=20mA -- -- 0.605 V VOL Output Voltage Low Open Drain 2X Drive Logic Level Output at VDD=3.3V, IOL=20mA -- -- 0.255 V VO Maximal Voltage Applied to any PIN in High-Impedance State -- -- VDD V IOL LOW-Level Output Current Open Drain Current at V OL=0.605V -- -- 20 mA IOL LOW-Level Output Current Open Drain 2X Drive Current at VOL=0.255V -- -- 20 mA TSU Start up Time After VDD reaches 1.6V -- 7 -- ms
SLG7NT4082_DS_r101 Page 5 Timing Diagrams
SLG7NT4082_DS_r101 Page 6 Package Top Marking Datasheet Revision Programming Code Number Part Code Revision Date 1.01 06 4082V AF 12/11/2012
SLG7NT4082_DS_r101 Page 7 Package Drawing and Dimensions
12 Lead TDFN Package
JEDEC MO-229, Variation WDDE
SLG7NT4082_DS_r101 Page 8 Tape and Reel Specification Package Type # of Pins Nominal Package Size (mm) Max Units Reel & Hub Size (mm) Trailer A Leader B Pocket (mm) per reel per box Pockets Length (mm) Pockets Length (mm) Width Pitch TDFN 12L 2.5x2.5mm 0.4P Green 12 2.5x2.5x0.75 3000 3000 178/60 42 168 42 168 8 4 Carrier Tape Drawing and Dimensions Package Type Pocket BTM Length (mm) Pocket BTM Width (mm) Pocket Depth (mm) Index Hole Pitch (mm) Pocket Pitch (mm) Index Hole Diameter (mm) Index Hole to Tape Edge (mm) Index Hole to Pocket Center (mm) Tape Width (mm) A0 B0 K0 P0 P1 D0 E F W TDFN 12L 2.5x2.5mm 0.4P Green Refer to EIA-481 Specifications Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 4.6875 mm3 (nominal). More information can be found at www.jedec.org.
SLG7NT4082_DS_r101 Page 9 Silego Website & Support Silego Technology Website Silego Technology provides online support via our website at http://www.silego.com/.This website is used as a means to make files and information easily available to customers. For more information regarding Silego Green products, please visit: http://greenpak.silego.com/ http://greenpak2.silego.com/ http://greenfet.silego.com/ http://greenfet2.silego.com/ http://greenclk.silego.com/ Products are also available for purchase directly from Silego at the Silego Online Store at http://store.silego.com/ Silego Technical Support Datasheets and errata, application notes and example designs, user guides, and hardware support documents and the latest software releases are available at the Silego website or can be requested directly at info@silego.com. For specific GreenPAK design or applications questions and support please send email requests to GreenPAK@silego.com Users of Silego products can receive assistance through several channels: Online Live Support Silego Technology has live video technical assistance and sales support available at http://www.silego.com/ . Please ask our live web receptionist to schedule a 1 on 1 training session with one of our application engineers. Contact Your Local Sales Representative Customers can contact their local sales representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. More information regarding your local representative is available at the Silego website or send a request to info@silego.com Contact Silego Directly Silego can be contacted directly via e-mail at info@silego.com or user submission form, located at the following URL: http://support.silego.com/ Other Information The latest Silego Technology press releases, listing of seminars and events, listings of world wide Silego Technology offices and representatives are all available at http://www.silego.com/ THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. SILEGO TECHNOLOGY DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. SILEGO TECHNOLOGY RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.