SLG46538-APTR

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GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply

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PDF pages: 172

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Applications

The SLG46538-A provides a small, low power component for common ly used Mixed-Signal functions. The user creates their circuit design by programming the one time Non-Volatile Memory (NVM) to configure the interconnect logic, the IO Pins, and the macrocells of the SLG46538-A. This highly versatile device allows a wide variety of Mixed-Signal functions to be designed within a very small, low power single integrated circuit. The additional power supply (VDD2) on the SLG46538-A provides the ability to interface two independent voltage domains within the same design. Users can configure pins, dedicated to each po wer supply, as inputs, outputs, or both (controlled dynamically by internal logic) to both VDD and VDD2 voltage domains. Using the available macrocells designers can implement Mixed-Signal functions bridging both domains or simply pass through level-translation in both High to Low and Low to High directions. Key Features  Four Analog Comparators (ACMP)  Two Voltage References (Vref)  Nineteen Combination Function Macrocells  Three Selectable DFF/LATCH or 2-bit LUTs  One Selectable Continuous DFF/LATCH or 3-bit LUT  Four Selectable DFF/LATCH or 3-bit LUTs  One Selectable Pipe Delay or 3-bit LUT  One Selectable Programmable Function Generator or 2-bit LUT  Five 8-bit Delays/Counters or 3-bit LUTs  Two 16-bit Delays/Counters or 4-bit LUTs  Two Deglitch Filters with Edge Detectors  State Machine  Eight States  Flexible Input Logic from State Transitions  Serial Communications  I2C Protocol Compliant  Pipe Delay – 16 Stage/3 Output (Part of Combination Function Macrocell)  Programmable Delay  Additional Logic Functions  One Inverter  Two Oscillators  Configurable 25 kHz or 2 MHz  25 MHz RC Oscillator  Crystal Oscillator  Power-On Reset  Eight Byte RAM + OTP User Memory  RAM Memory Space that is Readable and Writable via I  User Defined Initial Values Transferred from OTP  Logic & Mixed-Signal Circuits  Highly Versatile Macrocells  Read Back Protection (Read Lock)  Power Supply  1.8 V (±5 %) to 5.0 V (±10 %) VDD2 (VDD2 ≤ VDD)  Operating Temperature Range: -40 °C to 125 °C  RoHS Compliant/Halogen-Free  Available Package  20-pin TQFN: 3.5 mm x 3.5 mm x 0.75 mm, 0.5 mm pitch  AEC-Q100 Grade 1 Qualified  Infotainment  Navigation  Advanced Driver Assistance Systems (ADAS)  Automotive Display Clusters  Body Electronics

1 Block Diagram

Figure 1: Block Diagram 3-bit LUT3_2 or DFF5 Vref Programmable Delay RC Oscillator ACMP0 ACMP1 ACMP2 ACMP3 Additional Logic Functions Combination Function Macrocells 2-bit LUT2_0 or DFF0 2-bit LUT2_2 or DFF2 2-bit LUT2_1 or DFF1 2-bit LUT2_3 or PGen 3-bit LUT3_1 or DFF4 3bit LUT3_0 or DFF3 3-bit LUT3_4 or DFF7 3-bit LUT3_3 or DFF6 FILTER_1 with Edge Detect POR I2C Serial Communication State Machine 8 states 3-bit LUT3_5 or CNT/DLY2 3-bit LUT3_6 or CNT/DLY3 3-bit LUT3_7 or CNT/DLY4 3-bit LUT3_8 or CNT/DLY5 3-bit LUT3_9 or CNT/DLY6 4-bit LUT4_0 or CNT/DLY0 4-bit LUT4_1 or CNT/DLY1 3-bit LUT3_10 or Pipe Delay FILTER_0 with Edge Detect

8 Byte RAM +

2 Pinout

2.1 PIN CONFIGURATION - TQFN- 20L

Table 1: Functional Pin Description TQFN 20L Pin # Pin Name Signal Name Function Input Options Output Options 1V DD VDD Power Supply -- -- 2I O 0 IO0 General Purpose Input Digital Input without Schmitt Trigger -- Digital Input with Schmitt Trigger -- Low Voltage Digital Input -- 3I O 1I O 1 General Purpose IO with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- VDD2 IO12 IO13 IO14 IO2 IO1 1617 IO0 VDD 1 TQFN-20 (Top View) IO4 IO3 5 IO9 IO10 IO5 GND11 IO7 IO6 IO8 IO16 IO15 1819 IO17 Pin # Signal Name Pin Functions 1V DD Power Supply 2I O 0 G P I

3 IO1 GPIO with OE

5 IO3 GPIO with OE

6 IO4 GPIO/ACMP0+

7 IO5 GPIO with OE/ACMP0-

8 IO6 GPIO/SCL

9 IO7 GPIO/SDA

10 IO8 GPIO with OE/ACMP1+

11 GND GND

12 IO9 GPIO/ACMP0-/ACMP1-/ACMP2-/ACMP3-

13 IO10 GPIO with OE/ACMP2+/ACMP3+

15 IO12 GPIO/ACMP3+

16 IO13 GPIO with OE/XTAL0

17 IO14 GPIO/XTAL1/EXT_CLK0

18 IO15 GPIO with OE/Vref0/EXT_CLK1

19 IO16 GPIO with OE/Vref0

20 IO17 GPIO/EXT_CLK2

TP -- Leave unconnected or connect to GND OE: Output Enable ACMPx+: ACMPx Positive Input ACMPx-: ACMPx Negative Input SCL: I2C Clock Input SDA: I2C Data Input/Output Vrefx: Voltage Reference Output EXT_CLKx: External Clock Input XTALx: Crystal TP: Thermal Pad. Thermal Pad is not connected to any pin, but it can be connected to GND for better thermal performance. Legend: TP

4 IO2 IO2 General Purpose IO

Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) 5I O 3I O 3 General Purpose IO with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- 6I O 4 IO4 General Purpose IO Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) ACMP0+ Analog Comparator 0 Positive Input Analog -- 7I O 5 IO5 General Purpose IO with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- ACMP0- Analog Comparator 0 Negative Input Analog -- 8I O 6 IO6 General Purpose IO Digital Input without Schmitt Trigger Open-Drain NMOS (1x) (2x) Digital Input with Schmitt Trigger -- Low Voltage Digital Input -- SCL I 2C Serial Clock Digital Input without Schmitt Trigger Open-Drain NMOS Digital Input with Schmitt Trigger Open-Drain NMOS Low Voltage Digital Input Open-Drain NMOS 9I O 7 IO7 General Purpose IO Digital Input without Schmitt Trigger Open-Drain NMOS (1x) (2x) Digital Input with Schmitt Trigger -- Low Voltage Digital Input -- SDA I 2C Serial Data Digital Input without Schmitt Trigger Open-Drain NMOS Digital Input with Schmitt Trigger Open-Drain NMOS Low Voltage Digital Input Open-Drain NMOS Table 1: Functional Pin Description (Continued) TQFN 20L Pin # Pin Name Signal Name Function Input Options Output Options

10 IO8

with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) (4x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) ACMP1+ Analog Comparator 1 Positive Input Analog --

11 GND GND Ground -- --

12 IO9

Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) (4x) Low Voltage Digital Input -- EXT_Vref Analog Comparator Negative Input Analog --

13 IO10

with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- ACMP2+ Analog Comparator 2 Positive Input Analog -- ACMP3+ Analog Comparator 3 Positive Input Analog --

14 V DD2 VDD2 Power Supply -- --

15 IO12

Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) ACMP3+ Analog Comparator 3 Positive Input Analog --

16 IO13

with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- XTAL0 External Crystal Connection 0 -- Analog Table 1: Functional Pin Description (Continued) TQFN 20L Pin # Pin Name Signal Name Function Input Options Output Options

17 IO14

Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) XTAL1 External Crystal Connection 1 Analog -- EXT_CLK0 External Clock Connection 0 Digital Input without Schmitt Trigger -- Digital Input with Schmitt Trigger -- Low Voltage Digital Input --

18 IO15

with OE (Note 1) Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input -- Vref0 Voltage Reference 0 Output -- Analog EXT_CLK1 External Clock Connection 1 Digital Input without Schmitt Trigger -- Digital Input with Schmitt Trigger -- Low Voltage Digital Input --

19 IO16 IO16 General Purpose IO

20 IO17

Digital Input without Schmitt Trigger Push-Pull (1x) (2x) Digital Input with Schmitt Trigger Open-Drain NMOS (1x) (2x) Low Voltage Digital Input Open-Drain PMOS (1x) (2x) EXT_CLK2 External Clock Connection Digital Input without Schmitt Trigger -- Digital Input with Schmitt Trigger -- Low Voltage Digital Input -- TP TP -- Thermal Pad. Leave un- connected or connect to GND. -- -- Note 1 General Purpose IO's with OE can be used to implement bidirectional signals under user control via Connection Matrix to OE signal in IO structure. Table 1: Functional Pin Description (Continued) TQFN 20L Pin # Pin Name Signal Name Function Input Options Output Options

Revision 2.3 14 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 2: Pin Type Definitions Pin Type Description VDD Power Supply IO Input/Output GND Ground VDD2 Power Supply 2 NC No Connection

3 Characteristics

3.1 ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

3.2 ELECTROSTATIC DISCHARGE RATINGS

3.3 RECOMMENDED OPERATING CONDITIONS

Table 3: Absolute Maximum Ratings Parameter Min Max Unit Supply voltage on VDD relative to GND -0.5 7 V Supply voltage on VDD2 relative to GND -0.5 V DD + 0.5 V DC Input voltage GND - 0.5 VDD + 0.5 V IOs 9, 10, 12, 13, 14, 15, 16, 17 V DD2 + 0.5 Maximum Average or DC Current Through VDD Pin (per chip side) TJ = 85 °C -- 45 mA TJ = 110 °C -- 22 mA Maximum Average or DC Current Through VDD2 Pin (per chip side) TJ = 85 °C -- 45 mA TJ = 110 °C -- 22 mA Maximum Average or DC Current Through GND Pin (per chip side) TJ = 85 °C -- 86 mA TJ = 110 °C -- 41 mA Maximum Average or DC Current (Through pin) Push-Pull 1x -- 11 mA Push-Pull 2x -- 16 OD 1x -- 11 OD 2x -- 21 OD 4x -- 43 Current at Input Pin -1.0 1.0 mA Input leakage (Absolute Value) -- 1000 nA Storage Temperature Range -65 150 °C Junction Temperature -- 150 °C Moisture Sensitivity Level 1 Supply voltage on V DD relative to GND -0.5 7 V Table 4: Electrostatic Discharge Ratings Parameter Min Max Unit ESD Protection (Human Body Model) 2000 -- V ESD Protection (Charged Device Model) 500 -- V Table 5: Recommended Operating Conditions Parameter Condition Min Max Unit Supply Voltage (VDD)1 . 7 1 5 . 5 V Supply Voltage 2 (VDD2)V DD2 ≤ VDD 1.71 V DD V Operating Temperature -40 125 °C Programming Voltage 7.25 7.75 V

3.4 ELECTRICAL CHARACTERISTICS

Maximal Voltage Applied to any PIN in High Impedance State -- V DD V Capacitor Value at VDD 0.1 -- μF Analog Input Common Mode Range Allowable Input Voltage at Analog Pins 0 V DD V Table 6: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted Parameter Description Condition Min Typ Max Unit VACMP ACMP Input Voltage Range Positive Input 0 -- V DD V Negative Input 0 -- 1.2 V VIH HIGH-Level Input Voltage Logic Input (Note 1) 0.7x VDD (Note 2) VDD+ 0.3 (Note 2) V Logic Input with Schmitt Trigger 0.8x VDD (Note 2) VDD+ 0.3 (Note 2) V Low-Level Logic Input (Note 1) 1.25 -- VDD+ 0.3 (Note 2) V VIL LOW-Level Input Voltage Logic Input (Note 1) GND- 0.3 -- 0.3x VDD (Note 2) V Logic Input with Schmitt Trigger GND- 0.3 -- 0.2x VDD (Note 2) V Low-Level Logic Input (Note 1) GND- 0.3 -- 0.5 V VHYS Schmitt Trigger Hysteresis Voltage Logic Input with Schmitt Trigger, VDD = 1.8 V ± 5 % 0.10 0.41 0.66 V Logic Input with Schmitt Trigger, VDD = 3.3 V ± 10 % 0.29 0.62 0.94 Logic Input with Schmitt Trigger, VDD = 5.0 V ± 10 % 0.44 0.90 1.38 VOH HIGH-Level Output Voltage Push-Pull, IOH = 100 μA, 1x Drive, VDD = 1.8 V ± 5 % 1.69 1.79 -- V Push-Pull, IOH = 3 mA, 1x Drive, VDD = 3.3 V ± 10 % 2.74 3.12 -- V Push-Pull, IOH = 5 mA, 1x Drive, VDD = 5.0 V ± 10 % 4.15 4.76 -- V PMOS OD, IOH = 100 μA, 1x Drive, VDD = 1.8 V ± 5 % 1.69 1.79 -- V PMOS OD, IOH = 3 mA, 1x Drive, VDD = 3.3 V ± 10 % 2.74 3.12 -- V PMOS OD, IOH = 5 mA, 1x Drive, VDD = 5.0 V ± 10 % 4.16 4.76 -- V Table 5: Recommended Operating Conditions(Continued) Parameter Condition Min Max Unit

Revision 2.3 17 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary VOH HIGH-Level Output Voltage Push-Pull, IOH = 100 μA, 2x Drive, VDD = 1.8 V ± 5 % 1.70 1.79 -- V Push-Pull, IOH = 3 mA, 2x Drive, VDD = 3.3 V ± 10 % 2.87 3.21 -- V Push-Pull, IOH = 5 mA, 2x Drive, VDD = 5.0 V ± 10 % 4.32 4.89 -- V PMOS OD, IOH = 100 μA, 2x Drive, VDD = 1.8 V ± 5 % 1.70 1.79 -- V PMOS OD, IOH = 3 mA, 2x Drive, VDD = 3.3 V ± 10 % 2.87 3.21 -- V PMOS OD, IOH = 5 mA, 2x Drive, VDD = 5.0 V ± 10 % 4.33 4.89 -- V VOL LOW-Level Output Voltage Push-Pull, IOL= 100 μA, 1x Drive, VDD = 1.8 V ± 5 % -- 0.01 0.03 V Push-Pull, IOL= 3 mA, 1x Drive, VDD = 3.3 V ± 10 % -- 0.13 0.23 V Push-Pull, IOL= 5 mA, 1x Drive, VDD = 5.0 V ± 10 % -- 0.19 0.24 V Push-Pull, IOL = 100 μA, 2x Drive, VDD = 1.8 V ± 5 % -- 0.01 0.01 V Push-Pull, IOL = 3 mA, 2x Drive, VDD = 3.3 V ± 10 % -- 0.06 0.11 V Push-Pull, IOL =5 mA, 2x Drive, VDD = 5.0 V ± 10 % -- 0.09 0.12 V Open-Drain, IOL = 100 μA, 1x Drive, VDD = 1.8 V ± 5 % -- 0.01 0.02 V Open-Drain, IOL = 3 mA, 1x Drive, VDD = 3.3 V ± 10 % -- 0.08 0.15 V Open-Drain, IOL = 5 mA, 1x Drive, VDD = 5.0 V ± 10 % -- 0.12 0.16 V Open-Drain, IOL = 100 μA, 2x Drive, VDD = 1.8 V ± 5 % -- 0.01 0.02 V Open-Drain, IOL = 3 mA, 2x Drive, VDD = 3.3 V ± 10 % -- 0.04 0.08 V Open-Drain, IOL = 5 mA, 2x Drive, VDD = 5.0 V ± 10 % -- 0.07 0.08 V Open-Drain NMOS 4x, IO8, IOL = 100 μA, VDD = 1.8 V ± 5 % -- 0.001 0.002 V Open-Drain NMOS 4x, IO8, IOL = 3 mA, VDD = 3.3 V ± 10 % -- 0.02 0.04 V Open-Drain NMOS 4x, IO8, IOL = 5 mA, VDD = 5.0 V ± 10 % -- 0.03 0.05 V Table 6: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

Revision 2.3 18 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary IOH HIGH-Level Output Pulse Current (Note 3) Push-Pull, VOH = VDD - 0.2, 1x Drive, VDD = 1.8 V ± 5 % 1.07 1.70 -- mA Push-Pull, VOH = 2.4 V, 1x Drive, VDD = 3.3 V ± 10 % 6.05 12.08 -- mA Push-Pull, VOH = 2.4 V, 1x Drive, VDD = 5.0 V ± 10 % 22.08 34.04 -- mA PMOS OD, VOH = VDD - 0.2, 1x Drive, VDD = 1.8 V ± 5 % 1.07 1.70 -- mA PMOS OD, VOH = 2.4 V, 1x Drive, VDD = 3.3 V ± 10 % 6.05 12.08 -- mA PMOS OD, VOH = 2.4 V, 1x Drive, VDD = 5.0 V ± 10 % 22.08 34.04 -- mA Push-Pull, VOH = VDD - 0.2, 2x Drive, VDD = 1.8 V ± 5 % 2.22 3.41 -- mA Push-Pull, VOH = 2.4 V, 2x Drive, VDD = 3.3 V ± 10 % 11.54 24.16 -- mA Push-Pull, VOH = 2.4 V, 2X Drive, VDD = 5.0 V ± 10 % 41.76 68.08 -- mA PMOS OD, VOH = VDD - 0.2, 2x Drive, VDD = 1.8 V ± 5 % 2.22 3.41 -- mA PMOS OD, VOH = 2.4 V, 2x Drive, VDD = 3.3 V ± 10 % 11.52 24.16 -- mA PMOS OD, VOH = 2.4 V, 2x Drive, VDD = 5.0 V ± 10 % 41.69 68.08 -- mA IOL LOW-Level Output Pulse Current (Note 3) Push-Pull, VOL = 0.15 V, 1x Drive, VDD = 1.8 V ± 5 % 0.92 1.69 -- mA Push-Pull, VOL = 0.4 V, 1x Drive, VDD = 3.3 V ± 10 % 4.88 8.24 -- mA Push-Pull, VOL = 0.4 V, 1X Drive, VDD = 5.0 V ± 10 % 7.22 11.58 -- mA Push-Pull, VOL = 0.15 V, 2x Drive, VDD = 1.8 V ± 5 % 1.83 3.38 -- mA Push-Pull, VOL = 0.4 V, 2x Drive, VDD = 3.3 V ± 10 % 9.75 16.49 -- mA Push-Pull, VOL = 0.4 V, 2X Drive, VDD = 5.0 V ± 10 % 13.83 23.16 -- mA Open-Drain, VOL = 0.15 V, 1x Drive, VDD = 1.8 V ± 5 % 1.38 2.53 -- mA Open-Drain, VOL = 0.4 V, 1x Drive, VDD = 3.3 V ± 10 % 7.31 12.37 -- mA Open-Drain, VOL = 0.4 V, 1X Drive, VDD = 5.0 V ± 10 % 10.82 17.38 -- mA Open-Drain, VOL = 0.15 V, 2x Drive, VDD = 1.8 V ± 5 % 2.75 5.07 -- mA Open-Drain, VOL = 0.4 V, 2x Drive, VDD = 3.3 V ± 10 % 14.54 24.74 -- mA Open-Drain, VOL = 0.4 V, 2X Drive, VDD = 5.0 V ± 10 % 17.34 34.76 -- mA Table 6: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

Revision 2.3 19 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary IOL LOW-Level Output Pulse Current (Note 3) Open-Drain NMOS 4x, IO8, VOL = 0.15 V, VDD = 1.8 V ± 5 % 7.21 9.00 -- mA Open-Drain NMOS 4x, IO8, VOL = 0.4 V, VDD = 3.3 V ± 10 % 31.32 41.06 -- mA Open-Drain NMOS 4X, IO8, VOL = 0.4 V, VDD = 5.0 V ± 10 % 41.06 55.18 -- mA TSU Startup Time From V DD rising past PONTHR 0.61 1.24 1.65 ms PONTHR Power-On Threshold V DD Level Required to Start Up the Chip 1.41 1.54 1.66 V POFFTHR Power-Off Threshold VDD Level Required to Switch Off the Chip 1.00 1.15 1.31 V RPUP Pull-up Resistance 1 M Pull-up 873.2 1094.7 1364.3 k Ω 100 k Pull-up 85.17 109.30 135.52 k Ω 10 k Pull-up 9.61 11.86 14.73 k Ω RPDWN Pull-down Resistance 1 M Pull-down 862.5 1096.3 1357.4 k Ω 100 k Pull-down 87.95 109.76 136.06 k Ω 10 k Pull-down 8.66 11.81 15.05 k Ω Note 1 No hysteresis. Note 2 The GreenPAK’s power rails are divided in two sides. IOs 0, 1, 2, 3, 4, 5, 6, 7, and 8 are connected to one side, IOs 9, 10, 12, 13, 14, 15, 16, and 17 to another. Note 3 DC or average current through any pin should not exceed value given in Absolute Maximum Conditions. Table 7: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted Parameter Description Condition Min Typ Max Unit VIH2 HIGH-Level Input Voltage IOs 9, 10, 12, 13, 14, 15, 16, Logic Input (Note 1) 0.7x VDD (Note 2) VDD+ 0.3 (Note 2) V Logic Input with Schmitt Trigger 0.8x VDD (Note 2) VDD+ 0.3 (Note 2) V Low-Level Logic Input (Note 1) 1.25 -- VDD+ 0.3 (Note 2) V VIL2 LOW-Level Input Voltage IOs 9, 10, 12, 13, 14, 15, 16, Logic Input (Note 1) GND- 0.3 -- 0.3x V DD (Note 2) V Logic Input with Schmitt Trigger GND- 0.3 -- 0.2x VDD (Note 2) V Low-Level Logic Input (Note 1) GND- 0.3 -- 0.5 V VHYS Schmitt Trigger Hysteresis Voltage IOs 9, 10, 12, 13, 14, 15, 16, Logic Input with Schmitt Trigger, V DD2 = 1.8 V ± 5 % 0.10 0.41 0.66 V Logic Input with Schmitt Trigger, VDD2 = 3.3 V ± 10 % 0.29 0.62 0.94 V Logic Input with Schmitt Trigger, VDD2 = 5.0 V ± 10 % 0.29 0.62 0.94 V Table 6: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

Revision 2.3 20 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary VOH2 HIGH-Level Output Voltage IOs 9, 10, 12, 13, 14, 15, 16, Push-Pull 1x, Open-Drain PMOS 1x, IOH = 100 μA, VDD2 = 1.8 V ± 5 % 1.68 1.79 -- V Push-Pull, IOH = 3 mA, 1x Drive, VDD2 = 3.3 V ± 10 % 2.70 3.12 -- V PMOS OD, IOH = 3 mA, 1x Drive, VDD2 = 3.3 V ± 10 % 2.70 3.12 -- V Push-Pull, PMOS OD, IOH = 3 mA, 1x Drive, VDD2 = 5.0 V ± 10 % 4.15 4.76 -- V Push-Pull 2x, Open-Drain PMOS 2x, IOH = 100 μA, VDD2 = 1.8 V ± 5 % 1.70 1.79 -- V Push-Pull, IOH = 3 mA, 2x Drive, VDD2 = 3.3 V ± 10 % 2.85 3.21 -- V PMOS OD, IOH = 3 mA, 2x Drive, VDD2 = 3.3 V ± 10 % 2.86 3.21 -- V Push-Pull, PMOS OD, IOH = 3 mA, 2x Drive, VDD2 = 5.0 V ± 10 % 4.32 4.89 -- V VOL2 LOW-Level Output Voltage IOs 9, 10, 12, 13, 14, 15, 16, Push-Pull 1x, I OL= 100 μA, VDD2 = 1.8 V ± 5 % -- 0.010 0.015 V Push-Pull, IOL= 3 mA, 1x Drive, VDD2 = 3.3 V ± 10 % -- 0.13 0.23 V Push-Pull, IOL= 3 mA, 1x Drive, VDD2 = 5.0 V ± 10 % -- 0.19 0.24 V Push-Pull 2x, IOL = 100 μA, VDD2 = 1.8 V ± 5 % -- 0.007 0.010 V Push-Pull, IOL = 3 mA, 2x Drive, VDD2 = 3.3 V ± 10 % -- 0.06 0.11 V Push-Pull, IOL = 3 mA, 2x Drive, VDD2 = 5.0 V ± 10 % -- 0.09 0.12 V Open-Drain NMOS 1x, IOL = 100 μA, VDD2 = 1.8 V ± 5 % -- 0.007 0.010 V Open-Drain, IOL = 3 mA, 1x Drive, VDD2 = 3.3 V ± 10 % -- 0.08 0.15 V Open-Drain NMOS, IOL = 3 mA, 1x Drive, VDD2 = 5.0 V ± 10 % -- 0.12 0.16 V Open-Drain NMOS 2x, IOL = 100 μA, VDD2 = 1.8 V ± 5 % -- 0.003 0.010 V Open-Drain, IOL = 3 mA, 2x Drive, VDD2 = 3.3 V ± 10 % -- 0.04 0.08 V Open-Drain NMOS, IOL = 3 mA, 2x Drive, VDD2 = 5.0 V ± 10 % -- 0.07 0.08 V Open-Drain NMOS 4x, IO9, IOL = 100 μA, VDD2 = 1.8 V ± 5 % -- 0.001 0.004 V Open-Drain NMOS 4x, IO9, IOL = 3 mA, VDD2 = 3.3 V ± 10 % -- 0.02 0.04 V Open-Drain NMOS 4x, IO9, IOL = 3 mA, VDD2 = 5.0 V ± 10 % -- 0.03 0.05 V Table 7: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

Revision 2.3 21 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary IOH2 HIGH-Level Output Pulse Current (Note 3) IOs 9, 10, 12, 13, 14, 15, 16, Push-Pull 1x,Open-Drain PMOS 1x, VOH = VDD - 0.2, VDD2 = 1.8 V ± 5 % 1.03 1.70 -- mA Push-Pull, VOH = 2.4 V, 1x Drive, VDD2 = 3.3 V ± 10 % 6.05 12.08 -- mA Push-Pull, VOH = 2.4 V, 1x Drive, VDD2 = 5.0 V ± 10 % 22.08 34.04 -- mA PMOS OD, VOH = 2.4 V, 1x Drive, VDD2 = 3.3 V ± 10 % 6.05 12.08 -- mA PMOS OD, VOH = 2.4 V, 1x Drive, VDD2 = 5.0 V ± 10 % 22.08 34.04 -- mA Push-Pull 2x, Open-Drain PMOS 2x, VOH = VDD - 0.2, VDD2 = 1.8 V ± 5 % 2.03 3.41 -- mA Push-Pull, VOH = 2.4 V, 2x Drive, VDD2 = 3.3 V ± 10 % 11.54 24.16 -- mA Push-Pull, VOH = 2.4 V, 2x Drive, VDD2 = 5.0 V ± 10 % 41.76 68.08 -- mA PMOS OD, VOH = 2.4 V, 2x Drive, VDD2 = 3.3 V ± 10 % 11.52 24.16 -- mA PMOS OD, VOH = 2.4 V, 2x Drive, VDD2 = 5.0 V ± 10 % 41.69 68.08 -- mA IOL2 LOW-Level Output Pulse Current (Note 3) IOs 9, 10, 12, 13, 14, 15, 16, Push-Pull 1x, VOL = 0.15 V, VDD2 = 1.8 V ± 5 % 0.92 1.66 -- mA Push-Pull, VOL = 0.4 V, 1x Drive, VDD2 = 3.3 V ± 10 % 4.88 8.24 -- mA Push-Pull, VOL = 0.4 V, 1x Drive, VDD2 = 5.0 V ± 10 % 7.22 11.58 -- mA Push-Pull 2x, VOL = 0.15 V, VDD2 = 1.8 V ± 5 % 1.83 3.30 -- mA Push-Pull, VOL = 0.4 V, 2x Drive, VDD2 = 3.3 V ± 10 % 9.75 16.49 -- mA Push-Pull, VOL = 0.4 V, 2x Drive, VDD2 = 5.0 V ± 10 % 13.83 23.16 -- mA Open-Drain NMOS 1x, VOL = 0.15 V, VDD2 = 1.8 V ± 5 % 1.38 2.53 -- mA Open-Drain, VOL = 0.4 V, 1x Drive, VDD2 = 3.3 V ± 10 % 7.31 12.37 -- mA Open-Drain NMOS, VOL = 0.4 V, 1x Drive, VDD2 = 5.0 V ± 10 % 10.82 17.38 -- mA Open-Drain NMOS 2x, VOL = 0.15 V, VDD2 = 1.8 V ± 5 % 2.75 5.07 -- mA Open-Drain, VOL = 0.4 V, 2x Drive, VDD2 = 3.3 V ± 10 % 14.54 24.74 -- mA Open-Drain NMOS, VOL = 0.4 V, 2x Drive, VDD2 = 5.0 V ± 10 % 17.34 34.76 -- mA Open-Drain NMOS 4x, IO9, VOL = 0.15 V, VDD2 = 1.8 V ± 5 % 5.50 10.14 -- mA Open-Drain NMOS 4x, IO9, VDD2 = 3.3 V ± 10 % 31.32 41.06 -- mA Table 7: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

3.5 I2C PINS ELECTRICAL CHARACTERISTICS

3.6 ASYNCHRONOUS STATE MACHINE SPECIFICATION

Current (Note 3) IOs 9, 10, 12, 13, 14, 15, 16, Open-Drain NMOS 4x, IO9, V DD2 = 5.0 V ± 10 % 41.06 55.18 -- mA Note 1 No hysteresis. Note 2 The GreenPAK’s power rails are divided in two sides. IOs 0, 1, 2, 3, 4, 5, 6, 7, and 8 are connected to one side, IOs 9, 10, 12, 13, 14, 15, 16, and 17 to another. Note 3 DC or average current through any pin should not exceed value given in Absolute Maximum Conditions. Table 8: I2C Pins Timing Characteristics at T = -40 °C to 125 °C Unless Otherwise Noted Parameter Description Condition Min Typ Max Unit FSCL Clock Frequency, SCL V DD = 1.71 V to 5.5 V -- -- 400 kHz tLOW Clock Pulse Width Low V DD = 1.71 V to 5.5 V 1300 -- -- ns tHIGH Clock Pulse Width High V DD = 1.71 V to 5.5 V 600 -- -- ns tI Input Filter Spike Suppression (SCL, SDA) tAA Clock Low to Data Out Valid V DD = 1.71 V to 5.5 V -- -- 900 ns tBUF Bus Free Time between Stop and Start VDD = 1.71 V to 5.5 V 1300 -- -- ns tHD_STA Start Hold Time V DD = 1.71 V to 5.5 V 600 -- -- ns tSU_STA Start Set-up Time V DD = 1.71 V to 5.5 V 600 -- -- ns tHD_DAT Data Hold Time V DD = 1.71 V to 5.5 V 0 -- -- ns tSU_DAT Data Set-up Time V DD = 1.71 V to 5.5 V 100 -- -- ns tR Inputs Rise Time V DD = 1.71 V to 5.5 V -- -- 300 ns tF Inputs Fall Time V DD = 1.71 V to 5.5 V -- -- 300 ns tSU_STO Stop Set-up Time V DD = 1.71 V to 5.5 V 600 -- -- ns tDH Data Out Hold Time V DD = 1.71 V to 5.5 V 50 -- -- ns Table 9: Asynchronous State Machine Specifications at T = -40 °C to 125 °C Unless Otherwise Noted Parameter Description Condition Min Typ Max Unit tst_out_delay Asynchronous State Machine Output Delay Time VDD = 1.8 V ± 5 % 104 -- 213 nsVDD = 3.3 V ± 10 % 44 -- 89 VDD = 5.0 V ± 10 % 32 -- 58 tst_out Asynchronous State Machine Output Transition Time tst_pulse Asynchronous State Machine Input Pulse Acceptance Time Table 7: EC at T = -40 °C to 125 °C, VDD = 1.71 V to 5.5 V Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

3.7 MACROCELLS CURRENT CONSUMPTION

3.8 TIMING CHARACTERISTICS

tst_comp Asynchronous State Machine Input Compete Time Table 10: Typical Current Estimated for Each Macrocell at T = 25 °C Parameter Description Note VDD/VDD2 = 1.8 V VDD/VDD2 = 3.3 V VDD/VDD2 = 5.0 V Unit IDD Current Chip Quiescent, IDD1 0.45 0.75 1.12 μA Chip Quiescent, IDD2 0.015 0.021 0.029 μA OSC 2 MHz, pre-divide = 1 41.48 64.00 94.89 μA OSC 2 MHz, pre-divide = 8 25.68 32.41 43.22 μA OSC 25 kHz, pre-divide = 1 7.16 7.94 9.25 μA OSC 25 kHz, pre-divide = 8 6.97 7.60 8.68 μA OSC 25 MHz, pre-divide = 1 87.25 238.27 428.66 μA OSC 25 MHz, pre-divide = 1, Force On 87.25 238.27 428.67 μA OSC 25 MHz, pre-divide = 8 78.01 212.45 390.17 μA ACMP (each) 54.96 52.64 60.81 μA ACMP with buffer (each) 75.06 72.74 81.25 μA Vref (each) 49.70 47.32 55.60 μA Vref with buffer (each) 71.93 71.27 79.62 μA Table 11: Typical Delay Estimated for Each Macrocell at T = 25 °C Parameter Description Note VDD/VDD2 = 1.8 V VDD/VDD2 = 3.3 V VDD/VDD2 = 5.0 V Unit Rising Falling Rising Falling Rising Falling tpd Delay Digital Input to PP 1x 42 45 17 19 12 13 ns tpd Delay Digital Input with Schmitt Trig- ger to PP 1x 42 43 16 17 18 12 ns tpd Delay Low Voltage Digital input to PP 1x 45 428 17 177 12 120 ns tpd Delay Digital input to PMOS output 42 - 17 - 12 - ns tpd Delay Digital input to NMOS output - 80 - 27 - 18 ns tpd Delay Output enable from pin, OE Hi-Z to 1 53 - 21 - 15 - ns tpd Delay Output enable from pin, OE Hi-Z to 0 50 - 20 - 14 - ns tpd Delay LUT2bit (LATCH) 34 33 14 13 10 9 ns tpd Delay LATCH (LUT2bit) 30 34 14 13 10 9 ns tpd Delay LUT3bit (LATCH) 38 37 18 15 13 10 ns tpd Delay LATCH+nRESET(LUT3bit) 45 42 21 17 15 12 ns tpd Delay LUT4bit 28 33 14 13 10 9 ns tpd Delay LUT2bt 19 26 10 10 7 7 ns tpd Delay LUT3bit 28 34 14 13 10 9 ns Table 9: Asynchronous State Machine Specifications at T = -40 °C to 125 °C Unless Otherwise Noted(Continued) Parameter Description Condition Min Typ Max Unit

Revision 2.3 24 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary tpd Delay CNT/DLY Logic 40 38 18 15 13 11 ns tpd Delay P_DLY1C 367 356 165 160 123 119 ns tpd Delay P_DLY2C 720 718 314 312 233 231 ns tpd Delay P_DLY3C 1061 1060 462 460 343 341 ns tpd Delay P_DLY4C 1396 1400 609 609 451 451 ns tpd Delay Filter 200 200 78 78 53 53 ns tpd Delay ACMP (5 mV overdrive, IN- = 600 mV) 3000 3000 2000 2000 2000 2000 ns tw Pulse Width IO with 1x Push-Pull (min transmitted) 20 20 20 20 20 20 ns tw Pulse Width Filter (min transmitted) 150 150 55 55 35 35 ns Table 12: Typical Propagations Delays and Pulse Widths at T = 25 °C Parameter Description Note VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit tw Pulse Width, 1 cell mode: (any)edge detect, edge detect output 296 135 101 ns tw Pulse Width, 2 cell mode: (any)edge detect, edge detect output 597 272 203 ns tw Pulse Width, 3 cell mode: (any)edge detect, edge detect output 898 410 305 ns tw Pulse Width, 4 cell mode: (any)edge detect, edge detect output 1195 546 407 ns time1 Delay, 1 cell mode: (any)edge detect, edge detect output 55 2 41 8 n s time1 Delay, 2 cell mode: (any)edge detect, edge detect output 55 2 41 8 n s time1 Delay, 3 cell mode: (any)edge detect, edge detect output 55 2 41 8 n s time1 Delay, 4 cell mode: (any)edge detect, edge detect output 55 2 41 8 n s time2 Delay, 1 cell mode: both edge delay, edge detect output 367 165 106 ns time2 Delay, 2 cell mode: both edge delay, edge detect output 667 300 193 ns time2 Delay, 3 cell mode: both edge delay, edge detect output 968 440 279 ns time2 Delay, 4 cell mode: both edge delay, edge detect output 126 5 575 365 ns Table 13: Typical Pulse Width Performance at T = 25 °C Parameter VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit Filtered Pulse Width for Filter 0 < 114 < 47 < 30 ns Filtered Pulse Width for Filter 1 <75 <30 <19 ns Table 11: Typical Delay Estimated for Each Macrocell at T = 25 °C (Continued) Parameter Description Note VDD/VDD2 = 1.8 V VDD/VDD2 = 3.3 V VDD/VDD2 = 5.0 V Unit Rising Falling Rising Falling Rising Falling

3.9 OSC CHARACTERISTICS

Table 14: Typical Counter/Delay Offset Measurements Parameter RC OSC Freq RC OSC Power VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit Offset (Power-On Delay) 25 kHz auto 1.6 1.6 1.6 μs Offset (Power-On Delay), fast start 25 kHz auto 2.1 2.1 2.1 μs Offset (Power-On Delay) 2 MHz auto 0.4 0.2 0.2 μs Offset (Power-On Delay), fast start 2 MHz auto 0.7 0.5 0.4 μs Offset (Power-On Delay) 25 MHz auto 0.01 0.05 0.04 μs Frequency settling time 25 kHz auto 19 14 12 μs Frequency settling time 2 MHz auto 14 14 14 μs Variable (CLK period) 25 kHz forced 0-40 0-40 0-40 μs Variable (CLK period) 2 MHz forced 0-0.5 0-0.5 0-0.5 μs Variable (CLK period) 25 MHz 0-0.04 0-0.04 0-0.04 μs Tpd (non-delayed edge) 25 kHz/

2 MHz either 35 14 10 ns

Table 15: 25 kHz RC OSC0 Frequency Limits Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Minimum Value, kHz Maximum Value, kHz Minimum Value, kHz Maximum Value, kHz Minimum Value, kHz Maximum Value, kHz Table 16: 25 kHz RC OSC0 Frequency Error (Error Calculated Relative to Nominal Value) Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum)

Revision 2.3 26 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 17: 2 MHz RC OSC0 Frequency Limits Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Minimum Value, MHz Maximum Value, MHz Minimum Value, MHz Maximum Value, MHz Minimum Value, MHz Maximum Value, MHz Table 18: 2 MHz RC OSC0 Frequency Error (Error Calculated Relative to Nominal Value) Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum) Table 19: 25 MHz RC OSC1 Frequency Limits Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Minimum Value, MHz Maximum Value, MHz Minimum Value, MHz Maximum Value, MHz Minimum Value, MHz Maximum Value, MHz Table 20: 25 MHz RC OSC1 Frequency Error (Error Calculated Relative to Nominal Value) Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum)

Revision 2.3 27 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Note: 25 MHz RC OSC1 performance is not guaranteed at VDD < 2.5 V. Table 20: 25 MHz RC OSC1 Frequency Error (Error Calculated Relative to Nominal Value)(Continued) Power Supply Range (VDD), V Temperature Range +25 °C 0 °C to +125 °C -40 °C to +125 °C Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum) Error (% at Minimum) Error (% at Maximum)

3.9.1 OSC Power-On Delay

Note: DLY/CNT Counter Data = 100, RC OSC Power Setting: "Auto Power-On", RC OSC Clock to Matrix Input: "Enable". Table 21: OSC Power-On Delay, T = 25 °C Power Supply Range (VDD) V RC OSC0 2 MHz RC OSC0 25 kHz RC OSC1 Typical Value, ns Maximum Value, ns Typical Value, µs Maximum Value, µs Typical Value, ns Maximum Value, ns Table 22: OSC Power-On Delay, T = 25 °C, Fast Start-Up Time Mode Power Supply Range (VDD) V RC OSC0 2 MHz RC OSC1 25 kHz Typical Value, ns Maximum Value, ns Typical Value, µs Maximum Value, µs

3.10 ACMP CHARACTERISTICS

Table 23: ACMP Specifications at T = -40 °C to +85 °C, VDD = 2.3 V to 5.5 V, Unless Otherwise Noted Parameter Description Note Conditions Min Typ Max Unit VACMP ACMP Input Voltage Range Positive Input VDD = 1.8 V ± 5% 0- - V DD V Negative Input 0 -- 1.2 V Positive Input V DD = 3.3 V ± 10% 0- - V DD V Negative Input 0 -- 1.2 V Positive Input V DD = 5.0 V ± 10% 0- - V DD V Negative Input 0 -- 1.2 V Voffset ACMP Input Offset Voltage Low Bandwidth - Enable, Vhys = 0 mV, Gain = 1, Vref = 50 mV to 1200 mV, V DD = 1.71 V to 5.5 V T = -40 °C to 85 °C -10.9 -- 10.9 mV Low Bandwidth - Disable, Vhys = 0 mV, Gain =1, Vref = 50 mV to 1200 mV, V DD = 1.71 V to 5.5 V T = -40 °C to 85 °C -10.7 -- 10.5 mV tstart ACMP Start Time ACMP Power-On delay, Minimal required wake time for the "Wake and Sleep function", Regulator and Charge Pump set to automatic ON/OFF BG = 550 μs, T = 25 °C V DD = 1.71 V to 5.5 V -- 609.7 862.2 µS BG = 550 μs, T = -40 °C to 85 °C VDD = 1.71 V to 5.5 V -- 675.0 1028.8 µS BG = 100 μs, T = 25 °C VDD = 2.7 V to 5.5 V -- 132.4 176.2 µS BG = 100 μs, T = -40 °C to 85 °C VDD = 2.7 V to 5.5 V -- 149.4 213.5 µS ACMP Power-On delay, Minimal required wake time for the "Wake and Sleep function", Regulator and Charge Pump always OFF BG = 550 μs, T = 25 °C V DD = 3V to 5.5 V -- 609.5 862.0 µS BG = 550 μs, T = -40 °C to 85°C VDD = 3 V to 5.5 V -- 674.6 1027.5 µS BG = 100 μs, T = 25 °C VDD = 3 V to 5.5 V -- 131.6 176.0 µS BG = 100 μs, T = -40 °C to 85°C V DD = 3 V to 5.5 V -- 149.2 213.3 µS

Revision 2.3 30 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary VHYS Built-in Hysteresis VHYS = 25 mV VIL = Vin - VHYS/2 VIH = Vin + VHYS/2 LB - Enabled, T = 25 °C 7.32 -- 35.5 mV LB - Disabled, T = 25 °C 10.0 -- 38.5 mV VHYS = 50 mV VIL = Vin - VHYS VIH = VHYS LB - Enabled, T = 25 °C 42.9 -- 57.8 mV LB - Disabled, T = 25 °C 44.2 -- 54.3 mV VHYS = 200 mV VIL = Vin - VHYS VIH = VHYS LB - Enabled, T = 25 °C 192.7 -- 208.7 mV LB - Disabled, T = 25 °C 193.3 -- 204.8 mV VHYS = 25 mV VIL = Vin - VHYS/2 VIH = Vin + VHYS/2 LB - Enabled 0.0 -- 58.0 mV LB - Disabled 0.0 -- 52.9 mV VHYS = 50 mV VIL = Vin - VHYS VIH = VHYS LB - Enabled 22.5 -- 86.9 mV LB - Disabled 29.2 -- 76.5 mV VHYS = 200 mV VIL = Vin - VHYS VIH = VHYS LB - Enabled 157.1 -- 251.6 mV LB - Disabled 160.2 -- 245.3 mV Rsin Series Input Resistance Gain = 1x -- 100.0 -- ΜΩ Gain = 0.5x -- 1.0 -- ΜΩ Gain = 0.33x -- 0.8 -- ΜΩ Gain = 0.25x -- 1.0 -- ΜΩ PROP Propagation Delay, Response Time Low Bandwidth - Enable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 50 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 50 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 50 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 50 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 250 mV Low to High, High to Low, Table 23: ACMP Specifications at T = -40 °C to +85 °C, V DD = 2.3 V to 5.5 V, Unless Otherwise Noted(Continued) Parameter Description Note Conditions Min Typ Max Unit

Revision 2.3 31 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary PROP Propagation Delay, Response Time Low Bandwidth - Disable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 250 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 250 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 250 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 600 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 600 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 600 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 600 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 850 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 850 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 850 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 850 mV Low to High, High to Low, Table 23: ACMP Specifications at T = -40 °C to +85 °C, V DD = 2.3 V to 5.5 V, Unless Otherwise Noted(Continued) Parameter Description Note Conditions Min Typ Max Unit

Revision 2.3 32 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary PROP Propagation Delay, Response Time Low Bandwidth - Enable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 1200 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(1.71..3.3)V, Overdrive=5 mV, Vref = 1200 mV Low to High, High to Low, Low Bandwidth - Enable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 1200 mV Low to High, High to Low, Low Bandwidth - Disable, Gain = 1, VDD=(3.3..5.5)V, Overdrive=5 mV, Vref = 1200 mV Low to High, High to Low, G Gain error (including threshold and internal Vref error), T = -40 °C to +85 °C G = 1, V DD = 1.71 V Vref = 50 mV to 1200 mV -- 1 -- Table 23: ACMP Specifications at T = -40 °C to +85 °C, VDD = 2.3 V to 5.5 V, Unless Otherwise Noted(Continued) Parameter Description Note Conditions Min Typ Max Unit

3.11 ANALOG TEMPERATURE SENSOR CHARACTERISTICS

Internal Vref error, Vref = 1200 mV VDD = 1.8 V ± 5% -1.01% -- 0.70% VDD = 3.3 V ± 10% -1.06% -- 0.72% VDD = 5.0 V ± 10% -1.16% -- 0.74% Internal Vref error, Vref = 1000 mV VDD = 1.8 V ± 5% -1.14% -- 0.76% VDD = 3.3 V ± 10% -1.04% -- 0.73% VDD = 5.0 V ± 10% -1.15% -- 0.73% Internal Vref error, Vref = 500 mV VDD = 1.8 V ± 5% -1.11% -- 0.75% VDD = 3.3 V ± 10% -1.10% -- 0.78% VDD = 5.0 V ± 10% -1.15% -- 0.80% Table 24: TS Output vs Temperature (Output Range 1) T, °C VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Typical, V Accuracy, % Typical, V Accuracy, % Typical, V Accuracy, % Table 23: ACMP Specifications at T = -40 °C to +85 °C, V DD = 2.3 V to 5.5 V, Unless Otherwise Noted(Continued) Parameter Description Note Conditions Min Typ Max Unit

Revision 2.3 34 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 25: TS Output vs Temperature (Output Range 2) T, °C VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Typical, V Accuracy, % Typical, V Accuracy, % Typical, V Accuracy, % Table 26: TS Output Error (Output Range 1) VDD, V Error at T -40 °C, -20 °C, 0 °C, 20 °C, 40 °C, 60 °C, 80 °C, Table 27: TS Output Error (Output Range 2) VDD, V Error at T -40 °C, -20 °C, 0 °C, 20 °C, 40 °C, 60 °C, 80 °C,

Revision 2.3 35 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 27: TS Output Error (Output Range 2)(Continued) VDD, V Error at T -40 °C, -20 °C, 0 °C, 20 °C, 40 °C, 60 °C, 80 °C,

4 User Programmability

Non-volatile memory (NVM) is used to configure the SLG46538-A’s connection matrix routing and macrocells. The NVM is One Time Programmable (OTP). However, Dialog’s GreenPAK development tools can be used to configure the connection matrix and macrocells, without programming the NVM, to allow on-chip emulation. This configuration will remain active on the device as long as it remains powered and can be re-written as needed to facilitate rapid design changes. When a design is ready for in-circuit testing, the same GreenPAK development tools can be used to program the NVM and create samples for small quantity builds. Once the NVM is programmed, the device will retain this configuration for the duration of i ts lifetime. Once the design is finalized, the design file can be forwarded to Dialog to integrate into the production process. Figure 2: Steps to Create a Custom GreenPAK Device Product Definition E-mail Product Idea, Definition, Drawing or Schematic to CMBUGreenPAK@diasemi.com Dialog Semiconductor Applications Engineers will review design specifications with customer Samples, Design and Characterization Report send to customer Customers verifies GreenPAK design Customer creates their own design in GreenPAK Designer Emulate design to verify behavior Program Engineering Samples with GreenPAK Development Tools Customer verifies GreenPAK in system design Custom GreenPAK part enters production GreenPAK Design approved GreenPAK Design Approved in system test GreenPAK Design approved E-mail .gpx to CMBUGreenPAK@diasemi.com

Revision 2.3 37 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 5I O P i n s The SLG46538-A has a total of 17 multi-function IO pins which can function as either a user defined Input or Output, as well as serving as a special function (such as voltage reference output), or serving as a signal for programming of the on-chip Non Volatile Memory (NVM). Refer to Section 2 for normal and programming mode pin definitions. Normal Mode pin definitions are as follows:  VDD: VDD power supply  IO0: general purpose input  IO1: general purpose input or output with OE  IO2: general purpose input or output  IO3: general purpose input or output with OE  IO4: general purpose input or output or analog comparator 0(+)  IO5: general purpose input or output with OE or analog comparator 0(-)  IO6: general purpose input or OD output I2C SCL  IO7: general purpose input or OD output I2C SDA  IO8: general purpose input or output with OE or analog comparator 1(+)  GND: ground  IO9: general purpose input or output or analog comparator 1(-)  IO10: general purpose input or output with OE or analog comparator 2(+)  VDD2: VDD2 power supply  IO12: general purpose input or output or analog comparator 3(+)  IO13: general purpose input or output with OE  IO14: general purpose input or output  IO15: general purpose input or output with OE and Vref output (Vref1)  IO16: general purpose input or output with OE and Vref output (Vref0)  IO17: general purpose input or output or external clock input Programming Mode pin definitions are as follows:  VDD: VDD power supply  IO0: VPP programming voltage  IO6: Programming SCL  IO7: Programming SDA  GND: ground Of the 17 user defined IO pins on the SLG46538-A, all but one of the pins (IO0) can serve as both digital input and digital output. IO0 can only serve as a digital input pin. IOs 0, 1, 2, 3, 4, 5, 6, 7, and 8 are powered from VDD and IOs 9, 10, 12, 13, 14, 15, 16, and 17 are powered from VDD2. All internal macrocells are powered from VDD. Voltage on VDD2 Pin must be less or equal voltage on VDD Pin. In case VDD2 floating and any Pin powered from VDD2 is configured as input, ESD pin protection diodes must be considered when applying an input signal to the pin. This will cause a significant current leakage. In case VDD2 floating and any Pin powered from VDD2 is configured as Output, the pin will behave as NMOS Open-Drain. It is not recommended to connect VDD2 to the GND.

5.1 INPUT MODES

Each IO pin can be configured as a digital input pin with/witho ut buffered Schmitt Trigger, or can also be configured as a low voltage digital input. IOs 4, 5, 8, 9, 10, and 12 can also be configured to serve as analog inputs to the on-chip comparators. IOs 15 and 16 can also be configured as analog reference voltage inputs.

5.2 OUTPUT MODES

IOs 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 13, 14, 15, 16, and 17 can all be configured as digital output pins.

5.3 PULL-UP/DOWN RESISTORS

All IO pins have the option for user selectable resistors connected to the input structure. The selectable values on these resistors are 10 kΩ, 100 kΩ, and 1 MΩ. In the case of IO0, the resistors are fixed to a pull-down co nfiguration. In the case of all other IO pins, the internal resistors can be configured as either Pull-up or Pull-downs.

5.4 GPI STRUCTURE

5.4.1 GPI Structure (for IO0)

Figure 3: IO0 GPI Structure Diagram LV_EN SMT_EN WOSMT_EN OE Digital IN 900 kΩ 90 kΩ 10 kΩ Floating Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input Input Mode [1:0] 00: Digital In without Schmitt Trigger, wosmt_en = 1, OE = 0 01: Digital In with Schmitt Trigger, smt_en = 1, OE = 0 10: Low Voltage Digital In mode, lv_en = 1, OE = 0 11: Reserved Note 1: OE cannot be selected by user Note 2: OE is Matrix output, Digital In is Matrix input OE OE PAD

5.5 MATRIX OE IO STRUCTURE

5.5.1 Matrix OE IO Structure (for IOs 1, 3, 5)

Figure 4: Matrix OE IO Structure Diagram Digital OUT OE Digital OUT OE VDD VDD PP1x_EN OD2x_EN 172 Ω (Note 2) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO (For IO5 only) Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Pull-up_EN Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Digital OUT OE VDD PP2x_EN PAD Digital OUT OE VDD Input Mode [1:0] 00: Digital In without Schmitt Trigger, wosmt_en = 1 01: Digital In with Schmitt Trigger, smt_en = 1 10: Low Voltage Digital In mode, lv_en = 1 11: Analog IO mode Output Mode [1:0] 00: Push-Pull 1x mode, pp1x_en = 1 01: Push-Pull 2x mode, pp2x_en = 1, pp1x_en = 1 10: NMOS 1x Open-Drain mode, od1x_en = 1 11: NMOS 2x Open-Drain mode, od2x_en = 1, od1x_en = 1 Note 1: Digital Out and OE are Matrix output, Digital In is Matrix input Note 2: Can be varied over PVT, for reference only OD1x_EN

5.5.2 Matrix OE IO Structure (for IOs 10, 13, 15, 16)

Figure 5: Matrix OE IO Structure Diagram Digital OUT OE Digital OUT OE VDD2 VDD2 PP1x_EN OD2x_EN 172 Ω (Note 2) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO (For IOs 10, 15, 16 only) Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Pull-up_EN Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Digital OUT OE VDD2 PP2x_EN PAD Digital OUT OE VDD2 Input Mode [1:0] 00: Digital In without Schmitt Trigger, wosmt_en = 1 01: Digital In with Schmitt Trigger, smt_en = 1 10: Low Voltage Digital In mode, lv_en = 1 Output Mode [1:0] 00: Push-Pull 1x mode, pp1x_en = 1 01: Push-Pull 2x mode, pp2x_en = 1, pp1x_en = 1 10: NMOS 1x Open-Drain mode, od1x_en = 1 11: NMOS 2x Open-Drain mode, od2x_en = 1, od1x_en = 1 Note 1: Digital Out and OE are Matrix output, Digital In is Matrix input Note 2: Can be varied over PVT, for reference only OD1x_EN

5.5.3 Matrix OE IO Structure (for IOs 6 and 7)

Figure 6: Matrix OE IO Structure Diagram LV_EN SMT_EN WOSMT_EN OE Digital IN 900 kΩ 90 kΩ 10 kΩ Floating Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE PAD Digital OUT OE OD1x_EN IO6, IO7 Mode [2:0] 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Reserved 100: Reserved 101: Open-Drain NMOS 110: Reserved 111: Reserved Note: Digital Out and OE are Matrix output, Digital In is Matrix input

5.5.4 Matrix OE 4x Drive Structure (for IO8)

Figure 7: Matrix OE IO 4x Drive Structure Diagram Digital OUT OE Digital OUT OE VDD VDD PP1x_EN ODn_EN 4x_EN ODn_EN 4x_EN ODn_EN OD1x_EN 4x_EN Digital OUT OE ODn_EN OD2x_EN 4x_EN 172 Ω (Note 2) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Pull-up_EN Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Digital OUT OE VDD PP2x_EN PAD Digital OUT OE Digital OUT OE VDD Input Mode [1:0] 00: Digital In without Schmitt Trigger, wosmt_en = 1 01: Digital In with Schmitt Trigger, smt_en = 1 10: Low Voltage Digital In mode, lv_en = 1 11: analog IO mode Output Mode [1:0] 00: Push-Pull 1x mode, pp1x_en = 1 01: Push-Pull 2x mode, pp2x_en = 1, pp1x_en = 1 10: NMOS Open-Drain 1x mode, od1x_en = 1, odn_en = 1 11: NMOS Open-Drain 2x mode, od2x_en = 1, od1x_en = 1, odn_en = 1 Note 1: Digital Out and OE are Matrix output, Digital In is Matrix input Note 2: Can be varied over PVT, for reference only

5.6 REGISTER OE IO STRUCTURE

5.6.1 IO Structure (for IOs 2 and 4)

Figure 8: IO Structure Diagram Digital OUT OE Digital OUT OE ODn_EN Digital OUT OE VDD VDD PAD 2x_EN ODn_EN 2x_EN PP_EN ODp_EN 172 Ω (Note 2) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO (For IO4 only) Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Pull-up_EN Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Digital OUT OE VDD 2x_EN PP_EN ODp_EN Mode [2:0] 000: Digital In without Schmitt Trigger, wosmt_en = 1, OE = 0 001: Digital In with Schmitt Trigger, smt_en = 1, OE = 0 010: Low Voltage Digital In mode, lv_en = 1, OE = 0 011: Analog IO mode 100: Push-Pull mode, pp_en = 1, OE = 1 101: NMOS Open-Drain mode, odn_en = 1, OE = 1 110: PMOS Open-Drain mode, odp_en = 1, OE = 1 111: Analog IO and NMOS Open-Drain mode, odn_en = 1 and AIO_en = 1 Note 1: OE cannot be selected by user and is controlled by register Note 2: Can be varied over PVT, for reference only

5.6.2 IO Structure (for IOs 12, 14, 17)

Figure 9: IO Structure Diagram Digital OUT OE Digital OUT OE ODn_EN Digital OUT OE VDD2 VDD2 PAD 2x_EN ODn_EN 2x_EN PP_EN ODp_EN 172 Ω (Note 2) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO (For IO12 only) Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Pull-up_EN Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Digital OUT OE VDD2 2x_EN PP_EN ODp_EN Mode [2:0] 000: Digital In without Schmitt Trigger, wosmt_en = 1, OE = 0 001: Digital In with Schmitt Trigger, smt_en = 1, OE = 0 010: Low Voltage Digital In mode, lv_en = 1, OE = 0 011: Analog IO mode 100: Push-Pull mode, pp_en = 1, OE = 1 101: NMOS Open-Drain mode, odn_en = 1, OE = 1 110: PMOS Open-Drain mode, odp_en = 1, OE = 1 111: Analog IO and NMOS Open-Drain mode, odn_en = 1 and AIO_en = 1 Note 1: OE cannot be selected by user and is controlled by register Note 2: Can be varied over PVT, for reference only VDD2

Revision 2.3 45 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 5.6.3 4x Drive Structure (for IO9) Figure 10: IO 4x Drive Structure Diagram Digital OUT OE Digital OUT OE Digital OUT OE VDD VDD PP1x_EN Digital OUT OE ODn_EN 4x_EN ODn_EN 4x_EN ODn_EN OD1x_EN 4x_EN Digital OUT OE ODn_EN OD2x_EN 4x_EN 172 Ω (Note 3) LV_EN SMT_EN OE WOSMT_EN Digital IN Analog IO Non-Schmitt Trigger Input Schmitt Trigger Input Low Voltage Input OE OE 900 kΩ 90 kΩ 10 kΩ Floating Res_sel [1:0] 00: Floating 01: 10 kΩ 10: 100 kΩ 11: 1 MΩ Pull-up_EN VDD Digital OUT OE VDD PP2x_EN PAD Mode [2:0] 000: Digital In without Schmitt Trigger, wosmt_en = 1, OE = 0 001: Digital In with Schmitt Trigger, smt_en = 1, OE = 0 010: Low Voltage Digital In mode, lv_en = 1, OE = 0 011: Analog IO mode 100: Push-Pull mode, pp_en = 1, OE = 1 101: NMOS Open-Drain mode, odn_en = 1, OE = 1 110: PMOS Open-Drain mode, odp_en = 1, OE = 1 111: Analog IO and NMOS Open-Drain mode, odn_en = 1 and AIO_en = 1 Note 1: OE cannot be selected by user Note 2: Digital Out and OE are Matrix output, Digital In is Matrix input Note 3: Can be varied over PVT, for reference only

6 Connection Matrix

The Connection Matrix in the SLG46538-A is used to create the i nternal routing for internal functional macrocells of the devic e once it is programmed. The registers are programmed from the on e-time NVM cell during Test Mode Operation. The output of each functional macrocell within the SLG46538-A has a specific digital bit code assigned to it that is either set to active “High” or inactive “Low” based on the design that is created. Once the 20 48 register bits within the SLG46538-A are programmed a fully custom circuit will be created. The Connection Matrix has 64 inputs and 110 outputs. Each of the 64 inputs to the Connection Matrix is hard-wired to the digital output of a particular source macrocell, including IO pins, LUT s, analog comparators, other digital resources, such as V DD and GND. The input to a digital macrocell uses a 6-bit register to select one of these 64 input lines. For a complete list of the SLG46538-A’s register table, see Section 20. Figure 11: Connection Matrix Figure 12: Connection Matrix Example Ground 0 IO0 Digital In 1 IO1 Digital In 2 IO2 Digital In 3 Matrix Input Signal Functions N Resetb_core 62 VDD 63 N Function Registers 109 Matrix OUT: PD of either Temp out or XTAL Osc Registers [877:872] Matrix OUT: ASM-state0-EN0 Registers [5:0] Matrix OUT: ASM-state0-EN1 Registers [13:8] Matrix OUT: ASM-state0-EN2 Registers [21:16] Matrix Inputs Matrix Outputs IO9 IO10 IO12 Connection Matrix LUT IO10 IO9 LUT IO12 Function

6.1 MATRIX INPUT TABLE

Table 28: Matrix Input Table Matrix Input Number Matrix Input Signal Function Matrix Decode 5 4 3 2 1 0

0 G N D 000000

1 I O 0 D i g i t a l I n p u t 000001

2 I O 1 D i g i t a l I n p u t 000010

3 I O 2 D i g i t a l I n p u t 000011

4 I O 3 D i g i t a l I n p u t 000100

5 I O 4 D i g i t a l I n p u t 000101

6 I O 5 D i g i t a l I n p u t 000110

7 I O 8 D i g i t a l I n p u t 000111

8 L U T 2 _ 0 / D F F 0 O u t p u t 001000

9 L U T 2 _ 1 / D F F 1 O u t p u t 001001

1 0 L U T 2 _ 2 / D F F 2 O u t p u t 001010 1 1 L U T 2 _ 3 / P G e n O u t p u t 001011 1 2 L U T 3 _ 0 / D F F 3 O u t p u t 001100 1 3 L U T 3 _ 1 / D F F 4 O u t p u t 001101 1 4 L U T 3 _ 2 / D F F 5 O u t p u t 001110 1 5 L U T 3 _ 3 / D F F 6 O u t p u t 001111 1 6 L U T 3 _ 4 / D F F 7 O u t p u t 010000 1 7 L U T 3 _ 5 / C N T _ D L Y 2 ( 8 b i t ) O u t p u t 010001 1 8 L U T 3 _ 6 / C N T _ D L Y 3 ( 8 b i t ) O u t p u t 010010 1 9 L U T 3 _ 7 / C N T _ D L Y 4 ( 8 b i t ) O u t p u t 010011 2 0 L U T 3 _ 8 / C N T _ D L Y 5 ( 8 b i t ) O u t p u t 010100 2 1 L U T 3 _ 9 / C N T _ D L Y 6 ( 8 b i t ) O u t p u t 010101 2 2 L U T 4 _ 0 / C N T _ D L Y 0 ( 1 6 b i t ) O u t p u t 010110 2 3 L U T 4 _ 1 / C N T _ D L Y 1 ( 1 6 b i t ) O u t p u t 010111 2 4 L U T 3 _ 1 0 / P i p e D e l a y ( 1 s t s t a g e ) O u t p u t 011000 2 5 P i p e D e l a y O u t p u t 0 011001 2 6 P i p e D e l a y O u t p u t 1 011010

27 Internal OSC Pre-Divided by 1/2/4/8 Output and Post-Divided by 1/

2/3/4/8/12/24/64 Output (25 kHz/2 MHz) 011011

28 Internal OSC Pre-Divided by 1/2/4/8 Output and Post-Divided by 1/

2/3/4/8/12/24/64 Output (25 kHz/2 MHz) 011100 2 9 I n t e r n a l O S C P r e - D i v i d e d b y 1 / 2 / 4 / 8 O u t p u t ( 2 5 M H z ) 011101 3 0 F i l t e r 0 / E d g e D e t e c t 0 O u t p u t 011110 3 1 F i l t e r 1 / E d g e D e t e c t 1 O u t p u t 011111

32 IO6 Digital or I

2C _ v i r t u a l _ 0 I n p u t 100000

33 IO7 Digital or I 2C _ v i r t u a l _ 1 I n p u t 100001

34 I 2C _ v i r t u a l _ 2 I n p u t 100010

35 I 2C _ v i r t u a l _ 3 I n p u t 100011

36 I 2C _ v i r t u a l _ 4 I n p u t 100100

6.2 MATRIX OUTPUT TABLE

37 I 2C _ v i r t u a l _ 5 I n p u t 100101

38 I 2C _ v i r t u a l _ 6 I n p u t 100110

39 I 2C _ v i r t u a l _ 7 I n p u t 100111

4 0 A S M - s t a t e X - d o u t 0 101000 4 1 A S M - s t a t e X - d o u t 1 101001 4 2 A S M - s t a t e X - d o u t 2 101010 4 3 A S M - s t a t e X - d o u t 3 101011 4 4 A S M - s t a t e X - d o u t 4 101100 4 5 A S M - s t a t e X - d o u t 5 101101 4 6 A S M - s t a t e X - d o u t 6 101110 4 7 A S M - s t a t e X - d o u t 7 101111 4 8 I O 9 D i g i t a l I n p u t 110000 4 9 I O 1 0 D i g i t a l I n p u t 110001 5 0 I n v e r t e r O u t p u t 110010 5 1 I O 1 2 D i g i t a l I n p u t 110011 5 2 I O 1 3 D i g i t a l I n p u t 110100 5 3 I O 1 4 D i g i t a l I n p u t 110101 5 4 I O 1 5 D i g i t a l I n p u t 110110 5 5 I O 1 6 D i g i t a l I n p u t 110111 5 6 I O 1 7 D i g i t a l I n p u t 111000 5 7 A C M P _ 0 O u t p u t 111001 5 8 A C M P _ 1 O u t p u t 111010 5 9 A C M P _ 2 O u t p u t 111011 6 0 A C M P _ 3 O u t p u t 111100 6 1 P r o g r a m m a b l e D e l a y w i t h E d g e D e t e c t o r O u t p u t 111101 6 2 n R S T _ c o r e ( P O R ) a s m a t r i x i n p u t 111110 63 V DD 111111 Table 29: Matrix Output Table Register Bit Address Matrix Output Signal Function Matrix Output Number [7:0] Matrix OUT: ASM-state0-EN0 0 [15:8] Matrix OUT: ASM-state0-EN1 1 [23:16] Matrix OUT: ASM-state0-EN2 2 [31:24] Matrix OUT: ASM-state1-EN0 3 [39:32] Matrix OUT: ASM-state1-EN1 4 [47:40] Matrix OUT: ASM-state1-EN2 5 Table 28: Matrix Input Table(Continued) Matrix Input Number Matrix Input Signal Function Matrix Decode 5 4 3 2 1 0

Revision 2.3 49 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary [55:48] Matrix OUT: ASM-state2-EN0 6 [63:56] Matrix OUT: ASM-state2-EN1 7 [71:64] Matrix OUT: ASM-state2-EN2 8 [79:72] Matrix OUT: ASM-state3-EN0 9 [87:80] Matrix OUT: ASM-state3-EN1 10 [95:88] Matrix OUT: ASM-state3-EN2 11 [103:96] Matrix OUT: ASM-state4-EN0 12 [111:104] Matrix OUT: ASM-state4-EN1 13 [119:112] Matrix OUT: ASM-state4-EN2 14 [127:120] Matrix OUT: ASM-state5-EN0 15 [135:128] Matrix OUT: ASM-state5-EN1 16 [143:136] Matrix OUT: ASM-state5-EN2 17 [151:144] Matrix OUT: ASM-state6-EN0 18 [159:152] Matrix OUT: ASM-state6-EN1 19 [167:160] Matrix OUT: ASM-state6-EN2 20 [175:168] Matrix OUT: ASM-state7-EN0 21 [183:176] Matrix OUT: ASM-state7-EN1 22 [191:184] Matrix OUT: ASM-state7-EN2 23 [199:192] Matrix OUT: ASM-state-nRST 24 [207:200] Matrix OUT: IO1 Digital Output Source 25 [215:208] Matrix OUT: IO1 Output Enable 26 [223:216] Matrix OUT: IO2 Digital Output Source 27 [231:224] Matrix OUT: IO3 Digital Output Source 28 [239:232] Matrix OUT: IO3 Output Enable 29 [247:240] Matrix OUT: IO4 Digital Output Source 30 [255:248] Matrix OUT: IO5 Digital Output Source 31 [263:256] Matrix OUT: IO5 Output Enable 32 [271:264] Matrix OUT: IO6 Digital Output Source (SCL with VI/In put & NMOS Open-Drain) 33 [279:272] Matrix OUT: IO7 Digital Output Source (SDA with VI/In put & NMOS Open-Drain) 34 [287:280] Matrix OUT: IO8 Digital Output Source 35 [295:288] Matrix OUT: IO8 Output Enable 36 [303:296] Matrix OUT: IO9 Digital Output Source 37 [311:304] Matrix OUT: IO10 Digital Output Source 38 [319:312] Matrix OUT: IO10 Output Enable 39 [327:320] Matrix OUT: Inverter Input 40 [335:328] Reserved 41 [343:336] Matrix OUT: IO12 Digital Output Source 42 [351:344] Matrix OUT: IO13 Digital Output Source 43 [359:352] Matrix OUT: IO13 Output Enable 44 Table 29: Matrix Output Table (Continued) Register Bit Address Matrix Output Signal Function Matrix Output Number

Revision 2.3 50 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary [367:360] Matrix OUT: IO14 Digital Output Source 45 [375:368] Matrix OUT: IO15 Digital Output Source 46 [383:376] Matrix OUT: IO15 Output Enable 47 [391:384] Matrix OUT: IO16 Digital Output Source 48 [399:392] Matrix OUT: IO16 Output Enable 49 [407:400] Matrix OUT: IO17 Digital Output Source 50 [415:408] Matrix OUT: ACMP0 PDB (Power-Down) 51 [423:416] Matrix OUT: ACMP1 PDB (Power-Down) 52 [431:424] Matrix OUT: ACMP2 PDB (Power-Down) 53 [439:432] Matrix OUT: ACMP3 PDB (Power-Down) 54 [447:440] Matrix OUT: Input of Filter_0 with fixed time edge de tector 55 [455:448] Matrix OUT: Input of Filter_1 with fixed time edge de tector 56 [463:456] Matrix OUT: Input of Programmable Delay & Edge Detect or 57 [471:464] Matrix OUT: OSC 25 kHz/2 MHz PDB (Power-Down) 58 [479:472] Matrix OUT: OSC 25 MHz PDB (Power-Down) 59 [487:480] Matrix OUT: IN0 of LUT2_0 or Clock Input of DFF0 60 [495:488] Matrix OUT: IN1 of LUT2_0 or Data Input of DFF0 61 [503:496] Matrix OUT: IN0 of LUT2_1 or Clock Input of DFF1 62 [511:504] Matrix OUT: IN1 of LUT2_1 or Data Input of DFF1 63 [519:512] Matrix OUT: IN0 of LUT2_2 or Clock Input of DFF2 64 [527:520] Matrix OUT: IN1 of LUT2_2 or Data Input of DFF2 65 [535:528] Matrix OUT: IN0 of LUT2_3 or Clock Input of PGen 66 [543:536] Matrix OUT: IN1 of LUT2_3 or nRST of PGen 67 [551:544] Matrix OUT: IN0 of LUT3_0 or Clock Input of DFF3 68 [559:552] Matrix OUT: IN1 of LUT3_0 or Data Input of DFF3 69 [567:560] Matrix OUT: IN2 of LUT3_0 or nRST (nSET) of DFF3 70 [575:568] Matrix OUT: IN0 of LUT3_1 or Clock Input of DFF4 71 [583:576] Matrix OUT: IN1 of LUT3_1 or Data Input of DFF4 72 [591:584] Matrix OUT: IN2 of LUT3_1 or nRST (nSET) of DFF4 73 [599:592] Matrix OUT: IN0 of LUT3_2 or Clock Input of DFF5 74 [607:600] Matrix OUT: IN1 of LUT3_2 or Data Input of DFF5 75 [615:608] Matrix OUT: IN2 of LUT3_2 or nRST (nSET) of DFF5 76 [623:616] Matrix OUT: IN0 of LUT3_3 or Clock Input of DFF6 77 [631:624] Matrix OUT: IN1 of LUT3_3 or Data Input of DFF6 78 [639:632] Matrix OUT: IN2 of LUT3_3 or nRST (nSET) of DFF6 79 [647:640] Matrix OUT: IN0 of LUT3_4 or Clock Input of DFF7 80 [655:648] Matrix OUT: IN1 of LUT3_4 or Data Input of DFF7 81 [663:656] Matrix OUT: IN2 of LUT3_4 or nRST (nSET) of DFF7 82 [671:664] Matrix OUT: IN0 of LUT3_5 or Delay2 Input (or Counter 2 RST Input) 83 Table 29: Matrix Output Table (Continued) Register Bit Address Matrix Output Signal Function Matrix Output Number

Revision 2.3 51 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary [679:672] Matrix OUT: IN1 of LUT3_5 or External Clock Input of Delay2 (or Counter2) 84 [687:680] Matrix OUT: IN2 of LUT3_5 85 [695:688] Matrix OUT: IN0 of LUT3_6 or Delay3 Input (or Counter 3 RST Input) 86 [703:696] Matrix OUT: IN1 of LUT3_6 or External Clock Input of Delay3 (or Counter3) 87 [711:704] Matrix OUT: IN2 of LUT3_6 88 [719:712] Matrix OUT: IN0 of LUT3_7 or Delay4 Input (or Counter 4 RST Input) 89 [727:720] Matrix OUT: IN1 of LUT3_7 or External Clock Input of Delay4 (or Counter4) 90 [735:728] Matrix OUT: IN2 of LUT3_7 91 [743:736] Matrix OUT: IN0 of LUT3_8 or Delay5 Input (or Counter 5 RST Input) 92 [751:744] Matrix OUT: IN1 of LUT3_8 or External Clock Input of Delay5 (or Counter5) 93 [759:752] Matrix OUT: IN2 of LUT3_8 94 [767:760] Matrix OUT: IN0 of LUT3_9 or Delay6 Input (or Counter 6 RST Input) 95 [775:768] Matrix OUT: IN1 of LUT3_9 or External Clock Input of Delay6 (or Counter6) 96 [783:776] Matrix OUT: IN2 of LUT3_9 97 [791:784] Matrix OUT: IN0 of LUT3_10 or Input of Pipe Delay 98 [799:792] Matrix OUT: IN1 of LUT3_10 or nRST of Pipe Delay 99 [807:800] Matrix OUT: IN2 of LUT3_10 or Clock of Pipe Delay 100 [815:808] Matrix OUT: IN0 of LUT4_0 or Delay0 Input (or Counter 0 RST/SET Input) 101 [823:816] Matrix OUT: IN1 of LUT4_0 or External Clock Input of Delay0 (or Counter0) 102 [831:824] Matrix OUT: IN2 of LUT4_0 or UP Input of FSM0 103 [839:832] Matrix OUT: IN3 of LUT4_0 or KEEP Input of FSM0 104 [847:840] Matrix OUT: IN0 of LUT4_1 or Delay1 Input (or Counter 1 RST/SET Input) 105 [855:848] Matrix OUT: IN1 of LUT4_1 or External Clock Input of Delay1 (or Counter1) 106 [863:856] Matrix OUT: IN2 of LUT4_1 or UP Input of FSM1 107 [871:864] Matrix OUT: IN3 of LUT4_1 or KEEP Input of FSM1 108 [879:872] Matrix OUT: PD ofeither Temp-output with BG AND/OR crystal oscillator by register [1268] 109 Note 1 For each Address, the two most significant bits are unused. Table 29: Matrix Output Table (Continued) Register Bit Address Matrix Output Signal Function Matrix Output Number

6.3 CONNECTION MATRIX VIRTUAL INPUTS

As mentioned previously, the Connection Matrix inputs come from the outputs of various digital macrocells on the device. Eight of the Connection Matrix inputs have the special characteristic that the state of these signal lines comes from a correspondin g data bit written as a register value via I 2C. This gives the user the ability to write data via the serial channel, and have this information translated into signals that can be driven into the Connection Matrix and from the Connection Matrix to the digita l inputs of other macrocells on the device. The I2C address for reading and writing these register values is at byte 0244. Six of the eight Connection Matrix Virtual Inputs are dedicated to this virtual input function. An I2C write command to these register bits will set the signal values going into the Connection Matrix to the desired state. A read command to these register bits will read either the original data values coming from the NVM memory bits (that were loaded during the initial device startup), or the values from a previous write command (if that has happened). Two of the eight Connection Matrix Virtual Inputs are shared wi th Pin digital inputs,(IO6 Digital or I 2C_virtual_0 Input) and (IO7 Digital or I2C_virtual_1 Input). If the virtual input mode is selected, an I2C write command to these register bits will set the signal values going into the Connection Matrix to the desired state. Two register bits select whether the Connection Matrix input comes from the pin input or from the virtual register:  register [1074] Select SCL & Virtual Input 0 or IO6  register [1082] Select SDA & Virtual Input 1 or IO7 See Table 30 for Connection Matrix Virtual Inputs.

6.4 CONNECTION MATRIX VIRTUAL OUTPUTS

The digital outputs of the various macrocells are routed to the Connection Matrix to enable interconnections to the inputs of other macrocells in the device. At the same time, it is possible to read the state of each of the macrocell outputs as a register value via I2C. This option, called Connection Matrix Virtual Outputs, allows the user to remotely read the values of each macrocell output. The I2C addresses for reading these register values are at bytes 0240 to 0247. Write commands to these same register values will be ignored (with the exception of the Virtual Input register bits at byte 0244). Table 30: Connection Matrix Virtual Inputs Matrix Input Number Matrix Input Signal Function Register Bit Addresses (d)

32 I 2C_virtual_0 Input [1952]

33 I 2C_virtual_1 Input [1953]

34 I 2C_virtual_2 Input [1954]

35 I 2C_virtual_3 Input [1955]

36 I 2C_virtual_4 Input [1956]

37 I 2C_virtual_5 Input [1957]

38 I 2C_virtual_6 Input [1958]

39 I 2C_virtual_7 Input [1959]

7 Combination Function Macrocells

The SLG46538-A has seventeen combination function macrocells that can serve more than one logic or timing function. In each case, they can serve as a Look Up T able (LUT), or as another logic or timing function. See the list below for the functions th at can be implemented in these macrocells.  Three macrocells that can serve as either 2-bit LUTs or as D Flip-Flops;  Five macrocells that can serve as either 3-bit LUTs or as D Flip-Flops with Set/Reset Input;  One macrocell that can serve as either 3-bit LUT or as Pipe Delay;  One macrocell that can serve as either 2-bit LUT or as Programmable Pattern Generator (PGen);  Five macrocells that can serve as either 3-bit LUTs or as 8-Bit Counter/Delays;  Two macrocells that can serve as either 4-bit LUTs or as 16-Bit Counter/Delays. Inputs/Outputs for the 17 combination function macrocells are configured from the connection matrix with specific logic functions being defined by the state of NVM bits. When used as a LUT to implement combinatorial logic functions, the outputs of the LUTs can be configured to any user defined function, including the following standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR). 7.1 2-BIT LUT OR D FLIP-FLOP MACROCELLS There are three macrocells that can serve as either 2-bit LUTs or as D Flip-Flops. When used to implement LUT functions, the 2-bit LUTs each take in two input signals from the connection m atrix and produce a single output, which goes back into the connection matrix. When used to implement D Flip-Flop function, the two input signals from the connection matrix go to the data (D) and clock (CLK) inputs for the Flip-Flop, with the output going back to the connection matrix. The operation of the D Flip-Flop and LATCH will follow the functional descriptions below:  DFF: CLK is rising edge triggered, then Q = D; otherwise Q will not change  LATCH: when CLK is Low, then Q = D; otherwise Q remains its previous value (input D has no effect on the output, when CLK is High). Figure 13: 2-bit LUT0 or DFF0 DFF0 clk D 2-bit LUT0 OUT IN0 IN1 To Connection Matrix Input [8]4-bits NVM From Connection Matrix Output [61] 1-bit NVM Registers [1207:1204] Register [1191] From Connection Matrix Output [60] Q/nQ Register [1207] DFF or LATCH Select Register [1206] Output Select (Q or nQ) Register [1205] DFF Initial Polarity Select LUT Truth Table DFF Registers 0: 2-bit LUT0 IN0 1: DFF0 clk 0: 2-bit LUT0 IN1 1: DFF0 Data 0: 2-bit LUT0 OUT 1: DFF0 OUT

Revision 2.3 55 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.1.1 2-Bit LUT or D Flip-Flop Macrocells Used as 2-Bit LUTs Each macrocell, when programmed for a LUT function, uses a 4-bit register to define their output function: 2-Bit LUT0 is defined by registers [1207:1204] 2-Bit LUT1 is defined by registers [1203:1200] 2-Bit LUT2 is defined by registers [1215:1212] Table 34 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created within each of the 2-bit LUT logic cells. Table 34: 2-bit LUT Standard Digital Functions Function MSB LSB A N D - 2 1000 N A N D - 2 0111 O R - 2 1110 N O R - 2 0001 X O R - 2 0110 X N O R - 2 1001 Table 31: 2-bit LUT0 Truth Table IN1 IN0 OUT 0 0 register [1204] LSB 0 1 register [1205] 1 0 register [1206] 1 1 register [1207] MSB Table 32: 2-bit LUT1 Truth Table IN1 IN0 OUT 0 0 register [1200] LSB 0 1 register [1201] 1 0 register [1202] 1 1 register [1203] MSB Table 33: 2-bit LUT2 Truth Table IN1 IN0 OUT 0 0 register [1212] LSB 0 1 register [1213] 1 0 register [1214] 1 1 register [1215] MSB

7.1.2 Initial Polarity Operations

7.2 3-BIT LUT OR D FLIP-FLOP WITH SET/RESET MACROCELLS There are five macrocells that can serve as either 3-bit LUTs or as D Flip-Flops with Set/Reset inputs. When used to implement LUT functions, the 3-bit LUTs each take in three input signals from the connection matrix and produce a single output, which goes back into the connection matrix. When used to implement D Flip-Flop function, the three input signals from the connection matrix go to the data (D) and clock (CLK), and Reset/Set (rRST/nSET) i nputs for the Flip-Flop, with the output going back to the connection matrix. DFF3 has a user selectable option to allow the macrocell output to either come from the Q/nQ output of one D Flip-Flop, or two D Flip-Flops in series, with the first D Flip-Flop triggering o n the rising clock edge, and the second D Flip-Flop triggering on the falling clock edge. Figure 16: DFF Polarity Operations

Revision 2.3 63 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.2.1 3-Bit LUT or D Flip-Flop Macrocells Used as 3-Bit LUTs Table 35: 3-bit LUT0 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1216] LSB 0 0 1 register [1217] 0 1 0 register [1218] 0 1 1 register [1219] 1 0 0 register [1220] 1 0 1 register [1221] 1 1 0 register [1222] 1 1 1 register [1223] MSB Table 36: 3-bit LUT1 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1224] LSB 0 0 1 register [1225] 0 1 0 register [1226] 0 1 1 register [1227] 1 0 0 register [1228] 1 0 1 register [1229] 1 1 0 register [1230] 1 1 1 register [1231] MSB Table 37: 3-bit LUT2 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1232] LSB 0 0 1 register [1233] 0 1 0 register [1234] 0 1 1 register [1235] 1 0 0 register [1236] 1 0 1 register [1237] 1 1 0 register [1238] 1 1 1 register [1239] MSB Table 38: 3-bit LUT3 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1240] LSB 0 0 1 register [1241] 0 1 0 register [1242] 0 1 1 register [1243] 1 0 0 register [1244] 1 0 1 register [1245] 1 1 0 register [1246] 1 1 1 register [1247] MSB Table 39: 3-bit LUT4 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1248] LSB 0 0 1 register [1249] 0 1 0 register [1250] 0 1 1 register [1251] 1 0 0 register [1252] 1 0 1 register [1253] 1 1 0 register [1254] 1 1 1 register [1255] MSB Table 40: 3-bit LUT11 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1368] LSB 0 0 1 register [1369] 0 1 0 register [1370] 0 1 1 register [1371] 1 0 0 register [1372] 1 0 1 register [1373] 1 1 0 register [1374] 1 1 1 register [1375] MSB Table 41: 3-bit LUT12 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1376] LSB 0 0 1 register [1377] 0 1 0 register [1378] 0 1 1 register [1379] 1 0 0 register [1380] 1 0 1 register [1381] 1 1 0 register [1382] 1 1 1 register [1383] MSB Table 42: 3-bit LUT13 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1384] LSB 0 0 1 register [1385] 0 1 0 register [1386] 0 1 1 register [1387] 1 0 0 register [1388] 1 0 1 register [1389] 1 1 0 register [1390] 1 1 1 register [1391] MSB

Revision 2.3 64 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Each macrocell, when programmed for a LUT function, uses a 8-bit register to define their output function: 3-Bit LUT0 is defined by registers [1223:1216] 3-Bit LUT1 is defined by registers [1231:1224] 3-Bit LUT2 is defined by registers [1239:1232] 3-Bit LUT3 is defined by registers [1247:1240] 3-Bit LUT4 is defined by registers [1255:1248] 3-Bit LUT11 is defined by registers [1375:1368] 3-Bit LUT12 is defined by registers [1383:1376] 3-Bit LUT13 is defined by registers [1391:1384] 3-Bit LUT14 is defined by registers [1399:1392] 3-Bit LUT15 is defined by registers [1407:1400] 3-Bit LUT16 is defined by registers [1415:1408] 3-Bit LUT17 is defined by registers [1423:1416] Table 43: 3-bit LUT14 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1392] LSB 0 0 1 register [1393] 0 1 0 register [1394] 0 1 1 register [1395] 1 0 0 register [1396] 1 0 1 register [1397] 1 1 0 register [1398] 1 1 1 register [1399] MSB Table 44: 3-bit LUT15 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1400] LSB 0 0 1 register [1401] 0 1 0 register [1402] 0 1 1 register [1403] 1 0 0 register [1404] 1 0 1 register [1405] 1 1 0 register [1406] 1 1 1 register [1407] MSB Table 45: 3-bit LUT16 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1408] LSB 0 0 1 register [1409] 0 1 0 register [1410] 0 1 1 register [1411] 1 0 0 register [1412] 1 0 1 register [1413] 1 1 0 register [1414] 1 1 1 register [1415] MSB Table 46: 3-bit LUT17 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1416] LSB 0 0 1 register [1417] 0 1 0 register [1418] 0 1 1 register [1419] 1 0 0 register [1420] 1 0 1 register [1421] 1 1 0 register [1422] 1 1 1 register [1423] MSB

Revision 2.3 65 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 47 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created within each of the six 3-bit LUT logic cells.

7.2.2 Initial Polarity Operations

7.3 3-BIT LUT OR PIPE DELAY MACROCELL There is one macrocell that can serve as either a 3-bit LUT or as a Pipe Delay. When used to implement LUT functions, the 3-bit LUT takes in th ree input signals from the connection matrix and produces a single output, which goes back into the connection matrix. When used as a Pipe Delay, there are three inputs signals from the matrix: Input (IN), Clock (CLK), and Reset (nRST). The Pipe Delay cell is built from 16 D Flip-Flop logic cells that provide the three delay options, two of which are user selectable. The DFF Table 47: 3-bit LUT Standard Digital Functions Function MSB LSB A N D - 3 10000000 N A N D - 3 01111111 O R - 3 11111110 N O R - 3 00000001 X O R - 3 10010110 X N O R - 3 01101001 Figure 29: DFF Polarity Operations VDD Data Clock POR nReset (Case 1) Q with nReset (Case 1) nReset (Case 2) Q with nReset (Case 2) Initial Polarity: High

Revision 2.3 66 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary cells are tied in series where the output (Q) of each delay cell goes to the next DFF cell. The first delay option (OUT2) is fixed at the output of the first Flip-Flop stage. The other two outputs (OUT0 and OUT1) provide user selectable options for 1 to 16 stages of delay.There are delay output points for each set of the OUT0 and OUT1 outputs to a 16-input mux that is controlled by registers [1259:1256] for OUT0 and registers [1263:1260] for OUT1. The 16-input mux is used to select the amount of delay. The overall time of the delay is based on the clock used in the SLG46538-A design. Each DFF cell has a time delay of the inverse of the clock time (either external clock or the RC Oscillator w ithin the SLG46538-A). The sum of the number of DFF cells used will be the total time delay of the Pipe Delay logic cell. Note: CLK is rising edge triggered. 7.3.1 3-Bit LUT or Pipe Delay Macrocells Used as 3-Bit LUTs Figure 30: 3-bit LUT10 or Pipe Delay Table 48: 3-bit LUT10 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1256] LSB 0 0 1 register [1257] 3-bit LUT10 OUTIN1 IN0 From Connection Matrix Output [98] From Connection Matrix Output [99] IN2 From Connection Matrix Output [100]

16 Flip-FlopsnRST

Matrix Output [98] From Connection Matrix Output [99] From Connection Matrix Output [100] Registers [1263:1260] Registers [1259:1256] To Connection Matrix Input [26] To Connection Matrix Input [25] OUT1 OUT0 Register [1271] To Connection Matrix Input [24]

1 Pipe OUT

Registers [1263:1256] Register [1270]

Revision 2.3 67 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Each macrocell, when programmed for a LUT function, uses a 8-bit register to define their output function: 3-Bit LUT10 is defined by registers [1263:1256] 7.3.2 3-Bit LUT or Pipe Delay Macrocells Used as Pipe Delay Register Settings 7.4 3-BIT LUT OR 8-BIT COUNTER/DELAY MACROCELLS There are five macrocells that can serve as either 3-bit LUTs or as Counter/Delays. When used to implement LUT function, the 3-bit LUT takes in three input signals from the connection matr ix and produces a single output, which goes back into the connection matrix. When used to implement 8-Bit Counter/Delay function, two of the three input signals from the connection matrix go to the external clock (EXT_CLK) and reset (DLY_IN/CNT Reset) for the Counter/Delay, with the output going back to the connection matrix. These macrocells can also operate in a one-shot mode, which will generate an output pulse of user-defined width. These macrocells can also operate in a frequency detection or edge detection mode. For timing diagrams refer to Section 7.6 Note Counters initialize with counter data after POR. Two of the five macrocells can have their active count value read via I2C (CNT4 and CNT6). See Section 17.6.1 for further details. 0 1 0 register [1258] 0 1 1 register [1259] 1 0 0 register [1260] 1 0 1 register [1261] 1 1 0 register [1262] 1 1 1 register [1263] MSB Table 49: Pipe Delay Register Settings Signal Function Register Bit Address Register Definition LUT3_10 or Pipe Delay Output Select [1270] 0: LUT3_10 1: 1 Pipe Delay Output OUT0 select [1259:1256] OUT1 select [1263:1260] Pipe Delay OUT1 Polarity Select Bit [1271] 0: Non-inverted 1: Inverted Table 48: 3-bit LUT10 Truth Table (Continued) IN2 IN1 IN0 OUT

Revision 2.3 69 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 33: 3-bit LUT7 or CNT/DLY4 CNT/DLY4 OUT clk DLY_IN/CNT_Reset 3-bit LUT7 OUT IN0 IN1 8-bits NVM 1-bit NVM IN2 Registers [1559:1552] Register [1196] From Connection Matrix Output [89] From Connection Matrix Output [90] To Connection Matrix Input [19] From Connection Matrix Output [91] LUT Truth Table CNT Data 0: 3-bit LUT7 IN1 1: CNT/DLY4 clk 0: 3-bit LUT7 OUT 1: CNT/DLY4 OUT 0: 3-bit LUT7 IN0 1: CNT/DLY4 RST

Revision 2.3 71 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.4.2 3-Bit LUT or Counter/Delay Macrocells Used as 3-Bit LUTs Each macrocell, when programmed for a LUT function, uses a 8-bit register to define their output function: 3-Bit LUT5 is defined by registers [1543:1536] 3-Bit LUT6 is defined by registers [1551:1544] 3-Bit LUT7 is defined by registers [1559:1552] 3-Bit LUT8 is defined by registers [1567:1560] 3-Bit LUT9 is defined by registers [1575:1568] Table 50: 3-bit LUT5 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1536] LSB 0 0 1 register [1537] 0 1 0 register [1538] 0 1 1 register [1539] 1 0 0 register [1540] 1 0 1 register [1541] 1 1 0 register [1542] 1 1 1 register [1543] MSB Table 51: 3-bit LUT6 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1544] LSB 0 0 1 register [1545] 0 1 0 register [1546] 0 1 1 register [1547] 1 0 0 register [1548] 1 0 1 register [1549] 1 1 0 register [1550] 1 1 1 register [1551] MSB Table 52: 3-bit LUT7 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1552] LSB 0 0 1 register [1553] 0 1 0 register [1554] 0 1 1 register [1555] 1 0 0 register [1556] 1 0 1 register [1557] 1 1 0 register [1558] 1 1 1 register [1559] MSB Table 53: 3-bit LUT8 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1560] LSB 0 0 1 register [1561] 0 1 0 register [1562] 0 1 1 register [1563] 1 0 0 register [1564] 1 0 1 register [1565] 1 1 0 register [1566] 1 1 1 register [1567] MSB Table 54: 3-bit LUT9 Truth Table IN2 IN1 IN0 OUT 0 0 0 register [1568] LSB 0 0 1 register [1569] 0 1 0 register [1570] 0 1 1 register [1571] 1 0 0 register [1572] 1 0 1 register [1573] 1 1 0 register [1574] 1 1 1 register [1575] MSB

Revision 2.3 72 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 55 shows the register bits for the standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR) that can be created within each of the six 3-bit LUT logic cells. 7.5 4-BIT LUT OR 16-BIT COUNTER/DELAY MACROCELLS There are two macrocells that can serve as either 4-bit LUTs or as 16-bit Counter/Delays. When used to implement LUT function, the 4-bit LUT takes in four input signals from the Connection M atrix and produces a single output, which goes back into the Connection Matrix. When used to implement 16-Bit Counter/Delay function, four input signals from the connection matrix go to the external clock (EXT_CLK) and reset (DLY_IN/CNT_Reset), Keep and Up for the Counter/Delay, with the output going back to the connection matrix. These two macrocells have an optional Finite State Machine (FSM ) function. There are two matrix inputs for Up and Keep to support FSM functionality. Any counter within GreenPAK is counting down by default. In FSM mode (CNT/DLY0 and CNT/DLY1) it is possible to reverse counting by applying High level to Up input. Also, there is a possibility to pause counting by applying High level to Keep input, after the level goes Low, the counter will proceed counting.These macrocells can also operate in a one-shot mode, which will generate an output pulse of user-defined width. These macrocells can also operate in a frequency detection. Delay time and Output Period can be calculated using the following formulas:  Delay time: [(Counter data + 2)/CLK input frequency – Offset*];  Output Period: [(Counter data + 1)/CLK input frequency – Offset*]. One Shot pulse width can be calculated using formula:  Pulse width = [(Counter Data + 2)/CLK input frequency – Offset*]; *Offset is the asynchronous time offset between the input signal and the first clock pulse. Note Counters initialize with counter data after POR For timing diagrams refer to Section 7.6. Both of these macrocells can have their active count value read via I2C. See Section 17.6.1 for further details. Table 55: 3-bit LUT Standard Digital Functions Function MSB LSB A N D - 3 10000000 N A N D - 3 01111111 O R - 3 11111110 N O R - 3 00000001 X O R - 3 10010110 X N O R - 3 01101001

Revision 2.3 73 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.5.1 4-Bit LUT or 16-Bit CNT/DLY Block Diagram Figure 36: 4-bit LUT0 or CNT/DLY0 CNT/DLY0 OUT clk DLY_IN/CNT_Reset 4-bit LUT0 OUT IN0 IN1 16-bits NVM 1-bit NVM IN2 IN3 Registers [1591:1576] Register [1193] From Connection Matrix Output [101] From Connection Matrix Output [104] From Connection Matrix Output [102] To Connection Matrix Input [22] FSM UP KEEP From Connection Matrix Output [103] LUT Truth Table CNT Data 0: 4-bit LUT0 IN1 1: CNT/DLY0 clk 0: 4-bit LUT0 OUT 1: CNT/DLY0 OUT 0: 4-bit LUT0 IN0 1: CNT/DLY0 RST 0: 4-bit LUT0 IN2 1: FSM UP 0: 4-bit LUT0 IN3 1: FSM KEEP

Revision 2.3 74 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 37: 4-bit LUT1 or CNT/DLY1 CNT/DLY1 OUT clk DLY_IN/CNT_Reset 4-bit LUT1 OUT IN0 IN1 16-bits NVM 1-bit NVM IN2 IN3 Registers [1607:1592] Register [1192] From Connection Matrix Output [105] From Connection Matrix Output [108] From Connection Matrix Output [106] To Connection Matrix Input [23] FSM UP KEEP From Connection Matrix Output [107] LUT Truth Table CNT Data 0: 4-bit LUT1 IN1 1: CNT/DLY1 clk 0: 4-bit LUT1 IN0 1: CNT/DLY1 RST 0: 4-bit LUT1 IN2 1: FSM UP 0: 4-bit LUT1 IN3 1: FSM KEEP

Revision 2.3 75 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.5.2 4-Bit LUT or 16-Bit Counter/Delay Macrocells Used as 4-Bit LUTs Each macrocell, when programmed for a LUT function, uses a 16-bit register to define their output function: 4-Bit LUT0 is defined by registers [1591:1576] 4-Bit LUT1 is defined by registers [1607:1592] Table 58: 4-bit LUT Standard Digital Functions Function MSB LSB A N D - 4 1000000000000000 N A N D - 40111111111111111 O R - 4 1111111111111110 N O R - 4 0000000000000001 X O R - 4 0110100110010110 X N O R - 41001011001101001 Table 56: 4-bit LUT0 Truth Table IN3 IN2 IN1 IN0 OUT 0 0 0 0 register [1576] LSB 0 0 0 1 register [1577] 0 0 1 0 register [1578] 0 0 1 1 register [1579] 0 1 0 0 register [1580] 0 1 0 1 register [1581] 0 1 1 0 register [1582] 0 1 1 1 register [1583] 1 0 0 0 register [1584] 1 0 0 1 register [1585] 1 0 1 0 register [1586] 1 0 1 1 register [1587] 1 1 0 0 register [1588] 1 1 0 1 register [1589] 1 1 1 0 register [1590] 1 1 1 1 register [1591] MSB Table 57: 4-bit LUT1 Truth Table IN3 IN2 IN1 IN0 OUT 0 0 0 0 register [1592] LSB 0 0 0 1 register [1593] 0 0 1 0 register [1594] 0 0 1 1 register [1595] 0 1 0 0 register [1596] 0 1 0 1 register [1597] 0 1 1 0 register [1598] 0 1 1 1 register [1599] 1 0 0 0 register [1600] 1 0 0 1 register [1601] 1 0 1 0 register [1602] 1 0 1 1 register [1603] 1 1 0 0 register [1604] 1 1 0 1 register [1605] 1 1 1 0 register [1606] 1 1 1 1 register [1607] MSB

7.6 CNT/DLY/FSM TIMING DIAGRAMS

7.6.1 Delay Mode (Edge Select: Both, Counter Data: 3) CNT/DLY2 to CNT/DLY6

7.6.2 Count Mode (Count Data: 3), Counter Reset (Rising Edge Detect) CNT/DLY2 to CNT/DLY6

7.6.3 One-Shot Mode CNT/DLY0 to CNT/DLY6

This macrocell will generate a pulse whenever a selected edge is detected on its input. Register bits set the edge selection. The pulse width determines by counter data and clock selection prop erties. The output pulse polarity (non-inverted or inverted) is Figure 38: Delay Mode Timing Diagram Figure 39: Counter Mode Timing Diagram Delay In RC OSC: force Power-On (always running) Delay Output Asynchronous delay variable Asynchronous delay variable delay = period x (counter data + 1) + variable variable is from 0 to 1 clock period delay = period x (counter data + 1) + variable variable is from 0 to 1 clock period Delay In RC OSC: auto Power-On (powers up from delay in) Delay Output offset offset delay = offset + period x (counter data + 1) See offset in table 3 delay = offset + period x (counter data + 1) See offset in table 3 RESET_IN CLK Counter OUT Count start in 0 clk after reset 4 clk period pulse

Revision 2.3 77 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary selected by register bit. See Table 59. Any incoming edges will be ignored during the pulse width gene ration. The following diagram shows one-shot function for non-inverted output. Figure 40: One-Shot Function Timing Diagram One-Shot/Freq. DET/Delay IN One-Shot Function Rising Edge Detection One-Shot Function Falling Edge Detection One-Shot Function Both Edge Detection t t t t Delay time Delay time Delay time Delay time Delay time Delay time

Revision 2.3 78 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary This macrocell generates a high level pulse with a set width (defined by counter data) when detecting the respective edge. It does not restart while pulse is high.

7.6.4 Frequency Detection Mode CNT/DLY0 to CNT/DLY6

Rising Edge: The output goes high if the time between two succe ssive edges is less than the delay. The output goes low if the second rising edge has not come after the last rising edge in specified time. Falling Edge: The output goes high if the time between two fall ing edges is less than the set time. The output goes low if the second falling edge has not come after the last falling edge in specified time. Both Edge: The output goes high if the time between the rising and falling edges is less than the set time, which is equivalent to the length of the pulse. The output goes low if after the last rising/falling edge and specified time, the second edge has not come. Table 59: DLY/CNTx One-Shot/Freq. Detect Output Polarity Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write [1329] Select the Polarity of DLY/CNT6's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1330] Select the Polarity of DLY/CNT5's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1331] Select the Polarity of DLY/CNT4's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1332] Select the Polarity of DLY/CNT3's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1333] Select the Polarity of DLY/CNT2's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1334] Select the Polarity of DLY/CNT1's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid [1335] Select the Polarity of DLY/CNT0's One Shot/ Freq. Detect Output 0: Default Output 1: Inverted Output Valid Valid

Revision 2.3 79 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 41: Frequency Detection Mode Timing Diagram One-Shot/Freq. DET/Delay IN Frequency Detector Function Rising Edge Detection Frequency Detector Function Falling Edge Detection Frequency Detector Function Both Edge Detection t t t t Delay time Delay time Delay time Delay time Delay time Delay time

7.6.5 Edge Detection Mode CNT/DLY2 to CNT/DLY6

The macrocell generates high level short pulse when detecting the respective edge. See Table 12. Figure 42: Edge Detection Mode Timing Diagram One-Shot/Freq. DET/Delay IN Edge Detector Function Rising Edge Detection Edge Detector Function Falling Edge Detection Edge Detector Function Both Edge Detection t t t t Delay time Delay time Delay time Delay time Delay time

7.6.6 Delay Mode CNT/DLY0 to CNT/DLY6

The macrocell shifts the respective edge to a set time and rest arts by appropriate edge. It works as a filter if the input sig nal is shorter than the delay time.

7.6.7 CNT/FSM Mode CNT/DLY0, CNT/DLY1

Figure 43: Delay Mode Timing Diagram Figure 44: CNT/FSM Timing Diagram (Reset Rising Edge Mode, Oscillator is Forced On, UP = 0) for Counter Data = 3 One-Shot/Freq. DET/Delay IN Delay Function Rising Edge Detection Delay Function Falling Edge Detection Delay Function Both Edge Detection t t t t Delay time Delay time Delay time Delay time Delay time Delay time RESET IN CLK 3 1 3210Q COUNT END 32 1 00 KEEP 2 32 10 Note: Q = current counter value

7.6.8 Difference in Counter Value for Counter, Delay, One-Shot, and Frequency Detect Modes

There is a difference in counter value for Counter and Delay/On e-Shot/Frequency Detect modes. The counter value is shifted for two rising edges of the clock signal in Delay/One-Shot/Frequency Detect modes compared to Counter mode. See Figure 48. Figure 47: CNT/FSM Timing Diagram (Set Rising Edge Mode, Oscillator is Forced On, UP = 1) for Counter Data = 3 Figure 48: Counter Value, Counter Data = 3 SET IN CLK 3 5 4567Q COUNT END 89 1 0 113 KEEP 4 12 65533 65534 65535 3 45 Note: Q = current counter value One-Shot/Freq.SET/Delay IN CLK CNT Out Delay Data One-Shot Out One-Shot Data DLY Out CNT Data 0 3 2 1 0 3 2 3 3 3 2 1 3 3 3 3 3 2 1 3 3

Revision 2.3 84 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 7.7 2-BIT LUT OR PROGRAMMABLE PATTERN GENERATOR The SLG46538-A has one combination function macrocell that can serve as a logic or timing function. This macrocell can serve as a Look Up Table (LUT), or Programmable Pattern Generator (PGen). When used to implement LUT functions, the 2-bit LUT takes in four input signals from the connection matrix and produces a single output, which goes back into the connection matrix. When used as a LUT to implement combinatorial logic functions, the outputs of the LUTs can be configured to any user defined function, inc luding the following standard digital logic devices (AND, NAND, OR, NOR, XOR, XNOR). The user can also define the combinatorial relationship between inputs and outputs to be any selectable function. When operating as a Programmable Pattern Generator, the output of the macrocell with clock out a sequence of two to sixteen bits that are user selectable in their bit values, and user selectable in the number of bits (up to sixteen) that are output before the pattern repeats. See Figure 50. Figure 49: 2-bit LUT3 or PGen PGen OUT clk nRST 2-bit LUT3 OUT To Connection Matrix Input [11] From Connection Matrix Output [66] Register [1211:1208] Register [1188] From Connection Matrix Output [67] In0 In1 Registers [1623:1608] LUT Truth Table Pattern Size PGen Data S1 0: 2-bit LUT3 OUT 1: PGen OUT

7.8 WAKE AND SLEEP CONTROLLER

The SLG46538-A has a Wake and Sleep (WS) function for all ACMPs . The macrocell CNT/DLY0 can be reconfigured for this purpose registers [1319:1318] = 11 and registers [1495] = 1. Th e WS serves for power saving, it allows to switch on and off selected ACMPs on selected bit of 16-bit counter. Figure 50: PGen Timing Diagram VDD OUT D15 CLK 0 1 t 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 D14D0 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 t t t nRST

Revision 2.3 86 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary To use any ACMP under WS controller the following settings must be done:  ACMP Power Up Input from matrix = 1 (for each ACMP separately);  CNT/DLY0 must be set to Wake and Sleep Controller function (for all ACMPs);  Register WS => enable (for each ACMP separately);  CNT/DLY0 set/reset input = 0 (for all ACMPs);  In case of using OSC1 (25 MHz), OSC0 must be set to Force Power-On. As the OSC any oscillator with any pre-divider can be used. The user can select a period of time while the ACMPs are sleeping in a range of 1 - 65535 clock cycles. Before they are sent to s leep their outputs are latched, so the ACMPs remain their state (High or Low) while sleeping. WS controller has the following settings:  Wake and Sleep Output State (High/Low) If OSC is powered off (Power-Down option is selected; power-down input = 1) and Wake and Sleep Output State = High, the ACMP is continuously on. If OSC is powered off (Power-Down option is selected; power-down input = 1) and Wake and Sleep Output State = Low, the ACMP is continuously off. Both cases WS function is turned off.  Counter Data (Range: 1 - 65535) User can select wake and sleep ratio of the ACMP; counter data = sleep time, one clock = wake time. Figure 51: Wake/Sleep Controller OSC CK_OSC WS_PD 000:/1 001:/4 010:/12 011:/24 100:/64 cnt_end WS out WS_PD Power Control From Connection Matrix Output[58] Analog Control Block Registers [1316:1314] WS_PD to W&S out state selection block WS clock freq. selection Registers [1591:1576] WS ratio control data Register [1494] WS out state for OSC off ACMPs_pdb WS out bg/regulator pdb WS time selection Register [1489] ACMP0..3 OUT To Connection Matrix Input [60:57] From Connection Matrix Output [54:51] Registers [1493:1490] ACMP WS enable WS out Latches Note: WS_PD is High at WS OSC (25 kHz/2 MHz OSC) Power-down WS Controller CNT0 out To Connection Matrix Input [22] ck CNT ACMPs_pdb WS

Revision 2.3 87 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary  Q mode - defines the state of WS counter data when Set/Reset signal appears Reset - when active signal appears, the WS counter will reset to zero and High level signal on its output will turn the ACMPs on. When Reset signal goes out, the WS counter will go Low and turn the ACMPs off until the counter counts up to the end Set - when active signal appears, the WS counter will stop and Low level signal on its output will turn the ACMPs off. When Set signal goes out, the WS counter will go on counting and High level signal will turn the ACMPs on while counter is counting up to the end.  Edge Select defines the edge for Q mode High level Set/Reset - switches mode Set/Reset when level is High Note: Q mode operates only in case of “High Level Set/Reset”.  Wake time selection - time required for wake signal to turn the ACMPs on Normal Wake Time - when WS signal is High, it takes a BG time (100/550 µs) to turn the ACMPs on. They will stay on until WS signal is Low again. Wake time is one clock period. It shoul d be longer than BG turn on time and minimal required comparing time of the ACMP . Short Wake Time - when WS signal is High, it takes a BG time (100/550 µs) to turn the ACMPs on. They will stay on for 1 µs and turn off regardless of WS signal. The WS signal width does not matter.  Keep - pauses counting while Keep = 1  Up - reverses counting If Up = 1, CNT is counting up from user selected value to 65535. If Up = 0, CNT is counting down from user selected value to 1.

8 Analog Comparators

Matrix. Also, all ACMPs have Wake and Sleep function (WS), see Section 7.8. When ACMP is powered down, output is low. PWR UP = 1 => ACMP is powered up. PWR UP = 0 => ACMP is powered down. Figure 54. The ACMP cells have an input "Low bandwidth" signal selection, which can be used to save power and reduce noise the ACMPs with the POR signal, and not the VDD signal. Note: Regulator and Charge Pump set to automatic ON/OFF.

8.1 ACMP0 BLOCK DIAGRAM AND REGISTER SETTINGS

Table 62: Built-In Hysteresis Tolerance at T = 25 °C Vhys (mV) VDD= 1.7 V to 1.8 V VDD = 1.89 V to 5.5 V Vref = 50 mV to 500)mV Vref = 550 V to 1000 mV Vref = 1050 V to 1200 mV Vref =

50 V to 500 mV

Vref = 550 V to 1000 mV Vref = 1050 V to 1200 mV min max min max min max min max min max min max Figure 57: ACMP0 Block Diagram 11010 11011 11100 11101 Internal Vref IO9: EXT_Vref IO5: ACMP0(-) 110 100 0X1 IO4: ACMP0(+) External VDD 1.71 V ~ 5.5 V External VDD 2.7 V ~ 5.5 V Selectable Gain Registers [1630:1629] to ACMP1, ACMP2, AC- MP3’s MUX input Vref From Connection Matrix Output [51] pdb LBW Selection Register [1631] Hysteresis Selection Registers [1175:1174] L/S To Connection Matrix Input [57] Registers [1628:1624] *IO4_aio_en; register [1173]; register [1172] *IO4_aio_en: if registers [1062:1061] = ’11’ then 1, otherwise: 0 BG_ok Latch Register [1490] IO9: EXT_Vref/2 IO5: ACMP0(-)/2 11001- 00000 ACMP0 Wake & Sleep function Enable

8.2 ACMP1 BLOCK DIAGRAM AND REGISTER SETTINGS

Figure 58: ACMP1 Block Diagram 11010 11011 11100 11101 Internal Vref IO9: EXT_Vref IO9: EXT_Vref 11X 10X 0X1 IO8: ACMP1(+) From ACMP0's MUX output External VDD 2.7 V ~ 5.5 V Selectable Gain Registers [1638:1637] Vref From Connection Matrix Output [52] pdb LBW Selection Register [1639] Hysteresis Selection AVD = 1.8 V L/S To Connection Matrix Input [58] Registers [1636:1632] *IO8_aio_en; register [1169]; register [1168] *IO8_aio_en: if registers [1093:1092] = ’11’ then 1, otherwise: 0 BG_ok Latch Register [1491] IO9: EXT_Vref/2 IO9: EXT_Vref/2 11101- 00000 100 µA Current Source ACMP1 Wake & Sleep function Enable en Register [1183] Note: when 100 µA Current Source is enabled input voltage on IO 8 should not exceed 1.8 V Registers [1171:1170]

8.3 ACMP2 BLOCK DIAGRAM AND REGISTER SETTINGS

Figure 59: ACMP2 Block Diagram Internal Vref IO9: EXT_Vref Reserved IO10: ACMP2(+) from ACMP0’s MUX output Selectable Gain Registers [1646:1645] Vref From Connection Matrix Output [53] pdb LBW Selection Register [1647] Hysteresis Selection Registers [1182:1181] L/S To Connection Matrix Input [59] Registers [1644:1640] *IO10_aio_en; register [1180] *IO10_aio_en: if registers [1109:1108] = ’11’ then 1, otherwise: 0 BG_ok Latch Register [1492] ACMP2 Wake & Sleep function Enable 11010 11011 11100 11101 IO9: EXT_Vref/2 Reserved 11001- 00000

8.4 ACMP3 BLOCK DIAGRAM AND REGISTER SETTINGS

Figure 60: ACMP3 Block Diagram Internal Vref Reserved IO12: ACMP3(+) IO10 : ACMP2(+) Selectable Gain Registers [1654:1653] Vref From Connection Matrix Output [54] pdb LBW Selection Register [1655] Hysteresis Selection Registers [1179:1178] L/S Registers [1652:1648] *IO12_aio_en; register [1177]; register [1176] *IO12_aio_en: if registers [1126:1125] = ’11’ then 1, otherwise: 0 From ACMP0’s MUX output To Connection Matrix Input [60] BG_ok Latch Register [1493] ACMP3 Wake & Sleep function Enable 11010 11011 11100 11101 IO9: ACMP3(-)/2 Reserved 11001- 00000 IO9: ACMP3(-)

9 Pipe Delay

The SLG46538-A has a pipe delay logic cell that is shared with the LUT3_10 in one of the Combination Function macrocells. The user can select one of these functions to use in a design, but not both. Please see Section 7.3 for the description of this Combination Function macrocell.

10 Programmable Delay/Edge Detector

The SLG46538-A has a programmable time delay logic cell availab le, that can generate a delay, that is selectable from one of four timings configured in the GreenPAK Designer. The programma ble time delay cell can generate one of four different delay patterns, rising edge detection, falling edge detection, both e dge detection, and both edge delay. See Figure 61 and Figure 62 for further information. Note: The input signal must be longer than the delay, otherwise it will be filtered out.

10.1 PROGRAMMABLE DELAY TIMING DIAGRAM - EDGE DETECTOR OUTPUT

Please refer to Table 12. Figure 61: Programmable Delay Figure 62: Edge Detector Output Programmable Delay OUTIN Registers [1267:1266] From Connection Matrix Output [57] To Connection Matrix Input [61] Registers [1265:1264] Edge Mode SelectionDelay Value Selection time1 Edge Detector Output IN Rising Edge Detector Falling Edge Detector Both Edge Detector Both Edge Delay time1 time1 is a fixed value time2 delay value is selected via register time2 time2 width width

Revision 2.3 96 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 11 Additional Logic Function. Deglitch Filter The SLG46538-A has three additional logic functions that are co nnected directly to the Connection Matrix inputs and outputs. There are two deglitch filters, each with edge detector functions. See Section 3.8.

11.1 DEGLITCH FILTER/EDGE DETECTOR

11.2 INV GATE

Figure 63: Deglitch Filter/Edge Detector Figure 64: INV Gate From Connection Matrix Output [55] To Connection Matrix Input [30] From Connection Matrix Output [56] To Connection Matrix Input [31] Filter_0 Filter_1 Register [1462] Register [1458] C C R R Register [1463] Register [1459] Edge Detect Edge Detect Edge Select Registers [1457:1456] Edge Select Registers [1461:1460] INV Gate From Connection Matrix Output [40] To Connection Matrix Input [50]

12 Voltage Reference

12.1 VOLTAGE REFERENCE OVERVIEW

The SLG46538-A has a Voltage Reference (Vref) Macrocell to provide references to the four analog comparators. This macrocell can supply a user selection of fixed voltage references, /3 and /4 reference off of the VDD power supply to the device, and externally supplied voltage references from IOs 5 and 9. The macrocell also has an option to output reference voltages on IOs 15 and 16. See Table 63 for the available selections for each analog comparator. Also, see Figure 65, which shows the reference output structure.

12.2 VREF SELECTION TABLE

Table 63: Vref Selection Table SEL[4:0] ACMP0_Vref ACMP1_Vref ACMP2_Vref ACMP3_Vref 11101 vref_ext_acmp0/2 vref_ext_acmp1/2 vref_ext_acmp2/2 vref_ext_a cmp2/2 11100 vref_ext_acmp1/2 vref_ext_acmp1/2 vref_ext_acmp1/2 vref_ext_a cmp1/2 11011 vref_ext_acmp0 vref_ext_acmp1 vref_ext_acmp2 vref_ext_acmp2 11010 vref_ext_acmp1 vref_ext_acmp1 vref_ext_acmp1 vref_ext_acmp1 11001 V DD /4 V DD/4 V DD/4 V DD/4

11000 V DD/3 V DD/3 V DD/3 V DD/3

10111 1.20 1.20 1.20 1.20 10110 1.15 1.15 1.15 1.15 10101 1.10 1.10 1.10 1.10 10100 1.05 1.05 1.05 1.05 10011 1.00 1.00 1.00 1.00 10010 0.95 0.95 0.95 0.95 10001 0.90 0.90 0.90 0.90 10000 0.85 0.85 0.85 0.85 01111 0.80 0.80 0.80 0.80 01110 0.75 0.75 0.75 0.75 01101 0.70 0.70 0.70 0.70 01100 0.65 0.65 0.65 0.65 01011 0.60 0.60 0.60 0.60 01010 0.55 0.55 0.55 0.55 01001 0.50 0.50 0.50 0.50 01000 0.45 0.45 0.45 0.45 00111 0.40 0.40 0.40 0.40 00110 0.35 0.35 0.35 0.35 00101 0.30 0.30 0.30 0.30 00100 0.25 0.25 0.25 0.25 00011 0.20 0.20 0.20 0.20 00010 0.15 0.15 0.15 0.15 00001 0.10 0.10 0.10 0.10 00000 0.05 0.05 0.05 0.05 VDD Practical Vref Range Note 2.0 V - 5.5 V 50 mV ~ 1.2 V 1.7 V - 2.0 V 50 mV ~ 1.0 V Do not operate above 1.0 V

12.3 VREF BLOCK DIAGRAM

Figure 65: Voltage Reference Block Diagram CMP0_VREF CMP1_VREF CMP2_VREF CMP3_VREF Registers [1628:1624] Registers [1636:1632] Registers [1644:1640] Registers [1652:1648]VDD/3 VDD/4 ext_vref_acmp2 (IO11) ext_vref_acmp1 (IO9) ext_vref_acmp0 (IO5) Register [1476] 000 001 100 101 110 000 001 100 101 110 Register [1474] VDD/2 VDD/3 VDD/4 Registers [1486:1484] Registers [1482:1480] Vref Out_0 (IO16) IO16_aio_en Registers [1157:1156]=11 Vref Out_1 (IO15) IO15_aio_en Registers [1149:1148]=11

12.4 VREF LOAD REGULATION

Note 1: Vref buffer performance is not guaranteed at VDD < 2.7 V. Figure 66: Typical Load Regulation, Vref = 600 mV, T = -40 °C to +125 °C, Buffer - Enable Figure 67: Typical Load Regulation, Vref = 1000 mV, T = -40 °C to +125 °C, Buffer - Enable 350 400 450 500 550 600 650 100 150 200 250 300 350 400 450 500 V REF I (UA) VDD=5.5V VDD=3.3V VDD=2.7V 700 750 800 850 900 950 1000 1050 100 150 200 250 300 350 400 450 500 V REF I (UA) VDD=5.5V VDD=3.3V VDD=2.7V

Revision 2.3 100 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 68: Typical Load Regulation, Vref = 1200 mV, T = -40 °C to +125 °C, Buffer - Enable 850 900 950 1000 1050 1100 1150 1200 1250 100 150 200 250 300 350 400 450 500 V REF I (UA) VDD=5.5V VDD=3.3V VDD=2.7V

13 Clocking

13.1 OSC GENERAL DESCRIPTION

The SLG46538-A has three internal oscillators. RC Oscillator that runs at 25 kHz/2 MHz (OSC0), Oscillator that runs at 25 MHz (OSC1) and Crystal Oscillator. It is possible to use all three oscillators simultaneously. The fundamental frequency can also come from clock input (IO15 or IO17 for 25 kHz/2 MHz and IO14 for 25 MHz or Crystal OSC), see Section 19. 13.2 25 KHZ/2 MHZ AND 25 MHZ RC OSCILLATORS There are two divider stages that allow the user flexibility fo r introducing clock signals on various Connection Matrix Input lines. The pre-divider allows the selection of /1, /2, /4, or /8 divide down frequency from the fundamental. The second stage divider (only for 25 kHz/2 MHz Oscillator) has an input of frequency from the pre-divider, and outputs one of seven different frequencies on Connection Matrix Input lines [27] (OUT0) and [28] (OUT1). See Figure 69 and Figure 70 for details. There are two modes of the POWER CONTROL pin, (register [1658] for 25 kHz/2 MHz OSC and register [1657] for 25 MHz OSC):  POWER-DOWN [0]. If PWR CONTROL input of oscillator is LOW, the oscillator will be turned on. If PWR CONTROL input of oscillator is HIGH the oscillator will be turned off and OSC divider will reset.  FORCE ON [1]. If PWR CONTROL input of oscillator is HIGH, the oscillator will be turned on. If PWR CONTROL input of oscillator is LOW the oscillator will be turned off. The PWR CONTROL signal has the highest priority. The SLG46538-A has a 25 kHz/2 MHz OSC FAST START-UP function register [1338] (1 – on, 0 – off). It allows the OSC to run immediately after power-up this decreases the settling time. Note that when OSC FAST START-UP is on, the current consumption will rise. The user can select two OSC POWER MODEs (register [1343] for 25 kHz/2 MHz OSC and register [1341] for 25 MHz OSC):  If AUTO POWER-ON [0] is selected, the OSC will run when any macrocell that uses OSC is powered on.  If FORCE POWER-ON [1] is selected, the OSC will run when the SLG46538-A is powered on. OSC can be turned on by:  Register control (force Power-On)  Delay mode, when delay requires OSC  CNT/FSM The Power-Down Mode is paired with temperature sensor, Section 18. If it is enabled for Crystal OSC, it is not available for Temp Sensor and vice versa. However, it is possible to enable Power-Down Mode for Crystal OSC and Temp Sensor simultaneously.

Revision 2.3 102 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 69: 25 kHz/2 MHz RC OSC Block Diagram Figure 70: 25 MHz RC OSC Block Diagram Internal RCO Register [1342] 0: 25 kHz 1: 2 MHz IO17 EXT_CLK EXT_CLK Sel register [1358] / 2 / 3 / 4 / 8 / 12 / 24 / 64 To Connection Matrix Input [27] Registers [1349:1347] DIV /1 /2 /4 /8 Registers [1340:1339] Pre-divider Second Stage Divider From Connection Matrix Output [58] PWR DOWN To Connection Matrix Input [28] Registers [1346:1344] IO15 EXT_CLK EXT_CLK Sel register [1355] Auto Power-On Force Power-On OSC Power Mode register [1343] OUT0 OUT1 Internal RCO

25 MHz Osc

IO14 EXT_CLK EXT_CLK Sel register [1357] To Connection Matrix Input [29]DIV /1 /2 /4 /8 Registers [1337:1336] Divider From Connection Matrix Output [59] PWR DOWN Auto Power-On 0 Force Power-On OSC Power Mode register [1341] OUT

13.3 OSCILLATORS POWER-ON DELAY

Note 1: OSC power mode: “Auto Power-On”. Note 2: “OSC enable” signal appears when any macrocell that uses OSC is powered on. Figure 71: Oscillator Startup Diagram Figure 72: RC Oscillator Maximum Power-On Delay vs. VDD at T = 25 °C, OSC0 = 2 MHz CLK OSC enable Power-On Delay 150 200 250 300 350 400 450 1.7 1.8 1.9 2.3 2.5 2.7 3.0 3.3 3.6 4.2 4.5 5.0 5.5 VDD(V) NormalStartͲUpMode FastStartͲUpMode

13.4 OSCILLATORS ACCURACY

Note: OSC power setting: Force Power-On; Clock to matrix input - enable; Bandgap: turn on by register - enable. Note: For more information see Section 3.9. Figure 75: RC Oscillator Frequency vs. Temperature, RC OSC0 = 2 MHz Figure 76: RC Oscillator Frequency vs. Temperature, RC OSC0 = 25 kHz 1.75 1.8 1.85 1.9 1.95 2.05 2.1 2.15 2.2 -40 -20 100 120 F (MHz) T (°C) Fmax @ VDD=1.8 V Fmin @ VDD=1.8 V Fmax @ VDD=3.3 V Fmin @ VDD=3.3 V Fmax @ VDD=5.0 V Fmin @ VDD=5.0 V 23.5 24.5 25.5 26.5 -40 -20 100 120 F (kHz) T (°C) Fmax @ VDD=1.8 V Fmin @ VDD=1.8 V Fmax @ VDD=3.3 V Fmin @ VDD=3.3 V Fmax @ VDD=5.0 V Fmin @ VDD=5.0 V

Revision 2.3 106 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Note: 25 MHz RC OSC1 performance is not guaranteed at VDD < 2.5 V. Figure 77: OSC1 (25 MHz) Frequency vs. Temperature -40 -20 100 120 F (MHz) T (°C) Fmax @ VDD=1.8 V Fmin @ VDD=1.8 V Fmax @ VDD=3.3 V Fmin @ VDD=3.3 V Fmax @ VDD=5.0 V Fmin @ VDD=5.0 V

14 Crystal Oscillator

The Crystal OSC provides high precision and stability of the output frequency. IO14 and IO13 are input and output, respectively, of an inverting amplifier which is configured for use as an On- chip Oscillator, as shown in Figure 79. Either a quartz crystal or a ceramic resonator may be used. The optimal value of the capacit ors depends on the crystal or resonator in use, the amount of stray capacitance, and the electromagnetic noise of the environ ment. Refer to Table 64. For ceramic resonators, the capacitor values given by the manufacturer should be used. It is possible to use an external clock source, it must be connected to IO14. In this case no external components are required. The Power-Down Mode is paired with temperature sensor. If it is enabled for Crystal OSC, it is not available for Temp Sensor and vice versa. However, it is possible to enable Power-Down Mode for Crystal OSC and Temp Sensor simultaneously. Figure 78: Crystal OSC Block Diagram Figure 79: External Crystal Connection Table 64: External Components Selection f C1 C2 R1 R2 32.768 kHz 10 pF 330 pF 20 M Ω 20 kΩ 4 - 40 MHz 12 pF 12 pF 1 M Ω 0 Ω Crystal OSC To Connection Matrix Input [53] From Connection Matrix Output [109] PWR DOWN Disable Enable OSC Power Mode register [1136] IO14 IO13 OUT Crystal SLG46538-AIO14 IO13

15 Power-On Reset

The SLG46538-A has a Power-On Reset (POR) macrocell to ensure correct device initialization and operation of all macrocells in the device. The purpose of the POR circuit is to have consistent behavior and predictable results when the VDD power is first ramping to the device, and also while the V DD is falling during power-down. To accomplish this goal, the POR drives a defined sequence of internal events that trigger changes to the states of different macrocells inside the device, and finally to the state of the IO pins.

15.1 GENERAL OPERATION

To start the POR sequence in the SLG46538-A, the voltage applied on the VDD should be higher than the Power-On threshold, the VDD voltage must ramp up to the operational voltage value, but the POR sequence will start earlier, as soon as the VDD voltage rises to the Power-On threshold. After the POR sequence has sta rted, the SLG46538-A will have a typical period of time to go through all the steps in the sequence (noted in the datasheet for that device), and will be ready and completely operational after the POR sequence is complete. The SLG46538-A is guaranteed to be powered down and nonoperatio nal when the V DD voltage (voltage on V DD) is less than Power-Off Threshold (see in Electrical Characteristics table), but not less than -0.6 V. Another essential condition for the chip to be powered down is that no voltage higher (see (Note 2)) than the VDD voltage is applied to any other PIN. For example, if VDD voltage is 0.3 V, applying a voltage higher than 0.3 V to any other PIN is incorrect, and can lead to incorrect or unexpected device behavior. Note 1 The Power-On threshold is defined in Electrical Characteristics table. Note 2 There is a 0.6V margin due to forward drop voltage of the ESD protection diodes. To power down the chip the V DD voltage should be lower than the operational and to guarantee that chip is powered down it should be less than Power-Off Threshold. All PINs are in high impedance state when the chip is powered down and while the POR sequence is taking place. The last step in the POR sequence releases the IO structures from the high impedance state, at which time the device is operational. The pin configuration at this point in time is defined by the design programmed into the chip. Also, as it was mentioned before the voltage on PINs can’t be bigger than the VDD, this rule also applies to the case when the chip is powered on. Note that VDD2 has no influence on POR sequence, all internal macrocells are powered from VDD. It means, VDD2 can be switched on/off while VDD is on. If voltage on VDD2 appears after the POR sequence, IOs 9, 10, 12, 13, 14, 15, 16, 17 become available when VDD2 reaches 0.6 V. For proper power up sequence, make sure VDD2 will not exceed VDD at any point during startup. For normal operation VDD should not be switched off while VDD2 is on, due to VDD2 ≤ VDD, see Section 3.

15.2 POR SEQUENCE

The POR system generates a sequence of signals that enable certain macrocells. The sequence is shown in Figure 80. As can be seen from Figure 80 after the VDD has start ramping up and crosses the Power-On threshold, first , the on-chip NVM memory is reset. Next, the chip reads the data from NVM, and transfers this information to SRAM registers that serve to configure each macrocell, and the Connection Matrix which routes signals between macrocells. The third stage causes the reset of the input pins, and then to enable them. After that, the LUTs are reset a nd become active. After LUTs, the Delay cells, RC OSC, DFFs, LATCHES, and Pipe Delay are initialized. Only after all macrocells are initialized internal POR signal (POR macrocell output) goes from LOW to HIGH. The last portion of the device to be initiali zed are the output PINs, which transition from high impedance t o active at this point. The typical time that takes to complete the POR sequence varies by device type in the GreenPAK family. It also depends on many environmental factors, such as: slew rate, VDD value, temperature, and even will vary from chip to chip (process influence).

15.3 MACROCELLS OUTPUT STATES DURING POR SEQUENCE

To have a full picture of SLG46538-A operation during powering and POR sequence, review the overview the macrocell output states during the POR sequence (Figure 81 describes the output signals states). First, before the NVM has been reset, all macrocells have their output set to logic LOW (except the output PINs which are in high impedance state). Before the NVM is ready, all macrocell outputs are unpredictable (except the output PINs). On the next step, some of the macrocells start initialization: input pins output state becomes LOW; LUTs also output LOW. Only P DLY macrocell configured as edge detector becomes active at this time. After that input PINs are enabled. Next, only LUTs are configured. Next, Figure 80: POR Sequence VDD POR_NVM (reset for NVM) NVM_ready_out POR_GPI (reset for input enable) POR_LUT (reset for LUT output) POR_CORE (reset for DLY/RCO/DFF /LATCH/Pipe DLY POR_OUT (generate low to high to matrix) POR_GPO (reset for output enable) t t t t t t t t

Revision 2.3 110 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary all other macrocells are initialized. After macrocells are init ialized, internal POR matrix signal switches from LOW to HIGH. The last are output PINs that become active and determined by the input signals. Figure 81: Internal Macrocell States during POR Sequence Unpredictable Unpredictable Unpredictable Unpredictable Unpredictable Unpredictable Unpredictable Unpredictable VDD Input PIN_out to matrix LUT_out to matrix Programmable Delay_out to matrix Prog. Edge_Detector_out to matrix DFF/LATCH_out to matrix Delay_out to matrix POR_out to matrix Ext. GPO VDD_out to matrix Determined by Input signals Determined by Input signals Starts to detect input edges Determined by Input signals Determined by Input signals Determined by Input signals Starts to detect input edges Determined by External Signal Guaranteed HIGH before POR_GPI Determined by input signals OUT = IN without Delay Determined by initial state Determined by input signals OUT = IN without Delay Tri-state t t t t t t t t t t Output State Unpredictable Determined by Input signals

15.3.1 Initialization

All internal macrocells by default have initial LOW level. Star ting from indicated power-up time of 1.15 V to 1.6 V, macrocell s in GPAK are powered on while forced to the reset state. All output s are in Hi-Z and chip starts loading data from NVM. Then the reset signal is released for internal macrocells and they start to initialize according to the following sequence: 1. I 2C. 2. Input PINs, ACMP , Pull-up/down. 3. LUTs. 4. DFFs, Delays/Counters, Pipe Delay. 5. POR output to matrix. 6. Output PIN corresponds to the internal logic. The Vref output pin driving signal can precede POR output signal going high by 3 μs - 5 μs. The POR signal going high indicates the mentioned power-up sequence is complete. Note: The maximum voltage applied to any PIN should not be higher tha n the V DD level. There are ESD Diodes between PIN → VDD and PIN → GND on each PIN. So, if the input signal applied to PIN is higher than VDD, then current will sink through the diode to VDD. Exceeding VDD results in leakage current on the input PIN, and VDD will be pulled up, following the voltage on the input PIN.There is no effect from input pin when input voltage is applied at the same time as VDD.

15.3.2 Power-Down

During power-down, macrocells in SLG46538-A are powered off after VDD falling down below Power-Off Threshold. Please note that during a slow rampdown, outputs can possibly switch state during this time. Figure 82: Power-Down Not guaranteed output state VDD (V) Time 1.6 V 1.15 V 2 V 1 V

1 V Vref Out Signal

16 Asynchronous State Machine Macrocell

16.1 ASM MACROCELL OVERVIEW

The Asynchronous State Machine (ASM) macrocell is designed to a llow the user to create state machines with between 2 to 8 states. The user has flexibility to define the available states, the available state transitions, and the input signals (a, b, c …) that will cause transitions from one state to another state, as shown in Figure 83. This macrocell has a total of 25 inputs, as shown in Figure 84, which come from the Connection Matrix outputs. Of these 25 inputs, 24 are user selectable for driving general state transitions, and 1 is for driving a state transition to an Initial/Reset state. Each of the 24 inputs is level sensitive and active high, meaning that a high level input will drive the user selected transition from one state to another. The fact that there are 24 inputs puts the upper bo und of 24 possible state transitions total in the user defined state machine design. There is on nReset input which will drive an im mediate state transition to the user-defined Initial/Reset stat e when active, shown in red, in the Figure 83. For more details refer to Section 16.2. There are a total of 8 outputs, which go to the Connections Matrix inputs, and from there can be routed to other internal macrocells or pins. The 8 outputs are user defined for each of the possible 8 states. This information is held in the Connection Matrix Output RAM. For more details refer to Section 16.3. In using this macrocell, the user must take into consideration the critical timing required on all input and output signals. The timing waveforms and timing specifications for this macrocell are all measured relative to the input signals (which come into the macrocell on the Connection Matrix outputs) and on the outputs from the m acrocell (which are direct connections to Connection Matrix inputs). The user must consider any delays from other logic and internal chip connections, including IO delays, to ensure that signals are properly processed, and state transitions are deterministic. The GPAK Designer development tools support user designs for th e ASM macrocell at both the physical level and logic level. Figure 83 is a representation of the user design at the logical level, a nd Figure 84 shows the physical resources inside the macrocell. To best utilize this macrocell, the user must develop a logical representation of their desired state machine, as well as a physical mapping of the input and outputs required for the desired functionality. Figure 83: Asynchronous State Machine State Transitions a c g d e f h b High Speed Normal SpeedStandby Off Fault

16.2 ASM INPUTS

The ASM macrocell has a total of 25 inputs which come from the Connection Matrix outputs. Of these 25 inputs, 24 are user selectable for driving general state transitions, and 1 is for driving a state transition to an Initial/Reset state. There are a total of 24 inputs to the ASM macrocell for general state transitions, highlighted in red in Figure 85. Each of these inputs is level sensitive, and active high. A high level input will trigger a state transition. These inputs are grouped so that each set of 3 inputs can drive a state transition going into a particular state. As an example, there are three inputs that can drive a state transition to State 1. This sets an upper bound on the number of transitions that the user can select going into a particular state to be 3, shown in Figure 86. There is no limitation on the number of transitions that can be supported coming out of a particular state, the user can selec t to have transitions going from a state to all other states, shown in Figure 87. The ASM macrocell also has a nReset input highlighted in blue i n Figure 85. This input is level sensitive and active low. An active signal on this input will drive an immediate state trans ition to the user-defined Initial/Reset state. The user can cho ose which state within the ASM Editor inside GPAK Designer is the initial state. Figure 84: Asynchronous State Machine State Transition Signal Routing State 0 In State 1 In State 2 In State 3 In State 4 In State 5 In State 6 In State 7 In State 0 State 0 Output Bits (8) State 1 State 2 State 3 State 4 State 5 State 6 State 7 Connection Matrix Output RAM (8x8) nReset from Connection Matrix State Holding Latches State 1 Output Bits (8) State 2 Output Bits (8) State 3 Output Bits (8) State 4 Output Bits (8) State 5 Output Bits (8) State 6 Output Bits (8) State 7 Output Bits (8) to Connection Matrix

16.3 ASM OUTPUTS

There are a total of 8 outputs from the ASM macrocell, which go to the Connections Matrix inputs, and from there can be routed to other internal macrocells or pins. The 8 outputs are user de fined for each of the possible 8 states, this information is he ld in the Connection Matrix Output RAM, shown in Figure 88. The Connection Matrix Output RAM has a total of 64 bits, arranged as 8 bits per state. The values loaded in each of the 8 bits define the signal level on each of the 8 ASM macrocell outputs. The ASM Editor inside the GPAK Designer software allows the use r to make their selections for the value of each bit in the Connection Matrix Output RAM, which selects the level of the ma crocell outputs based on the current state of the ASM macrocell, as shown in Figure 88. Figure 87: Maximum 7 State Transitions out of a Given State State 3State 6 State 1 State 0 State 4State5 State 2State 7

Revision 2.3 116 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 88: Connection Matrix Output RAM Table 65: ASM Editor - Connection Matrix Output RAM RAM State name Connection Matrix Output RAMOUT7 OUT6 OUT5 OUT4 OUT3 OUT2 OUT1 OUT0 State 0 0 0 0 0 0 0 0 1 State 1 0 0 0 0 0 0 1 0 State 2 0 0 0 0 0 1 0 0 State 3 0 0 0 0 1 0 0 0 State 4 0 0 0 1 0 0 0 0 State 5 0 0 1 0 0 0 0 0 State 6 0 1 0 0 0 0 0 0 State 7 1 0 0 0 0 0 0 0 State Transition Signal Routing State 0 In State 1 In State 2 In State 3 In State 4 In State 5 In State 6 In State 7 In State 0 State 0 Output Bits (8) State 1 State 2 State 3 State 4 State 5 State 6 State 7 nReset from Connection Matrix State Holding Latches State 1 Output Bits (8) State 2 Output Bits (8) State 3 Output Bits (8) State 4 Output Bits (8) State 5 Output Bits (8) State 6 Output Bits (8) State 7 Output Bits (8) to Connection Matrix Connection Matrix Output RAM (8x8)

Revision 2.3 117 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary There is a possibility to configure ASM (it's settings and tran sitions) via I 2C. Registers (registers [197:0]) correspond for ASM inputs, registers (registers [1727:1664]) correspond for ASM outputs configuration. Using I2C commands (see Section 17.4) it is possible to read ASM settings and connections, as well as change them. Additionally, user can change Connection Matrix Output RAM bit configuration (bytes 0xD0 to 0xD7). Note: After Connection Matrix Output RAM was updated via I 2C, ASM outputs to Connection Matrix can be changed only after ASM changes its state or after reset event. To change ASM outputs to Connection Matrix instantly after I2C write command, ASM must be in reset all the time.

16.4 BASIC ASM TIMING

The basic state transition timing from input on Matrix Connection output to output on Matrix Connection input is shown in Figure 89 and Figure 90. The time from a valid input signal to the time that there is a valid change of state and valid signals being available on the state outputs is State Machine Output Delay Ti me (T st_out_delay). The minimum and maximum values of Tst_out_delay define the differential timing between the shortest state transition (input on matrix output and output on matrix input) and the longest state transition (input on matrix output and output on matrix input). 16.5 ASYNCHRONOUS STATE MACHINES VS. SYNCHRONOUS STATE MACHINES It is important to note that this macrocell is designed for asynchronous operation, which means the following: 1. No clock source is needed, it reacts only to input signals. 2. The input signals do not have to be synchronized to each other, the macrocell will react to the earliest valid signal for state transition. 3. This macrocell does not have traditional set-up and hold time specifications which are related to incoming clock, as this macrocell has no clock source. 4. The macrocell only consumes power while in state transition.

16.6 ASM POWER CONSIDERATIONS

A benefit of the asynchronous nature of this macrocell is that it will consume power only during state transitions. Shown in Figure 89 and Figure 91, the current consumption of the macrocell will be a fraction o f a µA between state transitions, and will rise only during state transitions. See Section 3.4 to find average current during state transitions. Figure 89: State Transition Figure 90: State Transition Timing a State 0 State 1 Input Signal (a) Tst_out_delay State Outputs State 0 State 1

Revision 2.3 118 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 16.7 ASM LOGICAL VS. PHYSICAL DESIGN A successful design with the ASM macrocell must include both th e logic level design, as well as the physical level design. The GPAK Designer development software support user designs for the ASM macrocell at both the logic level and physical level. The logic level design of the user defined state machine takes place inside the ASM Editor. In the ASM Editor, the user can select and name states, define and name allowed state transitions, define the Initial/Reset state, and define the output values for the 8 outputs in the Output RAM Matrix. The physical level design takes place in the general GPAK Designer window, and here the user makes connections for the sources for ASM input signal s, as well as making connections for destinations for ASM output signals.

16.8 ASM SPECIAL CASE TIMING CONSIDERATIONS

16.8.1 State Transition Pulse Input Timing

All inputs to the ASM macrocell are level sensitive. If the inp ut to the state machine macrocell for a state transition is a p ulse, there is a minimum pulse width on the input to the state machin e macrocell (as measured at the matrix input to the macrocell) which is guaranteed to result in a state transition shown in Figure 93 and Figure 94. This pulse width is defined by the State Machine Input Pulse Acceptance Time (T st_pulse). If a pulse width that is shorter than T st_pulse is input to the state machine macrocell, it is indeterminate whether the state transition wil l happen or not. If a pulse that is rejected (invalid due to th e pulse width being narrower than the guaranteed minimum of Tst_pulse), this will not stop a valid pulse on another state transition input that does meet minimum pulse width. Figure 91: State Transition Figure 92: State Transition Timing and Power Consumption Figure 93: State Transition a State 0 State 1 Input Signal (a) Tst_out_delay State Outputs State 0 State 1 ASM Power Consumption Average Active ASM Power Sub μA Inactive ASM Power Consumption a State 0 State 1

16.8.2 State Transition Competing Input Timing

There will be situations where two input signals can be valid inputs that will drive two different state transitions from a given state. In that sense, the two signals are “competing” (signals a and b in Figure 95), and the signal that arrives sooner should drive the state transition that will “win”, or drive the state transition . If one signal arrives Tst_comp before the other one, it is guaranteed to win, and the state transition that it codes for will be taken, as shown in Figure 96. If the two signals arrive within Tst_comp of each other, it will be indeterminate which state transition will win, but one of the transitions will take place as long as the winning signal satisfies the pulse width criteria described in the paragraph above, as shown in Figure 97. Figure 94: State Transition Pulse Input Timing Figure 95: State Transition - Competing Inputs Figure 96: State Transition Timing - Competing Inputs Indeterminate Input Signal (a) Tst_pulse State Outputs Tst_pulse Tst_out_delay State 0 State 1 a State 0 State 2State 1 b Input Signal (b) Tst_out_delay State Outputs State 0 State 1 or State 2 Input Signal (a) Tst_comp

16.8.3 ASM State Transition Sequential Timing

It is possible to have a valid input signal for a transition out from a particular state be active before the state is active. If this is the case, the macrocell will only stay in that particular state for Tst_out_delay time before making the transition to the next state. An example of this sequential behavior is shown in Figure 98 and the associated timing is shown in Figure 99.

16.8.4 State Transition Closed Cycling

It is possible to have a closed cycle of state transitions that will run continuously if there are valid inputs that are activ e at the same time. The rate at which the state transitions will take pl ace is determined by T st_out_delay. The example shown here in Figure 100 involves cycling between two states, but any number of two – e ight states can be included in state transition closed cycling of this nature. Figure 101 shows the associated timing for closed cycling. Figure 97: State Transition Timing - Competing Inputs Determinable Figure 98: State Transition - Sequential Figure 99: State Transition - Sequential Timing Input Signal (b) Tst_out_delay State Outputs State 0 State 1 Input Signal (a) Tst_comp a State 0 State 1 b State 2 Input Signal (b) Tst_out_delay State Outputs State 0 State 1 Input Signal (a) Tst_out_delay State 2

17 I 2C Serial Communications Macrocell

17.1 I2C SERIAL COMMUNICATIONS MACROCELL OVERVIEW

In the standard use case for the GreenPAK devices, the configuration choices made by the user are stored as bit settings in the Non-Volatile Memory (NVM), and this information is transferred at startup time to volatile RAM registers that enable the configuration of the macrocells. Other RAM registers in the device are responsible for setting the connections in the Connection Matrix to route signals in the manner most appropriate for the user’s application. The I2C Serial Communications Macrocell in this device allows an I 2C bus Master to read and write this information via a serial channel directly to the RAM registers, allowing the remote re-c onfiguration of macrocells, and remote changes to signal chains within the device. An I2C bus Master is also able read and write other register bits th at are not associated with NVM memory. As an example, the input lines to the Connection Matrix can be read as digital register bits. These are the signal outputs of each of the macrocells in the device, giving an I2C bus Master the capability to remotely read the current value of any macrocell. The user has the flexibility to control read access and write a ccess via registers bits register [1832], register [1870], and register [1871]. See Section 17.5 for more details on I2C read/write memory protection. Note: GreenPAK I2C is fully compatible with standard I2C protocol.

17.2 I2C SERIAL COMMUNICATIONS DEVICE ADDRESSING

Each command to the I 2C Serial Communications macrocell begins with a Control Byte. T he bits inside this Control Byte are shown in Figure 102. After the Start bit, the first four bits are a control code, which can be set by the user in registers [1867:1864]. This gives the user flexibility on the chip level addressing of this device and other devices on the same I2C bus. The Block Address is the next three bits (A10, A9, A8), which will define the mos t significant bits in the addressing of the data to be read or written by the command. The last bit in the Control Byte is the R/W bit, which selects whether a read command or write command is requested, with a “1” selecting for a Read command, and a “0” selecting for a Write command. This Control Byte will be followed by an Acknowledge bit (ACK), which is sent by this device to indicate successful communication of the Control Byte data. In the I2C-bus specification and user manual, there are two groups of eight addresses (0000 xxx and 1111 xxx) that are reserved for the special functions, such as a system General Call address. If the user of this device choses to set the Control Code to either “1111” or “0000” in a system with other slave device, please consult the I2C-bus specification and user manual to understand the addressing and implementation of these special functions, to ensure reliable operation. In the read and write command address structure, there are a to tal of 11 bits of addressing, each pointing to a unique byte of information, resulting in a total address space of 2K bytes. Of this 2K byte address space, the valid addresses accessible to the I2C Macrocell on the SLG46538-A are in the range from 0 (0x00) to 255 (0xFF). The MSB address bits (A10, A9, and A8) will be “0” for all commands to the SLG46538-A. With the exception of the Current Address Read command, all com mands will have the Control Byte followed by the Word Address. Figure 102 shows this basic command structure. Figure 102: Basic Command Structure X X X X A A A R/W A A Control Byte Word Address Control Code Block Address Read/Write bit (1 = Read, 0 = Write) S ACK Acknowledge bit Start bit Not used, set to 0

17.3 I2C SERIAL GENERAL TIMING

General timing characteristics for the I2C Serial Communications macrocell are shown in Figure 103. Timing specifications can be found in the Section 3.4.

17.4 I2C SERIAL COMMUNICATIONS COMMANDS

17.4.1 Byte Write Command

Following the Start condition from the Master, the Control Code [4 bits], the Block Address [3 bits], and the R/W bit (set to “0”), are placed onto the I2C bus by the Master. After the SLG46538-A sends an Acknowledge bit (ACK), the next byte transmitted by the Master is the Word Address. The Block Address (A10, A9, A8), combined with the Word Address (A7 through A0), together set the internal address pointer in the SLG46538-A, where the d ata byte is to be written. After the SLG46538-A sends another Acknowledge bit, the Master will transmit the data byte to be written into the addressed memory location. The SLG46538-A again provides an Acknowledge bit and then the Master generates a Stop condition. The internal write cycle for the data will take place at the time that the SLG46538-A generates the Acknowledge bit.

17.4.2 Sequential Write Command

The write Control Byte, Word Address, and the first data byte a re transmitted to the SLG46538-A in the same way as in a Byte Write command. However, instead of generating a Stop condition, the Bus Master continues to transmit data bytes to the SLG46538-A. Each subsequent data byte will increment the internal address counter, and will be written into the next higher byte in the command addressing. As in the case of the Byte Write command, the internal write cycle will take place at the time that the SLG46538-A generates the Acknowledge bit. Figure 103: I2C General Timing Characteristics Figure 104: Byte Write Command, R/W = 0 SCL tF tR tSU STO tBUF tHIGH tLOW tSU DAT tHD DATtHD STA tSU STA tAA tDH SDA IN SDA OUT X X X X A A A W A A Control Byte Word Address Control Code Block Address R/W bit = 0 S ACK Acknowledge bit Start bit ACK D D Data P Stop bit Acknowledge bit SDA LINE Bus Activity Acknowledge bit ACK Not used, set to 0

17.4.3 Current Address Read Command

The Current Address Read Command reads from the current pointer address location. The address pointer is incremented at the first STOP bit following any write control byte. For example, if a Sequential Read command (which contains a write control byte) reads data up to address n, the address pointer would get incremented to n + 1 upon the STOP of that command. Subsequently, a Current Address Read that follows would start reading data at n + 1. The Current Address Read Command contains the Control Byte sent by the Master, with the R/W bit = “1”. The SLG46538-A will issue an Acknowledge bit, and then transmit eight data bits for the requested byte. The Master will not issue an Acknowledge bit, and follow immediately with a Stop condition.

17.4.4 Random Read Command

The Random Read command starts with a Control Byte (with R/W bit set to “0”, indicating a write command) and Word Address to set the internal byte address, followed by a Start bit, and then the Control Byte for the read (exactly the same as the Byte Write command). The Start bit in the middle of the command will halt the decoding of a Write command, but will set the internal address counter in preparation for the second half of the command. After the Start bit, the Bus Master issues a second control byte wi th the R/W bit set to “1”, after which the SLG46538-A issues an Acknowledge bit, followed by the requested eight data bits. Figure 105: Sequential Write Command Figure 106: Current Address Read Command, R/W = 1 X X X X A A A 8 W Control Byte Word Address (n) Control Code Block Address R/W bit = 0 S ACK Acknowledge bitStart bit Data (n) Stop bit SDA LINE Bus Activity ACK Data (n + 1) ACK ACK Data (n + x) P Acknowledge bit ACK Not used, set to 0 X X X X A A A R Control Byte Data (n) Control Code Block Address R/W bit = 1 S ACK Acknowledge bit Start bit P Stop bit No Ack bit SDA LINE Bus Activity Not used, set to 0 NACK

17.4.5 Sequential Read Command

The Sequential Read command is initiated in the same way as a Current Address Read or Random Read command, except that once the SLG46538-A transmits the first data byte, the Master i ssues an Acknowledge bit as opposed to a Stop condition in a random read. The Master can continue reading sequential bytes of data, and will terminate the command with a Stop condition.

17.4.6 I2C Serial Command Address Space

In the read and write command address structure, there are a to tal of 11 bits of addressing, each pointing to a unique byte of information, resulting in a total address space of 2K bytes. Of this 2K byte address space, the valid addresses accessible to the I2C Macrocell on the SLG46538-A are in the range from 0 (0x00) to 255 (0xFF). The MSB address bits (A10, A9, and A8) will be “0” for all commands to the SLG46538-A.

17.4.7 I2C Serial Command Register Map

These register addresses are broken down into four Banks to giv e the user greater control on access to reading and writing information in each bank. Each of the four banks is 512 bits (64 bytes) in length. Writing information to register bits in these Banks will change the configuration of the device, resulting in either a change in the interconnection options provided by the Connection Matrix, or by changing the configuration of individual macrocells. During device use, all register bits can be read or written via I2C, unless protection bits are set to prevent this. See Section 20 for detailed information on all register bits. Figure 107: Random Read Command Figure 108: Sequential Read Command X X X X A A A 8 W Control Byte Word Address (n) Control Code Block Address R/W bit = 0 S ACK Acknowledge bitStart bit Control Byte Stop bit SDA LINE Bus Activity ACK Data (n) ACK PXXXX A A A 8 RS R/W bit = 1 No Ack bit Not used, set to 0 Control Code X X X X A A A 8 R Control Byte Data (n) Control Code Block Address R/W bit = 1 S ACK Acknowledge bitStart bit Data (n+1) Stop bit SDA LINE Bus Activity ACK Data (n + 2) ACK ACK Data (n + x) P No Ack bit Not used, set to 0

17.5 I2C SERIAL COMMAND REGISTER PROTECTION

The memory space is divided into four banks, each of which has 512bits (64bytes). There are three bits that allow the user to define rules for reading and writing bits in each of these banks via I2C:  register [1832] I2C lock for read bits [1535:0] (Bank 0/1/2). If the system provides any read commands to the addresses in these three banks, the device will respond with ‘FFH’ in data field.  register [1871] I2C lock for write bits [1535:0] (Bank 0/1/2). If the system provides any write commands to the addresses in these three banks, the device will acknowledge these commands, but will not do internal writes to the register space.  register [1870] I2C lock for write all bits (Bank 0/1/2/3). If the system provides any write commands to the addresses in these four banks, the device will acknowledge these commands, but will not do internal writes to the register space. Note: register [1870] is higher priority than register [1871], and if register [1870] is set, than register [1871] does not have any effect. Note: If the user sets IOs 6 and 7 function to a selection other than SDA and SCL, all access via I2C will be disabled. If register [1870] is not set, register bits in Bank 3 are open to read and write commands via I2C with the following exceptions:  register [1871] Bank 0/1/2 I2C-write protection bit is always protected from I2C write  registers [1867:1864] I2C Control Code Bit [3:0] is always protected from I2C write Note: Any write commands that come to the device via I 2C that are not blocked, based on the protection bits, will chan ge the contents of the RAM register bits that mirror the NVM bits. These write commands will not change the NVM bits themselves, and a POR event will restore the register bits to original programmed contents of the NVM. See Section 20 for detailed information on all registers.

17.5.1 Register Read/Write Protection

There are six read/write protect modes for the design sequence from being corrupted or copied. See Table 66 for details. Figure 109: Register Bank Map Byte 0 Bank 0 Bank 1 Bank 2 Bank 3 Byte 63 Byte 64 Byte 127 Byte 128 Byte 191 Byte 192 Byte 255

Revision 2.3 127 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Table 66: Read/Write Protection Options Bank Byte Bits Description Lock Status Unlocked Locked for read bits [1535:0] Locked for write bits [1535:0] Locked for write all bits Locked for read and write bits [1535:0] Locked for read bits [1535:0] and write all bits register [1832] = 0, [1871] = 0, [1870] = 0 register [1832] = 1, [1871] = 0, [1870] = 0 register [1832] = 0, [1871] = 1, [1870] = 0 register [1832] =0, [1871] = x, [1870] = 1 register [1832] = 1, [1871] = 1, [1870] = 0 register [1832] = 1, [1871] = x, [1870] = 1 0 0-63 511-0 Connection Matrix Outputs Configuration R/W W R R - - 64-109 879-512 R/W W R R - - 110-127 880-1023 Reserved - - - - - - 128-186 1495-1024 Function Configuration for PINs, LUTs/DFFs, OSC, ASM and some configuration for DLYs, ACMP R/W W R R - - 187-191 1535-1496 Reserved - - - - - - 192-206 1655-1536 CNT/DLY counter data and some LUTs truth table, ACMP Vref R/W R/W R/W R R/W R 207 1662 I2C reset bit with reloading NVM into Data register R/W R/W R/W R R/W R 1661-1659,

1663 Reserved R R R R R R

1658-1656 OSC Power Control R/W R/W R/W R R/W R

Revision 2.3 128 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 208-223 1791-1664 ASM output RAM and User configurable RAM / OTP R/W R/W R/W R R/W R 224-227 1823-1792 Reserved - - - - - - 228 1831-1824 Reserved R/W R/W R/W R R/W R 229 1839-1836 Product Family ID R R R R R R 1835-1834 Reserved - - - - - -

1833 Reserved R R R R R R

1832 I2C Lock for read bits

[1535:0] R R R R R R 230 1847-1840 Pattern ID R/W R/W R/W R R/W R 231 1855-1848 Reserved R R R R R R 232 1863-1856 Reserved R R R R R R 233

1871 I2C Lock for write bits

[1535:0] R R R R R R

1870 I2C Lock for write all

1869-1868 Reserved - - - - - - 1867-1864 I 2C Control Code R R R R R R 234-239 1919-1872 Counter Current Value R R R R R R 240-243 1951-1920 Macrocells Output Values (Connection Matrix Inputs) R R R R R R 244 1959-1952 Connection Matrix Virtual Inputs R/W R/W R/W R R/W R 245-247 1983-1960 Macrocells Output Values (Connection Matrix Inputs) R R R R R R 248-250 2007-1984 Reserved R R R R R R 251 2015-2008 Reserved R/W R/W R/W R R/W R 252-253 2031-2016 Reserved R R R R R R 254 2039-2032 Reserved R/W R/W R/W R R/W R 255 2047-2040 Reserved R/W R/W R/W R R/W R R/W Allow Read and Write Data Table 66: Read/Write Protection Options (Continued) Bank Byte Bits Description Lock Status Unlocked Locked for read bits [1535:0] Locked for write bits [1535:0] Locked for write all bits Locked for read and write bits [1535:0] Locked for read bits [1535:0] and write all bits register [1832] = 0, [1871] = 0, [1870] = 0 register [1832] = 1, [1871] = 0, [1870] = 0 register [1832] = 0, [1871] = 1, [1870] = 0 register [1832] =0, [1871] = x, [1870] = 1 register [1832] = 1, [1871] = 1, [1870] = 0 register [1832] = 1, [1871] = x, [1870] = 1

17.5.2 I2C Serial Reset Command

If I2C serial communication is established with the device, it is possible to reset the device to initial power up conditions, including configuration of all macrocells, and all connections provided b y the Connection Matrix. This is implemented by setting register [1662] I2C reset bit to “1”, which causes the device to re-enable the Po wer-On Reset (POR) sequence, including the reload of all register data from NVM. During the POR sequence, the outputs of the device will be in tri-state. After the reset has taken place, the contents of register [1662] will be set to “0” automatically. Figure 110 illustrates the sequence of events for this reset function. Note: I2C Serial Reset Command is not available during emulation.

17.6 I2C ADDITIONAL OPTIONS

17.6.1 Reading Counter Data via I2C

The current count value in four counters in the device can be read via I2C. The counters that have this additional functionality are 16-bit CNT0 and CNT1, and 8-bit counters CNT4 and CNT6.

17.6.2 User RAM and OTP Memory Array

There are eight bytes of RAM memory that can be read and written remotely by I2C commands. The initial contents of this memory space can be selected by the user, and this information will be transferred from OTP memory to the RAM memory space during W Allow Write Data Only R Allow Read Data Only - The Data is protected for Read and Write Figure 110: Reset Command Timing X X X X A A A W A A Control Byte Word Address Control Code Block Address Write bit S ACK Acknowledge bit Start bit ACK D D Data P Stop bit Acknowledge bit SDA LINE Bus Activity Acknowledge bit ACK Reset-bit register output reloading NVM into Data register Internal POR Internal Reset bit by I2C Stop Signal Reset-bit register (register [1662]) is cleared by reloading NV M into Data register 1) I2C write with register [1662] = 1 (I2C reset bit with reloading NVM into Data register) 2) POR go to LOW and reloading NVM into Data register start aft er “STOP” of I2C 3) POR go to HIGH after reloading NVM into Data register Not used, set to 0

Revision 2.3 130 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary the power-up sequence. The lowest order byte in this array (User Configurable RAM/OTP Byte 0) is located at I2C address 0xD8, and the highest order byte in this array is located at I2C address 0xDF. Table 67: RAM Array Table I2C Address (hex) Highest Bit Address Lowest Bit Address Memory Byte D8 1735 1728 User Configurable RAM/OTP Byte 0 D9 1743 1736 User Configurable RAM/OTP Byte 1 DA 1751 1744 User Configurable RAM/OTP Byte 2 DB 1759 1752 User Configurable RAM/OTP Byte 3 DC 1767 1760 User Configurable RAM/OTP Byte 4 DD 1775 1768 User Configurable RAM/OTP Byte 5 DE 1783 1776 User Configurable RAM/OTP Byte 6 DF 1791 1784 User Configurable RAM/OTP Byte 7

18 Analog Temperature Sensor

The SLG46538-A has an Analog Temperature sensor (TS) with an ou tput voltage linearly-proportional to the Centigrade temperature. The TS is rated to operate over a -40 °C to 180 °C temperature range. The error in the whole temperature range does not exceed ±10.3 % (±5.7 % in a range from -40 °C to 100 ° C). TS output voltage variation over V DD at constant temperature is less than ±10.3 %. For more detail refer to section 3.11. Figure 111: Analog Temperature Sensor Structure Diagram VREF0 Register [1464] VCP, registers [1474:1472] = 100 (always CP should be on) Register [1470] = 0 Vref Op Amp Offset Chopper Clock frequency 2 MHz Register [1469] = 1 Bandgap Op Amp Offset Chopper Enable TSVDD Registers [1486:1484] Vref select Register [1478] IO16 Closed TS_On Register [1464] = 1 Register [1464] = 1TS_O Open From Connection Matrix Output [109]PWR DOWN

Revision 2.3 132 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary Figure 112: TS Output vs. Temperature, VDD = 1.71 V to 5.5 V 0.4 0.5 0.6 0.7 0.8 0.9 1.1 1.2 -40 -20 100 TS OUT (V) T (°C) Output Range 1 (buffered) Output Range 2 (buffered)

19 External Clocking

The SLG46538-A supports several ways to use an external, higher accuracy clock as a reference source for internal operations.

19.1 CRYSTAL MODE

When register [1136] is set to 1, an external crystal can be connected to IOs 13 and 14 for supplying an accurate clock source . See Section 14. An external clocking signal on IO14 can be used in place of t he crystal. The high and low limits for crystal frequency that can be selected are 32.768 kHz and 40 MHz.

19.2 IO17 OR IO15 SOURCE FOR 25 KHZ/2 MHZ CLOCK

When register [1358] is set to 1, an external clocking signal o n IOs 15 or 17 will be routed in place of the internal RC oscil lator derived 25 kHz/2 MHz clock source. When register [1355] is set to 0, IO17 is in use, when set to 1, IO15 is in use. See Figure 69. The high and low limits for external frequency that can be selected are 0 MHz and 77 MHz.

19.3 IO14 SOURCE FOR 25 MHZ CLOCK

When register [1357] is set to 1, an external clocking signal o n IO14 will be routed in place of the internal RC oscillator de rived 25 MHz clock source. See Figure 70. The high and low limits for external frequency that can be selected are 0 MHz and 84 MHz.

20 Register Definitions

20.1 REGISTER MAP

Table 68: Register Map Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write Note: For register [0] to register [1495], I2C Read is valid (assuming register [1832] = 0), I2C Write is valid (assuming register [1871] = 0) Matrix 64-to-1 MUX's 6 selection bits 00 5:0 Matrix OUT ASM-state0-EN0 Valid Valid 7:6 Reserved Valid Valid 01 13:8 Matrix OUT ASM-state0-EN1 Valid Valid 15:14 Reserved Valid Valid 02 21:16 Matrix OUT ASM-state0-EN2 Valid Valid 23:22 Reserved Valid Valid 03 29:24 Matrix OUT ASM-state1-EN0 Valid Valid 31:30 Reserved Valid Valid 04 37:32 Matrix OUT ASM-state1-EN1 Valid Valid 39:38 Reserved Valid Valid 05 45:40 Matrix OUT ASM-state1-EN2 Valid Valid 47:46 Reserved Valid Valid 06 53:48 Matrix OUT ASM-state2-EN0 Valid Valid 55:54 Reserved Valid Valid 07 61:56 Matrix OUT ASM-state2-EN1 Valid Valid 63:62 Reserved Valid Valid 08 69:64 Matrix OUT ASM-state2-EN2 Valid Valid 71:70 Reserved Valid Valid 09 77:72 Matrix OUT ASM-state3-EN0 Valid Valid 79:78 Reserved Valid Valid 0A 85:80 Matrix OUT ASM-state3-EN1 Valid Valid 87:86 Reserved Valid Valid 0B 93:88 Matrix OUT ASM-state3-EN2 Valid Valid 95:94 Reserved Valid Valid 0C 101:96 Matrix OUT ASM-state4-EN0 Valid Valid 103:102 Reserved Valid Valid 0D 109:104 Matrix OUT ASM-state4-EN1 Valid Valid 111:110 Reserved Valid Valid 0E 117:112 Matrix OUT ASM-state4-EN2 Valid Valid 119:118 Reserved Valid Valid 0F 125:120 Matrix OUT ASM-state5-EN0 Valid Valid 127:126 Reserved Valid Valid 10 133:128 Matrix OUT ASM-state5-EN1 Valid Valid 135:134 Reserved Valid Valid 11 141:136 Matrix OUT ASM-state5-EN2 Valid Valid 143:142 Reserved Valid Valid

Revision 2.3 135 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 12 149:144 Matrix OUT ASM-state6-EN0 Valid Valid 151:150 Reserved Valid Valid 13 157:152 Matrix OUT ASM-state6-EN1 Valid Valid 159:158 Reserved Valid Valid 14 165:160 Matrix OUT ASM-state6-EN2 Valid Valid 167:166 Reserved Valid Valid 15 173:168 Matrix OUT ASM-state7-EN0 Valid Valid 175:174 Reserved Valid Valid 16 181:176 Matrix OUT ASM-state7-EN1 Valid Valid 183:182 Reserved Valid Valid 17 189:184 Matrix OUT ASM-state7-EN2 Valid Valid 191:190 Reserved Valid Valid 18 197:192 Matrix OUT ASM-state-nRST Valid Valid 199:198 Reserved Valid Valid 19 205:200 Matrix OUT IO1 Digital Output Source Valid Valid 207:206 Reserved Valid Valid 1A 213:208 Matrix OUT IO1 Output Enable Valid Valid 215:214 Reserved Valid Valid 1B 221:216 Matrix OUT IO2 Digital Output Source Valid Valid 223:222 Reserved Valid Valid 1C 229:224 Matrix OUT IO3 Digital Output Source Valid Valid 231:230 Reserved Valid Valid 1D 237:232 Matrix OUT IO3 Output Enable Valid Valid 239:238 Reserved Valid Valid 1E 245:240 Matrix OUT IO4 Digital Output Source Valid Valid 247:246 Reserved Valid Valid 1F 253:248 Matrix OUT IO5 Digital Output Source Valid Valid 255:254 Reserved Valid Valid 20 261:256 Matrix OUT IO5 Output Enable Valid Valid 263:262 Reserved Valid Valid 21 269:264 Matrix OUT IO6 Digital Output Source (SCL with VI/In- put & NMOS Open-Drain) Valid Valid 271:270 Reserved Valid Valid 22 277:272 Matrix OUT IO7 Digital Output Source (SDA with VI/In- put & NMOS Open-Drain) Valid Valid 279:278 Reserved Valid Valid 23 285:280 Matrix OUT IO8 Digital Output Source Valid Valid 287:286 Reserved Valid Valid 24 293:288 Matrix OUT IO8 Output Enable Valid Valid 295:294 Reserved Valid Valid 25 301:296 Matrix OUT IO9 Digital Output Source Valid Valid 303:302 Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 136 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 26 309:304 Matrix OUT IO10 Digital Output Source Valid Valid 311:310 Reserved Valid Valid 27 317:312 Matrix OUT IO10 Output Enable Valid Valid 319:318 Reserved Valid Valid 28 325:320 Matrix OUT Inverter Input Valid Valid 327:326 Reserved Valid Valid 29 333:328 Reserved Valid Valid 335:334 Reserved Valid Valid 2A 341:336 Matrix OUT IO12 Digital Output Source Valid Valid 343:342 Reserved Valid Valid 2B 349:344 Matrix OUT IO13 Digital Output Source Valid Valid 351:350 Reserved Valid Valid 2C 357:352 Matrix OUT IO13 Output Enable Valid Valid 359:358 Reserved Valid Valid 2D 365:360 Matrix OUT IO14 Digital Output Source Valid Valid 367:366 Reserved Valid Valid 2E 373:368 Matrix OUT IO15 Digital Output Source Valid Valid 375:374 Reserved Valid Valid 2F 381:376 Matrix OUT IO15 Output Enable Valid Valid 383:382 Reserved Valid Valid 30 389:384 Matrix OUT IO16 Digital Output Source Valid Valid 391:390 Reserved Valid Valid 31 397:392 Matrix OUT IO16 Output Enable Valid Valid 399:398 Reserved Valid Valid 32 405:400 Matrix OUT IO17 Digital Output Source Valid Valid 407:406 Reserved Valid Valid 33 413:408 Matrix OUT ACMP0 PDB (Power-Down) Valid Valid 415:414 Reserved Valid Valid 34 421:416 Matrix OUT ACMP1 PDB (Power-Down) Valid Valid 423:422 Reserved Valid Valid 35 429:424 Matrix OUT ACMP2 PDB (Power-Down) Valid Valid 431:430 Reserved Valid Valid 36 437:432 Matrix OUT ACMP3 PDB (Power-Down) Valid Valid 439:438 Reserved Valid Valid 37 445:440 Matrix OUT Input of Filter_0 with fixed time edge detector Valid Valid 447:446 Reserved Valid Valid 38 453:448 Matrix OUT Input of Filter_1 with fixed time edge detector Valid Valid 455:454 Reserved Valid Valid 39 461:456 Matrix OUT Input of Programmable Delay & Edge Detector Valid Valid 463:462 Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 137 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 3A 469:464 Matrix OUT OSC 25 kHz/2 MHz PDB (Power-Down) Valid Valid 471:470 Reserved Valid Valid 3B 477:472 Matrix OUT OSC 25 MHz PDB (Power-Down) Valid Valid 479:478 Reserved Valid Valid 3C 485:480 Matrix OUT IN0 of LUT2_0 or Clock Input of DFF0 Valid Valid 487:486 Reserved Valid Valid 3D 493:488 Matrix OUT IN1 of LUT2_0 or Data Input of DFF0 Valid Valid 495:494 Reserved Valid Valid 3E 501:496 Matrix OUT IN0 of LUT2_1 or Clock Input of DFF1 Valid Valid 503:502 Reserved Valid Valid 3F 509:504 Matrix OUT IN1 of LUT2_1 or Data Input of DFF1 Valid Valid 511:510 Reserved Valid Valid 40 517:512 Matrix OUT IN0 of LUT2_2 or Clock Input of DFF2 Valid Valid 519:518 Reserved Valid Valid 41 525:520 Matrix OUT IN1 of LUT2_2 or Data Input of DFF2 Valid Valid 527:526 Reserved Valid Valid 42 533:528 Matrix OUT IN0 of LUT2_3 or Clock Input of PGen Valid Valid 535:534 Reserved Valid Valid 43 541:536 Matrix OUT IN1 of LUT2_3 or nRST of PGen Valid Valid 543:542 Reserved Valid Valid 44 549:544 Matrix OUT IN0 of LUT3_0 or Clock Input of DFF3 Valid Valid 551:550 Reserved Valid Valid 45 557:552 Matrix OUT IN1 of LUT3_0 or Data Input of DFF3 Valid Valid 559:558 Reserved Valid Valid 46 565:560 Matrix OUT IN2 of LUT3_0 or nRST (nSET) of DFF3 Valid Valid 567:566 Reserved Valid Valid 47 573:568 Matrix OUT IN0 of LUT3_1 or Clock Input of DFF4 Valid Valid 575:574 Reserved Valid Valid 48 581:576 Matrix OUT IN1 of LUT3_1 or Data Input of DFF4 Valid Valid 583:582 Reserved Valid Valid 49 589:584 Matrix OUT IN2 of LUT3_1 or nRST (nSET) of DFF4 Valid Valid 591:590 Reserved Valid Valid 4A 597:592 Matrix OUT IN0 of LUT3_2 or Clock Input of DFF5 Valid Valid 599:598 Reserved Valid Valid 4B 605:600 Matrix OUT IN1 of LUT3_2 or Data Input of DFF5 Valid Valid 607:606 Reserved Valid Valid 4C 613:608 Matrix OUT IN2 of LUT3_2 or nRST (nSET) of DFF5 Valid Valid 615:614 Reserved Valid Valid 4D 621:616 Matrix OUT IN0 of LUT3_3 or Clock Input of DFF6 Valid Valid 623:622 Reserved Valid Valid 4E 629:624 Matrix OUT IN1 of LUT3_3 or Data Input of DFF6 Valid Valid 631:630 Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 138 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 4F 637:632 Matrix OUT IN2 of LUT3_3 or nRST (nSET) of DFF6 Valid Valid 639:638 Reserved Valid Valid 50 645:640 Matrix OUT IN0 of LUT3_4 or Clock Input of DFF7 Valid Valid 647:646 Reserved Valid Valid 51 653:648 Matrix OUT IN1 of LUT3_4 or Data Input of DFF7 Valid Valid 655:654 Reserved Valid Valid 52 661:656 Matrix OUT IN2 of LUT3_4 or nRST (nSET) of DFF7 Valid Valid 663:662 Reserved Valid Valid 53 669:664 Matrix OUT IN0 of LUT3_5 or Delay2 Input (or Counter2 RST Input) Valid Valid 671:670 Reserved Valid Valid 54 677:672 Matrix OUT IN1 of LUT3_5 or External Clock Input of Delay2 (or Counter2) Valid Valid 679:678 Reserved Valid Valid 55 685:680 Matrix OUT IN2 of LUT3_5 Valid Valid 687:686 Reserved Valid Valid 56 693:688 Matrix OUT IN0 of LUT3_6 or Delay3 Input (or Counter3 RST Input) Valid Valid 695:694 Reserved Valid Valid 57 701:696 Matrix OUT IN1 of LUT3_6 or External Clock Input of Delay3 (or Counter3) Valid Valid 703:702 Reserved Valid Valid 58 709:704 Matrix OUT IN2 of LUT3_6 Valid Valid 711:710 Reserved Valid Valid 59 717:712 Matrix OUT IN0 of LUT3_7 or Delay4 Input (or Counter4 RST Input) Valid Valid 719:718 Reserved Valid Valid 5A 725:720 Matrix OUT IN1 of LUT3_7 or External Clock Input of Delay4 (or Counter4) Valid Valid 727:726 Reserved Valid Valid 5B 733:728 Matrix OUT IN2 of LUT3_7 Valid Valid 735:734 Reserved Valid Valid 5C 741:736 Matrix OUT IN0 of LUT3_8 or Delay5 Input (or Counter5 RST Input) Valid Valid 743:742 Reserved Valid Valid 5D 749:744 Matrix OUT IN1 of LUT3_8 or External Clock Input of Delay5 (or Counter5) Valid Valid 751:750 Reserved Valid Valid 5E 757:752 Matrix OUT IN2 of LUT3_8 Valid Valid 759:758 Reserved Valid Valid 5F 765:760 Matrix OUT IN0 of LUT3_9 or Delay6 Input (or Counter6 RST Input) Valid Valid 767:766 Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 139 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 60 773:768 Matrix OUT IN1 of LUT3_9 or External Clock Input of Delay6 (or Counter6) Valid Valid 775:774 Reserved Valid Valid 61 781:776 Matrix OUT IN2 of LUT3_9 Valid Valid 783:782 Reserved Valid Valid 62 789:784 Matrix OUT IN0 of LUT3_10 or Input of Pipe Delay Valid Vali d 791:790 Reserved Valid Valid 63 797:792 Matrix OUT IN1 of LUT3_10 or nRST of Pipe Delay Valid Valid 799:798 Reserved Valid Valid 64 805:800 Matrix OUT IN2 of LUT3_10 or Clock of Pipe Delay Valid Val id 807:806 Reserved Valid Valid 65 813:808 Matrix OUT IN0 of LUT4_0 or Delay0 Input (or Counter0 RST/SET Input) Valid Valid 815:814 Reserved Valid Valid 66 821:816 Matrix OUT IN1 of LUT4_0 or External Clock Input of Delay0 (or Counter0) Valid Valid 823:822 Reserved Valid Valid 67 829:824 Matrix OUT IN2 of LUT4_0 or UP Input of FSM0 Valid Valid 831:830 Reserved Valid Valid 68 837:832 Matrix OUT IN3 of LUT4_0 or KEEP Input of FSM0 Valid Valid 839:838 Reserved Valid Valid 69 845:840 Matrix OUT IN0 of LUT4_1 or Delay1 Input (or Counter1 RST/SET Input) Valid Valid 847:846 Reserved Valid Valid 6A 853:848 Matrix OUT IN1 of LUT4_1 or External Clock Input of Delay1 (or Counter1) Valid Valid 855:854 Reserved Valid Valid 6B 861:856 Matrix OUT IN2 of LUT4_1 or UP Input of FSM1 Valid Valid 863:862 Reserved Valid Valid 6C 869:864 Matrix OUT IN3 of LUT4_1 or KEEP Input of FSM1 Valid Valid 871:870 Reserved Valid Valid 6D 877:872 Matrix OUT PD of either Temp-output with BG AND/ ORcrystal oscillator by register [1268] Valid Valid 879:878 Reserved Valid Valid 6E 887:880 Reserved Valid Valid 6F 895:888 Reserved Valid Valid 70 903:896 Reserved Valid Valid 71 911:904 Reserved Valid Valid 72 919:912 Reserved Valid Valid 73 927:920 Reserved Valid Valid 74 935:928 Reserved Valid Valid 75 943:936 Reserved Valid Valid 76 951:944 Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 140 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary 77 959:952 Reserved Valid Valid 78 967:960 Reserved Valid Valid 79 975:968 Reserved Valid Valid 7A 983:976 Reserved Valid Valid 7B 991:984 Reserved Valid Valid 7C 999:992 Reserved Valid Valid 7D 1007:1000 Reserved Valid Valid 7E 1015:1008 Reserved Valid Valid 7F 1023:1016 Reserved Valid Valid IO0

1024 Reserved Valid Valid

1025 Reserved Valid Valid

1027:1026 Reserved Valid Valid 1029:1028 IO0 Pull Down Resistor Value Selection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1031:1030 IO0 Mode Control 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Reserved Valid Valid IO1 80 1032 Reserved Valid Valid

1033 IO1 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1035:1034 IO1 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1037:1036 IO1 Mode Control (sig_io1_oe = 0) 00: Digital Input without Schmitt Trigger, 01: Digital Input with Schmitt Trigger, 10: Low Voltage Digital Input 11: Reserved Valid Valid 1039:1038 IO1 Mode Control (sig_io1_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1040 Reserved Valid Valid

1041 IO2 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1042 IO2 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1044:1043 IO2 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1047:1045 IO2 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Reserved 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Reserved Valid Valid IO3

1048 Reserved Valid Valid

1049 IO3 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1051:1050 IO3 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1053:1052 IO3 Mode Control (sig_io3_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Reserved Valid Valid 1055:1054 IO3 Mode Control (sig_io3_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid IO4

1056 Reserved Valid Valid

1057 IO4 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1058 IO4 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1060:1059 IO4 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1063:1061 IO4 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Analog Input/Output 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Analog Input & Open-Drain Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1064 Reserved Valid Valid

1065 IO5 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1067:1066 IO5 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1069:1068 IO5 Mode Control (sig_io5_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Analog Input/Output Valid Valid 1071:1070 IO5 Mode Control (sig_io5_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid IO6

1072 Reserved Valid Valid

1073 IO6 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1074 Select SCL & Virtual Input 0 or IO6 0: SCL & Virtual Input 0

1: IO6 Valid Valid 1076:1075 IO6 Pull-down Resistor Value Selection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1079:1077 IO6 (or SCL) Mode Control (input mode is selected by register at SCL) 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Reserved 100: Reserved 101: Open-Drain NMOS 110: Reserved 111: Reserved Valid Valid IO7

1080 Reserved Valid Valid

1081 IO7 (or SDA) Driver Strength Selection 0: 1x (I2C up to 400 kHz)

1: 2x (I2C up to 1 MHz) Valid Valid

1082 Select SDA & Virtual Input 1 or IO7 0: SDA & Virtual Input 1

1: IO7 Valid Valid 1084:1083 IO7 Pull-down Resistor Value Selection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1087:1085 IO7 (or SDA) Mode Control (input mode is selected by register at SDA, output mode is fixed as OD at SDA) 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Reserved 100: Reserved 101: Open-Drain NMOS 110: Reserved 111: Reserved Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1088 IO8 Super Drive (4x, NMOS

Open-Drain) Selection 0: Super Drive OFF 1: Super Drive ON (if sig_io8_oe = '1' & IO8 Mode Control = '1x') Valid Valid

1089 IO8 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1091:1090 IO8 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1093:1092 IO8 Mode Control (sig_io8_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Analog Input/Output Valid Valid 1095:1094 IO8 Mode Control (sig_io8_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid IO9

1096 IO9 Super Drive (4x, NMOS

Open-Drain) Selection 0: Super Drive OFF 1: Super Drive ON (if IO9 Mode Control = '101') Valid Valid

1097 IO9 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1098 IO9 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1100:1099 IO9 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1103:1101 IO9 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Analog Input/Output 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Analog Input & Open-Drain Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1104 Reserved Valid Valid

1105 IO10 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1107:1106 IO10 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1109:1108 IO10 Mode Control (sig_io10_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Analog Input/Output Valid Valid 1111:1110 IO10 Mode Control (sig_io10_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid Reserved

1112 Reserved Valid Valid

1113 Reserved Valid Valid

1115:1114 Reserved Valid Valid 1117:1116 Reserved Valid Valid 1119:1118 Reserved Valid Valid IO12

1120 Reserved Valid Valid

1121 IO12 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1122 IO12 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1124:1123 IO12 Pull-up/down Resistor Value Selection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1127:1125 IO12 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Analog Input/Output 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Analog Input & Open-Drain Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1128 Reserved Valid Valid

1129 IO13 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1131:1130 IO13 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1133:1132 IO13 Mode Control (sig_io13_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Sel for XSOC (X2) Valid Valid 1135:1134 IO13 Mode Control (sig_io13_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid IO14

1136 X1 & X2 for crystal OSC enable 0: Disable

1: Enable Valid Valid

1137 IO14 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1138 IO14 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1140:1139 IO14 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1143:1141 IO14 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Sel for XOSC (X1) 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Reserved Valid Valid IO15

1144 Reserved Valid Valid

1145 IO15 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1147:1146 IO15 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1149:1148 IO15 Mode Control (sig_io15_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Analog Input/Output Valid Valid 1151:1150 IO15 Mode Control (sig_io15_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1152 Reserved Valid Valid

1153 IO16 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1155:1154 IO16 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1157:1156 IO16 Mode Control (sig_io16_oe = 0) 00: Digital Input without Schmitt Trigger 01: Digital Input with Schmitt Trigger 10: Low Voltage Digital Input 11: Analog Input/Output Valid Valid 1159:1158 IO16 Mode Control (sig_io16_oe = 1) 00: Push-Pull 1x 01: Push-Pull 2x 10: Open-Drain NMOS 1x 11: Open-Drain NMOS 2x Valid Valid IO17

1160 Reserved Valid Valid

1161 IO17 Driver Strength Selection 0: 1x

1: 2x Valid Valid

1162 IO17 Pull-up/down Resistor Selection 0: Pull-down Resistor

1: Pull-up Resistor Valid Valid 1164:1163 IO17 Pull-up/down Resistor Value Se- lection 00: Floating 01: 10 K 10: 100 K 11: 1 M Valid Valid 1167:1165 IO17 Mode Control 000: Digital Input without Schmitt Trigger 001: Digital Input with Schmitt Trigger 010: Low Voltage Digital Input 011: Reserved 100: Push-Pull 101: Open-Drain NMOS 110: Open-Drain PMOS 111: Reserved Valid Valid ACMP1

1168 ACMP1 Positive Input Source Select 0: IO8

1: ACMP0 IN+ source Valid Valid

1169 ACMP1 Analog Buffer Enable (Max BW

1 MHz)

0: Disable analog buffer 1: Enable analog buffer Valid Valid 1171:1170 ACMP1 Hysteresis Enable 00: 0 mV 01: 25 mV 10: 50 mV 11: 200 mV (01: for both external & internal Vref; 10 & 11: for only internal Vref; External Vref will not have 50 mV & 200 mV hysteresis) Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1172 ACMP0 Positive Input Source Select 0: IO4

1: VDD Valid Valid

1173 ACMP0 Analog Buffer Enable (Max BW

0: Disable analog buffer 1: Enable analog buffer Valid Valid 1175:1174 ACMP0 Hysteresis Enable 00: 0 mV 01: 25 mV 10: 50 mV 11: 200 mV (01: for both external & internal Vref; 10 & 11: for only internal Vref; External Vref will not have 50 mV & 200 mV hysteresis) Valid Valid ACMP3 1177:1176 ACMP3 Positive Input Source Select 00: IO12 01: ACMP2 IN+ source 10: ACMP0 IN+ source 11: Reserved Valid Valid 1179:1178 ACMP3 Hysteresis Enable 00: 0 mV 01: 25 mV 10: 50 mV, 11: 200 mV (01: for both external & internal Vref; 10 & 11: for only internal Vref; External Vref will not have 50 mV & 200 mV hysteresis.) Valid Valid ACMP2

1180 ACMP2 Positive Input Source Select 0: IO10

1: ACMP0 IN+ source Valid Valid 1182:1181 ACMP2 Hysteresis Enable 00: 0 mV 01: 25 mV 10: 50 mV 11: 200 mV (01: for both external & internal Vref; 10 & 11: for only internal Vref; External Vref will not have 50 mV & 200 mV hysteresis) Valid Valid ACMP1 100 uA Current Source Enable 93 1183 ACMP1 100 uA Current Source Enable 0: Disable 1: Enable Valid Valid LUT3_x Function Select

1184 LUT3_3 or DFF6 with nRST/nSET Se-

0: LUT3_3 1: DFF6 with nRST/nSET Valid Valid

1185 LUT3_2 or DFF5 with nRST/nSET Se-

0: LUT3_2 1: DFF5 with nRST/nSET Valid Valid

1186 LUT3_1 or DFF4 with nRST/nSET Se-

0: LUT3_1 1: DFF4 with nRST/nSET Valid Valid

1187 LUT3_0 or DFF3 with nRST/nSET Se-

0: LUT3_0 1: DFF3 with nRST/nSET Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1188 LUT2_3 or PGen Select 0: LUT2_3

1: PGen Valid Valid

1189 LUT2_2 or DFF2 Select 0: LUT2_2

1: DFF2 Valid Valid

1190 LUT2_1 or DFF1 Select 0: LUT2_1

1: DFF1 Valid Valid

1191 LUT2_0 or DFF0 Select 0: LUT2_0

1: DFF0 Valid Valid LUT4_x Function Select

1192 LUT4_1 or DLY/CNT1(16bits) Select 0: LUT4_1

1: DLY/CNT1(16bits) Valid Valid

1193 LUT4_0 or DLY/CNT0(16bits) Select 0: LUT4_0

1: DLY/CNT0(16bits) Valid Valid LUT3_x Function Select

1194 LUT3_9 or DLY/CNT6(8bits) Select 0: LUT3_9

1: DLY/CNT6(8bits) Valid Valid

1195 LUT3_8 or DLY/CNT5(8bits) Select 0: LUT3_8

1: DLY/CNT5(8bits) Valid Valid

1196 LUT3_7 or DLY/CNT4(8bits) Select 0: LUT3_7

1: DLY/CNT4(8bits) Valid Valid

1197 LUT3_6 or DLY/CNT3(8bits) Select 0: LUT3_6

1: DLY/CNT3(8bits) Valid Valid

1198 LUT3_5 or DLY/CNT2(8bits) Select 0: LUT3_5

1: DLY/CNT2(8bits) Valid Valid

1199 LUT3_4 or DFF7 with nRST/nSET Se-

0: LUT3_4 1: DFF7 with nRST/nSET Valid Valid LUT2_1/DFF1

1200 LUT2_1 [0] Valid Valid

1201 LUT2_1 [1]/DFF1 Initial Polarity Select 0: Low

1: High Valid Valid

1202 LUT2_1 [2]/DFF1 Output Select 0: Q output

1: QB output Valid Valid

1203 LUT2_1 [3]/DFF1 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT2_0/DFF0

1204 LUT2_0 [0] Valid Valid

1205 LUT2_0 [1]/DFF0 Initial Polarity Select 0: Low

1: High Valid Valid

1206 LUT2_0 [2]/DFF0 Output Select 0: Q output

1: QB output Valid Valid

1207 LUT2_0 [3]/DFF0 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT2_3/PGen 97 1211:1208 LUT2_3 [3:0] or PGen 4bit counter data [3:0] Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

1212 LUT2_2 [0] Valid Valid

1213 LUT2_2 [1]/DFF2 Initial Polarity Select 0: Low

1: High Valid Valid

1214 LUT2_2 [2]/DFF2 Output Select 0: Q output

1: QB output Valid Valid

1215 LUT2_2 [3]/DFF2 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT3_0/DFF3 1219:1216 LUT3_0 [3:0] Valid Valid

1220 LUT3_0 [4]/DFF3 Initial Polarity Select 0: Low

1: High Valid Valid

1221 LUT3_0 [5]/DFF3 nRST or nSET Se-

0: nRST from Matrix Output 1: nSET from Matrix Output Valid Valid

1222 LUT3_0 [6]/DFF3 Output Select 0: Q output

1: QB output Valid Valid

1223 LUT3_0 [7]/DFF3 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT3_1/DFF4 1227:1224 LUT3_1 [3:0] Valid Valid

1228 LUT3_1 [4]/DFF4 Initial Polarity Select 0: Low

1: High Valid Valid

1229 LUT3_1 [5]/DFF4 nRST or nSET Se-

0: nRST from Matrix Output 1: nSET from Matrix Output Valid Valid

1230 LUT3_1 [6]/DFF4 Output Select 0: Q output

1: QB output Valid Valid

1231 LUT3_1 [7]/DFF4 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT3_2/DFF5 1235:1232 LUT3_2 [3:0] Valid Valid

1236 LUT3_2 [4]/DFF5 Initial Polarity Select 0: Low

1: High Valid Valid

1237 LUT3_2 [5]/DFF5 nRST or nSET Se-

0: nRST from Matrix Output 1: nSET from Matrix Output Valid Valid

1238 LUT3_2 [6]/DFF5 Output Select 0: Q output

1: QB output Valid Valid

1239 LUT3_2 [7]/DFF5 or LATCH Select 0: DFF function

1: LATCH function Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 150 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary LUT3_3/DFF6 1243:1240 LUT3_3 [3:0] Valid Valid

1244 LUT3_3 [4]/DFF6 Initial Polarity Select 0: Low

1: High Valid Valid

1245 LUT3_3 [5]/DFF6 nRST or nSET Se-

0: nRST from Matrix Output 1: nSET from Matrix Output Valid Valid

1246 LUT3_3 [6]/DFF6 Output Select 0: Q output

1: QB output Valid Valid

1247 LUT3_3 [7]/DFF6 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT3_4/DFF7 1251:1248 LUT3_4 [3:0] Valid Valid

1252 LUT3_4 [4]/DFF7 Initial Polarity Select 0: Low

1: High Valid Valid

1253 LUT3_4 [5]/DFF7 nRST or nSET Se-

0: nRST from Matrix Output 1: nSET from Matrix Output Valid Valid

1254 LUT3_4 [6]/DFF7 Output Select 0: Q output

1: QB output Valid Valid

1255 LUT3_4 [7]/DFF7 or LATCH Select 0: DFF function

1: LATCH function Valid Valid LUT3_10/Pipe Delay 9D 1259:1256 LUT3_10 [3:0]/Pipe Delay OUT0 Select Valid Valid 1263:1260 LUT3_10 [7:4]/Pipe Delay OUT1 Select Valid Valid 1265:1264 Select the Edge Mode of Programma- ble Delay & Edge Detector 00: Rising Edge Detector 01: Falling Edge Detector 10: Both Edge Detector 11: Both Edge Delay Valid Valid 1267:1266 Delay Value Select for Programmable Delay & Edge Detector (V DD = 3.3V, typical) 00: 125 ns 01: 250 ns 10: 375 ns 11: 500 ns Valid Valid 1269:1268 Crystal oscillator and temp output Pow- er-down enable 00: No matrix PD 01: matrix PD for crystal oscillator 10: Reserved matrix PD for temp sensor 11: matrix PD for both crystal oscillator and temp sensor Valid Valid

1270 LUT3_10 or Pipe Delay Select 0: LUT3_10

1: Pipe Delay Valid Valid

1271 Pipe Delay OUT1 Polarity Select 0: Non-inverted

1: Inverted Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 151 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary DLY/CNT2 1273:1272 DLY2 Mode Select or Asynchronous CNT2 Reset 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1276:1274 DLY/CNT2 Clock Source Select 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter1 Overflow Valid Valid

1277 DLY/CNT2 Output Selection if DLY/

CNT2 Mode Selection is "11" 0: Default Output 1: Edge Detector Output Valid Valid 1279:1278 DLY/CNT2 Mode Selection 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid DLY/CNT3 1281:1280 DLY3 Mode Select or Asynchronous CNT3 Reset 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1284:1282 DLY/CNT3 Clock Source Select 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter2 Overflow Valid Valid

1285 DLY/CNT3 Output Selection if DLY/

CNT3 Mode Selection is "11" 0: Default Output 1: Edge Detector Output Valid Valid 1287:1286 DLY/CNT3 Mode Selection 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 152 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary DLY/CNT4 1289:1288 DLY4 Mode Select or Asynchronous CNT4 Reset 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1292:1290 DLY/CNT4 Clock Source Select 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter3 Overflow Valid Valid

1293 DLY/CNT4 Output Selection if DLY/

CNT4 Mode Selection is "11" 0: Default Output 1: Edge Detector Output Valid Valid 1295:1294 DLY/CNT4 Mode Selection 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid DLY/CNT5 1297:1296 DLY5 Mode Select or Asynchronous CNT5 Reset 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1300:1298 DLY/CNT5 Clock Source Select 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter4 Overflow Valid Valid

1301 DLY/CNT5 Output Selection if DLY/

CNT5 Mode Selection is "11" 0: Default Output 1: Edge Detector Output Valid Valid 1303:1302 DLY/CNT5 Mode Selection 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 153 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary DLY/CNT6 1305:1304 DLY6 Mode Select or Asynchronous CNT6 Reset 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1308:1306 DLY/CNT6 Clock Source Select 000: Internal OSC clock 001: OSC/4 010: OSC/12, 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter5 Overflow Valid Valid

1309 DLY/CNT6 Output Selection if DLY/

CNT6 Mode Selection is "11" 0: Default Output 1: Edge Detector Output Valid Valid 1311:1310 DLY/CNT6 Mode Selection 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid DLY/CNT0 1313:1312 DLY0 Mode Select or Asynchronous CNT0 Reset (16bits) 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1316:1314 DLY/CNT0 Clock Source Select (16bits) 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter6 Overflow Valid Valid

1317 CNT0/FSM0's Q are Set to data or Re-

set to 0s Selection (16bits) 0: Reset to 0s 1: Set to data (Registers [1583:1576, 1591:1584]) Valid Valid 1319:1318 DLY/CNT0 Mode Selection (16bits) 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid Table 68: Register Map (Continued) Address Signal Function Register Bit Definition I2C Interface Byte Register Bit Read Write

Revision 2.3 154 of 172 © 2021 Dialog Semiconductor SLG46538-A GreenPAK Programmable Mixed-Signal Matrix with Asynchronous State Machine and Dual Supply Preliminary DLY/CNT1 1321:1320 DLY1 Mode Select or Asynchronous CNT1 Reset (16bits) 00: On both Falling and Rising Edges (for Delay & Counter Reset) 01: on Falling Edge only (for Delay & Count- er Reset) 10: on Rising Edge only (for Delay & Count- er Reset) 11: No Delay on either Falling or Rising Edges/High Level Reset Valid Valid 1324:1322 DLY/CNT1 Clock Source Select (16bits) 000: Internal OSC clock 001: OSC/4 010: OSC/12 011: OSC/24 100: OSC/64 101: 25 MHz OSC clock 110: External Clock 111: Counter0 Overflow Valid Valid

1325 CNT1/FSM1's Q are Set to data or Re-

set to 0s Selection (16bits) 0: Reset to 0s 1: Set to data (Registers [1599:1592, 1607:1600]) Valid Valid 1327:1326 DLY/CNT1 Mode Selection (16bits) 00: Delay mode 01: One Shot 10: Freq. Detect 11: Counter mode Valid Valid DLY/CNTx One-Shot/Freq. Detect Output Polarity